JPH1083937A - Layered electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To arrange an electrode for capacitance correction use on the center part in the layer direction of a layerd material, to relax concentration of a thermal stress on the electrode in a firing process and to prevent the generation of a delamination between the electrode for capacitance correction use and an insulator. SOLUTION: A layered capacitor 1 is one fired integrally in such a way as to stack a dielectric sheet 2 with internal electrodes 3 and 4 provided on the surface, a dielectric sheet 2 with an electrode 5 for capacitance correction use provided on the surface and the like. The electrode 5 is arranged on the center part in the thickness direction (the laminating direction of the laminated material) of the capacitor 1 and the capacitor 1 is structually provided in a vertically symmetrical state in the thickness direction.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a multilayer electronic component,
In particular, the present invention relates to a multilayer electronic component such as a capacitor or a varistor having an electrode for correcting characteristics such as capacitance.

[0002]

2. Description of the Related Art For example, a structure shown in FIG. 5 is known as a structure of a multilayer capacitor that requires a narrow deviation capacitance. This multilayer capacitor 21 has internal electrodes 2
A stacked body is formed by stacking the dielectrics 22, 24 and the dielectric 22, and a capacitance correction electrode 25 is arranged on the outermost layer of the internal electrodes 23, 24. The area of the capacitance correction electrode 25 is set smaller than the areas of the internal electrodes 23 and 24. A capacitance is formed between the internal electrodes 23 and 24, and a capacitance for fine adjustment is formed between the internal electrode 23 and the capacitance correction electrode 25.

[0003]

However, in the conventional multilayer capacitor 21, the internal electrodes 23 and 24 are not provided.
When laminating the dielectric material 22 and the capacitance correction electrode 25 and firing them integrally, the delamination 26 may be generated between the capacitance correction electrode 25 and the dielectric 22. The thermal stress is concentrated on the capacitance correcting electrode 25 because the capacitance correcting electrode 25 is arranged in the outermost layer and the difference in thermal shrinkage between the capacitance correcting electrode 25 and the dielectric 22 is large. It is thought to be from.

When the multilayer capacitor 21 is soldered to a circuit board or the like, a surface portion opposite to the surface portion on which the capacitance correction electrode 25 is disposed (the upper surface portion in FIG. 5) (FIG. 5). A thermal crack may occur in the multilayer capacitor 21 due to a difference in thermal stress in the lower surface portion of FIG. 5). Therefore, an object of the present invention is to provide a multilayer electronic component having excellent heat resistance.

[0005]

In order to achieve the above object, a laminated electronic component according to the present invention is characterized in that the capacitance correcting electrode is arranged at the center of the laminated body in the laminating direction. I do.

[0006]

According to the above arrangement, the difference in the thermal contraction rate between the capacitance correcting electrode and the dielectric is reduced, and the concentration of thermal stress on the capacitance correcting electrode is prevented.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of a multilayer electronic component according to the present invention will be described with reference to the accompanying drawings.
In the present embodiment, a multilayer capacitor will be described as an example. As shown in FIG. 1, the multilayer capacitor 1 includes a dielectric sheet 2 having internal electrodes 3 and 4 provided on the surface thereof, a dielectric sheet 2 having capacitance correcting electrodes 5 provided on the surface, and a dielectric layer 2 having a protective layer. It is composed of a body sheet 2 and the like. As a material of the dielectric sheet 2, a resin such as epoxy or a ceramic dielectric is used.

The internal electrode 3 is formed in a wide area on the surface of the dielectric sheet 2, and a lead portion 3 a thereof is exposed on the right side of the sheet 2. Similarly, the internal electrode 4 is formed in a wide area on the surface of the dielectric sheet 2, and the lead portion 4 a is exposed on the left side of the sheet 2. The capacitance correction electrode 5 is formed on substantially the left half of the surface of the dielectric sheet 2, and a lead portion 5 a thereof is exposed on the left side of the sheet 2. The area of the capacitance correction electrode 5 is set smaller than the area of the internal electrode 4. The electrodes 3 to 5 are made of Ag-Pd, Ag, Pd, Ni, C
u, etc., sputtering method, vacuum evaporation method,
It is formed by any method such as a printing method.

