JP2010027902A - Surface-mounted infrared photodetection unit, method of manufacturing surface-mounted infrared photodetection unit, and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide: a surface-mounted infrared photodetection unit with good productivity such that a shield portion united with a lead frame is easily formed with high precision; a method of manufacturing the surface-mounted infrared photodetection unit; and electronic equipment mounted with the surface-mounted infrared photodetection unit. <P>SOLUTION: The surface-mounted infrared photodetection unit 1 includes the lead frame 13 mounted with a photodetector 11 and a signal processing integrated circuit 12, a resin sealing portion 14 sealing the lead frame 13 with a resin including the photodetector 11 and signal processing integrated circuit 12, a surface-mounted terminal 15 extended from the lead frame 13 and bent toward a bottom surface 14b of the resin sealing portion 14, a shield portion 20 bent along the resin sealing portion 14 to cover a region corresponding to the signal processing integrated circuit 12 with a top surface 14t, and an engagement portion 21 extended from the shield portion 20 and bent toward the bottom surface 14b to engage the shield portion 20 with the resin sealing portion 14, wherein the engagement portion 21 is a surface-mounted terminal 15r. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a surface-mounted infrared light receiving unit having a shield part formed by extending a lead frame on which a light-receiving element and a signal processing integrated circuit are mounted, and a surface-mounted infrared light receiving device for manufacturing such a surface-mounted infrared light receiving unit. The present invention relates to a unit manufacturing method and an electronic device equipped with such a surface-mounting infrared light receiving unit.

  Remote controllers (so-called remote controllers) that transmit / receive control signals and data signals using infrared rays are for home use such as AV equipment (TVs, VTRs, audio components, etc.), air conditioners and the like because of their convenience and operability. It is widely applied to personal electronic devices such as electric devices, portable devices, and small electronic devices.

  The infrared light receiving unit that functions as a receiver of the remote control photoelectrically converts a light receiving element that receives an infrared signal and a weak infrared signal received by the light receiving element, performs signal processing on the photoelectrically converted signal, and performs control processing. Signal processing integrated circuits that output digital signals are combined into a single package to achieve miniaturization, high-density mounting, and high functionality.

  Since the signal processing integrated circuit processes a weak infrared signal, it incorporates a high gain amplifier. Therefore, since it is greatly affected by external noise (electromagnetic noise), the shield effect is realized and improved by mounting the shield case later on the outside of the package. That is, it is indispensable to ensure an effective shielding effect in the surface-mounted infrared light receiving unit that receives a weak signal as a light receiving target and a processing target. For example, Patent Document 1 discloses a shield case for realizing such a shield effect.

  In addition, recent infrared light receiving units are often required to be mounted with high density as the electronic equipment to be mounted is reduced in size and thickness, so that the surface mounting type can reduce the board mounting area. There are many things to do. Further, from the viewpoint of improving the efficiency of mounting on a wiring board, a reflow type surface mounting type capable of automatic mounting is desired instead of a type in which leads are inserted into the wiring board.

  Therefore, recent infrared light receiving units have a light receiving element and a signal processing integrated circuit chip mounted on the surface of a wiring board made of glass epoxy resin or the like, and resin sealing is performed on the light receiving element and the signal processing integrated circuit. In many cases, a sealing portion is formed, and then a shield case is attached to the resin sealing portion by retrofitting to realize a shielding effect.

  FIGS. 13A and 13B are explanatory views for explaining the outline of the surface-mounted infrared light receiving unit according to Conventional Example 1. FIG. 13A is a plan view, FIG. 13B is a side view in the arrow B direction of FIG. (C) is a side view in the arrow C direction of (A).

  In the surface-mounted infrared light receiving unit 101 according to Conventional Example 1, a light receiving element (not shown) and a signal processing integrated circuit (not shown) are mounted on the wiring board 101b, and the light receiving element and the signal processing integrated circuit are mounted on the resin sealing portion 114. And the shield case 120 is retrofitted to the resin sealing portion 114. A surface-mounted infrared light receiving unit configured in the same manner as the surface-mounted infrared light receiving unit 101 according to Conventional Example 1 is disclosed in Patent Document 1, for example.

  That is, the shield case 120 includes an opening window 120w that allows an infrared signal to pass toward the light receiving element, and is engaged with and attached to the resin sealing portion 114 (wiring board 101b) by the extension portion 121a and the attachment portion 121b. Yes.

  However, in the surface-mounted infrared light receiving unit 101 according to Conventional Example 1, the base material (such as the wiring board 101b made of glass epoxy resin) is expensive, and the shield case 120 is the wiring board 101b and the resin sealing portion 114. Since it is a separate body, there are problems such as complicated production processes and the need for a large number of production steps, and it has been difficult to provide an inexpensive surface-mount infrared receiving unit with good productivity.

