JPH1082827A - Ic evaluating jig - Google Patents

Abstract

PROBLEM TO BE SOLVED: To accurately evaluate the electric characteristic of an IC by bringing the IC lead portion of the IC chip into pressure-contact with a transmission line on a printed board with a press section made of a transparent material, and electrically connecting them. SOLUTION: A printed board 8 is stored at the bottom of a metal case 7, and a transmission line 9 constituted of a power wire and a signal wire is arranged on it. An IC chip 1 is mounted on a recess 10 on the printed board 8 so that an IC lead 4 is nearly overlapped on the tip section of the transmission line 9. The other end section of the transmission line 9 is connected to an external measuring device via a connector 11 provided on the wall of the metal case 7. The cover 12 of the metal case 7 is made of a transparent material so that the IC lead 4 and the tip section of the transmission line 9 can be seen from the outside. A press section constituted of a transparent lug 13 pressing the IC lead is provided inside the cover 12, and the position of the IC chip 1 can be adjusted by a rod 15 inserted through a hole 14 at the center section of the cover 12. The IC chip 1 and the transmission line 9 can be simply positioned.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC evaluation jig, and more particularly, to a method for evaluating the electrical characteristics of a semiconductor integrated circuit chip (hereinafter abbreviated as an IC chip), mounting the IC chip on the IC chip. The present invention relates to an apparatus (hereinafter, abbreviated as an IC evaluation jig) having a line for supplying power to a chip, applying an input thereto, and extracting an output from an IC chip.

[0002]

2. Description of the Related Art In order to evaluate the electrical characteristics of ICs, I
C evaluation jigs are widely used.

In an IC evaluation jig, it is necessary to quickly replace a large number and various kinds of IC chips to be evaluated, or to connect to a power supply line and an input / output line of a measuring device. For this reason, as shown in FIG. 1, a conventional IC evaluation jig usually includes a connection pin (IC lead) 4 of the IC chip 1 on the pedestal 2 having the power supply line and the input / output line (socket electrode) 3. A means for applying pressure from above by means of a lid 5 is provided so that the wire and the input / output wire 3 are placed at predetermined positions and the connection portion does not shift during measurement. Further, in order to roughly position the IC chip 1 and prevent the displacement, a position setting means such as a depression of the shape of the IC chip 1 is provided in a portion of the pedestal 2 on which the IC chip 1 is placed.

[0004]

SUMMARY OF THE INVENTION I operating at very high frequencies
When evaluating the electrical characteristics of C, it is liable to be affected by the impedance of the transmission line, so it is required to evaluate it under the same conditions as when an IC is incorporated in an actual device.
When the connection is made using the IC evaluation jig shown in FIG. 1, the inductive component (inductance) of the portion electrically connected to the IC lead 4 becomes large (usually 5 nH or more), and the electrical characteristics of the IC at the ultra-high frequency are correctly adjusted. It is difficult to evaluate. For this reason, an IC is mounted on a printed circuit board provided with a transmission line for an input / output portion and a power supply portion, and evaluation is performed.
As shown in FIG. 2, a microstrip line composed of a wide ground electrode, a dielectric printed board, and a narrow ribbon conductor is often used as a transmission line for transmitting an input / output signal of an IC evaluation jig.

However, when a microstrip line is used in a portion for transmitting an input / output signal of an IC evaluation jig, an IC
Since there is a difference between the depression of the shape of the IC chip 1 of the evaluation jig and the shape of the IC chip 1, it is necessary to adjust the IC lead 4 to exactly match the conductor of the microstrip line.
In the conventional device, the positioning of the IC chip 1 is difficult or a complicated adjustment mechanism is required.

SUMMARY OF THE INVENTION An object of the present invention is to provide an IC evaluation jig that can accurately evaluate the electrical characteristics of an IC with a simple mechanism without deteriorating high-frequency characteristics.

[0007]

In order to achieve the above object, an IC evaluation jig according to the present invention has a recess for mounting an IC chip, and electrically connects an IC lead portion of the IC chip around the recess. The printed circuit board includes a printed circuit board having a transmission line portion for directly connecting, and a pressing portion for pressing the IC lead portion against the transmission line, and the pressing portion is formed of a transparent material. The pressing portion may be fixedly attached to a lid that stores the IC chip and a printed circuit board.
The pressing portion may be movable by an alignment adjustment mechanism provided separately.

The IC evaluation jig of the present invention can be realized by providing a complicated positioning mechanism on a printed circuit board. However, the cover pressing portion is made transparent so that the IC lead and the transmission line portion on the printed circuit board can be realized. Is visible from above, it is possible to accurately and easily match and press the IC lead portion of the IC chip on a narrow transmission line having a predetermined shape such as a microstrip line. In addition, if a microstrip line is used, the inductance component can be greatly reduced, and the electrical characteristics of the IC can be correctly evaluated without deteriorating the characteristics of the high-frequency IC.

