JP5702245B2 - Printed wiring boards, board laminates, planar coils, and planar transformers - Google Patents

Description

  The present invention relates to a printed wiring board, a substrate laminate, a planar coil, and a planar transformer.

  In order to respond to the miniaturization of electronic devices and the like, for example, a technique for constructing a planar coil (inductive element) using a printed wiring board in which conductor patterns are formed in a loop shape on both sides of an insulating substrate is known (for example, Patent Documents). 1). Further, a technique is known in which a plurality of printed wiring boards having the same configuration as described above are stacked to construct an inductive element such as a planar coil or a planar transformer (for example, see Patent Document 2).

JP 2008-294085 A JP 2009-259922 A

  However, in the conventional techniques introduced in Patent Documents 1 and 2, when realizing inductive elements having different specifications, for example, a plurality of types of conductor patterns forming a coil part, shapes and positions of inter-substrate connection parts, and the like are different. It is necessary to prepare a printed wiring board. For this reason, there existed a subject that a manufacturing cost increased by using the design man-hour of the printed wiring board containing multiple types of coil parts, and multiple types of printed wiring boards.

The present invention has been made in consideration of such circumstances, and the object thereof is a printed wiring that is used as a base for easily realizing inductive elements having different specifications by being used alone or by laminating a predetermined number of sheets. It is to provide a substrate.
That is, the present invention uses one or a plurality of printed wiring boards having the same specifications, thereby increasing the degree of freedom in designing induction elements such as planar coils and planar transformers, and designing printed wiring boards including coil portions. An object of the present invention is to provide a printed wiring board capable of realizing a reduction in man-hours and manufacturing costs and an improvement in manufacturing quality, a board laminated body on which the printed wiring board is laminated, and a planar coil and a planar transformer including the printed wiring board or the board laminated body. It is said.

  In order to achieve the above-described object, the printed wiring board according to the present invention has a configuration of a substrate laminate that includes conductor portions on each of the first surface and the second surface that form both surfaces of the insulating substrate, and is formed by laminating a plurality of sheets. A first conductor portion formed on the first surface by forming a loop surrounding a predetermined first region of the first surface; and the second surface overlapping the first region. A second conductor portion formed on the second surface by forming a loop surrounding the second region defined in the above, a third conductor portion provided on the first surface away from the first conductor portion, and the first A fourth conductor portion provided on the second surface away from the two conductor portions; a first conductor portion and the fourth conductor portion provided between both surfaces of the insulating substrate; and the second conductor portion. And first and second inter-surface connection portions respectively connecting the third conductor portions, and the first region The first conductor portion and the third conductor portion, respectively, connected to the first conductor portion and the third conductor portion in a region on one side of the first surface that is divided with a reference line passing through Forming the first and second selective connection portions in a region on the other side of the first substrate that is divided around the reference line. A region that is symmetrical with the region is a non-formation region of the conductor portion.

  Preferably, the first and second regions are defined as opening regions of holes formed in the insulating substrate. In addition, it is desirable that a non-formation region of the conductor portion that is line-symmetric with the formation region of the first and second selective connection portions with the reference line as a center is also an opening region of a hole formed in the insulating substrate.

  Further, the printed wiring board according to the present invention is further provided on the second surface connected to the second conductor portion and used for connection with the second conductor portion in another printed wiring board. And a second inter-substrate connection portion provided on the second surface and connected to the first conductor portion in another printed wiring board, connected to the fourth conductor portion.

  Furthermore, the substrate laminate according to the present invention is a laminate of the above-mentioned plurality of printed wiring boards having the same specifications, and the plurality of printed wiring boards are arranged such that the first surfaces are connected to each other or the second surface. Further, the first region and the second region are stacked on top of each other and are connected to each other through the first and second inter-substrate connecting portions.

