JPH1074962A - Infrared remote control light-receiving unit and its manufacture - Google Patents
Infrared remote control light-receiving unit and its manufactureInfo
- Publication number
- JPH1074962A JPH1074962A JP8229581A JP22958196A JPH1074962A JP H1074962 A JPH1074962 A JP H1074962A JP 8229581 A JP8229581 A JP 8229581A JP 22958196 A JP22958196 A JP 22958196A JP H1074962 A JPH1074962 A JP H1074962A
- Authority
- JP
- Japan
- Prior art keywords
- light receiving
- receiving unit
- remote control
- lead frame
- molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Light Receiving Elements (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ＴＶ、ＶＴＲ、エ
アコン等に取付けられ、リモートコントローラからの赤
外線を受光する赤外線リモコン受光ユニットに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an infrared remote control light receiving unit which is attached to a TV, VTR, air conditioner, etc. and receives infrared rays from a remote controller.
【０００２】[0002]
【従来の技術】赤外線リモコン受光ユニットは赤外線信
号を受信する距離を長くするため、集積回路（ＩＣ）部
に高増幅率増幅器（ハイゲインアンプ）を内蔵している
ため、外部からのノイズを受けやすく、外部からのノイ
ズをシールドしないと逆に赤外線信号受信距離が短くな
る。このシールド方法の従来例の１つに、実開平７−１
０９５７号公報（発明の名称：赤外線リモコン用受光モ
ジュール、出願人：新日本無線株式会社）があり、これ
を図７に示す。2. Description of the Related Art An infrared remote control light receiving unit has a built-in high-amplification amplifier (high-gain amplifier) in an integrated circuit (IC) portion for increasing a distance for receiving an infrared signal, so that it is easily affected by external noise. If the external noise is not shielded, the receiving distance of the infrared signal becomes shorter. One of the conventional examples of this shielding method is Japanese Utility Model 7-1.
No. 0957 (Title of Invention: Light-receiving module for infrared remote control, Applicant: New Japan Radio Co., Ltd.) is shown in FIG.
【０００３】図７において、赤外線リモコン受光ユニッ
ト５０は、リードフレーム５１上に信号処理用の集積回
路素子と赤外線検出素子を固着・配線後、全体が樹脂で
モールド（モールド部５２）され、赤外線透過可能な樹
脂のレンズ部５３を有している。そして、レンズ部５３
を除き、シールド板５４で赤外線リモコン受光ユニット
の全体をシールドしている。しかし、このシールド板５
４はリードフレーム５１とは別に用意された金属板によ
り構成され、接地電位に接続して、外部からのノイズを
シールドする構造となっている。５５は赤外線リモコン
受光ユニットを基板等に穿設した角穴に嵌合し基板等に
仮固定するための爪部である。In FIG. 7, an infrared remote control light receiving unit 50 has a signal processing integrated circuit element and an infrared detecting element fixed and wired on a lead frame 51, and then is entirely molded with resin (mold part 52) to transmit infrared light. It has a lens portion 53 of a possible resin. Then, the lens unit 53
Except for the above, the entire infrared remote control light receiving unit is shielded by the shield plate 54. However, this shield plate 5
Reference numeral 4 denotes a structure formed of a metal plate prepared separately from the lead frame 51 and connected to a ground potential to shield external noise. Reference numeral 55 denotes a claw portion for fitting the infrared remote control light receiving unit into a square hole formed in a board or the like and temporarily fixing the infrared remote control light receiving unit to the board or the like.
【０００４】また、図８は赤外線リモコン受光ユニット
の別の従来例の略断面図である。図８において、赤外線
リモコン受光ユニット５６は、リードフレーム５７上に
フォトダイオード５８及び集積回路（ＩＣ）５９が搭載
されており、金線６０でワイヤーボンドされている。そ
して、リードフレーム５７上のフォトダイオード５８及
び集積回路（ＩＣ）５９をモールドする前の状態におい
て、リードフレーム５７を折り曲げ部６１で折り曲げら
れてシールド部６２を形成する工程を取っている。シー
ルド部６２はフォトダイオード５８及び集積回路（Ｉ
Ｃ）５９を覆うように構成されている。受光窓となるリ
ードフレーム上の穿孔６３はフォトダイオード５８に対
応する位置に設けられている。リードフレーム５７う
ち、リード部６４の部分を除いた部分は樹脂でモールド
（モールド部６５）されている。FIG. 8 is a schematic sectional view of another conventional example of an infrared remote control light receiving unit. 8, the infrared remote control light receiving unit 56 has a photodiode 58 and an integrated circuit (IC) 59 mounted on a lead frame 57, and is wire-bonded with a gold wire 60. Then, before the photodiode 58 and the integrated circuit (IC) 59 on the lead frame 57 are molded, a step of forming the shield portion 62 by bending the lead frame 57 at the bent portion 61 is performed. The shield part 62 includes the photodiode 58 and the integrated circuit (I
C) It is configured to cover 59. The perforations 63 on the lead frame serving as light receiving windows are provided at positions corresponding to the photodiodes 58. The portion of the lead frame 57 other than the lead portion 64 is molded with resin (mold portion 65).
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、上記の
図７の従来例では、シールド板５４はリードフレーム５
１とは別に用意された金属板により構成されており、そ
の組み立て工程を複雑にし、製造コストを高くする要因
となっている。また、前記シールドケースは、組み立て
によるものであり、小形で、薄型の安価な赤外線リモコ
ン受光ユニットを得るには最適ではない。However, in the above-described conventional example shown in FIG.
It is composed of a metal plate prepared separately from the above-mentioned one, which complicates the assembling process and increases the manufacturing cost. Further, the shield case is assembled, and is not optimal for obtaining a small, thin, and inexpensive infrared remote control light receiving unit.
