JP2602796Y2 - Receiver module for infrared remote control - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light-receiving module for a remote controller which is attached to a TV, VTR, air conditioner, etc. and receives infrared rays from a remote controller.

[0002]

2. Description of the Related Art Conventionally, this type of light receiving module has been described with reference to FIG.
The structure shown in FIG. FIG. 4 is a sectional view of an essential part of an example of a conventional light receiving module, wherein 1 is a photodiode having a built-in infrared detecting element, and 2 is an I / O for signal processing.
C, 3 denotes a printed circuit board, 4 denotes a shield case, 5 denotes an electrode lead, 6 denotes a resistor, 7 denotes a capacitor, and 8 denotes a holder.

The structure of a conventional light receiving module includes a photodiode 1 for converting infrared light received on a printed circuit board 3 into an electric signal, an IC 2 required for signal processing for performing various controls by the electric signal, a resistor 6, and the like. The capacitor 7 is mounted on both sides for miniaturization, and the electrode lead 5 is soldered and housed in the shield case 4 or the shield case 4 and the holder 8.

The shield case 4 used here is for preventing malfunction of the light receiving module due to external electromagnetic noise, and mainly uses metal as its material. The holder 8 fixes the printed circuit board 3 and is formed of an insulating resin or the like so that a short circuit does not occur even when the electrode leads 5 touch. The example of FIG. 4 has a structure in which the printed circuit board 3 is incorporated in the holder 8 and a shield case is placed over them.

[0005]

As described above, conventionally, the number of parts is large, so that the assembling process is complicated and the assembling time is long, so that the manufacturing cost is high. For example, one substrate (glass epoxy, ethylene tetrafluoride,
A large number of identical wiring patterns and through holes are formed on a ceramic substrate, etc., and an IC, a resistor, and a capacitor are soldered on one surface of the substrate, and a photodiode is soldered on the other surface corresponding to each wiring pattern. After dividing the board into strips, solder the electrode leads corresponding to the individual wiring patterns, and further divide the strip-shaped board with multiple electrode leads into individual printed circuit board sizes to mount components. After assembling the printed circuit board, the assembly procedure was to assemble it into a shield case or assemble it into a holder and then assemble it into a shield case.

In such a structure, there are many soldering points, and most of the failures of the electronic equipment have poor soldering, so that there is a problem in reliability. Further, in a method of directly incorporating a printed circuit board into a shield case without using a holder, generally, a claw and a protrusion formed by cutting and raising a part of the inner surface of the shield case are provided, and the claw and the protrusion are provided. , The edge of the printed circuit board is pinched, so once the printed circuit board is installed in the shield case, the printed circuit board cannot be easily removed, reducing the number of components, but making recovery work difficult Was.

[0007]

In order to solve the above-mentioned problems, the present invention provides a lead frame in which external leads are extended in one direction.
And a signal processing integrated circuit fixed to the lead frame.
Circuit element and infrared detecting element, and the integrated circuit element and red
Wiring provided between each element of the external line detection element and the external lead,
The external lead is molded into a substantially rectangular parallelepiped shape while leaving the end thereof.
A light receiving unit having a shaped infrared transmitting resin,
The light receiving unit is enclosed and stored, and the red
A window provided at a position on the upper surface facing the outside line detection element,
The light receiving unit is provided by being cut and raised from the inner wall and fixedly supported.
And a shield case having a section to be held
A light receiving module for a remote control, wherein the infrared transmitting tree
A pair of sides adjacent to and facing the external lead-out side of the grease
A step or notch is provided on the surface, and the
The light-receiving surface of the light-receiving unit comes into contact with the
The section is the back side of the light incident surface, the step or the notch
Part and the side opposite to the side surface from which the external lead extends
The light receiving unit is in contact with the window
It is configured to be fixedly supported between the section and the section .

[0008] Further, the infrared detection is provided on the light incident surface.
A semi-circular shape at the position corresponding to the infrared optical axis incident on the element
Is formed on the shield case.
A hole is formed in the bottom of the mortar-shaped concave portion provided on the
The window is fitted to the window, and the vicinity of the window is a peripheral portion of the window.
It is configured so as that.