  14A and 14B are explanatory views for explaining the outline of the surface-mounted infrared light receiving unit according to Conventional Example 2. FIG. 14A is a plan view, FIG. 14B is a side view in the arrow B direction of FIG. (C) is a side view in the arrow C direction of (A).

  In the surface-mounted infrared light receiving unit 101 according to Conventional Example 2, a light receiving element (not shown) and a signal processing integrated circuit (not shown) are mounted on a lead frame 113, and the light receiving element and the signal processing integrated circuit are mounted on a resin sealing portion 114. The shield portion 120 is formed by bending the tip of the extension portion 122 of the lead frame 113 to the top surface 114 t side of the resin sealing portion 114.

  Further, since it is an optical semiconductor device integrated with light receiving and emitting, the resin sealing portion 114 includes a light receiving lens portion 114r and a light emitting lens portion 114e. Further, since it is a surface mount type, the surface mount type terminal 115 is disposed on the back surface of the resin sealing portion 114.

  In the surface-mounted infrared light receiving unit 101 according to Conventional Example 2, it is possible to achieve a shielding effect by the shield part 120, and the shield part 120 is configured using the lead frame 113. This eliminates the need for a retrofit shield case. Therefore, the surface-mounted infrared light receiving unit 101 is more productive and inexpensive than the conventional example 1.

  However, the shield part 120 has a problem in strength because it is merely fixed by bending the tip of the extension part 122 toward the top surface 114t of the resin sealing part 114 and is not fixed. Therefore, the shield part 120 may be deformed in the production process and the mounting process on the electronic device, and there is a problem in terms of productivity and reliability.

  That is, in the production process, it is necessary to prevent the deformation of the shield part 120, so that workability may be reduced. In addition, when the shield part 120 is deformed, there is a problem that the shield effect cannot be obtained. Further, there is a possibility that the shield part 120 may come into contact with other surrounding parts, and the electronic device at the mounting destination is destroyed. There was a risk of causing.

  Note that a surface-mounted infrared light receiving unit 101 according to Conventional Example 2 is disclosed in Patent Document 2, for example.

  Moreover, patent document 3 and patent document 4 are known as a surface-mount type infrared light receiving unit including a shield part in other forms.

  The surface-mounted infrared light receiving unit described in Patent Document 3 has a so-called single-line package form, and has a configuration in which pins are inserted into the wiring board, so that there is a problem that mounting on the wiring board is not easy. In addition, there is a problem that the extended portion of the lead frame becomes large and the member cost increases.

In addition, the surface-mounted infrared light receiving unit described in Patent Document 4 has a complicated shape of the resin sealing portion and the shield portion, and high-precision processing is required to ensure consistency between the shield portion and the resin sealing portion. It becomes necessary, and the shape of the resin sealing part in the resin sealing process becomes complicated, and high-precision processing is difficult. Further, it is difficult to align the shield part and the resin sealing part in the assembly process, and there is a problem that the shield case cannot be fixed securely.
Japanese Utility Model Publication No. 4-97361 JP 2005-142530 A Japanese Patent Application Laid-Open No. 10-74662 US Pat. No. 6,583,401

  The present invention has been made in view of such a situation. A lead frame on which a light receiving element and a signal processing integrated circuit are mounted, a resin sealing portion for resin-sealing the lead frame, and an outer side of the resin sealing portion. A surface-mounted infrared light receiving unit that includes a surface-mounted terminal that is extended from the lead frame and bent toward the bottom surface of the resin-encapsulated portion, and is a signal that is extended from the lead frame and bent along the resin-encapsulated portion. By using a surface mount type terminal as a shield part that covers a region corresponding to the processing integrated circuit and an engagement part that extends from the shield part and is bent toward the bottom surface and engages the shield part with the resin sealing part. The lead frame integrated with the mounting type terminal is extended to form a shield portion having an area sufficiently covering the signal processing integrated circuit, and the shield portion is engaged with the resin sealing portion. By making the part function as a surface mount type terminal, the shield part is securely engaged with the resin sealing part (top surface), ensuring the parallelism of the shield part to the resin sealing part, and integrated with the lead frame An object of the present invention is to provide a highly productive surface-mount infrared receiving unit capable of easily and accurately forming a highly reliable shield part.

