JP4664492B2

JP4664492B2 - Connector, semiconductor component mounting device

Info

Publication number: JP4664492B2
Application number: JP2000393703A
Authority: JP
Inventors: 茂村山; 雅則金子
Original assignee: Advantest Corp
Current assignee: Advantest Corp
Priority date: 2000-12-25
Filing date: 2000-12-25
Publication date: 2011-04-06
Anticipated expiration: 2020-12-25
Also published as: JP2002198139A

Description

【０００１】
【発明の属する技術分野】
本発明は、コネクタ及び半導体部品取付装置に関する。特に本発明は、容易に嵌合させることができ、また、精度よく信号を伝搬させることができるコネクタ及び半導体部品取付装置に関する。
【０００２】
【従来の技術】
従来の半導体部品取付装置は、半導体部品が挿入されるソケットボード部と、当該ソケットボードとケーブルを介して電気的に接続されるマザーボード部とを備える。当該ケーブルは、ソケットボード部及びマザーボード部に対して半田付けされることによりソケットボード部とマザーボード部とを電気的に接続する。
【０００３】
【発明が解決しようとする課題】
近年の半導体部品の高度化・複雑化に伴い、半導体部品が格納されるパッケージが多様化し、また、パッケージされた半導体部品のピン数も様々である。そのため、例えば半導体部品を試験する試験装置においては、ピン数やパッケージの種類が異なる半導体部品を試験する必要がある。
【０００４】
しかしながら従来の半導体部品取付装置においては、半導体部品が挿入されるソケットボード部及びマザーボード部が、ケーブルと半田により接合されているため、パッケージの異なる半導体部品を試験する場合において、半導体部品取付装置全体を交換する。従来の半導体部品取付装置では、半導体部品取付装置の交換が長い時間を要し、試験時間を増大させ、しいては試験コストの増大を招くため、容易に交換することができる半導体部品取付装置が望まれていた。
【０００５】
更に種々のパッケージに格納された半導体部品を試験するには、各々のパッケージ等の種類に対応する半導体部品取付装置を用意する必要がある。半導体部品取付装置は非常に高価であり、従来の半導体部品取付装置では、各々のパッケージ等に対応する半導体部品取付装置を用意する必要があるため、試験コストが増大するという問題を生じていた。
【０００６】
そこで本発明は、上記の課題を解決することのできるコネクタ及び半導体部品取付装置を提供することを目的とする。この目的は特許請求の範囲における独立項に記載の特徴の組み合わせにより達成される。また従属項は本発明の更なる有利な具体例を規定する。
【０００７】
【課題を解決するための手段】
即ち、本発明の第１の形態によると、信号が伝搬するソケット信号端子板及びソケット接地端子板を有するソケット部と、ソケット部に挿入されることによりソケット部と嵌合され、ソケット信号端子板と電気的に接続される第１プラグ信号端子板、及び第１プラグ信号端子板を挟んで設けられた第１プラグ接地端子板及び第２プラグ接地端子板を有し、ソケット接地端子板と電気的に接続されるプラグ部とを備えたことを特徴とするコネクタを提供する。
【０００８】
また、第１プラグ信号端子板と、第１プラグ接地端子板及び第２プラグ接地端子板との間に挿入されることにより、第１プラグ信号端子板をソケット信号端子板に押圧し、第１プラグ接地端子板及び第２プラグ接地端子板をソケット接地端子板に押圧するスライダを更に備えたことが望ましい。
【０００９】
また、スライダは、プラグ部がソケット部に挿入される方向と略垂直な方向に第１プラグ信号端子板、第１プラグ接地端子板及び第２プラグ接地端子板を押圧することが好ましく、また、スライダは、第１プラグ信号端子板と、第１プラグ接地端子板及び第２プラグ接地端子板の少なくとも一方とを押圧する第１突出部及び第２突出部を有することが好ましい。
【００１０】
また、第１突出部は、第１プラグ接地端子板とソケット信号端子板との間に挿入されることにより、プラグ接地端子板を第２ソケット接地端子板に押圧し、第２突出部は、第１プラグ信号端子板と第２プラグ接地端子板との間に挿入されることにより、第１プラグ信号端子板をソケット信号端子板に押圧し、第２プラグ接地端子板を第３ソケット接地部に押圧することが好ましい。
【００１１】
また、第１突出部及び第２突出部の幅は、スライダが第１プラグ接地端子板及び第２プラグ接地端子板との間に挿入される方向に沿って細くなるように形成されるのが好ましい。
【００１２】
プラグ部は、ソケット信号端子板を挟んで第１第１プラグ信号端子板に対向するように設けられ、ソケット信号端子板に電気的に接続される第２プラグ信号端子板を更に有することが望ましい。
【００１３】
また、ソケット接地端子板は、互いに対向する第１接地面及び第２接地面を有するコの字形状を有し、ソケット信号端子板は、第１接地面と第２接地面との間に設けられており、第１プラグ信号端子板及び第１プラグ接地端子板は、ソケット信号端子板と第１接地面との間に対向して設けられ、第２プラグ信号端子板及び第２プラグ接地端子板は、ソケット信号端子板と第２接地面との間に対向して設けられることが好ましい。
【００１４】
また、スライダは、第１プラグ信号端子板と第１プラグ接地端子板との間、及び第２プラグ信号端子板と第２プラグ接地端子板との間に挿入されることにより、第１プラグ信号端子板及び第２プラグ信号端子板をソケット信号端子板の両側からソケット信号端子板に押圧し、第１プラグ接地端子板を第１接地面に押圧し、第２プラグ接地端子板を第２接地面に押圧することが好ましい。
【００１５】
また、信号が伝搬する芯線と、芯線の周囲に芯線と絶縁されて設けられたシールド線とを有する同軸ケーブルを更に備え、芯線は、第１プラグ信号端子板に電気的に接続され、シールド線は、第１プラグ接地端子板及び第２プラグ接地端子板に電気的に接続されるのが望ましい。
【００１６】
本発明の第２の形態によると、半導体部品が接続される半導体部品取付装置であって、半導体部品が挿入され、半導体部品に供給する信号が伝搬するソケット信号端子板及びソケット接地端子板を含むソケット部を有するソケットボード部と、ソケット部に挿入されることによりソケット部と嵌合され、ソケット信号端子板と電気的に接続される第１プラグ信号端子板、及び第１プラグ信号端子板を挟んで設けられた第１プラグ接地端子板及び第２プラグ接地端子板を有し、ソケット接地端子板と電気的に接続されるプラグ部を有するマザーボード部とを備えたことを特徴とする半導体部品取付装置を提供する。
【００１７】
マザーボード部は、第１プラグ信号端子板と、第１プラグ接地端子板及び第２プラグ接地端子板との間に挿入されることにより、第１プラグ信号端子板をソケット信号端子板に押圧し、第１プラグ接地端子板及び第２プラグ接地端子板をソケット接地端子板に押圧するスライダを更に有することが好ましい。また、複数のスライダを駆動する駆動部を更に備えるのが好ましい。
【００１８】
なお上記の発明の概要は、本発明の必要な特徴の全てを列挙したものではなく、これらの特徴群のサブコンビネーションも又発明となりうる。
【００１９】
【発明の実施の形態】
以下、発明の実施の形態を通じて本発明を説明するが、以下の実施形態はクレームにかかる発明を限定するものではなく、又実施形態の中で説明されている特徴の組み合わせの全てが発明の解決手段に必須であるとは限らない。
【００２０】
図１は、本発明の一実施形態に係る半導体部品取付装置１００を示す。半導体部品取付装置１００は、半導体部品９０が挿入されるソケットボード部１１２と、ソケットボード部１１２と嵌合され、電気的に接続されるマザーボード部１２２とを備える。ソケットボード部１１２は、挿入された半導体部品９０に供給する信号が伝搬するソケット部、及び挿入された半導体部品に当該信号を供給すべくソケット部に電気的に接続された配線基板を含む複数のソケットボード１１０を有する。また、マザーボード部１２２は、ソケットボード１１０に含まれる当該ソケット部と嵌合するプラグ部、当該ソケット部と当該プラグ部とを嵌合させるためのスライダ、及び当該プラグ部を格納するハウジングを含む複数のボードスペーサ１２０を有する。
【００２１】
また、半導体部品取付装置１００は、複数の当該スライダを連結する複数のスライダ連結部１３０と、複数のスライダ連結部１３０を連動させるスライダ連動部１３２とを更に備える。当該スライダ連結部１３０及びスライダ連動部１３２は、ソケットボード部１１２に含まれる複数のスライダを一括して駆動する手段であってよい。
【００２２】
半導体部品取付装置１００は、例えば半導体部品を試験する試験装置等の半導体部品と９０電気的に接続される装置に接続される。また、ボードスペーサ１２０が有するプラグ部の一端は、当該プラグ部と試験装置とを電気的に接続する同軸ケーブルに接続される。そして、当該試験装置は、半導体部品９０を試験するための試験信号を半導体部品に供給し、また、半導体部品９０から出力された出力信号を受け取り、半導体部品９０の良否を判定する。
【００２３】
各々のソケットボード１１０は、複数のソケット部を有するのが好ましく、また、各々のボードスペーサ１２０は、複数のプラグ部を有するのが好ましい。更に、ソケットボード１１０が有するソケット部の数と、ボードスペーサ１２０が有するプラグ部の数とは等しいことが好ましい。
【００２４】
そして、図１（ａ）に示すように、ソケットボード部１１２は、半導体部品９０が挿入される側と反対の側において、マザーボード部１２２と嵌合する。そして、スライダ連動部１３２を駆動することにより、スライダ連結部１３０に連結されたスライダを駆動する。そして、各々のスライダがプラグ部を押圧することにより、ソケット部とプラグ部とを接触させる。プラグ部、ソケット部、及びスライダの構成及び動作については、図３及び図４において詳述する。
【００２５】
図１（ｂ）及び（ｃ）は、スライダ連結部１３０及びスライダ連動部１３２を示す。図１（ｂ）に示すようにスライダ連動部１３０は、複数のスライダ連結部１３０を駆動する偏心カムであるのが好ましい。本実施例においてスライダ連結部１３０は、スライダ連結部１３０と嵌合し、スライダ連結部１３０を滑動させる嵌合部１３４を有する。ここで嵌合部１３４は、円弧形状を有する溝部又は開口部であることが好ましい。そして、例えばアクチュエータ等の駆動手段により、スライダ連動部１３２を所定の方向に駆動する。当該所定の方向は、スライダ連結部１３０の長手方向と略垂直な方向であるのが好ましい。そして、スライダ連結部１３０は、嵌合部１３４において滑動することにより、スライダ連動部１１３２が移動する方向と略垂直な方向に移動する。更に各々のスライダ連結部１３０が、当該スライダ連結部１３０に連結されたスライダを駆動することにより、ソケットボード１１０が有するソケット部と、ボードスペーサ１２０が有するプラグ部とを嵌合させる。
【００２６】
図１（ｃ）に示すように、スライダ連結部１３０は、スライダ連動部１３２に固定されるように設けられてもよい。このとき、例えばアクチュエータ等の駆動手段により、スライダを移動させる方向と略平行な方向に、スライダ連動部１３２を駆動することにより、スライダ連結部１３０を当該略平行な方向に移動させる。そして、各々のスライダ連結部１３０が、当該スライダ連結部１３０に連結されたスライダを駆動することにより、ソケットボード１１０が有するソケット部と、ボードスペーサ１２０が有するプラグ部とを嵌合させる。
【００２７】
マザーボード部１２２が、スライダ連結部１３０及びスライダ連動部１３２を有することにより、各々のボードスペーサ１２０に含まれるスライダを一括して駆動させることができる。また、スライダ連動部１３２が偏心カム機構を有することにより、精度良くスライダを駆動させることができる。
【００２８】
図２は、ソケットボード１１０及びボードスペーサ１２０の他の例を示す。本実施例においてソケットボード１１０及びボードスペーサ１１０は、スライダ４０と、スライダ４０を外部に設けられた治具１４０を用いて駆動するための嵌合部１３８とを有する。図２（ａ）に示すように、嵌合部１３８において、治具１４０を用いて回転運動を直線運動に変換することにより、スライダを駆動させてもよい。