[0009]

In the light receiving module according to the present invention, the active and passive elements for signal processing, excluding the photodiode, are monolithically integrated to form a one-chip integrated circuit element. Decrease.
Further, since the integrated circuit element and the infrared detecting element are both fixed and wired to the lead frame, the external leads of the lead frame play the role of the conventional electrode leads, and are required in the assembly process conventionally required. The soldering of the electrode leads becomes unnecessary.

The manufacturing process of the integrated circuit device of the present invention is almost the same as the manufacturing process of the integrated circuit device mounted on the conventional IC, but only involves changing the specifications of the photomask and changing conditions such as diffusion and ion implantation. Yes, it does not require drastic process changes that require new equipment and materials.

The process of assembling the light receiving unit of the present invention is the same as the process of assembling a conventional photodiode. However, changes in the shape of the lead frame, addition of die bonding and wire bonding, and changes in jigs and the like due to this are conceivable, but do not require equipment that has never existed before, and do not require drastic process changes. .

Compared to the conventional method of forming an integrated circuit by individually mounting single-function elements and the like on a printed circuit board by surface mounting or manual soldering, the present invention realizes a semiconductor manufacturing process which is highly effective in mass production. Since a monolithic integrated circuit is configured, manufacturing costs are significantly reduced. Further, since soldering is eliminated, the reliability of the product is improved.

According to the present invention, since the light receiving unit is sandwiched between the contact portion of the section with the lower surface of the light receiving unit and a part of the shield case, a gap between the part of the shield case and the contact portion is provided. When the thickness of the light receiving unit is smaller than that of the light receiving unit, a bending moment is applied to the section due to the vertical force acting on the contact portion. That is, the section is curved so as to be concave toward the light receiving unit. By setting the gap to a predetermined distance determined by an experiment or the like, the light receiving unit can be held by the section, and the light receiving unit in the shield case can be reliably fixed at a correct position.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings. FIG. 1A is a sectional view of a main part showing an embodiment of the present invention, and FIG. 1B is a sectional view taken along line AA of FIG. 1A.
FIG. 2A is an explanatory view showing details of a light receiving unit used in the embodiment of FIG. 1, and FIG.
FIG. 3A shows a top view. In these figures, 4 is a shield case, 9 is a light receiving unit, 10 is an external lead, 1
1a, 11b, 11c are sections, 12 is a window, 13 is a through hole,
Reference numeral 14 denotes a claw portion that engages with 13, reference numeral 15 denotes a bent portion of the shield case, reference numeral 16 denotes a through hole for leading the external lead 10 out of the shield case, and reference numeral 17 denotes a square hole in which the light receiving module is formed in a substrate or the like. Claw portions for temporarily fixing the light receiving module to a substrate or the like, 18 are spacers for floating the light receiving module from a surface of the substrate or the like at a predetermined gap, 19 is a lead frame, 20 is an infrared detecting element, and 21 is a signal processing device. An integrated circuit element, 22 is a resin, 23a and 23b are steps, 24a and
24b and 24c indicate convex portions.

First, the structure of the light receiving unit 9 will be described with reference to FIG. The infrared detecting element 20 is provided on the die island of the lead frame 19 in which the external leads are extended in one direction.
Further, the integrated circuit element 21 for signal processing is fixed by die bonding. Detection element 20 and integrated circuit element 2
1 and the internal leads of the lead frame 19 are wired by wire bonding.

The infrared detecting element 20 is the same as the element mounted on a conventional photodiode, and the integrated circuit element 21 is mounted on a passive element such as a capacitor or a resistor other than the conventional photodiode or mounted on a conventional IC. The integrated circuit element is fabricated on a single semiconductor substrate and monolithically integrated.

The resin 22 is a resin that transmits infrared rays used in a conventional photodiode, and is formed by transfer molding on a portion of the lead frame to which the elements 20 and 21 are fixed and wired except for external leads. Infrared detector 2
A converging convex lens is formed on the light incident surface at a position corresponding to the 0 optical axis, and is formed by one transfer molding simultaneously with other portions.