  The present invention also provides a lead frame on which a light receiving element and a signal processing integrated circuit are mounted, a resin sealing portion for resin-sealing the lead frame, and a resin sealing portion extended from the lead frame outside the resin sealing portion. A surface-mounted terminal bent toward the bottom surface, a shield portion that extends from the lead frame and is bent along the resin sealing portion and covers a region corresponding to the signal processing integrated circuit on the top surface of the resin sealing portion; A surface-mounted infrared light receiving unit manufacturing method for manufacturing a surface-mounted infrared light receiving unit that includes an engagement portion that extends from the shield portion and is bent toward the bottom surface and engages the shield portion with the resin sealing portion, A resin sealing portion forming process for forming a resin sealing portion using a tie bar included in a lead frame, and a tie bar is cut and divided into individual surface mount infrared receiving units. By bending the portion extended from the lead frame by providing an iber cutting step and a bending step of forming a surface mount type terminal and a shield portion by bending the portion extended from the lead frame outside the resin sealing portion Another object of the present invention is to provide a method for manufacturing a surface-mounted infrared light receiving unit that can manufacture a surface-mounted infrared light receiving unit having a formed surface-mounted terminal and a shield part at a low cost with high productivity.

  Further, the present invention is an electronic device equipped with a surface-mounted infrared light receiving unit, and mechanically and electrically by configuring the surface-mounted infrared light receiving unit with the surface-mounted infrared light receiving unit according to the present invention. Another object of the present invention is to provide an electronic device that has a stable shield portion and realizes a stable shielding action and has improved noise resistance and reliability.

  A surface-mount type infrared light receiving unit according to the present invention includes a light receiving element that receives infrared light, a lead frame including a signal processing integrated circuit that processes a signal photoelectrically converted by the light receiving element, the light receiving element, and the signal processing integrated. A resin-sealed portion for resin-sealing the lead frame including a circuit, and a surface-mounted terminal extended from the lead frame outside the resin-sealed portion and bent toward the bottom surface of the resin-sealed portion; A surface-mounting infrared light receiving unit, wherein the signal processing integration is performed on the top surface of the resin sealing portion that is extended from the lead frame outside the resin sealing portion and bent along the resin sealing portion. A shield part that covers a region corresponding to the circuit, and the shield part that is extended from the shield part and bent toward the bottom surface is engaged with the resin sealing part. And a engaging portion, the engaging portion is surface-mounted infrared receiving unit, characterized in that it is constituted as the surface mount terminal.

  With this configuration, the lead frame integrated with the surface mount type terminal is extended to form a shield portion having a sufficient area to cover the signal processing integrated circuit, and the engagement portion in which the shield portion is engaged with the resin sealing portion. Since it functions as a surface mount type terminal, the shield part can be reliably engaged with the resin sealing part (top surface), and the parallelism of the shield part to the resin sealing part can be ensured. It is possible to provide a highly productive surface-mount infrared receiving unit capable of easily and accurately forming a highly reliable shield portion integrated with the above. In addition, since the engaging part is a surface mount type terminal, the shield part can be firmly fixed to the resin sealing part and the wiring board, and the workability in the manufacturing process and the reliability during operation are improved. It can be greatly improved.

  Further, in the surface-mounted infrared light receiving unit according to the present invention, the engagement portion is an extension of the shield portion between the extension portion extended in the extension direction of the shield portion from the shield portion and the shield portion. The cross extension part extended in the direction which cross | intersects a direction is comprised by the cross direction bending part which a tip has.

  With this configuration, the engaging portions can be formed symmetrically easily and with high accuracy by a simple bending structure.

  In the surface-mount infrared receiving unit according to the present invention, the cross extension portion is extended in two directions opposite to each other.

  With this configuration, since the cross extension portion (cross direction bending portion as the engagement portion) is arranged on both sides with respect to the resin sealing portion, the engagement strength can be reliably improved.

  Moreover, in the surface-mount type infrared light receiving unit according to the present invention, the cross-direction bent portion is bent in a bowl shape and arranged to face the bottom surface.

  With this configuration, the engagement strength of the engagement portion (cross direction bending portion) with respect to the resin sealing portion can be reliably improved, and the surface having a shield portion with high mechanical strength and high reliability and productivity. A mounting type infrared light receiving unit can be obtained.

  Moreover, in the surface-mounted infrared light receiving unit according to the present invention, the cross-direction bent portion has a tongue piece portion formed in parallel with the cross-direction bend portion and inclined toward the bottom surface side.

  With this configuration, it is possible to relieve stress applied from the cross-direction bent portion to the resin sealing portion (bottom surface) when the cross-direction bent portion is bent toward the resin sealing portion, and surface mounting with high yield and productivity Type infrared light receiving unit.

  Further, in the surface-mount type infrared light receiving unit according to the present invention, the engaging portion is bent in an extension direction in which an extension portion extended from the shield portion in the extension direction of the shield portion is provided at a distal end in the extension direction of the shield portion. It is comprised by the part.