  The planar coil according to the present invention includes the printed wiring board or the substrate laminate described above, and the planar transformer according to the present invention includes the plurality of substrate laminates described above, and the plurality of substrates. The planar coils included in each of the laminates are laminated by electromagnetic coupling to each other. The electromagnetic coupling of the planar coil is performed, for example, via a core body that is inserted between holes formed in the first region and the second region across a plurality of substrate laminates.

  According to the printed wiring board having the above-described configuration, basically, the first conductor portion and the second conductor, in which loops are formed on the first surface and the second surface, respectively, simply by connecting the first and second selective connection portions. The units can be easily connected in series. Furthermore, since the region that is line-symmetric with the formation region of the first and second selective connection portions with respect to the reference line is a non-formation region of the conductor portion, the first of the plurality of printed wiring boards having the same specification When the surfaces or the second surfaces are brought into contact with each other and stacked, the selective connection portions of the printed wiring boards in contact with each other do not interfere with each other. Therefore, the first conductor portion and the second conductor portion included in each printed wiring board can be connected in series in order only by connecting a plurality of printed wiring boards via the first and second board connecting portions. it can.

  Accordingly, a plurality of printed wiring boards of the same specification according to the present invention are laminated by bringing the first surfaces or the second surfaces into contact with each other, and each printed wiring board is connected in order. An inductive element such as a planar coil in which the first conductor portion and the second conductor portion of the wiring board are connected in series can be easily realized, and the degree of freedom in designing an inductive element such as a planar coil and a planar transformer is increased. The number of man-hours for designing a printed wiring board including a portion can be reduced. In addition, since only unified printed wiring boards having the same specifications are used, it is possible to realize overall reduction of manufacturing costs and improvement of manufacturing quality including procurement and management of printed wiring boards.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows schematic structure of the printed wiring board based on one Embodiment of this invention, (a) is a perspective view, (b) is a block diagram of 1st surface (A surface), (c) is 2nd surface (B FIG. The figure which shows the example of connection between conductors which forms the flat coil of 1 turn and 2 turns using the printed wiring board shown in FIG. The figure which shows the example of connection between conductors which forms the 3-turn and 4-turn planar coil in the board | substrate laminated body which laminated | stacked two printed wiring boards shown in FIG. The figure which shows the example of a connection structure between the two printed wiring boards laminated | stacked. The figure which shows the example of connection between conductors which forms the 5-turn and 6-turn planar coil in the board | substrate laminated body which laminated | stacked three printed wiring boards shown in FIG. The figure which shows the laminated structure example of three printed wiring boards. It is a figure which shows schematic structure of the printed wiring board which concerns on another embodiment of this invention, (a) is a figure which shows the structure of 1st surface (A surface), (b) is the structure of 2nd surface (B surface). FIG.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a diagram showing a schematic configuration of a printed wiring board according to an embodiment of the present invention, where (a) is a schematic external perspective view of the printed wiring board P, and (b) is a first view of the printed wiring board P. The configuration of the front surface (front surface side: A surface) and (c) shows the configuration of the second front surface (back surface side; B surface) of the printed wiring board P. This printed wiring board P is used as a component of a substrate laminate S formed by being used alone or by laminating a plurality of sheets, and a first surface (A surface) forming both surfaces of an insulating substrate 1 having a predetermined thickness. ) 1a and the second surface (B surface) 1b each have a conductor portion 2 formed by printed wiring.

  As shown in FIG. 1, the insulating substrate 1 that forms the base of the printed wiring board P has a generally symmetrical convex shape around the reference line X, and the reference line X is formed on the convex portion. A rectangular hole (opening) 3 centered at the center is formed. By this hole 3, a rectangular first region 3a for defining a formation region of the planar coil is set on the first surface 1a, and at the same time, a rectangular second region overlapping the first region 3a is formed on the second surface 1b. Area 3b is set.