Next, the structure of the shield case will be described. It is a metal plate formed by plating a steel plate with tin or solder by a progressive press die.
What is different from the conventional one is that it is cut and raised from the metal plate on the lower surface.
That is, two sections 11a, 11b, and 11c are erected. Each of these three sections 11a, 11b, 11c has a projection 24a, 24b, 24c. These protrusions are first cut and raised substantially perpendicularly from the metal plate to the plane of the metal plate by a press machine, and then the outer shape of the section is determined so as to include the base of the protrusion, and the section is moved from the metal plate to the metal plate. By cutting and raising substantially perpendicularly to the plane, the sections 11a and 1 having the convex portions 24a, 24b and 24c
1b and 11c are obtained.

In this embodiment, the sections 11a and 1
Since the 1b and 11c and the convex portions 24a, 24b, and 24c are formed, operations such as welding and bonding can be omitted to obtain a section or a convex portion.

Next, the structure of the light receiving module in which the light receiving unit 9 is incorporated in the shield case 4 will be described with reference to FIG. Of the three sections 11a, 11b, and 11c erected in the shield case 4, 11a and 11b respectively abut against the side surfaces of the light receiving unit 9 having the steps 23a and 23b, and the section 11c is connected to the step 23a of the light receiving unit.
-It is in contact with the side facing the lead lead-out side without 23b. In addition, the sections 11a and 11c are
b, the light receiving unit 9 is restricted from moving in the horizontal direction, and is positioned in the same direction.

The protruding portions 24a, 24b, and 24c abut on the lower surface of the light receiving unit 9 (the back surface of the light incident surface), squeeze the upper surface of the shield case 4 in a mortar shape, and form a hole 12 in the bottom surface.
The light-entering surface of the light-receiving unit 9 abuts on the periphery to limit the vertical movement of the light-receiving unit 9 and perform positioning in the same direction.

When assembling the light receiving unit 9 into the shield case 4 in the assembling process, the bent portions 15 are not bent, but the sections 11a, 11b. 11c, the bent portion 15 is bent, and the claw portion 14 is bent.
Are engaged with the through holes 13, the window 12 is fitted to the lens portion of the light receiving unit 9, the periphery of the window 12 is brought into contact with the light incident surface of the light receiving unit 9, and the periphery of the window 12 and the projections 24 a, 24 b.
24c.

In this embodiment, as described above, the section 11a
Since the surface on which 11b and 11c are erected is like a lid, and the through hole 13 and the claw portion 14 are engaged, the light receiving unit 9 is stored in the shield case 4 and at the same time the light receiving unit in the shield case 4 is received. 9 complete positioning. Therefore, the light receiving unit 9 is simply fitted between the sections 11a, 11b, and 11c and the "lid" is closed, so that the assembling work is simple. Further, if the claw portion 14 is pressed by the tip of a screwdriver or the like, the shield case 4 is opened and the light receiving unit 9 can be easily taken out, so that the collecting operation is easy.

FIG. 3A shows another embodiment of the present invention.
FIG. 3B is a sectional view taken along line BB of FIG. 3, the same reference numerals as those in FIGS. 1, 2 and 4 denote the same or corresponding components, 25 denotes a concave portion formed on the lower surface of the light receiving unit 9, and 26a, 26b and 26c denote convex portions.

The recess 25 has an opening area larger than the bottom area, a trapezoidal cross section, and an inclined inner side surface. Each of the convex portions 26a, 26b, and 26c is in contact with the lower surface of the light receiving unit 9 and the inner surface of the concave portion 25,
A part of the upper surface is inclined. With such a configuration, if the light receiving unit 9 is fitted between the sections 11a, 11b, and 11c in a state where the bent portion 15 of the shield case 4 is not bent, the convex portions 26a and 26b
When the inclined portion 26c is engaged and the bent portion 15 is further bent to enclose the light receiving unit 9 in the shield case 4, the periphery of the window 12 pushes down the light receiving unit 9 and the convex portion 2
The inclined portions of 6a, 26b and 26c bite into the concave portion 25 along the inner surface thereof, and the sections 11a and 1
1b and 11c fall down to the light receiving unit 9 side, and the light receiving unit 9 is gripped without a gap between the sections 11a, 11b, and 11c. In the embodiment shown in FIG. 3, when the light receiving unit 9 is sufficiently gripped by the sections 11a, 11b, and 11c, the lower surface of the light receiving unit 9 becomes convex 26a, 26b, and 26c.
Abuts on the upper surface of the non-inclined surface.