  With this configuration, the engaging portion can be formed easily and with high accuracy by a simple bending structure.

  Moreover, in the surface-mount type infrared light receiving unit according to the present invention, the extension-direction bending portion is bent in a bowl shape and is arranged to face the bottom surface.

  With this configuration, it is possible to reliably improve the engagement strength of the engagement portion (bending portion in the extension direction) with respect to the resin sealing portion, the surface having a shield portion with high mechanical strength, high reliability, and high productivity. A mounting type infrared light receiving unit can be obtained.

  Moreover, in the surface-mount type infrared light receiving unit according to the present invention, the extension direction bent portion has a tongue piece portion formed in parallel with the extension direction bent portion and inclined toward the bottom surface side.

  With this configuration, it is possible to relieve stress applied to the resin sealing part (bottom surface) from the extension direction bending part when the extension direction bending part is bent toward the resin sealing part, and surface mounting with high yield and productivity Type infrared light receiving unit.

  Moreover, in the surface-mounted infrared light receiving unit according to the present invention, the resin sealing portion includes a protrusion on a side surface between the top surface and the bottom surface, and the extension portion is fitted to the protrusion. A fitting hole is provided.

  With this configuration, the shield part can be securely and firmly opposed to the resin sealing part and fixed, and a surface-mount infrared receiving unit having a shield part with high reliability and productivity can be obtained.

  Moreover, in the surface-mounted infrared light receiving unit according to the present invention, the protrusion has an inclined surface that is inclined outward with respect to the side surface.

  With this configuration, the fitting hole and the protrusion can be easily fitted, and a highly productive surface-mount infrared receiving unit can be obtained.

  Moreover, in the surface-mount type infrared light receiving unit according to the present invention, the protrusion has an arcuate surface that has an arcuate shape outward from the side surface.

  With this configuration, the fitting hole and the protrusion can be easily fitted, and a highly productive surface-mount infrared receiving unit can be obtained.

  In the surface-mount infrared receiving unit according to the present invention, the extension portion has a folding angle that is folded from a right angle with respect to the shield portion.

  With this configuration, the extension (fitting hole) can be securely fitted to the protrusion, and the extension (fitting hole) is not easily detached from the protrusion. A high surface-mount infrared receiving unit can be obtained.

  Moreover, in the surface-mount type infrared light receiving unit according to the present invention, the shield portion includes a bridging portion in an opening window portion opened corresponding to the light receiving element.

  This configuration prevents the entry of external noise to the light receiving element and improves the mechanical strength of the shield part and the opening window part, thereby improving the reliability of the shield part and the opening window part. Is possible.

  In addition, the surface mounting type infrared light receiving unit manufacturing method according to the present invention includes a light receiving element that receives infrared light, a lead frame including a signal processing integrated circuit that processes a signal photoelectrically converted by the light receiving element, the light receiving element, A resin-sealed portion for resin-sealing the lead frame including the signal processing integrated circuit, and a surface extended from the lead frame outside the resin-sealed portion and bent toward the bottom surface of the resin-sealed portion A mounting-type terminal and a region extending from the lead frame outside the resin sealing portion and bent along the resin sealing portion to cover a region corresponding to the signal processing integrated circuit on the top surface of the resin sealing portion A surface-mount infrared including a shield part and an engagement part that extends from the shield part and is bent toward the bottom surface and engages the shield part with a resin sealing part A surface mounting type infrared light receiving unit manufacturing method for manufacturing a light receiving unit, comprising: a resin sealing portion forming step of forming the resin sealing portion using a tie bar included in the lead frame; A tie bar cutting step for dividing the surface mounting type infrared light receiving unit, and a bending step for forming the surface mounting type terminal and the shield portion by bending a portion extending from the lead frame outside the resin sealing portion; It is characterized by providing.

  With this configuration, it is possible to manufacture a surface-mounted infrared light receiving unit having a surface-mounted terminal and a shield portion formed by bending a portion extending from the lead frame with good productivity and low cost.

  In the method for manufacturing a surface-mounted infrared light receiving unit according to the present invention, the extending direction of the engaging portion is a direction parallel to the extending direction of the tie bar before the bending step. .

  With this configuration, it is possible to bend the surface mount type terminal and the shield part easily and with high accuracy, and a highly productive surface mount type infrared light receiving unit manufacturing method can be obtained.

  In the method for manufacturing a surface-mounted infrared light receiving unit according to the present invention, the extending direction of the engaging portion is a direction intersecting with the extending direction of the tie bar in the state before the bending step. .