【０００６】また、上記の図８の従来例においては、フ
ォトダイオード５７及び集積回路（ＩＣ）５８を搭載し
た非モールド状態のリードフレーム５６を折り曲げるの
で、フォトダイオード５７及び集積回路（ＩＣ）５８及
び金線５９等に機械的なストレスが加り、金線５９の断
線及び、フォトダイオード５７、集積回路（ＩＣ）５８
等の破損や応力発生の問題を引き起こすことがあった。
また、リードフレーム５６折り曲げ時にはフォトダイオ
ード５７、集積回路（ＩＣ）５８、金線５９等との接触
を避けるため、治具等で保護し高さを決めて折り曲げる
必要があり、作業性が悪い。また、治具等を取り外した
後、樹脂モールドを行う場合にシールド部６３の支持部
材がないため、フォトダイオード５７、集積回路（Ｉ
Ｃ）５８、金線５９等とシールド部６３の接触やリード
フレーム５６への接触等の危険性があり、電気的なショ
ートによる不良をおこす可能性があった。In the conventional example shown in FIG. 8, the non-molded lead frame 56 on which the photodiode 57 and the integrated circuit (IC) 58 are mounted is bent, so that the photodiode 57 and the integrated circuit (IC) 58 Mechanical stress is applied to the gold wire 59 and the like, and the breakage of the gold wire 59, the photodiode 57, and the integrated circuit (IC) 58
In some cases, such problems as breakage and stress generation may occur.
In addition, when the lead frame 56 is bent, it is necessary to protect it with a jig or the like and to determine the height thereof in order to avoid contact with the photodiode 57, the integrated circuit (IC) 58, the gold wire 59, etc., and the workability is poor. Further, when the resin molding is performed after the jig or the like is removed, there is no support member for the shield part 63, so that the photodiode 57 and the integrated circuit (I
C) There is a risk of contact between the shield part 63 and the lead frame 56 with the 58, the gold wire 59 and the like, and there is a possibility of causing a failure due to an electric short circuit.
【０００７】[0007]
【課題を解決するための手段】本発明の請求項１記載の
赤外線リモコン受光ユニットは、リードフレーム上には
モールド部と非モールド部とがあり、且つ該モールド部
に電気回路を配設した赤外線リモコン受光ユニットにお
いて、該非モールド部に受光窓となる穿孔を設け、該非
モールド部を折り曲げて、モールド部の少なくとも一部
を覆う構造とすることを特徴とするものである。According to a first aspect of the present invention, there is provided an infrared remote control light receiving unit having a molded part and a non-molded part on a lead frame, and an electric circuit disposed in the molded part. In the remote control light receiving unit, the non-molded portion is provided with a hole serving as a light receiving window, and the non-molded portion is bent to cover at least a part of the molded portion.
【０００８】また、本発明の請求項２記載の赤外線リモ
コン受光ユニットは、前記非モールド部を折り曲げたリ
ードフレームを接地電位とすることを特徴とするもので
ある。The infrared remote control light receiving unit according to a second aspect of the present invention is characterized in that the lead frame obtained by bending the non-molded portion is set at the ground potential.
【０００９】また、請求項３記載の赤外線リモコン受光
ユニットは、前記非モールド部の受光窓となる穿孔をを
網目状の開口構造としたことを特徴とするものである。According to a third aspect of the present invention, there is provided an infrared remote control light receiving unit, wherein a perforation serving as a light receiving window of the non-molded portion has a mesh-like opening structure.
【００１０】また、請求項４記載の赤外線リモコン受光
ユニットは、前記非モールド部のリードフレームの一部
を伸延して係合手段となる部分を設けた構造よりなるこ
とを特徴とするものである。According to a fourth aspect of the present invention, the infrared remote control light receiving unit has a structure in which a part of the lead frame of the non-molded portion is extended to provide a portion serving as an engagement means. .
【００１１】さらに、請求項５記載の赤外線リモコン受
光ユニットの製造方法は、モールド部を形成する工程
と、非モールド部を折り曲げて該モールド部の少なくと
も一部を覆う構造とする工程とを含むことを特徴とする
ものである。Further, the method for manufacturing an infrared remote control light receiving unit according to claim 5 includes a step of forming a molded part and a step of bending a non-molded part to form at least a part of the molded part. It is characterized by the following.
【００１２】［作用］本発明は、リードフレーム上には
モールド部と非モールド部とがあり、且つ該モールド部
に電気回路を配設した赤外線リモコン受光ユニットであ
り、該非モールド部に受光窓となる穿孔を設け、該非モ
ールド部を折り曲げて、モールド部の少なくとも一部を
覆う構造である。そして、モールド部を樹脂でモールド
する工程と、非モールド部を折り曲げて該モールド部の
少なくとも一部を覆う構造とする工程とを含む製造方法
であることを特徴とすることにより、上記の課題を解決
している。The present invention is an infrared remote control light receiving unit in which a lead frame has a molded part and a non-molded part, and an electric circuit is arranged in the molded part. And the non-molded part is bent to cover at least a part of the molded part. The above problem is solved by a manufacturing method including a step of molding a mold part with a resin, and a step of bending a non-mold part to cover at least a part of the mold part. Solved.
【００１３】[0013]
【発明の実施の形態】以下本発明の一実施の形態である
赤外線リモコン受光ユニットを図を用いて説明する。図
１は本発明の一実施の形態である赤外線受光ユニットを
示す図であり、図１（ａ）はその上面図、図１（ｂ）は
略断面図であり、図２は赤外線受光ユニットのリードフ
レームの説明図であり、図３は赤外線受光ユニットのモ
ールド及び折り曲げ工程を説明する図であり、図３
（ａ）は樹脂でモールドされた状態を示す側面図であ
り、図３（ｂ）はモールド後にリードフレームを折り曲
げた状態を示す側面図である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An infrared remote control light receiving unit according to an embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram showing an infrared light receiving unit according to an embodiment of the present invention. FIG. 1 (a) is a top view, FIG. 1 (b) is a schematic sectional view, and FIG. FIG. 3 is a view for explaining a lead frame, and FIG. 3 is a view for explaining a molding and bending step of the infrared receiving unit.
