JPH1084183A - Soldering jig for surface mount chip - Google Patents

Abstract

PROBLEM TO BE SOLVED: To avoid a defective junction between the lead of a surface mount chip and the land of a board and, further, avoid bridging between adjacent leads. SOLUTION: Partition members 30 are made to protrude toward spaces between respective leads 84 on the sides of a surface mount chip 80 from the sides of a jig main part 20 which presses the surface mount chip 80 against a board 90. When the surface mount chip 80 is pressed for reflow soldering, the respective leads 84 are pressed against corresponding lands 82 on the board 90 and, further, as the partition members 30 are placed between the respective leads 84, bridging between the leads 84 can be avoided.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering jig used for soldering a surface mount device to a substrate.

[0002]

2. Description of the Related Art Conventionally, as a method for soldering a surface mount device to a substrate, for example, there is a method disclosed in Japanese Patent Application Laid-Open No. 2-174191.

As shown in FIG. 7, the upper surface of an element main body 104 of a surface mount element 106 is pressed downward by a load application rod 110, and each lead 102 extending from each side surface of the element main body 104. To each land 12 on the substrate 120.
2, the solder paste applied to each land 122 is heated and melted so that each lead 1
02 is soldered to each land 122.

[0004]

According to the method described above,
Since soldering is performed in a state where the lead 102 is pressed against the land 122, it is possible to prevent a bonding failure between the lead 102 and the land 122. On the other hand, when the amount of the solder paste applied is too large. And load application rod 1
If the load caused by the load 10 is too large, there is a possibility that a bridge may be generated between the adjacent leads 102 due to solder.

SUMMARY OF THE INVENTION Accordingly, the present invention has been made to solve the above-described problem, and it is intended to prevent a bonding failure between a lead of a surface mount element and a land on a substrate side and to provide a bridge between adjacent leads. It is an object of the present invention to provide a jig for soldering a surface mount element which can also prevent the occurrence of the occurrence.

[0006]

According to a first aspect of the present invention, there is provided a jig for soldering a surface-mounted element according to the present invention. Also, when soldering a surface mount element having a plurality of leads having elasticity directed downward and outward to a substrate on which lands are formed at positions corresponding to the leads, the leads are attached to the respective leads. A soldering jig for pressing and urging the surface-mounted element against the substrate so as to be embedded in a solder paste applied to a land, wherein a contact portion with a top surface of the element body is formed on a bottom surface, A jig body for pressing the surface-mounted element toward the substrate,
The jig body is extended from the side of the jig body to between the respective leads on the side of the element body, and a projecting dimension downward from a contact portion of the jig body is larger than a thickness dimension of the element body and A partition member set to be smaller than the height of the surface mount element including the lead.

Further, the protrusion dimension of the partition member may be set substantially equal to the thickness dimension of the element body.

The width of each partition member may be set slightly smaller than the distance between adjacent lands.

Further, it is preferable that the partition member is formed of phenol resin, glass epoxy resin or aluminum.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A soldering jig according to an embodiment of the present invention will be described below.

As shown in FIGS. 1 to 6, the soldering jig is used for soldering the surface mount element 80 to the surface of the substrate 90.

Here, the surface mount element 80 has a plurality of leads 84 extending at equal intervals from each side surface of a flat plate-shaped element main body 82 formed in a substantially rectangular shape in plan view. Each lead 84 is formed of an elastic material, is bent at an intermediate portion thereof, and has a tip portion extending outward at a position lower than the bottom surface of the element body 82.

On the surface of the substrate 90, lands 92 are formed in parallel at respective positions corresponding to the above-described leads 84, and a solder paste 94 is applied on the lands 92 in advance.

The soldering jig 10 is formed of a phenol resin, and is provided at each position between the leads 84 of the surface mount element 80 to be soldered by the jig 10 from the side surface of the flat jig body 20. Correspondingly, a plurality of partition members 30 are extended.

The jig main body 20 has a plan view in which the element main body 8 is viewed.
The contact portion 20 has a substantially square shape slightly smaller than 2 and has substantially the same thickness as the element main body 82, and has a bottom surface that can make surface contact with the upper surface of the element main body 82 of the surface mount element 80.
a. A weight 25 is attached to substantially the center of the upper surface of the jig main body 20, and the entire element main body 82 is pressed downward by the contact portion 20 a of the jig main body 20 using the weight of the weight 25, and Each of the leads 84 can be pressed against each land 82.

The partition member 30 is formed in a substantially L-shape in a side view from the side of the jig body 20 to the lower side thereof. Then, a pair of partition members 3 opposed to each other with the element body 82 interposed therebetween.
0 is equal to the distance between the inner walls of the vertical portion 30a.
And the space surrounded by the inner wall of each vertical portion 30a is finished in a shape corresponding to the element body 82.

As shown in FIG. 3, a vertical dimension D of the vertical portion 30a of the partition member 30 from the bottom surface of the jig main body 20 is larger than a thickness dimension h of the element main body 82. The partition member 30 is finished to have a size smaller than the height dimension of the surface mount element 80, and the width dimension W of each partition member 30 is slightly smaller than the interval dimension S between the adjacent leads 84 (for example, W = 0.8). Approximately 0.9 S or a dimension that can avoid interference with the land 92 (for example, W = approximately 0.7 S).