With this configuration, it is possible to bend the surface mount type terminal and the shield part easily and with high accuracy, and it is possible to provide a highly productive surface mount type infrared light receiving unit manufacturing method. In the light receiving unit manufacturing method, in the bending step, the engaging portion is bent in the same manner as the surface-mounted terminal.

  With this configuration, the engaging portion can be formed in the same manner as the original surface-mounted terminal, and therefore, the engaging portion (extending direction bending portion / crossing direction bending portion) can be easily and accurately formed. Can do.

  The electronic device according to the present invention is an electronic device equipped with a surface-mounted infrared light receiving unit, wherein the surface-mounted infrared light receiving unit is the surface-mounted infrared light receiving unit according to the present invention. To do.

  With this configuration, since the mechanically and electrically stable shield portion is provided and the shield function is stable, an electronic device having high noise resistance and high reliability can be obtained.

  According to the surface-mounted infrared light receiving unit of the present invention, a light receiving element that receives infrared light, a lead frame that includes a signal processing integrated circuit that processes a signal photoelectrically converted by the light receiving element, a light receiving element, and a signal processing integrated circuit A surface mounting type including a resin sealing portion for resin sealing the lead frame including a surface mounting terminal and a surface mounting type terminal extended from the lead frame outside the resin sealing portion and bent toward the bottom surface of the resin sealing portion An infrared light receiving unit that extends from the lead frame outside the resin sealing portion and is bent along the resin sealing portion to cover a region corresponding to the signal processing integrated circuit on the top surface of the resin sealing portion; An engagement portion that extends from the shield portion and is bent toward the bottom surface and engages the shield portion with the resin sealing portion, and the engagement portion is configured as a surface mount type terminal. Therefore, the lead frame integrated with the surface mount type terminal is extended to form a shield part having an area sufficiently covering the signal processing integrated circuit, and the shield part is engaged with the resin sealing part. By making the part function as a surface mount type terminal, the shield part can be reliably engaged with the resin sealing part (top surface), and it becomes possible to ensure the parallelism of the shield part to the resin sealing part. There is an effect that the highly reliable shield part integrated with the lead frame can be easily and highly accurately formed into a surface mountable infrared light receiving unit with good productivity. In addition, since the engaging part is a surface mount type terminal, the shield part can be firmly fixed to the resin sealing part and the wiring board, and the workability in the manufacturing process and the reliability during operation are improved. There is an effect that it can be greatly improved.

  Further, according to the method for manufacturing a surface-mounted infrared light receiving unit according to the present invention, a light receiving element that receives infrared light, a lead frame including a signal processing integrated circuit that processes a signal photoelectrically converted by the light receiving element, a light receiving element, A resin-encapsulated portion for resin-sealing the lead frame including the signal processing integrated circuit, a surface-mounted terminal extended from the lead frame outside the resin-encapsulated portion and bent toward the bottom surface of the resin-encapsulated portion, A shield part that extends from the lead frame outside the resin sealing part and is bent along the resin sealing part to cover the area corresponding to the signal processing integrated circuit on the top surface of the resin sealing part, and a bottom surface that extends from the shield part A surface-mounted infrared light receiving unit for manufacturing a surface-mounted infrared light receiving unit including an engagement portion that is bent toward the surface and the shield portion is engaged with a resin sealing portion. A manufacturing method, a resin sealing portion forming step of forming a resin sealing portion using a tie bar included in a lead frame, and a tie bar cutting step of cutting the tie bar and dividing it into individual surface mount type infrared light receiving units. And a bending step of forming a surface-mounted terminal and a shield portion by bending a portion extended from the lead frame outside the resin sealing portion, and a surface formed by bending the portion extended from the lead frame There is an effect that it is possible to manufacture a surface-mounted infrared light receiving unit having a mounting type terminal and a shield part with high productivity and low cost.

  The electronic device according to the present invention is an electronic device equipped with a surface-mounted infrared light receiving unit, and the surface-mounted infrared light receiving unit is a surface-mounted infrared light receiving unit according to the present invention. In addition, there is an effect that an electronic device having an electrically stable shield portion and having a stable shielding action and having high noise resistance and high reliability can be obtained.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<Embodiment 1>
Based on FIG. 1 and FIG. 2, a surface-mounting infrared light receiving unit and a surface-mounting infrared light receiving unit manufacturing method for manufacturing the surface-mounted infrared light receiving unit and the surface-mounted infrared light receiving unit according to the present embodiment will be described.

  1A and 1B are explanatory diagrams for explaining a surface-mounted infrared light receiving unit according to Embodiment 1 of the present invention, in which FIG. 1A is a plan view, and FIG. 1B is a side view as viewed from an arrow B direction in FIG. The figure and (C) are the side views seen from the arrow C direction of (A).