FIG. 3A is a side view showing a state where the lead frame is molded with a resin, and FIG. 3B is a side view showing a state where the lead frame is bent after the molding.
【００１４】図２において、リードフレーム１０上に
は、モールド部１１と非モールド部１２とがあり、モー
ルド部１１には赤外線受光素子１３、高増幅率増幅器
（ハイゲインアンプ）を内蔵した集積回路（ＩＣ）素子
１４、チップコンデンサ１５やチップ抵抗１６が搭載さ
れている。赤外線受光素子１３や集積回路（ＩＣ）素子
１４は金線１７によりリードフレーム１０の各部分及び
素子間とワイヤーボンドされ、電気的に接続されてい
る。リードフレーム１０のモールド部１１の一方より、
リード１８ａ、１８ｂ、１８ｃ、１８ｄ、１８ｅ（接地
端子）が出ている。また、非モールド部１２には抜き穴
１９を持つ折り曲げ部２０ａや他の折り曲げ部２０ｂ及
び赤外線透過用の受光窓となる穿孔２１などがある。抜
き穴１９は折り曲げ部２０ａの折り曲げの変形を容易に
するためのものであり、リードフレーム１０の変形を容
易にするものであれば、切り欠き等の抜き穴以外の構造
でもよい。また、図２では、抜き穴１９を折り曲げ部２
０ａにのみ図示しているが、折り曲げ部２０ｂに抜き穴
を施しても良いことは当然である。In FIG. 2, a molded portion 11 and a non-molded portion 12 are provided on a lead frame 10, and the molded portion 11 includes an infrared light receiving element 13 and an integrated circuit (a high gain amplifier (high gain amplifier)). (IC) An element 14, a chip capacitor 15, and a chip resistor 16 are mounted. The infrared light receiving element 13 and the integrated circuit (IC) element 14 are wire-bonded to each part of the lead frame 10 and between the elements by a gold wire 17 and are electrically connected. From one of the mold portions 11 of the lead frame 10,
Leads 18a, 18b, 18c, 18d, 18e (ground terminals) are exposed. The non-molded portion 12 includes a bent portion 20a having a hole 19, another bent portion 20b, and a hole 21 serving as a light receiving window for infrared transmission. The hole 19 is for facilitating the bending deformation of the bent portion 20a, and may have a structure other than the hole such as a notch as long as it facilitates the deformation of the lead frame 10. Further, in FIG.
Although it is illustrated only at 0a, it goes without saying that a punched hole may be provided in the bent portion 20b.
【００１５】図３は本発明の一実施の形態よりなる赤外
線受光ユニットのモールド及び折り曲げ工程を説明する
図であり、図３（ａ）は樹脂でモールドされた状態を示
す側面図であり、図３（ｂ）はモールド後にリードフレ
ームを折り曲げた状態を示す側面図である。FIG. 3 is a view for explaining the molding and bending steps of the infrared ray receiving unit according to one embodiment of the present invention. FIG. 3A is a side view showing a state where the infrared ray receiving unit is molded with resin. FIG. 3B is a side view showing a state in which the lead frame is bent after molding.
【００１６】図３（ａ）は、リードフレーム１０上のモ
ールド部１１にある赤外線受光素子１３、集積回路素子
１４、チップコンデンサ１５やチップ抵抗１６等をエポ
キシ樹脂等の樹脂でモールドした状態を示す側面図であ
り、樹脂モールドすることにより、これら内部の部品を
折り曲げ加工時の応力や完成後の湿気や衝撃から保護の
役目を果たしている。１０はリードフレーム、１１はモ
ールド部、２３はレンズ部である。FIG. 3A shows a state in which the infrared light receiving element 13, the integrated circuit element 14, the chip capacitor 15, the chip resistor 16 and the like in the mold portion 11 on the lead frame 10 are molded with a resin such as an epoxy resin. It is a side view, and plays a role of protection from stress at the time of bending processing, moisture and impact after completion of these components by resin molding. 10 is a lead frame, 11 is a mold part, and 23 is a lens part.
【００１７】次に、図３（ｂ）はモールド後にリードフ
レームを折り曲げた状態を示す側面図であり、リードフ
レーム１０は折り曲げ部２０ａ及び２０ｂで折り曲げら
れ、折り曲げ部分（非モールド部）によりシールド部２
４を形成し、赤外線受光ユニットが完成する。赤外線透
過用の受光窓となる穿孔２１はレンズ部２３と位置合わ
せの関係にある。図３（ｂ）の工程において、リードフ
レーム１０上の赤外線受光素子１３、集積回路素子１
４、チップコンデンサ１５やチップ抵抗１６や金線１７
は、樹脂、例えばエポキシ樹脂などの樹脂で先ずモール
ドされ、固定されているため、リードフレーム１０の折
り曲げ加工時においても、これらの部品、赤外線受光素
子１３、集積回路素子１４、チップコンデンサ１５やチ
ップ抵抗１６や金線１７が変形したり、破損したりする
ことがなく、赤外線リモコン受光ユニットの信頼性を高
めることができる。また、モールドする樹脂が従来より
も少なくて済むため、赤外線受光ユニットを軽量化ある
いは小型化もしくは薄型化することができる。Next, FIG. 3B is a side view showing a state in which the lead frame is bent after molding. The lead frame 10 is bent at the bent portions 20a and 20b, and the bent portion (non-molded portion) forms a shield portion. 2
4, and the infrared receiving unit is completed. The perforation 21 serving as a light receiving window for infrared transmission has a positional relationship with the lens unit 23. In the step of FIG. 3B, the infrared light receiving element 13 on the lead frame 10 and the integrated circuit element 1
4. Chip capacitor 15, chip resistor 16, gold wire 17
Are first molded and fixed with a resin such as an epoxy resin, so that these components, the infrared light receiving element 13, the integrated circuit element 14, the chip capacitor 15, the chip The resistance of the infrared remote control light receiving unit can be improved without the resistance 16 and the gold wire 17 being deformed or broken. Further, since less resin is required to be molded than in the past, it is possible to reduce the weight, size, or thickness of the infrared light receiving unit.
