JPH1079406A - Device for probing measuring semiconductor wafer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To effectively detect the connection between a measuring probe and an electrode pad of semiconductor device in the proving device which is used for an electrical test of a semiconductor integrate circuit device. SOLUTION: A stage potential control signal is sent out, and a stage 7 is elevated to the ground level controlled by a stage potential control circuit 8 in a probing device 3. A back side of a semiconductor wafer 6 contacting the stage 7 becomes at the same potential as the stage. Applying a current supplying voltage measurement circuit 2 in a multimeter 1, a current supplying voltage measurement is conducted by all of measuring probes 5. When the electrode pad contacts the measuring probes 5, a measuring result ranging from 0 to 1 V is obtained. Conversely, when it does not contact the measuring probes 5, the same value as the clamp voltage set is obtained. When it does not contact, a stage position control signal capable of elevating the stage position by one step is sent to a stage position control circuit 9 in the probing device 3, and position adjustment is repeated until contacting is made.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe device used for conducting an electrical test of a semiconductor integrated circuit device formed on a semiconductor wafer, and more particularly to a contact between a semiconductor integrated circuit device and a measuring probe. Technology.

[0002]

2. Description of the Related Art Generally, a large number of semiconductor integrated circuit devices are formed on a semiconductor wafer, and a probe device is used for an electrical test in the semiconductor wafer state. The probe device is configured to contact a large number of measurement probes arranged on the probe card with the electrode pads of the semiconductor integrated circuit device, and is electrically connected to the measurement probe of the probe card. The tester supplies a predetermined signal to the semiconductor integrated circuit device and measures the output. In the conventional probe device, a probe card having two dedicated sensor needles is used, and the conduction of the two sensor needles causes a large number of measurement probes arranged on the probe card to be connected to the semiconductor integrated circuit device. Detects contact with the electrode pad.

[0003]

However, in the case of an electrical test of a semiconductor integrated circuit device in which the electrode pads are bumped and the height of the electrode pads is different from the surface of the wafer, or because of a special sensor needle on the probe card due to wear. In the case where the height differs from that of another measurement probe, the height of the dedicated sensor needle needs to be adjusted each time. In addition, a probe card having two dedicated sensor needles cannot be used. That is, two of the probes of the probe card must be allocated to the sensors.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and even if the dedicated sensor needle of the probe card is abolished, the detection of contact between the measuring probe and the electrode pad of the semiconductor integrated circuit device is detected. To realize a semiconductor wafer measurement probe device capable of performing the measurement more efficiently.

[0005]

According to the present invention, there is provided a probe apparatus for measuring a semiconductor wafer, comprising: a) a control circuit for connecting a stage on which a semiconductor integrated circuit device is mounted to a ground level or an arbitrary potential; Use a probe card that does not have a dedicated sensor needle to detect contact between the probe and the semiconductor integrated circuit device. B) All measurement probes on the probe card can be used as sensor needles. C) For measurement Detection of contact between the probe and the semiconductor integrated circuit device
Performing using software d) The software for detecting the contact is processed on the tester side.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a semiconductor wafer measuring probe device according to the present invention will be described below with reference to the drawings.

In FIG. 1, 1 is a tester, 2 is a current applied voltage measuring circuit, 3 is a probe device, 4 is a probe card, 5 is a measuring probe, 6 is a semiconductor integrated circuit device (semiconductor wafer) 7 is a stage, 8 is a stage potential control circuit, 9
Is a stage position control circuit.

A procedure for correctly bringing the electrode pads of the semiconductor integrated circuit device 6 into contact with the measurement probe 5 is as shown in the flowchart of FIG. First, a control signal is sent from the tester 1 to the stage position control circuit 9, and the stage 7 moves to an initial position where the electrode pad of the semiconductor integrated circuit device 6 and the measuring probe 5 are clearly separated. Then, a stage potential control signal is output, and the stage 7 is set to a constant potential, for example, the ground level by the stage potential control circuit 8 of the probe device 3. Then, the back surface (base) of the semiconductor wafer 6 in contact with the stage 7 also has the same potential.
In this state, the current applied voltage measurement is performed on all the measuring probes 5 using the current applied voltage measurement circuit 2 in the tester 1. If the applied current is several tens of μA, and the electrode pad of the semiconductor integrated circuit device 6 is in contact with the measurement probe 5, a measurement result of about 0 V to 1 V is obtained. On the other hand, when there is no contact, the same value as the set clamp voltage is obtained. From the measurement results, if all the measurement probes 5 are not in contact, a stage position control signal for raising the stage position by one step is output to the stage position control circuit 9 in the probe device 3 to adjust the position. And the adjustment is repeated until the result that even one measuring probe 5 comes into contact is obtained. At this time, the measuring probe 5
Some of the measurement probes 5 are not in contact because of the variation in the height of the probe. However, since this is performed using the stylus pressure adjustment function of the probe device 3, the problem is that if at least one contact is confirmed, There is no. When the contact of the measuring probe 5 is confirmed, the stage 7 is released from the ground by the stage potential control signal. As a result, the electrode pads of the semiconductor integrated circuit device 6 and the measuring probe 5 of the probe card 4 can be correctly contacted, and the process moves to the electrical test of the semiconductor integrated circuit device 6. Note that the same software can be used for a series of controls even if the type of the semiconductor integrated circuit device changes.

[0009]

As described above, according to the present invention, the dedicated sensor needle can be eliminated, so that the two probes occupied for the sensor needle can be used, and the over-coating of the wafer can be performed. Since the sensor needles that are intensely worn due to direct contact with the sensor are eliminated, the number of times of maintenance is also reduced. In addition, there is no need to adjust the height of the measurement probe, which is required when switching between models with bumped electrode pads and models without bumped bumps. As a result, it is possible to reduce the inspection cost and, consequently, the cost of the semiconductor integrated circuit device itself.

[Brief description of the drawings]

FIG. 1 is a configuration diagram of a semiconductor wafer measurement probe device of the present invention.

FIG. 2 is a flowchart of contact detection between a measurement probe and a semiconductor integrated circuit device according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Tester 2 Current applied voltage measuring circuit 3 Probe device 4 Probe card 5 Measurement probe 6 Semiconductor integrated circuit device (semiconductor wafer) 7 Stage 8 Stage potential control circuit 9 Stage position control circuit

Claims (4)

[Claims] 1. A probe device for relatively moving and contacting a semiconductor integrated circuit device and a measuring probe in order to conduct an electrical test of a semiconductor integrated circuit device formed on a semiconductor wafer. A probe card that has a control circuit that can connect the stage on which the device is mounted to a ground level or an arbitrary potential, and that does not have a dedicated sensor needle for detecting contact between the measurement probe and the semiconductor integrated circuit device. A probe device for measuring a semiconductor wafer, which is used. 2. The probe device according to claim 1, wherein all the probes of the probe card can be used as sensor needles. 3. The probe device for semiconductor wafer measurement according to claim 1, wherein the detection of the contact between the measurement probe and the semiconductor integrated circuit device is performed using software. 4. The probe device for measuring a semiconductor wafer according to claim 1, wherein the software for detecting the contact is processed on a tester side.