  FIG. 2 is a plan view showing a state in which a resin sealing portion is formed on the lead frame in the manufacturing process of the surface-mounted infrared light receiving unit shown in FIG.

  A surface-mount type infrared light receiving unit 1 according to the present embodiment includes a light receiving element 11 that receives infrared light, a lead frame 13 that includes a signal processing integrated circuit 12 that processes a signal photoelectrically converted by the light receiving element 11, and a light receiving element. 11 and the signal processing integrated circuit 12 including a resin sealing portion 14 for resin sealing the lead frame 13, and extending from the lead frame 13 outside the resin sealing portion 14 toward the bottom surface 14 b of the resin sealing portion 14. And a bent surface mount type terminal 15.

  Further, the surface mount type infrared light receiving unit 1 is extended from the lead frame 13 on the outside of the resin sealing portion 14, bent along the resin sealing portion 14, and signal processing integrated circuit on the top surface 14 t of the resin sealing portion 14. 12, a shield portion 20 that covers a region corresponding to 12, and an engagement portion 21 that extends from the shield portion 20 and is bent toward the bottom surface 14 b to engage the shield portion 20 with the resin sealing portion 14. 21 is configured as a surface mount type terminal 15r.

  Accordingly, the lead frame 13 integrated with the surface mount type terminal 15 is extended to form the shield part 20 having an area sufficiently covering the signal processing integrated circuit 12, and the shield part 20 is engaged with the resin sealing part 14. Since the engaging portion 21 functions as the surface mount type terminal 15r, the shield portion 20 is reliably engaged with the resin sealing portion 14 (top surface 14t, bottom surface 14b, side surface 14bt), and the resin sealing of the shield portion 20 is performed. Since parallelism with respect to the portion 14 can be ensured, the highly reliable surface-mounted infrared light receiving unit 1 capable of forming the highly reliable shield portion 20 integrated with the lead frame 13 with high accuracy can be obtained. be able to.

  Further, since the engaging portion 21 is the surface mount type terminal 15r, the shield portion 20 can be firmly fixed to the resin sealing portion 14 and the wiring board (wiring board as a mounting destination: not shown). Thus, workability in the manufacturing process and reliability during operation can be greatly improved.

  The surface mount type terminal 15r can be set at a GND potential (ground potential), and the shield part 20 can be more effectively operated. In addition, it is not necessary to assign a GND terminal to the normal surface mount type terminal 15, and the number of lead leads from the resin sealing portion 14 can be suppressed. Generation | occurrence | production can be suppressed and reliability can be improved.

  The engaging part 21 is an intersection extending in the direction Dsf intersecting the extending direction Ds of the shield part 20 between the extending part 22 extended from the shield part 20 in the extending direction Ds of the shield part 20 and the shield part 20. The extension part 23 is configured by a cross-direction bent part 23c at the tip.

  Therefore, the engaging portion 21 can be formed symmetrically easily and with high accuracy by a simple bending structure. That is, the engaging part 21 can be disposed on both sides of the resin sealing part 14, and the shield part 20 can be fixed to the bottom surface 14 b on both sides of the resin sealing part 14, thereby reliably preventing deformation of the shield part 20. Therefore, workability in the manufacturing process and reliability in the operating state can be improved.

  Further, an opening window portion 20 w for transmitting light to the light receiving surface of the light receiving element 11 is formed between the shield portion 20 and the extension portion 22. The opening window portion 20 w is formed facing the light receiving element 11. That is, the shield part 20 can be disposed corresponding to the entire area of the top surface 14t in the area other than the opening window part 20w, and the influence of external noise (electromagnetic noise) can be reliably prevented. .

  The cross extension 23 is extended in two directions opposite to each other. Therefore, since the cross extension part 23 (cross direction bending part 23c as the engagement part 21) is arranged on both sides with respect to the resin sealing part 14, the engagement strength can be reliably improved.

  The intersecting direction bending portion 23c is bent in a bowl shape and arranged to face the bottom surface 14b. Therefore, the engagement strength of the engagement portion 21 (cross direction bending portion 23c) with respect to the resin sealing portion 14 can be reliably improved, and the shield portion 20 having high mechanical strength and high reliability and productivity can be obtained. The surface-mounted infrared light receiving unit 1 can be provided.