【００１８】このようにして組み立てられた本発明の一
実施の形態よりなる赤外線リモコン受光ユニットを図１
に示す。上面図の図１（ａ）において、１８ａ、１８
ｂ、１８ｃ、１８ｄ、１８ｅはリードであり、シールド
部２４には赤外線透過用の受光窓となる穿孔２１があ
り、赤外線はレンズ部２３により集光され、赤外線受光
素子１３（図示されず）に到達する。２０ａ及び２０ｂ
は折り曲げ部である。The infrared remote control light receiving unit according to the embodiment of the present invention assembled as described above is shown in FIG.
Shown in In FIG. 1A of a top view, 18a, 18
b, 18c, 18d, and 18e are leads, and the shield portion 24 has a hole 21 serving as a light receiving window for transmitting infrared light. The infrared light is condensed by the lens portion 23, and is transmitted to the infrared light receiving element 13 (not shown). To reach. 20a and 20b
Is a bent portion.
【００１９】図１（ｂ）は略断面図であり、リードフレ
ーム１０上には赤外線受光素子１３、集積回路素子１
４、チップコンデンサ１５やチップ抵抗１６が搭載され
ており、エポキシ樹脂などの樹脂でモールド（モールド
部１１）されている。２０ａ及２０ｂは折り曲げ部であ
り、２４はシールド部、２１は赤外線透過用の受光窓と
なる穿孔、２３はレンズ部である。FIG. 1B is a schematic sectional view, in which an infrared light receiving element 13 and an integrated circuit element 1 are provided on a lead frame 10.
4. A chip capacitor 15 and a chip resistor 16 are mounted, and are molded (molded portion 11) with a resin such as an epoxy resin. 20a and 20b are bent portions, 24 is a shield portion, 21 is a perforation serving as a light receiving window for infrared transmission, and 23 is a lens portion.
【００２０】また、図１（ｂ）に示されるように、モー
ルド部１１はシールド２４の高さより下にある構造であ
り、従来図の図８と比較してモールド樹脂の使用量を少
なくすることが出来ると共に、赤外線リモコン受光ユニ
ットを小型化、軽量化、薄型化を図ることが出来る。Further, as shown in FIG. 1B, the molding portion 11 has a structure below the height of the shield 24, so that the amount of the molding resin used can be reduced as compared with FIG. In addition, the infrared remote control light receiving unit can be reduced in size, weight, and thickness.
【００２１】リードフレームの非モールド部を折り曲げ
て作ったシールド部２４はモールド部１１の少なくとも
一部を覆う構造となっている。シールド部２４赤外線受
光素子１３への赤外線受光窓となる穿孔２１及びレンズ
部２３を除き、集積回路素子１４などの電気的、光学的
シールドの作用を果たしている。また、リード１８ｅは
接地端子であり、これと電気的に一体であるシールド部
２４は接地電位となっており、外部ノイズから集積回路
素子１４を遮蔽し、誤動作を防いでいる。また、モール
ド部１１の赤外線受光素子１３、集積回路素子１４、チ
ップコンデンサ１５やチップ抵抗１６は樹脂でモールド
されてるため、シールド部２４と電気的に接触すること
はない。The shield part 24 formed by bending the non-mold part of the lead frame has a structure that covers at least a part of the mold part 11. Except for the perforation 21 and the lens 23 serving as an infrared light receiving window for the infrared light receiving element 13, the shield part 24 functions as an electrical and optical shield for the integrated circuit element 14 and the like. The lead 18e is a ground terminal, and the shield portion 24, which is electrically integrated with the lead 18e, is at a ground potential, and shields the integrated circuit element 14 from external noise, thereby preventing malfunction. Further, since the infrared light receiving element 13, the integrated circuit element 14, the chip capacitor 15 and the chip resistor 16 of the molded part 11 are molded with resin, they do not come into electrical contact with the shield part 24.
【００２２】図４は本発明の別の一実施の形態である赤
外線受光ユニットを示す図であり、図４（ａ）はその外
形図、図４（ｂ）は略断面図である。FIG. 4 is a view showing an infrared receiving unit according to another embodiment of the present invention. FIG. 4 (a) is an outline view and FIG. 4 (b) is a schematic sectional view.
【００２３】外形図の図４（ａ）において、１８ａ、１
８ｂ、１８ｃ、１８ｄ、１８ｅはリードであり、シール
ド部２４には赤外線受光窓となる穿孔２１があり、図１
（ａ）の場合と異なり、穿孔２１には網目構造２５が施
されている。この網目構造のため、穿孔２１からの外部
ノイズの侵入を軽減し、外部ノイズから受光素子１３や
集積回路素子１４等を電磁気的に遮蔽し、誤動作を防止
している。２０ａ及び２０ｂは折り曲げ部である。In FIG. 4A of the outline drawing, 18a, 1
8b, 18c, 18d, and 18e are leads, and the shield portion 24 has a perforation 21 serving as an infrared receiving window.
Unlike the case of (a), the perforation 21 is provided with a mesh structure 25. Due to this mesh structure, intrusion of external noise from the perforations 21 is reduced, and the light receiving element 13 and the integrated circuit element 14 are electromagnetically shielded from external noise to prevent malfunction. 20a and 20b are bent portions.
【００２４】次に、略断面図の図４（ｂ）において、リ
ードフレーム１０上には赤外線受光素子１３、集積回路
素子１４などが搭載されており、エポキシ樹脂などの樹
脂でモールドされて、モールド部１１を形成している。
２０ａ及２０ｂは折り曲げ部であり、２１は穿孔、２５
は網目構造、２４はシールド部、２３はレンズ部であ
る。網目構造２５はリードフレーム１０の穿孔２１の対
応位置に細孔を多数形成することにより実現できるが、
穿孔２１の下に位置するレンズ部２３に導電性物質を網
目状に形成するか、透光性の導電性物質を全面に張り付
けても実現することができる。Next, in FIG. 4B, which is a schematic sectional view, an infrared light receiving element 13, an integrated circuit element 14, and the like are mounted on the lead frame 10, and are molded with a resin such as an epoxy resin. The part 11 is formed.