The conductor portion 2 formed by printed wiring on the first surface (A surface) 1a and the second surface (B surface) 1b of the insulating substrate 1 basically has the first region 3a (hole 3). A first conductor portion 11 provided on the first surface 1a by forming a surrounding loop and a second conductor portion 12 provided on the second surface 1b by forming a loop surrounding the second region 3b (hole 3). Further, a third conductor portion 13 provided on the first surface 1a away from the first conductor portion 11, and a fourth conductor portion 14 provided on the second surface 1b away from the second conductor portion 12 are provided. It consists of.
Here, an example in which a one-turn conductor loop is formed around the hole 3 will be described. However, as will be described later, a first conductor portion 11 and a second conductor portion 12 each having a plurality of turns of a conductor loop are provided. Of course it is possible.

  Specifically, as shown in FIG. 1B, the first conductor portion 11 extends on the first surface 1a from one end of the bottom of the convex insulating substrate 1 to the convex portion, and After one round (1 turn) around the area 3a, the insulating substrate 1 consists of a conductor pattern extending to the other end of the bottom side. Further, as shown in FIG. 1 (c), the second conductor portion 12 is formed on the second substrate 1b by making a round (one turn) around the second region 3b from the vicinity of the second region 3b. It consists of a conductor pattern extending over the bottom side of 1.

  In addition to the first and second conductor portions 11 and 12, the first surface 1a is hung from the vicinity of the first region 3a to the center of the bottom portion of the insulating substrate 1 as shown in FIG. The third conductor portion 13 is provided substantially in parallel with the first conductor portion 11, and the second surface 1b is located at the substantially central portion of the insulating substrate 1 as shown in FIG. A fourth conductor portion 14 is provided so as to cross the third conductor portion 13 across the reference line X described above.

  Incidentally, the first conductor portion 11 and the fourth conductor portion 14 are first vias which are formed by penetrating vias provided between both surfaces of the insulating substrate 1 on the bottom side of the insulating substrate 1 having a convex shape. They are connected via the inter-surface connection part 15. Similarly, the second conductor portion 12 and the third conductor portion 13 are provided by being inserted between both surfaces of the insulating substrate 1 in the vicinity of the hole 3 where the end portion of the third conductor portion 13 is positioned. The connection is made through the second inter-surface connection portion 16 made of the formed through via.

  Further, on the first surface 1 a side of the insulating substrate 1, the first conductor portion 11 and the third conductor portion 13 are arranged close to each other in parallel with each other at the first conductor portion 11 and the third conductor portion 13. First and second selective connection portions (pads) 17 and 18 respectively connected to the third conductor portion 13 are provided close to each other. These selective connection portions 17 and 18 are used for selective connection between the first conductor portion 11 and the third conductor portion 13, and the connection is, for example, a 0Ω chip which is an external connection component. This is realized by mounting a resistor across the selective connection portions 17 and 18. The connection component is not limited to a chip resistance of 0Ω, and for example, a method of electrically connecting selected connection portions by direct soldering or the like may be used.

  In particular, the selective connection portions 17 and 18 are provided in one region of the first surface 1a divided by the reference line X, specifically, in the region on the right side of the reference line X in FIG. Yes. The other region of the first surface 1a divided by the reference line X, specifically, the region where the selective connection portions 17 and 18 are formed in the left region of the reference line X in FIG. In the region, a hole 4 is provided as a conductor non-formation region.

  As will be described later, this hole 4 is formed when two printed wiring boards are overlapped with their first surfaces 1a in contact with each other, that is, when one printed wiring board is overlapped and turned over. It plays the role which exposes the said selective connection parts 17 and 18 in a wiring board to the 2nd surface 1b side of the said printed wiring board. The hole 4 also functions as a relief area (non-interference area) for the above-described connection component mounted on the selective connection portions 17 and 18 of another printed wiring board when the two printed wiring boards are overlapped. .

  On the other hand, the second surface 1b of the printed wiring board P having the above-described configuration is further connected to the second conductor portion 12 and connected to the second conductor portion 12 in another printed wiring board P. A board-to-board connection part (pad) 19 is provided. Further, on the second surface 1b of the printed wiring board P, a second inter-substrate connection part (pad) 20 used for connection to the first conductor part 11 in another printed wiring board P connected to the fourth conductor part 14 is provided. Is provided.