  The surface-mount type infrared light receiving unit manufacturing method according to the present embodiment includes a light receiving element 11 that receives infrared light, a lead frame 13 on which a signal processing integrated circuit 12 that processes a signal photoelectrically converted by the light receiving element 11 is mounted, A resin sealing portion 14 for resin-sealing the lead frame 13 including the element 11 and the signal processing integrated circuit 12, and extending from the lead frame 13 outside the resin sealing portion 14 toward the bottom surface 14 b of the resin sealing portion 14. And a signal processing integrated circuit which is extended from the lead frame 13 on the outside of the resin sealing portion 14 and bent along the resin sealing portion 14 at the top surface 14t of the resin sealing portion 14. 12 that covers a region corresponding to 12 and a shield portion 20 that is extended from the shield portion 20 and bent toward the bottom surface 14b. 4 is a manufacturing method for manufacturing a surface-mounted infrared receiving unit 1 having an engaging portion 21 engaged.

  A resin sealing portion forming step of forming the resin sealing portion 14 using the tie bar 13t of the lead frame 13, and a tie bar cutting step of cutting the tie bar 13t and dividing it into individual surface-mounted infrared light receiving units 1. A bending step of bending the portion extending from the lead frame 13 outside the resin sealing portion 14 to form the surface mount type terminal 15 and the shield portion 20.

  Therefore, the surface-mounted infrared light receiving unit 1 having the surface-mounted terminal 15 and the shield portion 20 formed by bending the portion extended from the lead frame 13 can be manufactured with high productivity and at low cost. That is, the process of attaching a retrofit shield case, which has been necessary in the past, is unnecessary, and productivity can be improved.

  In the surface-mounted infrared light receiving unit 1 according to the present embodiment, the extending direction Dsf of the engaging portion 21 (cross extension portion 23, cross direction bending portion 23c) is the same as that of the tie bar 13t before the bending step. The direction is parallel to the extending direction Dt. Therefore, the surface mount type terminal 15 and the shield part 20 can be bent easily and with high accuracy, and a highly productive surface mount type infrared light receiving unit manufacturing method can be obtained.

  Further, the engaging portion 21 (cross direction bending portion 23c) is configured as a surface mount type terminal 15r. That is, the engaging portion 21 (cross direction bending portion 23 c) is bent similarly to the surface mount type terminal 15. Therefore, since the engaging portion 21 can be formed in the same manner as the original surface mount type terminal 15, the engaging portion 21 (cross direction bending portion 23c) can be formed easily and with high accuracy.

  By forming a notch (notch groove: not shown) in advance at the position to be bent in the bending process, the bending can be performed easily and with high accuracy. For example, the depth of the notch is desirably 1/3 to 1/2 of the thickness of the lead frame 13.

  It should be noted that the extending direction Dsf of the engaging portion 21 (cross extension portion 23, cross direction bending portion 23c) is in a state parallel to the extension direction Dt of the tie bar 13t, and is outward with respect to the shield portion 20 in the extension direction Dt of the tie bar 13t. It is arranged. Accordingly, the device pitch DP1 in the extending direction Dt of the tie bar 13 is in a state in which the length of the engaging portion 21 (cross extension portion 23, cross direction bending portion 23c) is added to the shield portion 20, and thus the shield portion 20 Larger than Therefore, the number of surface-mounted infrared light receiving units 1 in the extending direction Dt of the tie bar 13t is limited as compared with the case of Embodiment 4 described later.

The area of the shield portion 20 according to the present embodiment (the area corresponding to the top surface 14t, the side surface 14bt, and the bottom surface 14b of the resin sealing portion 14 excluding the area of the opening window portion 20w) is, for example, 17.5 cm ^2. It is possible to be about. In the case of the conventional example, the area of the shield portion when the same resin sealing portion 14 is used is, for example, about 5.0 cm ² , but the resin sealing portion 14 (signal processing integrated circuit 12) has a larger area. It becomes possible to cover the film, and a reliable shielding action can be realized.

<Embodiment 2>
Based on FIG. 3 thru | or FIG. 5, the surface mounting type infrared light receiving unit and the surface mounting type infrared light receiving unit manufacturing method according to the present embodiment will be described. The basic configuration of the present embodiment is the same as that of the surface-mounted infrared light receiving unit and the surface-mounted infrared light receiving unit manufacturing method shown in the first embodiment. Will be described.

  FIG. 3 is an explanatory view for explaining a state in which a resin sealing portion is formed on the lead frame in the manufacturing process of the surface-mount type infrared light receiving unit according to Embodiment 2 of the present invention, (A) is a plan view, (B) is a side view showing an outline of the sealing resin portion viewed from the arrow B direction of (A), and (C) is a side view showing an outline of the sealing resin portion viewed from the arrow C direction of (A). It is. In FIGS. 3B and 3C, the lead frame that appears in the foreground is omitted in consideration of the visibility of the drawings.