20a and 20b are bent portions, 21 is a perforation, 25
Is a mesh structure, 24 is a shield part, and 23 is a lens part. The network structure 25 can be realized by forming a large number of pores at positions corresponding to the perforations 21 of the lead frame 10,
This can also be realized by forming a conductive material in a mesh shape on the lens portion 23 located below the perforation 21 or attaching a light-transmitting conductive material to the entire surface.
【００２５】図５、図６は本発明の一実施の形態よりな
る赤外線受光ユニットの他の例を示す図であり、図５
（ａ）及び図５（ｂ）は側面図であり、図６は赤外線受
光ユニットのリードフレームを示す説明図である。FIGS. 5 and 6 show another example of the infrared light receiving unit according to an embodiment of the present invention.
5A and 5B are side views, and FIG. 6 is an explanatory view showing a lead frame of the infrared light receiving unit.
【００２６】図６において、リードフレーム１０上には
赤外線受光素子１３、高増幅率増幅器（ハイゲインアン
プ）を内蔵した集積回路（ＩＣ）素子１４、チップコン
デンサ１５やチップ抵抗１６が搭載されており、赤外線
受光素子１３や集積回路素子１４は金線１７によりリー
ドフレーム１０の各部分及び各素子間とワイヤーボンド
され、電気的に接続されている。リードフレーム１０上
のモールド部１１には赤外線受光素子１３、集積回路素
子１４、チップコンデンサ１５やチップ抵抗１６を樹
脂、例えばエポキシ樹脂などの樹脂でモールドされてお
り、樹脂モールドはリードフレームの折り曲げ工程時の
応力や完成後の湿気や衝撃から内部の各部品を保護する
役目を果たしている。リードフレーム１０のモールド部
１１の一方には、リード１８ａ、１８ｂ、１８ｃ、１８
ｄ、１８ｅ（接地端子）があり、他方の非モールド部１
２には抜き穴１９がある折り曲げ部２０ａ、２０ｂ及び
赤外線受光窓となる穿孔２１がある。抜き穴１９は折り
曲げ部２０ａの変形を容易にするためのものであり、切
り欠き等リードフレーム１０の変形を容易にするもので
あれば抜き穴以外の構造でもよい。さらに、本発明にお
いては、リードフレーム１０の非モールド部１２の一部
を伸延して、係合手段となる部分の突起部２６ａ、２６
ｂが設けられている。樹脂モールド後、リードフレーム
１０の折り曲げ部２０ａ、２０ｂ及び係合手段となる部
分の突起部２６ａ、２６ｂの折り曲げ部２７ａ、２７
ｂ、２８ａ、２８ｂで折り曲げることにより、赤外線リ
モコン受光ユニットを組み立て、完成図の図５を得る。In FIG. 6, an infrared light receiving element 13, an integrated circuit (IC) element 14 having a built-in high gain amplifier (high gain amplifier), a chip capacitor 15 and a chip resistor 16 are mounted on a lead frame 10. The infrared light receiving element 13 and the integrated circuit element 14 are wire-bonded to each part of the lead frame 10 and between the elements by a gold wire 17 and are electrically connected. In a mold portion 11 on the lead frame 10, an infrared light receiving element 13, an integrated circuit element 14, a chip capacitor 15 and a chip resistor 16 are molded with a resin, for example, a resin such as an epoxy resin. It plays a role in protecting each component inside from the stress of the time, the moisture and the impact after completion. One of the molded portions 11 of the lead frame 10 has leads 18a, 18b, 18c, 18
d, 18e (ground terminal) and the other non-molded part 1
2 includes bent portions 20a and 20b having a hole 19 and a hole 21 serving as an infrared receiving window. The hole 19 is for facilitating the deformation of the bent portion 20a, and may have a structure other than the hole as long as it facilitates deformation of the lead frame 10 such as a notch. Further, in the present invention, a part of the non-molded portion 12 of the lead frame 10 is extended to form a projection 26a, 26
b is provided. After the resin molding, the bent portions 20a and 20b of the lead frame 10 and the bent portions 27a and 27 of the protrusions 26a and 26b serving as the engagement means.
By bending at b, 28a and 28b, the infrared remote control light receiving unit is assembled, and FIG. 5 of the completed drawing is obtained.
【００２７】側面図である図５（ａ）において、１１は
樹脂モールド部、１８ｅはリード、２０ａ及び２０ｂは
折り曲げ部、２１は赤外線透過用の受光窓となる穿孔、
２３はレンズ部、２４はシールド部、２６ｂは係合手段
となる部分の突起部、２７ｂは前記突起部の折り曲げ
部、２８ｂは前記突起部の足部を得るための折り曲げ部
である。また、リードフレームの非モールド部を折り曲
げて形成したシールド部２４はモールド部１１の少なく
とも一部を覆う構造となっており、赤外線受光素子１３
や集積回路素子１４などの電気的、光学的シールドの作
用を果たしている。また、リード１８ｅは接地端子であ
り、これと電気的に一体であるシールド部２４は接地電
位となっており、外部ノイズから集積回路素子１４を遮
蔽し、誤動作を防いでいる。In FIG. 5A, which is a side view, 11 is a resin mold portion, 18e is a lead, 20a and 20b are bent portions, 21 is a hole serving as a light receiving window for transmitting infrared rays,
23 is a lens portion, 24 is a shield portion, 26b is a projection of a portion serving as an engagement means, 27b is a bent portion of the projection, and 28b is a bent portion for obtaining a foot of the projection. The shield part 24 formed by bending the non-mold part of the lead frame has a structure that covers at least a part of the mold part 11.