【００２９】
また、図２（ｂ）に示すように、治具１４０は、複数のスライダを一括して駆動する機構であってよい。本実施例においては、回転運動を直線運動に変換して治具１４０を駆動する治具駆動部１４２を更に有し、治具駆動部１４２を回転させることによりスライダを駆動し、複数のスライダを一括して駆動する。
【００３０】
図３は、本発明の一実施形態に係るコネクタ１０を示す。図３（ａ）は、ソケット部２０と、ソケット部２０と嵌合することによりプラグ部３０を有するコネクタ１０を示す。図１において説明したソケットボード１１０が有するソケット部は、図３におけるソケット部２０と略同一の構造及び機能を有してよく、また、ボードスペーサ１２０が有するプラグ部は、図３におけるプラグ部３０と略同一の構造及び機能を有してよい。
【００３１】
ソケット部２０は、信号が伝搬するソケット信号端子板２２及びソケット接地端子板２４を有する。また、プラグ部３０は、ソケット部２０に挿入されたときに、ソケット信号ソケット信号端子板２２と電気的に接続される第１プラグ信号端子板３２及び第２プラグ信号端子板３３と、第１プラグ信号端子板３２を挟んで設けられ、ソケット接地端子板２４と電気的に接続される第１プラグ接地端子板３４及び第２プラグ接地端子板３５と、第１プラグ信号端子板３２、第２プラグ信号端子板３３、第１プラグ接地端子板３４、及び第２プラグ信号接地端子板３５が設けられるプラグ端子台３６とを有する。
【００３２】
また、コネクタ１０は、当該コネクタ１０に信号を供給、又は当該コネクタ１０から信号が供給される芯線及び当該芯線の周囲に当該芯線と絶縁して設けられたシールド線とを有する同軸ケーブル３８を更に備えてもよい。このとき、当該芯線は、プラグ端子台３６において、第１プラグ信号端子板３２及び第２プラグ信号端子板３３と電気的に接続される。また、当該シールド線は、プラグ端子台３６において、第１プラグ接地端子板３４及び第２プラグ信号接地端子板３５と電気的に接続される。そして、コネクタ１０は、同軸ケーブル３８から供給された信号を、ソケット信号端子板２２に電気的に接続された配線等に供給し、また、当該配線等から供給された信号を、同軸ケーブル３８に供給する。図１に示す半導体部品取付装置１００においては、試験装置から供給された信号を、ソケットボード１１０に挿入された半導体部品９０に供給することができる。
【００３３】
ソケット接地端子板２４は、コの字形状を有することが好ましい。本実施例においてソケット接地端子板２４は、互いに対向する第１接地面２４ａ及び第２接地面２４ｂと、第１接地面２４ａ及び第２接地面２４ｂに対して略垂直な面である第３接地面２４ｃを有する。また、ソケット信号端子板２２は、第１接地面２４ａ及び第２接地面２４ｂの間に設けられることが好ましい。本実施例においてソケット信号端子板２２は、第１接地面２４ａ、第２接地面２４ｂ及び第３接地面２４ｃに囲まれた領域の略中心に設けられる。
【００３４】
また、第1プラグ信号端子板３２及び第１プラグ接地端子板３４は、ソケット信号端子板２２と第１接地面２４ａとの間に対向して設けられるのが望ましい。本実施例において第1プラグ信号端子板３２及び第１プラグ接地端子板３４は、ソケット信号端子板２２と第１接地面２４ａとの間に対向して設けられ、また、第２プラグ信号端子板３３及び第２プラグ接地端子板３５は、ソケット信号端子板２２と第２接地面２４ｂとの間に対向して設けられる。更に、第１プラグ信号端子板３２及び第２プラグ信号端子板３３は、ソケット信号端子板２２を挟んで設けられるのが好ましい。また、第１プラグ信号端子板３２、第２プラグ信号端子板３３、第１プラグ接地端子板３４、及び第２プラグ信号接地端子板３５は、第３接地板２４ｃと略平行な方向に略同一直線状に設けられるのが好ましい。
【００３５】
第１プラグ信号端子板３２、第２プラグ信号端子板３３、第１プラグ接地端子板３４、及び第２プラグ信号接地端子板３５は、第３接地板２４ｃと略平行な方向に略同一直線状に設けることにより、コネクタ１０において信号が伝搬する部位のインピーダンスを略等しくすることができる。本実施例においては、コネクタ１０のインピーダンスは、略５０オームになるように、ソケット信号端子板２２、ソケット接地端子板２４、第１プラグ信号端子板３２、第２プラグ信号端子板３３、第１プラグ接地端子板３４、及び第２プラグ信号接地端子板３５は設けられる。
【００３６】
図３（ｂ）は、ソケット部２０にプラグ部３０が挿入された状態を示す。図３（ｂ）に示すようにコネクタ１０は、ソケット部２０に挿入されたプラグ部３０を、ソケット部２０と嵌合させるスライダ４０を更に備えることが望ましい。スライダ４０は、プラグ部３０に対して挿入されることにより、ソケット部２０とプラグ部３０とを嵌合させるのが好ましい。
【００３７】
また、スライダ４０は、ソケット部２０にプラグ部３０が挿入される方向と略垂直な方向に挿入されることにより、ソケット部２０とプラグ部３０とを電気的に接続させるのが好ましい。当該スライダ４０が挿入される方向は、第１プラグ信号端子板３２、第２プラグ信号端子板３３、第１プラグ接地端子板３４、及び第２プラグ信号接地端子板３５が設けられる直線と更に略垂直な方向であってよい。
【００３８】
コネクタ１０は、スライダ４０を更に備えることにより、プラグ部３０をソケット部２０に挿入した後に、プラグ部３０とソケット部２０とを嵌合させることができる。即ち、プラグ部３０をソケット部２０に対してＺＩＦ（ＺｅｒｏＩｎｓｅｒｔｉｏｎＦｏｒｃｅ）で挿入させることができる。
【００３９】
図４は、プラグ部３０がソケット部２０に対して挿入された状態におけるコネクタ１０の断面図、及びスライダ４０の動作を示す。図４（ａ）は、プラグ部３０がソケット部２０に対して挿入された状態におけるコネクタ１０の当該挿入方向対して略垂直な方向の断面図を示す。第１プラグ信号端子板３２、第２プラグ信号端子板３３、第１プラグ接地端子板３４、及び第２プラグ信号接地端子板３５は、第３接地板２４ｃと略平行な方向に略同一直線状に並ぶように、プラグ部３０はソケット部２０に対して挿入されるのが好ましい。また、本実施例においてスライダ４０は、プラグ部３０を押圧することにより、ソケット部２０とプラグ部３０とを嵌合させる第１突出部４２及び第２突出部４４を有する。
【００４０】
図４（ｂ）は、スライダ４０がプラグ部３０に挿入された状態におけるコネクタ１０を示す。スライダ４０は、第１プラグ信号端子板３２及び第２プラグ信号端子板３３を、ソケット信号端子板２２に押圧することにより、第１プラグ信号端子板３２及び第２プラグ信号端子板３３と、ソケット信号端子板２２とを電気的に接続させるのが好ましい。また、スライダ４０は、第１プラグ接地端子板３４及び第２プラグ接地端子板３５を、ソケット接地端子板２４に押圧することにより、第１プラグ接地端子板３４及び第２プラグ接地端子板３５と、ソケット接地端子板２４とを電気的に接続することが好ましい。
【００４１】
本実施例においては、第１突出部４２が、第１プラグ信号端子板３２及び第１プラグ接地端子板３４の間に挿入されることにより、第1プラグ信号端子板３２をソケット信号端子板２２に押圧し、第１プラグ接地端子板３４をソケット接地端子板２４に含まれる第1接地面２４ａに押圧する。また、第２突出部４４が、第２プラグ信号端子板３３及び第２プラグ接地端子板３５の間に挿入されることにより、第２プラグ信号端子板３３をソケット信号端子板２２に押圧し、第２プラグ接地端子板３５をソケット接地端子板２４に含まれる第２接地面２４ｂに押圧する。そして、ソケット部２０とプラグ部３０とを勘合し、電気的に接続させる。
【００４２】
また、第１突出部４２及び第２突出部４４は、第１突出部４２及び第２突出部４４がプラグ部３０に対して挿入される方向に沿って細くなるように形成されるのが好ましい。第１突出部４２及び第２突出部４４が、細くなるように形成されることにより、第１プラグ信号端子板３２及び第１プラグ接地端子板３４の間、及び第２プラグ信号端子板３３及び第２プラグ接地端子板３５の間が狭い場合であっても、スライダ４０を容易に挿入することができる。即ち、ソケット部２０とプラグ部３０とを容易に嵌合させることができる。
【００４３】
また、図１において説明した半導体部品取付装置においては、ソケットボード部に挿入される半導体部品のパッケージやピン数などの種類が異なる場合であっても、ソケットボード部を交換するだけで種々の半導体部品を取り付けることができる。しいては、半導体部品を試験する試験装置のコストを下げることができるとともに、半導体部品の試験コストを下げることができる。
【００４４】
図５は、本発明の他の例に係るプローバ２００の上面図を示す。プローバ２００は、放射状に設けられた複数のボードスペーサ１２０を有する。ボードスペーサ１２０は、図１から図３において説明した構成と同様の構成及び機能を有してよい。複数のボードスペーサ１２は、図３において説明したプラグ部を有するプローブカードと嵌合することにより、プローブカードとプローバ２００とが電気的に接続される。そして、プローバ２００の略中心に載置されたウェハに対して、プローブカードが有するプローブピンを用いて試験信号を供給する。また、プローバ２００は、複数のボードスペーサ１２０が有するスライダを一括して駆動する駆動機構を有することが好ましい。
【００４５】
プローバ２００は、図３において説明したソケット部を有するボードスペーサ１２０と、プラグ部を有するプローブカードとを備えることにより、効率よく試験信号を伝送し、ウェハに試験信号を供給することができる。
【００４６】
以上、本発明を実施（の）形態を用いて説明したが、本発明の技術的範囲は上記実施形態に記載の範囲には限定されない。上記実施形態に、多様な変更または改良を加えることができる。そのような変更または改良を加えた形態も本発明の技術的範囲に含まれ得ることが、特許請求の範囲の記載から明らかである。
【００４７】
【発明の効果】
上記説明から明らかなように、本発明によれば容易に嵌合させることができ、また、精度よく信号を伝搬させることができるコネクタ及び半導体部品取付装置を提供することができる。
【図面の簡単な説明】
【図１】本発明の一実施形態に係る半導体部品取付装置１００を示す。
【図２】ソケットボード１１０及びボードスペーサ１２０の他の例を示す。
【図３】本発明の一実施形態に係るコネクタ１０を示す。
【図４】プラグ部３０がソケット部２０に対して挿入された状態におけるコネクタ１０の断面図、及びスライダ４０の動作を示す。
【図５】プローバ２００の上面図を示す。
【符号の説明】
１０・・・コネクタ２０・・・ソケット部
２２・・・ソケット信号端子板２４・・・ソケット信号接地板
３０・・・プラグ部３２・・・第１プラグ信号端子板
３３・・・第２プラグ信号端子板３４・・・第１プラグ信号接地板
３５・・・第２プラグ信号接地板３６・・・プラグ端子台
３８・・・同軸ケーブル４０・・・スライダ
４２・・・第１突出部４４・・・第２突出部
９０・・・半導体部品１００・・半導体部品取付装置
１１０・・ソケットボード１１２・・ソケットボード部
１２０・・ボードスペーサ１２２・・マザーボード部
１３０・・スライダ連結部１３２・・スライダ連動部
１３４・・嵌合部１３８・・嵌合部
１４０・・治具１４２・・治具駆動部
２００・・プローバ[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a connector and a semiconductor component mounting apparatus. In particular, the present invention relates to a connector and a semiconductor component mounting apparatus that can be easily fitted and can propagate signals with high accuracy.
[0002]
[Prior art]