After the dielectric sheets 2 are stacked as shown in FIG. 1, they are integrally fired to form a laminate.
As shown in FIGS. 2 and 3, external electrodes 10 and 11 are formed on the left and right side surfaces of the laminate. External electrode 10,
11 is formed by an arbitrary method such as a sputtering method, a vacuum evaporation method, a coating method, and the like, and is made of Ag-Pd, Ag, Pd,
It is made of a material such as i or Cu. The external electrode 10 is provided with a lead portion 4 a of the internal electrode 4 and a lead portion 5 a of the capacitance correction electrode 5.
The external electrode 11 is electrically connected to the lead portion 3 a of the internal electrode 3.

The multilayer capacitor 1 thus obtained is
A main capacitance is formed between the internal electrodes 3 and 4, and a capacitance for fine adjustment is formed between the internal electrode 3 and the capacitance correction electrode 5. The capacitance correcting electrode 5 is arranged at the center in the thickness direction of the capacitor 1 (the laminating direction of the laminate), and the capacitor 1 is structurally vertically symmetrical in the thickness direction. That is, the structure is well balanced with respect to the heat shrinkage action and is resistant to heat stress. Therefore, when the internal electrodes 3 and 4, the dielectric sheet 2 and the capacitance correcting electrode 5 are stacked and fired integrally, the concentration of thermal stress on the capacitance correcting electrode 5 is reduced, and the capacitance correcting electrode 5 and the dielectric 2 can be prevented from delamination. further,
When soldering this capacitor 1 to a circuit board or the like,
No thermal crack or the like occurs in the capacitor 1.

[Other Embodiments] The multilayer electronic component according to the present invention is not limited to the above-described embodiment, but can be variously modified within the scope of the invention. The capacitance correcting electrode 5 does not necessarily have to be arranged exactly at the center of the stack in the stacking direction. Also, as shown in FIG.
In the same layer (or an adjacent layer) as the capacitance correction electrode 5,
The dummy electrodes 6 may be arranged so as to be juxtaposed to the capacitance correction electrodes 5 to further reduce the concentration of thermal stress on the capacitance correction electrodes 5. In this case, the dummy electrode 6 is electrically connected to the external electrode 11.

The electronic component may be a multilayer varistor or the like in addition to the multilayer capacitor. further,
In the above embodiment, the sheets are stacked and then integrally fired, but the invention is not necessarily limited to this. For example, an electronic component having a laminated structure may be obtained by sequentially applying a paste-like insulator material or a conductor material by a method such as printing, drying, and applying the paste again.

[0013]

As is apparent from the above description, according to the present invention, since the capacitance correcting electrode is disposed at the center of the laminate in the stacking direction, the heat stress concentration on the capacitance correcting electrode during the firing process. Is reduced, and delamination between the capacitance correcting electrode and the insulator can be prevented. Further, even when the multilayer electronic component is soldered to a circuit board or the like, it is possible to avoid a thermal crack or the like from occurring in the multilayer electronic component.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing an embodiment of a multilayer electronic component according to the present invention.

FIG. 2 is an exemplary perspective view showing the appearance of the multilayer electronic component shown in FIG. 1;

FIG. 3 is a sectional view taken along the line III-III of FIG. 2;

FIG. 4 is a sectional view showing another embodiment.

FIG. 5 is a sectional view showing a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Multilayer capacitor 2 ... Dielectric sheet 3, 4 ... Internal electrode 5 ... Capacitance correction electrode

Claims (1)

[Claims] 1. A multilayer electronic component in which an internal electrode and an insulator are stacked to form a multilayer body, wherein a capacitance correcting electrode is arranged at a central portion of the multilayer body in the stacking direction. Laminated electronic components.