And an electric and optical shield of the integrated circuit element 14 and the like. The lead 18e is a ground terminal, and the shield portion 24, which is electrically integrated with the lead 18e, is at a ground potential, and shields the integrated circuit element 14 from external noise, thereby preventing malfunction.
【００２８】また、図６のリードフレームを折り曲げ
て、図５（ａ）を得る工程において、リードフレーム１
０上の赤外線受光素子１３、集積回路素子１４、チップ
コンデンサ１５やチップ抵抗１６や金線１７は、樹脂、
例えばエポキシ樹脂などの樹脂で先ずモールドされ、固
定されているため、リードフレーム１０の折り曲げ加工
時においても、これらの部品、赤外線受光素子１３、集
積回路素子１４、チップコンデンサ１５やチップ抵抗１
６や金線１７が変形したり、破損したりすることがな
く、赤外線リモコン受光ユニットの信頼性を高めること
ができる。In the step of bending the lead frame of FIG. 6 to obtain FIG.
The infrared light receiving element 13, integrated circuit element 14, chip capacitor 15, chip resistor 16 and gold wire 17 on
For example, these parts, the infrared light receiving element 13, the integrated circuit element 14, the chip capacitor 15, the chip
6 and the gold wire 17 are not deformed or damaged, and the reliability of the infrared remote control light receiving unit can be improved.
【００２９】リード側から見た側面図である図５（ｂ）
において、１１は樹脂モールド部、１８ａ、１８ｂ、１
８ｃ、１８ｄ、１８ｅ（接地電位）はリード、２４はシ
ールド部、２６ａ及び２６ｂは係合手段となる部分の突
起部、２７ａ及び２７ｂは前記突起部の折り曲げ部、２
８ａ及び２８ｂは前記突起部の足部を得るための折り曲
げ部である。FIG. 5B is a side view seen from the lead side.
, 11 is a resin mold part, 18a, 18b, 1
8c, 18d and 18e (ground potentials) are leads, 24 is a shield part, 26a and 26b are projections of a portion serving as engagement means, 27a and 27b are bent parts of the projections,
8a and 28b are bent portions for obtaining the foot portion of the projection.
【００３０】また、係合手段となる部分の突起部２６ａ
及び２６ｂはシールド部２４を樹脂モールドされた赤外
線リモコン受光ユニットを挟み込むように構成されてい
る。このことにより、この部分においてもシールド効果
が得られると共に、赤外線リモコン受光ユニットとプリ
ント基板との係合を強固にする作用を果たし、シールド
部２４が動くことによって生じる不具合、例えば、受光
窓となる穿孔２１（図示されず）の位置ずれや電磁波の
シールド効果の変動などを防止することができる。The projection 26a of the portion serving as the engagement means
And 26b are configured to sandwich the infrared remote control light receiving unit in which the shield part 24 is resin-molded. As a result, a shielding effect can be obtained also in this portion, and an effect of strengthening the engagement between the infrared remote control light receiving unit and the printed circuit board can be achieved, thereby causing a problem caused by the movement of the shield portion 24, for example, a light receiving window. It is possible to prevent the displacement of the perforation 21 (not shown), the fluctuation of the electromagnetic wave shielding effect, and the like.
【００３１】[0031]
【発明の効果】以上のように、本発明の請求項１記載の
赤外線リモコン受光ユニットによれば、リードフレーム
上にはモールド部と非モールド部とがあり、且つ該モー
ルド部に電気回路を配設した赤外線リモコン受光ユニッ
トにおいて、該非モールド部に受光窓となる穿孔を設
け、該非モールド部を折り曲げて、モールド部の少なく
とも一部を覆う構造とすることを特徴とするものであ
り、外部ノイズである電磁波から集積回路素子３などの
電気回路を保護することができ、誤動作を防ぐことがで
きる。As described above, according to the infrared remote control light receiving unit according to the first aspect of the present invention, the lead frame has the molded part and the non-molded part, and the electric circuit is arranged in the molded part. In the provided infrared remote control light receiving unit, the non-molded portion is provided with a hole serving as a light receiving window, and the non-molded portion is bent to cover at least a part of the molded portion, which is characterized by external noise. An electric circuit such as the integrated circuit element 3 can be protected from a certain electromagnetic wave, and a malfunction can be prevented.
【００３２】また、本発明の請求項２記載の赤外線リモ
コン受光ユニットによれば、前記非モールド部を折り曲
げたリードフレームを接地電位とすることを特徴とする
ものであり、接地電位のリードとシールド部のリードフ
レームとは一体であり、シールド部を特に接地する配線
は不要となり、接地する構造が簡素となり、小型化とコ
ストダウンが図れる。Further, according to the infrared remote control light receiving unit according to the second aspect of the present invention, the lead frame obtained by bending the non-molded portion is set to the ground potential, and the ground potential lead and the shield are connected. Since the wiring is integral with the lead frame of the unit, wiring for grounding the shield part in particular is unnecessary, the structure for grounding is simplified, and miniaturization and cost reduction can be achieved.
【００３３】また、本発明の請求項３記載の赤外線リモ
コン受光ユニットによれば、前記非モールド部の受光窓
となる穿孔を網目状の開口構造としたことを特徴とする
ものであり、赤外線受光窓からの電磁波ノイズの侵入を
軽減でき、シールド効果を高めることができる。Further, according to the infrared remote control light receiving unit according to the third aspect of the present invention, the perforations serving as the light receiving windows of the non-molded portion have a mesh-like opening structure. Invasion of electromagnetic noise from windows can be reduced, and the shielding effect can be enhanced.