A conventional semiconductor component mounting apparatus includes a socket board portion into which a semiconductor component is inserted, and a motherboard portion that is electrically connected to the socket board via a cable. The cable is soldered to the socket board part and the mother board part to electrically connect the socket board part and the mother board part.
[0003]
[Problems to be solved by the invention]
With the recent advancement and complexity of semiconductor components, the packages in which the semiconductor components are stored are diversified, and the number of pins of the packaged semiconductor components is also various. For this reason, for example, in a test apparatus for testing semiconductor components, it is necessary to test semiconductor components having different numbers of pins and different types of packages.
[0004]
However, in the conventional semiconductor component mounting apparatus, since the socket board part and the mother board part into which the semiconductor component is inserted are joined to the cable and the solder, when testing semiconductor components with different packages, the entire semiconductor component mounting apparatus Replace. In the conventional semiconductor component mounting apparatus, it takes a long time to replace the semiconductor component mounting apparatus, thereby increasing the test time and increasing the test cost. Therefore, there is a semiconductor component mounting apparatus that can be easily replaced. It was desired.
[0005]
Furthermore, in order to test semiconductor components stored in various packages, it is necessary to prepare a semiconductor component mounting apparatus corresponding to each package type. The semiconductor component mounting apparatus is very expensive. In the conventional semiconductor component mounting apparatus, it is necessary to prepare a semiconductor component mounting apparatus corresponding to each package or the like, which causes a problem that the test cost increases.
[0006]
Then, an object of this invention is to provide the connector and semiconductor component attachment apparatus which can solve said subject. This object is achieved by a combination of features described in the independent claims. The dependent claims define further advantageous specific examples of the present invention.
[0007]
[Means for Solving the Problems]
That is, according to the first embodiment of the present invention, the socket signal terminal plate through which the signal propagates and the socket portion having the socket ground terminal plate are fitted into the socket portion by being inserted into the socket portion. A first plug signal terminal plate electrically connected to the first plug signal terminal plate, and a first plug ground terminal plate and a second plug ground terminal plate provided across the first plug signal terminal plate. And a plug part to be connected to each other.
[0008]
Further, the first plug signal terminal plate is inserted between the first plug ground terminal plate and the second plug ground terminal plate to press the first plug signal terminal plate against the socket signal terminal plate. It is desirable to further include a slider for pressing the plug ground terminal plate and the second plug ground terminal plate against the socket ground terminal plate.
[0009]
The slider preferably presses the first plug signal terminal plate, the first plug ground terminal plate, and the second plug ground terminal plate in a direction substantially perpendicular to the direction in which the plug portion is inserted into the socket portion. The slider preferably has a first protrusion and a second protrusion that press the first plug signal terminal plate and at least one of the first plug ground terminal plate and the second plug ground terminal plate.
[0010]
Further, the first protrusion is inserted between the first plug ground terminal plate and the socket signal terminal plate, thereby pressing the plug ground terminal plate against the second socket ground terminal plate. By being inserted between the first plug signal terminal plate and the second plug ground terminal plate, the first plug signal terminal plate is pressed against the socket signal terminal plate, and the second plug ground terminal plate is pushed to the third socket grounding portion. It is preferable to press it.
[0011]
Further, the width of the first protrusion and the second protrusion is formed so that the slider becomes thinner along the direction in which the slider is inserted between the first plug ground terminal plate and the second plug ground terminal plate. preferable.
[0012]
Preferably, the plug portion further includes a second plug signal terminal plate that is provided to face the first first plug signal terminal plate with the socket signal terminal plate interposed therebetween, and is electrically connected to the socket signal terminal plate. .
[0013]
The socket ground terminal plate has a U-shape having a first ground surface and a second ground surface facing each other, and the socket signal terminal plate is provided between the first ground surface and the second ground surface. The first plug signal terminal plate and the first plug ground terminal plate are provided opposite to each other between the socket signal terminal plate and the first ground plane, and the second plug signal terminal plate and the second plug ground terminal are provided. It is preferable that the board is provided opposite to the socket signal terminal board and the second ground plane.