In the embodiment shown in FIG. 3, since the sections 11a, 11b, and 11c are substantially perpendicular to the lower surface of the shield case 4 even if they are not cut and raised sufficiently, the projections 26a. If the light receiving units 9 are sealed in the shield case 4, if the light receiving units 9 are sealed in the shield case 4, no gap is formed between the sections 11a, 11b, 11c and the light receiving unit 9. Therefore, the sections 11a and 1
After cutting and raising 1b and 11c, the light receiving unit can be reliably fixed to the correct position in the shield case 4 even if the space between the sections is widened by springback.

Although the embodiment has been described above, the present invention is not limited to this, and various modifications can be made. For example, the place where the section is erected is the lower surface of the shield case, but may be the side surface. In this case, the section is bent substantially perpendicularly so that the tip of the section is directed toward the surface having the window between the projection and the base of the side surface. Then, the surface having the window can be freely opened and closed like a lid.

Further, in the above embodiment, the step is formed on the side surface of the light receiving unit, but it goes without saying that a notch may be used as long as the piece is engaged. Furthermore, in the above embodiment, the window periphery of the shield case was brought into contact with the light receiving surface of the light receiving unit, but other portions of the upper surface of the shield case, a block attached to the inner surface of the upper surface, or a section cut and raised from the side surface. Obviously, the contact may be made to abut the contact.

[0029]

[Effects of the Invention] As described above, according to the present invention,
Since the number of components of the light receiving module can be reduced and the structure can be simplified, the manufacturing cost can be reduced. Further, soldering is not required, and the reliability of the light receiving module can be improved. Further, the light receiving module can be easily taken out into the shield case, and particularly, the collecting operation becomes easy.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an embodiment of the present invention.

FIG. 2 is an explanatory view showing details of a light receiving unit used in the present invention.

FIG. 3 is a sectional view showing another embodiment of the present invention.

FIG. 4 is a sectional view showing a conventional example.

[Description of sign]

 Reference Signs List 4 shield case 9 light receiving unit 10 external lead 11a, 11b, 11c section 12 window 13 through hole 14 claw portion 15 bent portion 16 through hole 19 lead frame 20 infrared detecting element 21 integrated circuit element 22 resin 23a, 23b step 24a, 24b , 24c convex portion 25 concave portion 26a, 26b, 26c convex portion

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 31/02-31/0236

Claims (2)

(57) [Scope of request for utility model registration] 1. A lead frame having an external lead extending in one direction.
Frame and a signal processing assembly fixed to the lead frame.
Integrated circuit element, infrared detecting element, integrated circuit element,
Wiring between each element of the infrared and infrared detectors and external leads
And a molding into a substantially rectangular parallelepiped shape excluding the end of the external lead.
Light receiving unit having an infrared transmitting resin formed by molding
Surrounding the light receiving unit, and
A window provided on the upper surface facing the infrared detecting element
And the light receiving unit, which is cut and raised from the inner wall, is fixed.
And a shield case having a section to be fixedly supported.
A light-receiving module for an infrared remote controller, the light-receiving module being adjacent to a side surface of the infrared-transmitting resin that leads to the external lead.
Steps or notches are provided on a pair of opposing side surfaces,
The light incident surface of the light receiving unit abuts near the window,
The section of the shield case is on the back side of the light incident surface,
Part or notch, and the side from which the above-mentioned external lead extends
The light receiving unit is in contact with the
A light receiving module for an infrared remote controller, which is fixedly supported between the vicinity of the writing window and the section . 2. An infrared detecting element on the light incident surface.
At the position corresponding to the incident infrared optical axis, a semi-circular spherical lens
Window is provided on the upper surface of the shield case.
A hole is formed in the bottom of the mortar-shaped concave part, and the lens part is
2. The light receiving module for an infrared remote controller according to claim 1, wherein the light receiving module is fitted in the window, and the vicinity of the window is a peripheral portion of the window .