【００３４】また、本発明の請求項４記載の赤外線リモ
コン受光ユニットによれば、前記非モールド部のリード
フレームの一部を伸延して係合手段となる部分を設けた
構造よりなることを特徴とするものであり、係合手段と
なる部分の突起部２６ａ及び２６ｂはシールド部２４を
樹脂モールドされた赤外線リモコン受光ユニットを挟み
込むように構成されている。このことにより、この部分
においてもシールド効果が得られると共に、赤外線リモ
コン受光ユニットとプリント基板との係合を強固にする
作用を果たし、シールド部２４が動くことによって生じ
る不具合、例えば、受光窓となる穿孔２１の位置ずれや
電磁波のシールド効果の変動などを防止することができ
る。According to the infrared remote control light receiving unit according to a fourth aspect of the present invention, the non-molded portion has a structure in which a part of the lead frame is extended to provide a portion serving as an engagement means. The projections 26a and 26b serving as the engagement means are configured so as to sandwich the infrared remote control light receiving unit in which the shield 24 is resin-molded. As a result, a shielding effect can be obtained also in this portion, and an effect of strengthening the engagement between the infrared remote control light receiving unit and the printed circuit board can be achieved, thereby causing a problem caused by the movement of the shield portion 24, for example, a light receiving window. It is possible to prevent the displacement of the perforations 21 and the fluctuation of the electromagnetic wave shielding effect.
【００３５】さらに、本発明の請求項５記載の赤外線リ
モコン受光ユニットの製造方法によれば、モールド部を
樹脂でモールドする工程と、非モールド部を折り曲げて
該モールド部の少なくとも一部を覆う構造とする工程と
を含むことを特徴とするものであり、リードフレームの
モールド部を樹脂でモールドした後、リードフレームの
折り曲げ加工を行うものであり、折り曲げ工程で生じる
可能性のある電気回路の不良を未然に防ぐことができ
る。Further, according to the method of manufacturing the infrared remote control light receiving unit according to the fifth aspect of the present invention, the step of molding the molded portion with a resin and the structure of bending the non-molded portion to cover at least a part of the molded portion After molding the molded portion of the lead frame with a resin, and then bending the lead frame, which may cause a defect in the electric circuit that may occur in the bending process. Can be prevented beforehand.
【図１】本発明の一実施の形態よりなる赤外線受光ユニ
ットを示す図であり、（ａ）はその上面図であり、
（ｂ）は略断面図である。FIG. 1 is a diagram showing an infrared light receiving unit according to an embodiment of the present invention, where (a) is a top view thereof,
(B) is a schematic sectional view.
【図２】本発明の一実施の形態よりなる赤外線受光ユニ
ットのリードフレームを示す説明図である。FIG. 2 is an explanatory diagram showing a lead frame of the infrared light receiving unit according to one embodiment of the present invention.
【図３】本発明の一実施の形態よりなる赤外線受光ユニ
ットのモールド及び折り曲げ工程を説明する図であり、
（ａ）は、モールドされた状態を示す側面図であり、
（ｂ）はモールド後にリードフレームを折り曲げた状態
を示す側面図である。FIG. 3 is a diagram illustrating a mold and bending process of the infrared receiving unit according to the embodiment of the present invention;
(A) is a side view showing a molded state,
(B) is a side view showing the state where the lead frame was bent after molding.
【図４】本発明の一実施の形態よりなる他の赤外線受光
ユニットを示す図であり、（ａ）はその外形図であり、
（ｂ）は略断面図である。FIG. 4 is a diagram showing another infrared light receiving unit according to an embodiment of the present invention, wherein (a) is an outline view thereof,
(B) is a schematic sectional view.
【図５】本発明の一実施の形態よりなる他の赤外線受光
ユニットを示す図であり、（ａ）は長辺側から見た側面
図であり、（ｂ）はリード側から見た側面図である。5A and 5B are diagrams showing another infrared light receiving unit according to an embodiment of the present invention, wherein FIG. 5A is a side view as viewed from a long side, and FIG. 5B is a side view as viewed from a lead side. It is.
【図６】本発明の一実施の形態よりなる他の赤外線受光
ユニットのリードフレームを示す説明図である。FIG. 6 is an explanatory view showing a lead frame of another infrared light receiving unit according to an embodiment of the present invention.
【図７】従来例の赤外線リモコン受光ユニットの略断面
図である。FIG. 7 is a schematic sectional view of a conventional infrared remote control light receiving unit.
【図８】従来例の赤外線リモコン受光ユニットの略断面
図である。FIG. 8 is a schematic sectional view of a conventional infrared remote control light receiving unit.
１０ リードフレーム １１ モールド部 １２ 非モールド部 １３ 赤外線受光素子 １４ 高増幅率増幅器を内蔵した集積回路（ＩＣ）素子 １５ チップコンデンサ １６ チップ抵抗 １７ 金線 １８ａ、１８ｂ、１８ｃ、１８ｄ、１８ｅ リード １９ 抜き穴 ２０ａ、２０ｂ 折り曲げ部 ２１ 赤外線透過用の受光窓となる穿孔 ２３ レンズ部 ２４ シールド部 ２５ 網目構造 ２６ａ、２６ｂ 係合手段となる部分の突起部 ２７ａ、２７ｂ 突起部の折り曲げ部 ２８ａ、２８ｂ 突起部の足部を得るための折り曲げ部 DESCRIPTION OF SYMBOLS 10 Lead frame 11 Molded part 12 Non-molded part 13 Infrared light receiving element 14 Integrated circuit (IC) element with built-in high gain amplifier 15 Chip capacitor 16 Chip resistor 17 Gold wire 18a, 18b, 18c, 18d, 18e Lead 19 Drilled hole 20a, 20b Folded part 21 Perforation to be a light receiving window for infrared transmission 23 Lens part 24 Shield part 25 Mesh structure 26a, 26b Projection 27a, 27b Projection bent 27a, 28b Projection bent 28a, 28b Projection Bend to get foot
Claims (5)
ールド部とがあり、且つ該モールド部に電気回路を配設
した赤外線リモコン受光ユニットにおいて、該非モール
ド部に受光窓となる穿孔を設け、該非モールド部を折り
曲げて、モールド部の少なくとも一部を覆う構造とする
ことを特徴とする赤外線リモコン受光ユニット。1. An infrared remote control light-receiving unit having a molded part and a non-molded part on a lead frame, and an electric circuit arranged in the molded part, wherein the non-molded part is provided with a hole serving as a light receiving window, An infrared remote control light-receiving unit, wherein the molded part is bent to cover at least a part of the molded part.