The protrusion dimension D is a dimension that can suppress the element with an appropriate pressure within the range of h <D ≦ H, that is, when the element 84 is pressed by the soldering jig 10, Is slightly bent, and after the jig 10 is removed, the lead 84 may be set to such an extent that the lead 84 can return to the original shape.

Hereinafter, a method of using the above-mentioned soldering jig 10 will be described. That is, each lead 84 is attached to a substrate 90 on which a solder paste 94 is applied to each land 92 in advance.
Are placed on the lands 92 so that the surface mount elements 80 are mounted. At this time, the surface mount element 80 is temporarily fixed on the substrate 90 due to the adhesiveness of the solder paste 94.

Thereafter, the surface mounting element 80 temporarily fixed on the substrate 90 is set so as to cover the soldering jig 10, and each partition member 30 is connected to the lead 8 of the surface mounting element 80.
4 so as to be interposed.

Thus, the surface mounting element 80 is moved until the soldering jig 10 receives the weight of the weight 25 and the bottom surface of the vertical portion 30 a of the partition member 30 and the bottom surface of the element body 82 contact the upper surface of the substrate 90. Push down toward substrate 90,
As a result, each lead 84 is pressed against each land 92 of the substrate 90, and each lead 84 is embedded in the paste 94 (see FIGS. 4 and 6).

In this state, that is, in a state where the surface mounting element 80 is pressed against the substrate 90 by the soldering jig 10, the solder paste 94 is re-melted in a high-temperature atmosphere, and reflow soldering is performed.

The soldering jig 1 constructed as described above
According to No. 0, when the surface mount element 80 is reflow-soldered to the substrate 90, each lead 84 of the surface mount element 80 is pressed against the land 92 of the substrate 90.
Of the leads 84 and the lands 92 due to the floating of the leads can be prevented. In this reflow soldering, since the partition member 30 is interposed between the adjacent leads 84 and between the lands 92, the leads 84
There is no danger that the solder paste 94 protruding from the lands 92 due to the pressing will cause a solder bridge between the leads 84 and the lands 92.

In particular, since the soldering jig 10 is formed of a phenolic resin, good soldering can be performed without the solder paste 94 heated and melted adhering to the partition member 30.

Further, since the width W of each partition member 30 is set slightly smaller than the spacing S between the leads 92 adjacent to each other, when the leads 84 are pressed against the lands 92, the leads W are pressed. The reflow soldering can be performed at a more accurate position without the position 84 being largely displaced from the land 92.

Although the soldering jig 10 is formed of a phenol resin, other materials which are difficult to be soldered and which can withstand the heat of soldering, such as glass epoxy resin or aluminum, are used. Can be used.

[0027]

As described above, according to the soldering jig according to the first or second aspect of the present invention, a contact portion with the upper surface of the surface mount element main body is formed on the bottom surface, and the surface mount element is mounted on the substrate. A jig body for pressing toward the main body, and extending from the side of the jig body to between the respective leads on the side of the element body, and a projecting dimension downward from a contact portion of the jig body is A partition member that is set to be larger than the thickness dimension of the element body and smaller than the height dimension of the surface mount element including the leads, so that the leads are pressed against the lands and bonding failure between them is reduced. At the same time, since the partition member is interposed between the leads, it is possible to prevent the occurrence of a bridge therebetween.

If the width of each partition member is set slightly smaller than the distance between adjacent lands, the leads are pressed against the lands when the leads are pressed against the lands. Soldering can be performed at an accurate position without displacement from the land.

Further, when the partition member is formed of phenol resin, glass epoxy resin or aluminum, good soldering can be performed without the solder paste heated and melted adhering to the partition member. Can be.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a soldering jig according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a state in which the soldering jig is set on a surface mount element.

FIG. 3 is an enlarged sectional view of a main part of the soldering jig according to the first embodiment.

FIG. 4 is an essential part enlarged cross-sectional view showing a state in which the soldering jig is set on a surface mount element.

FIG. 5 is an enlarged front view of a main part showing the soldering jig same as above.

FIG. 6 is an enlarged front view showing a state where the soldering jig is set on a surface mount element.

FIG. 7 is a perspective view showing a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Soldering jig 20 Jig main body 20a Contact part 30 Partition member 80 Surface mount element 82 Element main body 84 Lead 90 Substrate 92 Land 94 Solder paste

Claims (4)

[Claims] 1. A surface mount device having a plurality of resilient leads extending from a side surface of a plate-shaped element main body to an outer side below a bottom surface of the element main body at positions corresponding to the respective leads. When soldering to the substrate on which the lands are formed, a soldering jig for pressing and urging the surface mount element against the substrate so as to embed the respective leads in the solder paste applied to the lands. A jig main body for pressing the surface-mounted element toward the substrate, a jig main body having a contact portion with the upper surface of the element main body formed on the bottom surface, and a jig main body side from the side of the jig main body. And extending downwardly from the contact portion of the jig body, the protrusion dimension is larger than the thickness dimension of the element body and is greater than the height dimension of the surface mount element including the leads. Set small Jig soldering surface mount element characterized in that a switching member. 2. The jig for soldering a surface mount element according to claim 1, wherein the projecting dimension of the partition member is set to be substantially the same as the thickness dimension of the element body. 3. The soldering of a surface mount device according to claim 1, wherein a width dimension of each partition member is set slightly smaller than a spacing dimension of each adjacent lead. Jig. 4. The jig according to claim 1, wherein the partition member is formed of phenol resin, glass epoxy resin, or aluminum.