[0014]
Further, the slider is inserted between the first plug signal terminal plate and the first plug ground terminal plate and between the second plug signal terminal plate and the second plug ground terminal plate, whereby the first plug signal. The terminal plate and the second plug signal terminal plate are pressed against the socket signal terminal plate from both sides of the socket signal terminal plate, the first plug ground terminal plate is pressed against the first ground plane, and the second plug ground terminal plate is connected to the second contact. It is preferable to press against the ground.
[0015]
And a coaxial cable having a core wire through which a signal propagates and a shield wire provided around the core wire and insulated from the core wire, the core wire being electrically connected to the first plug signal terminal plate, Is preferably electrically connected to the first plug ground terminal plate and the second plug ground terminal plate.
[0016]
According to a second aspect of the present invention, there is provided a semiconductor component mounting apparatus to which a semiconductor component is connected, including a socket signal terminal plate and a socket ground terminal plate into which the semiconductor component is inserted and a signal supplied to the semiconductor component is propagated. A socket board portion having a socket portion, a first plug signal terminal plate that is fitted into the socket portion by being inserted into the socket portion and electrically connected to the socket signal terminal plate, and a first plug signal terminal plate; A semiconductor component having a first plug grounding terminal plate and a second plug grounding terminal plate provided on both sides, and a mother board having a plug portion electrically connected to the socket grounding terminal plate. An attachment device is provided.
[0017]
The motherboard unit is inserted between the first plug signal terminal plate and the first plug ground terminal plate and the second plug ground terminal plate to press the first plug signal terminal plate against the socket signal terminal plate, It is preferable to further include a slider for pressing the first plug ground terminal plate and the second plug ground terminal plate against the socket ground terminal plate. Further, it is preferable to further include a drive unit that drives the plurality of sliders.
[0018]
The above summary of the invention does not enumerate all the necessary features of the present invention, and sub-combinations of these feature groups can also be the invention.
[0019]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described through embodiments of the invention. However, the following embodiments do not limit the claimed invention, and all combinations of features described in the embodiments are the solution of the invention. It is not always essential to the means.
[0020]
FIG. 1 shows a semiconductor component mounting apparatus 100 according to an embodiment of the present invention. The semiconductor component mounting apparatus 100 includes a socket board portion 112 into which the semiconductor component 90 is inserted, and a motherboard portion 122 that is fitted and electrically connected to the socket board portion 112. The socket board portion 112 includes a socket portion through which a signal supplied to the inserted semiconductor component 90 propagates, and a plurality of wiring boards electrically connected to the socket portion to supply the signal to the inserted semiconductor component. It has a socket board 110. In addition, the motherboard unit 122 includes a plug unit that fits into the socket unit included in the socket board 110, a slider that fits the socket unit and the plug unit, and a housing that houses the plug unit. Board spacer 120.
[0021]
The semiconductor component mounting apparatus 100 further includes a plurality of slider connecting portions 130 that connect the plurality of sliders, and a slider interlocking portion 132 that interlocks the plurality of slider connecting portions 130. The slider connecting part 130 and the slider interlocking part 132 may be means for collectively driving a plurality of sliders included in the socket board part 112.
[0022]
The semiconductor component mounting apparatus 100 is connected to a device that is 90 electrically connected to a semiconductor component, such as a test apparatus for testing a semiconductor component. Also, one end of the plug portion included in the board spacer 120 is connected to a coaxial cable that electrically connects the plug portion and the test apparatus. The test apparatus supplies a test signal for testing the semiconductor component 90 to the semiconductor component, receives an output signal output from the semiconductor component 90, and determines whether the semiconductor component 90 is good or bad.
[0023]
Each socket board 110 preferably has a plurality of socket portions, and each board spacer 120 preferably has a plurality of plug portions. Furthermore, it is preferable that the number of socket portions included in the socket board 110 is equal to the number of plug portions included in the board spacer 120.
[0024]