ットにおいて、前記非モールド部を折り曲げたリードフ
レームを接地電位とすることを特徴とする赤外線リモコ
ン受光ユニット。2. The infrared remote control light receiving unit according to claim 1, wherein the lead frame in which the non-molded portion is bent has a ground potential.
ットにおいて、前記非モールド部の受光窓となる穿孔を
網目状の開口構造としたことを特徴とする赤外線リモコ
ン受光ユニット。3. The infrared remote control light receiving unit according to claim 1, wherein a perforation serving as a light receiving window of the non-molded portion has a mesh-like opening structure.
ットにおいて、前記非モールド部のリードフレームの一
部を伸延して係合手段となる部分を設けた構造よりなる
ことを特徴とする赤外線リモコン受光ユニット。4. The infrared remote control light receiving unit according to claim 1, further comprising a structure in which a part of the lead frame of the non-molded portion is extended to provide a portion serving as an engagement means. unit.
ットの製造方法において、モールド部を樹脂でモールド
する工程と、非モールド部を折り曲げて該モールド部の
少なくとも一部を覆う構造とする工程とを含むことを特
徴とする赤外線リモコン受光ユニットの製造方法。5. The method of manufacturing an infrared remote control light-receiving unit according to claim 1, wherein the step of molding the molded portion with a resin and the step of bending the non-molded portion to cover at least a part of the molded portion are performed. A method of manufacturing an infrared remote control light receiving unit, comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22958196A JP3266806B2 (en) | 1996-08-30 | 1996-08-30 | Infrared remote control light receiving unit and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22958196A JP3266806B2 (en) | 1996-08-30 | 1996-08-30 | Infrared remote control light receiving unit and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1074962A true JPH1074962A (en) | 1998-03-17 |
| JP3266806B2 JP3266806B2 (en) | 2002-03-18 |
Family
ID=16894431
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22958196A Expired - Fee Related JP3266806B2 (en) | 1996-08-30 | 1996-08-30 | Infrared remote control light receiving unit and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3266806B2 (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000138393A (en) * | 1998-11-04 | 2000-05-16 | Hamamatsu Photonics Kk | Radiation detector |
| JP2002048600A (en) * | 2000-07-10 | 2002-02-15 | Dr Johannes Heidenhain Gmbh | Optical position measuring device |
| WO2004077575A1 (en) * | 2003-02-27 | 2004-09-10 | Sanyo Electric Co., Ltd. | Lead frame and light receiving module comprising it |
| WO2005071759A1 (en) * | 2004-01-26 | 2005-08-04 | Rohm Co., Ltd. | Light-receiving module |
| EP1187207A3 (en) * | 2000-09-07 | 2006-03-29 | STMicroelectronics, Inc. | Surface mount package with integral electro-static charge dissipating ring using lead frame as esd device |
| JP2007300055A (en) * | 2006-05-02 | 2007-11-15 | Everlight Electronics Co Ltd | Package structure of surface-mounting module |
| JP2008066511A (en) * | 2006-09-07 | 2008-03-21 | Fuji Xerox Co Ltd | Optical transmission module, method of manufacturing optical transmission module, and optical transmission apparatus |
| JP2010027902A (en) * | 2008-07-22 | 2010-02-04 | Sharp Corp | Surface-mounted infrared photodetection unit, method of manufacturing surface-mounted infrared photodetection unit, and electronic equipment |
-
1996
- 1996-08-30 JP JP22958196A patent/JP3266806B2/en not_active Expired - Fee Related
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000138393A (en) * | 1998-11-04 | 2000-05-16 | Hamamatsu Photonics Kk | Radiation detector |
| JP4638083B2 (en) * | 2000-07-10 | 2011-02-23 | ドクトル・ヨハネス・ハイデンハイン・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング | Optical position measuring device |
| JP2002048600A (en) * | 2000-07-10 | 2002-02-15 | Dr Johannes Heidenhain Gmbh | Optical position measuring device |
| EP1187207A3 (en) * | 2000-09-07 | 2006-03-29 | STMicroelectronics, Inc. | Surface mount package with integral electro-static charge dissipating ring using lead frame as esd device |
| WO2004077575A1 (en) * | 2003-02-27 | 2004-09-10 | Sanyo Electric Co., Ltd. | Lead frame and light receiving module comprising it |
| JP2004319940A (en) * | 2003-02-27 | 2004-11-11 | Sanyo Electric Co Ltd | Lead frame and receiving module equipped with it |
| JP4683826B2 (en) * | 2003-02-27 | 2011-05-18 | 三洋電機株式会社 | Lead frame and light receiving module including the same |
| JPWO2005071759A1 (en) * | 2004-01-26 | 2007-09-06 | ローム株式会社 | Receiver module |
| CN100459173C (en) * | 2004-01-26 | 2009-02-04 | 罗姆股份有限公司 | Light-receiving module |
| JP4542042B2 (en) * | 2004-01-26 | 2010-09-08 | ローム株式会社 | Receiver module |
| WO2005071759A1 (en) * | 2004-01-26 | 2005-08-04 | Rohm Co., Ltd. | Light-receiving module |
| JP2007300055A (en) * | 2006-05-02 | 2007-11-15 | Everlight Electronics Co Ltd | Package structure of surface-mounting module |
| JP2008066511A (en) * | 2006-09-07 | 2008-03-21 | Fuji Xerox Co Ltd | Optical transmission module, method of manufacturing optical transmission module, and optical transmission apparatus |
| JP2010027902A (en) * | 2008-07-22 | 2010-02-04 | Sharp Corp | Surface-mounted infrared photodetection unit, method of manufacturing surface-mounted infrared photodetection unit, and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3266806B2 (en) | 2002-03-18 |
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