[0009]

Embodiments of the present invention will now be described with reference to the drawings. <Embodiment 1> FIGS. 3 and 4 show an embodiment of the present invention, respectively.
1A and 1B show a perspective view and a side cross section showing the configuration of an embodiment of a C evaluation jig. As shown in the figure, a printed circuit board 8 is built in the bottom of a metal box 7, and transmission lines 9 for power supply wiring and signal wiring are arranged on the printed circuit board 8. IC of printed circuit board 8
The chip arrangement portion is provided with a depression 10 having a shape slightly larger than the shape of the IC chip 1. IC chip 1
The recess 10 and the transmission line 9 are arranged such that the IC leads 4 of the IC chip 1 substantially overlap at the tip of the transmission line 9 when placed in the recess 10. The other end of the transmission line 9 is a connector 1 provided on the wall of the metal box 7.
1 is connected to an external measuring device (not shown).

In this embodiment, the lid 12 of the metal box 7 is made of a transparent material so that the IC lead 4 of the IC chip 1 can see the tip of the transmission line 9 from outside the lid 12.
Further, on the inside of the lid 12, at least a pressing portion made of a transparent material projection 13 (a square tube in this embodiment) for pressing the IC lead 4 portion of the IC chip 1 is provided. Lid 1
2, that is, a hole 14 in the upper part of the IC chip 1.
Is provided, and the position of the IC chip 1 can be manually adjusted by the rod 14 passing through the hole 14. IC
When the IC lead 4 of the chip 1 reaches a predetermined position at the tip of the transmission line 9, the lid 12 is fixed to the metal box 7 with the screw 16.

In the above embodiment, the entire lid 12 is made of a transparent material. However, only the portions necessary for viewing the IC leads 4 of the IC chip 1 are made of a transparent material, and the surroundings are made of metal so that the mechanical strength is enhanced. Is also good.

<Embodiment 2> FIG. 5 is a side sectional view showing the configuration of another embodiment of an IC evaluation jig according to the present invention. In the present embodiment, the pressing portion 13 is formed independently of the lid or the box 7, and the position of the IC chip 1 is simultaneously adjusted by adjusting the position of the pressing portion 13 by the alignment mechanism 17. 3 and 4 are denoted by the same reference numerals and will not be described. The configuration of the alignment mechanism 17 is an IC that can be seen through the transparent pressing portion 13.
It may be configured to be manually driven while observing the state of the lead 4 and the strip line conductor, or to perform automatic control by pattern matching by optically detecting the state of the IC lead 4 and the strip line conductor. You may do so.

[0013]

When the IC lead of the IC chip 1 is connected to an external measuring device via a transmission line such as a microstrip line, the mutual positioning of the IC lead and the microstrip line is easily controlled. Can be. In particular, the present invention is effective for a jig in which the IC chip 1 is simply mounted on a printed board having a microstrip line, and the IC lead and the conductor of the microstrip line are electrically connected by pressure.

[Brief description of the drawings]

FIG. 1 is a side sectional view showing the structure of a conventional IC evaluation jig.

FIG. 2 is a perspective view of a transmission line (microstrip line) used for an IC evaluation jig.

FIG. 3 is a perspective view showing a configuration of an embodiment of an IC evaluation jig according to the present invention.

FIG. 4 is a side sectional view showing a configuration of an embodiment of an IC evaluation jig according to the present invention.

FIG. 5 is a side sectional view showing the configuration of another embodiment of the IC evaluation jig according to the present invention.

[Explanation of symbols]

1: IC chip, 2: pedestal, 3: socket electrode, 4: I
C lead, 5: lid, 6: rotating shaft, 7: box, 8: printed circuit board, 9: transmission line, 10: depression, 11: connector,
12: rod, 13: transparent projection, 14: hole, 15: rod, 1
6: screw, 17: alignment mechanism.

Claims (5)

[Claims] 1. An IC having a transmission line for accommodating an IC chip to be evaluated and connecting an IC lead wire of the IC chip to the outside.
A C evaluation jig for electrically contacting a pedestal on which the IC chip is mounted, an IC lead wire of the IC chip mounted on the pedestal, and an end of the transmission line on the IC chip side. An IC evaluation jig characterized by having a transparent solid pressing portion for pressing the IC. 2. The base is a bottom surface of a metal box, the pressing portion is attached to a cover of the metal box, and at least a portion of the cover to which the transparent solid is attached is made of a transparent material. The IC evaluation jig according to claim 1, wherein: 3. An IC evaluation jig according to claim 2, wherein a hole is provided in a part of said lid for inserting a position control device of said IC chip. 4. The apparatus according to claim 1, further comprising: detecting means for detecting the positions of the IC lead wire and the transmission line via the pressing portion; and an alignment mechanism for controlling the position of the transparent solid by an output of the detecting means. I according to claim 1, characterized in that:
C evaluation jig. 5. The IC evaluation jig according to claim 1, wherein said transmission line is a microstrip line formed in a printed circuit board shape.