As shown in FIG. 1A, the socket board portion 112 is fitted to the mother board portion 122 on the side opposite to the side where the semiconductor component 90 is inserted. Then, by driving the slider interlocking portion 132, the slider connected to the slider connecting portion 130 is driven. And each socket presses a plug part, and a socket part and a plug part are made to contact. The configuration and operation of the plug portion, socket portion, and slider will be described in detail with reference to FIGS.
[0025]
FIGS. 1B and 1C show the slider connecting portion 130 and the slider interlocking portion 132. As shown in FIG. 1B, the slider interlocking portion 130 is preferably an eccentric cam that drives the plurality of slider connecting portions 130. In this embodiment, the slider connecting portion 130 has a fitting portion 134 that fits with the slider connecting portion 130 and slides the slider connecting portion 130. Here, the fitting portion 134 is preferably a groove portion or an opening portion having an arc shape. And the slider interlocking | linkage part 132 is driven to a predetermined direction by drive means, such as an actuator, for example. The predetermined direction is preferably a direction substantially perpendicular to the longitudinal direction of the slider connecting portion 130. Then, the slider coupling part 130 moves in a direction substantially perpendicular to the direction in which the slider interlocking part 1132 moves by sliding on the fitting part 134. Furthermore, each slider connecting portion 130 drives the slider connected to the slider connecting portion 130, thereby fitting the socket portion included in the socket board 110 and the plug portion included in the board spacer 120.
[0026]
As shown in FIG. 1C, the slider coupling part 130 may be provided so as to be fixed to the slider interlocking part 132. At this time, the slider coupling portion 130 is moved in the substantially parallel direction by driving the slider interlocking portion 132 in a direction substantially parallel to the direction in which the slider is moved by a driving means such as an actuator. Then, each slider connecting portion 130 drives the slider connected to the slider connecting portion 130 to fit the socket portion included in the socket board 110 and the plug portion included in the board spacer 120.
[0027]
Since the motherboard unit 122 includes the slider connecting unit 130 and the slider interlocking unit 132, the sliders included in the board spacers 120 can be collectively driven. Moreover, since the slider interlocking part 132 has an eccentric cam mechanism, the slider can be driven with high accuracy.
[0028]
FIG. 2 shows another example of the socket board 110 and the board spacer 120. In the present embodiment, the socket board 110 and the board spacer 110 have a slider 40 and a fitting portion 138 for driving the slider 40 using a jig 140 provided outside. As shown in FIG. 2A, the slider may be driven by converting a rotational motion into a linear motion using a jig 140 in the fitting portion 138.
[0029]
Further, as shown in FIG. 2B, the jig 140 may be a mechanism that drives a plurality of sliders at once. In the present embodiment, the apparatus further includes a jig driving unit 142 that drives the jig 140 by converting the rotational motion into a linear motion, and the slider is driven by rotating the jig driving unit 142, so that a plurality of sliders are moved. Drive all at once.
[0030]
FIG. 3 shows a connector 10 according to one embodiment of the present invention. FIG. 3A shows the socket part 20 and the connector 10 having the plug part 30 by fitting with the socket part 20. The socket part included in the socket board 110 described in FIG. 1 may have substantially the same structure and function as the socket part 20 in FIG. 3, and the plug part included in the board spacer 120 is the plug part 30 in FIG. And may have substantially the same structure and function.
[0031]
The socket unit 20 includes a socket signal terminal plate 22 and a socket ground terminal plate 24 through which signals propagate. In addition, the plug unit 30 includes a first plug signal terminal plate 32 and a second plug signal terminal plate 33 that are electrically connected to the socket signal socket signal terminal plate 22 when the plug unit 30 is inserted into the socket unit 20. A first plug ground terminal plate 34 and a second plug ground terminal plate 35 which are provided across the plug signal terminal plate 32 and are electrically connected to the socket ground terminal plate 24, the first plug signal terminal plate 32 and the second plug signal terminal plate 32. A plug signal terminal board 33; a first plug ground terminal board 34; and a plug terminal base 36 on which a second plug signal ground terminal board 35 is provided.
[0032]
The connector 10 further includes a coaxial cable 38 that has a core wire that supplies a signal to the connector 10 or a signal to which a signal is supplied from the connector 10 and a shield wire that is provided around the core wire and is insulated from the core wire. You may prepare. At this time, the core wire is electrically connected to the first plug signal terminal plate 32 and the second plug signal terminal plate 33 in the plug terminal block 36. The shield wire is electrically connected to the first plug ground terminal plate 34 and the second plug signal ground terminal plate 35 in the plug terminal block 36. The connector 10 supplies a signal supplied from the coaxial cable 38 to a wiring or the like electrically connected to the socket signal terminal plate 22, and a signal supplied from the wiring or the like to the coaxial cable 38. Supply. In the semiconductor component mounting apparatus 100 shown in FIG. 1, the signal supplied from the test apparatus can be supplied to the semiconductor component 90 inserted into the socket board 110.