  In particular, the second inter-substrate connection portion 20 is provided at one end of the fourth conductor portion 14, and a hole 5 as a conductor non-formation region is formed on the side portion of the second inter-substrate connection portion 20. Is provided. When the two printed wiring boards are overlapped with the first surfaces 1a being in contact with each other, the holes 5 are formed so that a part of the first conductor portion 11 in another printed wiring board is part of the printed wiring board. It plays a role of exposing to the second surface 1b side.

  An area that is axisymmetric with respect to the hole 5 with respect to the reference line X, and a part of the first conductor portion 11 exposed through the hole 5 as described above is the first conductor. It is set as a third inter-substrate connection portion (pad) 21 used for connection of the fourth conductor portion of the printed wiring board P different from the portion 11 to the above-described second inter-substrate connection portion 20. The third inter-substrate connection portion 21 is a connection region that makes a pair with the second inter-substrate connection portion 20.

  Further, a notch (hole) 6 as a conductor non-formation region is provided on the side of the first inter-substrate connecting portion 19 of the second conductor portion 12 described above. When the two printed wiring boards P are overlapped with the second surfaces 1b coming into contact with each other, the notch 6 is used to place a part of the second conductor portion 12 in another printed wiring board P in the notch 6 It plays a role of exposing to the second surface 1b side of the printed wiring board P. An area that is line-symmetric with the notch 6 around the reference line X and that is exposed through the notch 6 of the second conductor portion 12 as described above is two printed wiring boards. It is set as a fourth inter-substrate connection part (pad) 22 provided for connection between the second conductor parts 12 in P. The fourth inter-substrate connection portion 22 is a connection region that makes a pair with the first inter-substrate connection portion 19.

  Note that both end portions of the first conductor portion 11 and the other end portion of the third conductor portion 13 positioned at the bottom side of the convex insulating substrate 1 described above are external wiring connection portions (pads) 23, 24 and 25 are set. The first surface 1a and the second surface 1b of the printed wiring board P are formed on a solder resist 26, which will be described later, except for the inter-board connecting portions 19, 20, 21, and 22 and the external wiring connecting portions 23, 24, and 25 described above. And insulated from the outside.

Next, a planar coil (planar coil) realized by using the printed wiring board P having the above configuration will be described.
FIG. 2 shows an example in which a one-turn and two-turn planar coil is realized by using one printed wiring board P. In FIG. 2, the conductor portions formed on both surfaces of the printed wiring board P are shown as seen through from one surface side.

  In the case of realizing a one-turn planar coil, the second connection through the first conductor portion 11 from the first external wiring connection portion 23 as shown in FIG. A conductor path indicated by a thick solid line A in the figure reaching the external wiring connection portion 24 is formed. Then, since the 1st conductor part 11 only makes the circumference | surroundings of the circumference | surroundings of the hole 3, the planar coil of 1 turn is implement | achieved here.

  On the other hand, in order to realize a two-turn planar coil, a 0Ω chip resistor 27 as a connecting component is mounted between the selective connection portions 17 and 18 described above, and the first conductor portion 11 and the third conductor portion 13 are connected. To do. Then, as shown in FIG. 2, a conductor path from the first external wiring connecting portion 23 to the selective connecting portion 17 through the first conductor portion 11 and further from the selective connecting portion 18 to the third conductor portion 13 through the chip resistor 27. Form. Since the end portion of the third conductor portion 13 is connected to the second conductor portion 12 on the second surface 1b side via the second inter-surface connection portion 16, the end portion thereof passes through the second conductor portion 12. A conductor path indicated by a thick solid line A and a thick broken line B in the figure is formed to reach the inter-board connecting portion 19. Then, the first conductor portion 11 makes a round around the hole 3, and the second conductor portion 12 overlaps the first conductor portion 11 and makes a round around the hole 3. A planar coil of turns is realized.