[0033]
The socket ground terminal plate 24 preferably has a U-shape. In this embodiment, the socket ground terminal plate 24 includes a first ground surface 24a and a second ground surface 24b facing each other, and a third contact which is a surface substantially perpendicular to the first ground surface 24a and the second ground surface 24b. It has a ground surface 24c. The socket signal terminal plate 22 is preferably provided between the first ground plane 24a and the second ground plane 24b. In the present embodiment, the socket signal terminal plate 22 is provided at substantially the center of a region surrounded by the first ground plane 24a, the second ground plane 24b, and the third ground plane 24c.
[0034]
Further, it is desirable that the first plug signal terminal plate 32 and the first plug ground terminal plate 34 are provided to face each other between the socket signal terminal plate 22 and the first ground surface 24a. In the present embodiment, the first plug signal terminal plate 32 and the first plug ground terminal plate 34 are provided to face each other between the socket signal terminal plate 22 and the first ground surface 24a, and the second plug signal terminal plate. 33 and the second plug ground terminal plate 35 are provided to face each other between the socket signal terminal plate 22 and the second ground surface 24b. Further, the first plug signal terminal plate 32 and the second plug signal terminal plate 33 are preferably provided with the socket signal terminal plate 22 interposed therebetween. The first plug signal terminal plate 32, the second plug signal terminal plate 33, the first plug ground terminal plate 34, and the second plug signal ground terminal plate 35 are substantially the same in a direction substantially parallel to the third ground plate 24c. It is preferably provided in a straight line.
[0035]
The first plug signal terminal plate 32, the second plug signal terminal plate 33, the first plug ground terminal plate 34, and the second plug signal ground terminal plate 35 are substantially collinear in a direction substantially parallel to the third ground plate 24c. By providing them in the connector 10, the impedance of the part where the signal propagates in the connector 10 can be made substantially equal. In the present embodiment, the socket signal terminal board 22, the socket ground terminal board 24, the first plug signal terminal board 32, the second plug signal terminal board 33, the first impedance so that the impedance of the connector 10 is approximately 50 ohms. A plug ground terminal plate 34 and a second plug signal ground terminal plate 35 are provided.
[0036]
FIG. 3B shows a state where the plug part 30 is inserted into the socket part 20. As shown in FIG. 3B, the connector 10 preferably further includes a slider 40 that fits the plug portion 30 inserted into the socket portion 20 with the socket portion 20. The slider 40 is preferably inserted into the plug portion 30 to fit the socket portion 20 and the plug portion 30 together.
[0037]
Further, it is preferable that the slider 40 is electrically connected to the socket portion 20 and the plug portion 30 by being inserted in a direction substantially perpendicular to the direction in which the plug portion 30 is inserted into the socket portion 20. The direction in which the slider 40 is inserted is further substantially the same as the straight line on which the first plug signal terminal plate 32, the second plug signal terminal plate 33, the first plug ground terminal plate 34, and the second plug signal ground terminal plate 35 are provided. It may be a vertical direction.
[0038]
The connector 10 further includes the slider 40, so that the plug portion 30 and the socket portion 20 can be fitted after the plug portion 30 is inserted into the socket portion 20. That is, the plug part 30 can be inserted into the socket part 20 by ZIF (Zero Insertion Force).
[0039]
FIG. 4 shows a cross-sectional view of the connector 10 and the operation of the slider 40 in a state where the plug part 30 is inserted into the socket part 20. FIG. 4A shows a cross-sectional view in a direction substantially perpendicular to the insertion direction of the connector 10 in a state where the plug portion 30 is inserted into the socket portion 20. The first plug signal terminal plate 32, the second plug signal terminal plate 33, the first plug ground terminal plate 34, and the second plug signal ground terminal plate 35 are substantially collinear in a direction substantially parallel to the third ground plate 24c. Preferably, the plug part 30 is inserted into the socket part 20 so as to line up. Further, in the present embodiment, the slider 40 includes a first projecting portion 42 and a second projecting portion 44 that fit the socket portion 20 and the plug portion 30 by pressing the plug portion 30.
[0040]
FIG. 4B shows the connector 10 in a state where the slider 40 is inserted into the plug portion 30. The slider 40 presses the first plug signal terminal plate 32 and the second plug signal terminal plate 33 against the socket signal terminal plate 22, so that the first plug signal terminal plate 32, the second plug signal terminal plate 33, and the socket are pressed. It is preferable that the signal terminal plate 22 is electrically connected. Further, the slider 40 presses the first plug ground terminal plate 34 and the second plug ground terminal plate 35 against the socket ground terminal plate 24, so that the first plug ground terminal plate 34 and the second plug ground terminal plate 35 The socket ground terminal plate 24 is preferably electrically connected.
[0041]
In the present embodiment, the first projecting portion 42 is inserted between the first plug signal terminal plate 32 and the first plug ground terminal plate 34 so that the first plug signal terminal plate 32 is connected to the socket signal terminal plate 22. The first plug grounding terminal plate 34 is pressed against the first grounding surface 24 a included in the socket grounding terminal plate 24. Further, the second protrusion 44 is inserted between the second plug signal terminal plate 33 and the second plug ground terminal plate 35 to press the second plug signal terminal plate 33 against the socket signal terminal plate 22, The second plug ground terminal plate 35 is pressed against the second ground surface 24 b included in the socket ground terminal plate 24. Then, the socket part 20 and the plug part 30 are fitted and electrically connected.
[0042]
Moreover, it is preferable that the 1st protrusion part 42 and the 2nd protrusion part 44 are formed so that it may become thin along the direction in which the 1st protrusion part 42 and the 2nd protrusion part 44 are inserted with respect to the plug part 30. . The first protrusions 42 and the second protrusions 44 are formed to be thin, so that the first plug signal terminal plate 32 and the first plug ground terminal plate 34 and the second plug signal terminal plate 33 and Even when the space between the second plug ground terminal plates 35 is narrow, the slider 40 can be easily inserted. That is, the socket part 20 and the plug part 30 can be easily fitted.
[0043]
Further, in the semiconductor component mounting apparatus described with reference to FIG. 1, various semiconductors can be obtained by simply replacing the socket board portion even when the types of semiconductor components packaged in the socket board portion and the number of pins are different. Parts can be attached. As a result, the cost of the test apparatus for testing the semiconductor component can be reduced, and the test cost of the semiconductor component can be reduced.
[0044]
FIG. 5 shows a top view of a prober 200 according to another example of the present invention. The prober 200 has a plurality of board spacers 120 provided radially. The board spacer 120 may have the same configuration and function as those described with reference to FIGS. The plurality of board spacers 12 are electrically connected to the probe card 200 and the prober 200 by fitting with the probe card having the plug portion described in FIG. Then, a test signal is supplied to the wafer placed substantially at the center of the prober 200 using the probe pins of the probe card. The prober 200 preferably has a drive mechanism that collectively drives the sliders of the plurality of board spacers 120.
[0045]
The prober 200 includes the board spacer 120 having the socket portion described in FIG. 3 and the probe card having the plug portion, thereby efficiently transmitting a test signal and supplying the test signal to the wafer.
[0046]
As mentioned above, although this invention was demonstrated using embodiment (), the technical scope of this invention is not limited to the range as described in the said embodiment. Various modifications or improvements can be added to the above embodiment. It is apparent from the scope of the claims that the embodiments added with such changes or improvements can be included in the technical scope of the present invention.
[0047]
【The invention's effect】
As is clear from the above description, according to the present invention, it is possible to provide a connector and a semiconductor component mounting apparatus that can be easily fitted and can propagate signals with high accuracy.
[Brief description of the drawings]
FIG. 1 shows a semiconductor component mounting apparatus 100 according to an embodiment of the present invention.
2 shows another example of the socket board 110 and the board spacer 120. FIG.
FIG. 3 shows a connector 10 according to an embodiment of the present invention.
4 is a cross-sectional view of the connector 10 in a state where the plug portion 30 is inserted into the socket portion 20, and the operation of the slider 40. FIG.
FIG. 5 shows a top view of the prober 200. FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 ... Connector 20 ... Socket part 22 ... Socket signal terminal board 24 ... Socket signal grounding board 30 ... Plug part 32 ... 1st plug signal terminal board 33 ... 2nd plug Signal terminal plate 34... First plug signal ground plate 35... Second plug signal ground plate 36... Plug terminal block 38 .. Coaxial cable 40. ... Second protrusion 90 ... Semiconductor part 100 ... Semiconductor part mounting device 110 ... Socket board 112 ... Socket board part 120 ... Board spacer 122 ... Motherboard part 130 ... Slider connecting part 132 ... Slider interlocking part 134 .. fitting part 138 .. fitting part 140 .. jig 142 .. jig driving part 200.