  On the other hand, when realizing a three-turn and four-turn planar coil, in addition to the printed wiring board P1 constructed with the two-turn planar coil described above, another one having the same specifications as the printed wiring board P1 (second sheet) This printed wiring board P2 is laminated on the printed wiring board P1. The first printed wiring board P1 is connected to form a two-turn planar coil as shown in FIG.

  Further, the second printed wiring board P2 is turned over with respect to the first printed wiring board P1, and the second surfaces 1b are brought into contact with each other and laminated. That is, as shown in FIG. 3, the second surface 1b of the second printed wiring board P2 is superimposed on the second surface 1b of the first printed wiring board P1. At this time, the holes 3 described above in the two printed wiring boards P1 and P2 are coaxially aligned, and the first conductor portion 11 and the second conductor portion 12 respectively provided in each of the printed wiring boards P1 and P2 are provided. The holes 3 are arranged so as to overlap each other around the hole 3.

  In FIG. 3 as well, the conductor portions provided on both surfaces of each printed wiring board P1, P2 are shown as perspective patterns viewed from the first surface 1a side of the first printed wiring board P1. Then, the first inter-board connection part 19 in the first printed wiring board P1 is connected to the fourth inter-board connection part 22 in the second printed wiring board P2, thereby the first inter-board connection parts 22 in both printed wiring boards P1 and P2. Two conductor portions 12 are connected to each other.

  Then, the second conductor portion 12 in the second printed wiring board P2 is connected to the first conductor portion 11 in the second printed wiring board P2 through the second inter-surface connection portion 16 described above. 3, the second conductor portion 12 is connected to the third conductor portion 13 of the second printed wiring board P2 through the first inter-surface connection portion 16 as indicated by a thick solid line C, whereby the third conductor A conductor path reaching the third external connection region 25 provided at the end of the portion 13 is formed. At this time, since the second conductor portion 12 of the second printed wiring board P2 also makes one round around the hole 3, a three-turn planar coil is combined with the first printed wiring board P1 described above. The realized substrate laminate S is constructed.

  As for the lamination of the two printed wiring boards P1 and P2 and the connection between the two printed wiring boards P1 and P2, as shown schematically in FIG. What is necessary is just to electrically connect between the conductor parts of two printed wiring boards P1 and P2 using the conductive connection members 31 such as conductive films. At this time, if through vias 28 for connecting the conductor portions respectively provided on both surfaces of each printed wiring board P1, P2 are appropriately provided, another printed wiring board as shown in FIG. The connection region with the P conductor portion can be expanded, and the connection reliability can be increased.

  When a four-turn planar coil is realized, a 0Ω chip resistor 27 as a connection component is mounted between the selective connection portions 17 and 18 in the second printed wiring board P2, and the second printed wiring board is mounted. The 1st conductor part 11 and the 3rd conductor part 13 in the board | substrate P2 are connected. Then, a conductor path as shown by a thick broken line D in the figure is added by the third conductor portion 13 in the second printed wiring board P2, and accordingly, the first and second conductor portions 11 in the first printed wiring board P1. , 12 is connected in series to the two-turn planar coil formed by the second and first conductor portions 12 and 11 of the second printed wiring board P2. Then, conductor portions 11 and 12 that surround the hole 3 from the first external wiring connection portion 23 of the first printed wiring board P1 to the first external wiring connection portion 23 of the second printed wiring board P2. A total of four turns of a planar coil is realized.

  Further, in the case of realizing a 5-turn and 6-turn planar coil, in addition to the above-described substrate laminate S of the two printed wiring boards P1 and P2 constructed of the 4-turn planar coil, each printed wiring board described above is further provided. A third printed wiring board P3 having the same specifications as P1 and P2 is laminated. The third printed wiring board P3 is laminated upside down with respect to the second printed wiring board P2 laminated on the first printed wiring board P1. At this time, the holes 3 in the three printed wiring boards P1, P2, and P3 are coaxially aligned with each other, and the first conductor portion 11 and the second conductor provided on the printed wiring boards P1, P2, and P3, respectively. Needless to say, the portions 12 are arranged so as to overlap each other around the hole 3.

  Specifically, the first and second printed wiring boards P1 and P2 are connected to form a four-turn planar coil as shown in FIG. 3 and the two boards as shown in FIG. The first surface 1b of the third printed wiring board P3 is brought into contact with the first surface 1a of the printed wiring board P2 of the eye, and these are superposed. In FIG. 5, as in FIGS. 2 and 3, the conductor portions provided on both surfaces of each printed wiring board P1, P2, P3 are the first surface 1a of the first printed wiring board P1. It is shown as a perspective pattern seen from the side. Then, the third inter-substrate connection part 22 in the second printed wiring board P2 is connected to the second inter-substrate connection part 20 in the third printed wiring board P3, and thereby the second printed wiring board P2 The first conductor portion 11 is connected to the fourth conductor portion 14 in the third printed wiring board P3.

Then, since the fourth conductor portion 14 is connected to the first conductor portion 11 via the first inter-surface connection portion 15 as described above, the third printed wiring as shown by the thick solid line D in FIG. A loop of the fifth turn is formed around the hole 3 by the first conductor portion 11 in the substrate P3.
Then, with respect to the third printed wiring board P3, if a 0Ω chip resistor 27, which is a connecting component, is mounted between the selective connection portions 17 and 18, the first printed wiring board P3 in the third printed wiring board P3 is thereby mounted. Since the second conductor portion 12 is connected to the conductor portion 11 via the second inter-surface connection portion 16 described above, the second conductor portion of the third printed wiring board P3 as shown by a thick broken line E in FIG. 12, a loop of the sixth turn is formed around the hole 3.

  Incidentally, when the printed circuit board laminate S is formed by laminating the three printed wiring boards P1, P2, and P3 as described above, for example, each printed wiring is used by using an E-shaped clamp member 29 as shown in FIG. The convex part side provided with the hole 3 of the substrates P1, P2, P3 is clamped. At this time, the printed wiring boards P1, P2, and P3 are aligned by inserting the central protrusion of the clamp member 29 into the holes 3 of the printed wiring boards P1, P2, and P3, respectively. At this time, in order to increase the inductance value or reduce the leakage magnetic flux, it is preferable to use a member that becomes the core body of the planar coil as the clamp member 29. If such a clamp member (core body) 29 is used, it is also convenient when a planar transformer is realized by magnetically coupling a plurality of planar coils.

  According to the printed wiring board P having the above-described configuration, a plurality of printed wiring boards P having the same specification are alternately turned over, and the first surfaces 1a or the second surfaces 1b are brought into contact with each other and sequentially overlapped. A substrate laminate S is constructed, and a 0Ω chip resistor 27, which is a connection component, is appropriately attached between the selective connection portions 17 and 18, and between the first conductor portions 11 in these printed wiring boards P and second By connecting the conductor portions 12 in order, a planar coil having a desired number of turns can be easily realized.

  Moreover, since the third conductor portion 13 and the fourth conductor portion 14 described above are used and only the conductor portions of the printed wiring board P stacked adjacent to each other are connected, they are introduced in the aforementioned Patent Documents 1 and 2 and the like. Unlike the prior art, there is no need to change the conductor pattern forming the coil portion, the position of the connecting portion, or the like for each printed wiring board. In other words, by using one or more stacked printed wiring boards P of the same specification with the same shape, size, conductor pattern, etc., it is possible to induce a planar coil or a planar transformer with a desired number of turns. Elements can be designed freely, and the degree of design freedom is high. Moreover, since the printed wiring board P having the same specification is used only in a unified manner, the design man-hours of the printed wiring board P as a base can be reduced, and the manufacturing cost for constructing inductive elements such as a planar coil and a planar transformer can be reduced. It can be reduced, and the manufacturing quality can be improved.

  The present invention is not limited to the embodiment described above. For example, the shape of the printed wiring board P, the shape of the components such as the conductor portions formed by the printed wiring on the first surface and the second surface, the arrangement thereof, and the like can be selected in addition to the embodiment.