Claims

A socket ground terminal plate having a U-shape having a first ground plane and a second ground plane that face each other, and a socket signal that is provided between the first ground plane and the second ground plane and that propagates a signal. and a socket portion having a terminal plate,
A first plug signal terminal plate that is fitted into the socket portion by being inserted into the socket portion and is electrically connected to the socket signal terminal plate, and the first plug signal terminal plate are interposed therebetween. A plug portion having a first plug ground terminal plate and a second plug ground terminal plate, electrically connected to the socket ground terminal plate;
By inserting between the first plug signal terminal plate and the first plug ground terminal plate and the second plug ground terminal plate, the first plug signal terminal plate is pressed against the socket signal terminal plate. A slider that presses the first plug ground terminal plate against the first ground surface and presses the second plug ground terminal plate against the second ground surface ;
The slider is inserted in a direction substantially perpendicular to a direction in which the plug part is inserted into the socket part, so that the direction in which the plug part is inserted into the socket part and the direction in which the slider is inserted are substantially the same. A connector characterized by pressing the first plug signal terminal plate, the first plug ground terminal plate, and the second plug ground terminal plate in a vertical direction.

The slider has a first protrusion and a second protrusion that press the first plug signal terminal plate and at least one of the first plug ground terminal plate and the second plug ground terminal plate.
The first protrusion is inserted between the first plug ground terminal plate and the socket signal terminal plate, thereby pressing the first plug ground terminal plate against the first ground plane.
The second protrusion is inserted between the first plug signal terminal plate and the second plug ground terminal plate so as to be interposed between the first plug signal terminal plate and the second plug ground terminal plate. spread out, the first plug signal terminal plate is pressed against the socket signal terminal board, a connector according to claim 1, wherein said second plug ground terminal plate, characterized in that pressed against the second ground plane.

The widths of the first protrusion and the second protrusion are formed such that the slider becomes thinner along the direction in which the slider is inserted between the first plug ground terminal plate and the second plug ground terminal plate. The connector according to claim 2, wherein:

The socket ground terminal plate having a U-shape having a first ground plane and a second ground plane facing each other, and a socket provided between the first ground plane and the second ground plane for signal propagation and a socket portion having a signal terminal plate,
A first plug signal terminal plate, a second plug signal terminal plate, and a first plug signal terminal plate, which are fitted into the socket portion by being inserted into the socket portion and are electrically connected to the socket signal terminal plate. And a first plug ground terminal plate and a second plug ground terminal plate provided across the second plug signal terminal plate, and a plug portion electrically connected to the socket ground terminal plate;
The first plug signal terminal is inserted between the first plug signal terminal board and the first plug ground terminal board and between the second plug signal terminal board and the second plug ground terminal board. And the second plug signal terminal plate against the socket signal terminal plate, the first plug ground terminal plate against the first ground surface, and the second plug ground terminal plate against the second ground surface . A slider for pressing,
The slider is inserted in a direction substantially perpendicular to a direction in which the plug part is inserted into the socket part, so that the direction in which the plug part is inserted into the socket part and the direction in which the slider is inserted are substantially the same. A connector characterized by pressing the first plug signal terminal plate, the first plug signal terminal plate, the first plug ground terminal plate, and the second plug ground terminal plate in a vertical direction.

The first plug signal terminal plate and the first plug ground terminal plate are provided opposite to each other between the socket signal terminal plate and the first ground plane,
5. The connector according to claim 4, wherein the second plug signal terminal plate and the second plug ground terminal plate are provided opposite to each other between the socket signal terminal plate and the second ground plane.

The slider is between the first plug ground terminal plate and the first plug signal terminal plate, and by being inserted between said second plug ground terminal plate and the second plug signal terminal plate, wherein Spreading between the first plug signal terminal plate and the first plug ground terminal plate and between the second plug signal terminal plate and the second plug ground terminal plate, the first plug signal terminal plate and the The second plug signal terminal plate is pressed against the socket signal terminal plate from both sides of the socket signal terminal plate, the first plug ground terminal plate is pressed against the first ground plane, and the second plug ground terminal plate is The connector according to claim 5 , wherein the connector is pressed against the second ground plane.

A coaxial cable having a core wire through which the signal propagates and a shield wire provided around the core wire and insulated from the core wire;
The core wire is electrically connected to the first plug signal terminal plate;
The shielded cable connector according to any one of claims 1 to 6, characterized in that it is electrically connected to the first plug ground terminal plate and said second plug ground terminal plate.

A semiconductor component mounting apparatus to which a semiconductor component is connected,
A socket ground terminal plate having a U-shape having a first ground plane and a second ground plane facing each other, and a semiconductor component inserted between the first ground plane and the second ground plane. a socket board portion having a socket portion including a socket signal terminal plate is signal supplied to the semiconductor parts is propagated,
A first plug signal terminal plate that is fitted into the socket portion by being inserted into the socket portion and is electrically connected to the socket signal terminal plate, and the first plug signal terminal plate are interposed therebetween. A first plug ground terminal plate and a second plug ground terminal plate, and a motherboard unit having a plug part electrically connected to the socket ground terminal plate;
The motherboard part is
By inserting between the first plug signal terminal plate and the first plug ground terminal plate and the second plug ground terminal plate, the first plug signal terminal plate is pressed against the socket signal terminal plate. A slider that presses the first plug ground terminal plate against the first ground surface and presses the second plug ground terminal plate against the second ground surface ;
The slider is inserted in a direction substantially perpendicular to a direction in which the plug part is inserted into the socket part, so that the direction in which the plug part is inserted into the socket part and the direction in which the slider is inserted are substantially the same. A semiconductor component mounting apparatus, wherein the first plug signal terminal plate, the first plug ground terminal plate, and the second plug ground terminal plate are pressed in a vertical direction.

The semiconductor component mounting apparatus according to claim 8 , further comprising a drive unit that drives the plurality of sliders.