  In addition, for the first conductor portion 11 and the second conductor portion 12 provided around the hole 3, the number of turns (the number of turns) may be arbitrarily set in advance. FIG. 7 shows an example in which the conductor portions 11 and 12 having two turns are provided around the hole 3, and it is of course possible to provide the conductor portions 11 and 12 having three or more turns. Further, the first and second conductor portions 11 will be described with respect to the conductor patterns of the third and fourth conductor portions 13 and 14 for connecting the first and second conductor portions 11 and 12, positions of inter-surface connection portions, and the like. , 12 are of course determined to have a circular pattern in the same direction.

  Furthermore, in order to define the first region 3a and the second region 3b on the first and second surfaces 1a and 1b, it is needless to say that the hole 3 is not necessarily provided in the insulating substrate 1. It is sufficient to set a region that defines the formation position of the conductor loop (planar coil) by the first and second conductor portions 11 and 12. In addition, the present invention can be variously modified and implemented without departing from the scope of the invention.

P, P1, P2, P3: printed wiring board, S: substrate laminate, 1: insulating substrate, 2: conductor portion, 3 (3a, 3b): hole (first and second regions), 4, 5: hole (Conductor non-formation region), 6: notch (conductor non-formation region), 11: first conductor portion, 12: second conductor portion, 13: third conductor portion, 14: fourth conductor portion, 15, 16, 28: Inter-surface connection portion (through via), 17: First selection connection portion (pad), 18: Second selection connection portion (pad), 19: First inter-substrate connection portion (pad), 20: First 2 inter-substrate connection (pad), 21: third inter-substrate connection (pad), 22: fourth inter-substrate connection (pad), 23, 24, 25: external wiring connection (pad), 26: solder Resist, 27: chip resistance, 29: clamp member, 31: conductive connection member.

Claims (5)

A printed wiring board comprising a conductor portion on each of a first surface and a second surface forming both surfaces of an insulating substrate, and constituting a component of a substrate laminate formed by laminating a plurality of sheets,
A first conductor portion formed on the first surface by forming a loop surrounding a predetermined first region of the first surface;
A second conductor portion provided on the second surface by forming a loop surrounding the second region defined on the second surface so as to overlap the first region;
A third conductor provided on the first surface away from the first conductor, and a fourth conductor provided on the second surface away from the second conductor;
First and second inter-surface connection portions provided across both surfaces of the insulating substrate and connecting the first conductor portion and the fourth conductor portion, and the second conductor portion and the third conductor portion, respectively. ,
The first conductor portion and the first conductor portion are connected to the first conductor portion and the third conductor portion, respectively, in a region on one side of the first surface that is divided with a reference line passing through the first region as a center. Comprising first and second selective connection portions provided for selective connection with three conductor portions;
A region that is symmetrical with the formation region of the first and second selective connection portions in the region on the other side of the first substrate that is divided with the reference line as a center is defined as a non-formation region of the conductor portion. Printed wiring board. The printed wiring board according to claim 1,
Furthermore, a first inter-board connection part provided on the second surface connected to the second conductor part and used for connection with the second conductor part in another printed wiring board;
A printed wiring board, comprising: a second inter-substrate connection portion provided on the second surface and connected to the first conductor portion in another printed wiring substrate, connected to the fourth conductor portion. A substrate laminate in which a plurality of printed wiring boards having the same specifications according to claim 1 or 2 are laminated,
The plurality of printed wiring boards are stacked such that the first surfaces or the second surfaces are brought into contact with each other, and the first region and the second region are overlapped with each other. A substrate laminate, wherein the substrates are connected via a connection portion between two substrates.   The planar coil provided with the printed wiring board of Claim 1 or 2, or the board | substrate laminated body of Claim 3.   A planar transformer comprising the plurality of substrate laminates according to claim 3, wherein the planar coils respectively provided in the plurality of substrate laminates are electromagnetically coupled to each other.

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