  4A and 4B are explanatory views for explaining the assembled state of the surface-mounted infrared light receiving unit shown in FIG. 3, wherein FIG. 4A is a plan view, and FIG. 4B is a side view as viewed from the direction of arrow B in FIG. The figure and (C) are the side views seen from the arrow C direction of (A).

  In the surface-mounted infrared light receiving unit 1 according to the present embodiment, the resin sealing portion 14 includes a protruding portion 14p on the side surface 14bt between the top surface 14t and the bottom surface 14b, and the extension portion 22 is provided on the protruding portion 14p. A fitting hole 22w to be fitted is provided.

  Therefore, the shield part 20 can be securely and firmly opposed to the resin sealing part 14 and fixed, and the surface-mounted infrared light receiving unit 1 having the shield part 20 with high reliability and productivity can be obtained. .

  FIG. 5 is an explanatory diagram for explaining a protrusion provided in the resin sealing portion of the surface-mount type infrared light receiving unit shown in FIG. 3, where (A) shows a case where the protrusion has an inclined surface, and (B) shows It is a side view which shows the case where a projection part has a circular arc surface, respectively.

  Further, the protrusion 14p can have a shape having an inclined surface 14s inclined outward with respect to the side surface 14bt (FIG. 5A). Therefore, the fitting hole 22w and the protrusion 14p can be easily fitted, and the surface mount infrared receiving unit 1 with high productivity (insertability / fitting property) can be obtained.

  Further, the protrusion 14p can have a shape having an arcuate surface 14c having an arcuate shape on the outer side with respect to the side surface 14bt (FIG. 5B). Therefore, the fitting hole 22w and the protrusion 14p can be easily fitted, and the surface mount infrared receiving unit 1 with high productivity (insertability / fitting property) can be obtained.

  Further, the extension portion 22 can have a shape having a folding angle θ that is folded at a right angle with respect to the shield portion 20. Therefore, the extension 22 (fitting hole 22w) can be securely fitted to the protrusion 14p, and the extension 22 (fitting hole 22w) is not easily detached from the protrusion 14p. Thus, the highly reliable surface-mounted infrared light receiving unit 1 can be obtained.

<Embodiment 3>
Based on FIG. 6, the surface-mounted infrared light receiving unit according to the present embodiment will be described. A modification in detail (opening window portion 20w) of the surface-mount type infrared light receiving unit 1 shown in the first and second embodiments will be described as a third embodiment. Mainly different matters will be described with reference to the reference numerals of the surface-mounted infrared light receiving unit 1 shown in the first and second embodiments.

  FIG. 6 is a plan view of a surface-mounted infrared light receiving unit according to Embodiment 3 of the present invention.

  In the surface-mounted infrared light receiving unit 1 according to the present embodiment, the shield portion 20 includes a bridging portion 20b in an opening window portion 20w opened corresponding to the light receiving element 11. Accordingly, it is possible to prevent the entry of external noise (electromagnetic noise) into the light receiving element 11 and to improve the mechanical strength of the shield part 20 and the opening window part 20w, and thus the shield part 20 and the opening window part 20w. It becomes possible to improve the reliability.

<Embodiment 4>
Based on FIGS. 7 and 8, a surface-mounting infrared light receiving unit and a surface-mounting infrared light receiving unit manufacturing method for manufacturing the surface-mounted infrared light receiving unit and the surface-mounted infrared light receiving unit according to the present embodiment will be described. The basic configuration of the present embodiment is the same as that of the surface-mounted infrared light receiving unit and the surface-mounted infrared light receiving unit manufacturing method shown in the first embodiment. Will be described.

  7A and 7B are explanatory diagrams for explaining a surface-mounted infrared light receiving unit according to Embodiment 4 of the present invention, in which FIG. 7A is a plan view, and FIG. 7B is a side view as viewed from the direction of arrow B in FIG. The figure and (C) are the side views seen from the arrow C direction of (A), (D) is the side view seen from the arrow D direction of (A).

  FIG. 8 is a plan view showing a state in which a resin sealing portion is formed on the lead frame in the manufacturing process of the surface-mounted infrared light receiving unit shown in FIG.

  As in the first embodiment, the surface-mounted infrared light receiving unit 1 according to the present embodiment is equipped with a light receiving element 11 that receives infrared light and a signal processing integrated circuit 12 that processes a signal photoelectrically converted by the light receiving element 11. A lead frame 13, a resin sealing portion 14 for sealing the lead frame 13 including the light receiving element 11 and the signal processing integrated circuit 12, and a resin sealing portion extended from the lead frame 13 outside the resin sealing portion 14 14 and a surface mount type terminal 15 bent toward the bottom surface 14b.

  Similarly to the first embodiment, the surface-mounted infrared light receiving unit 1 is extended from the lead frame 13 on the outside of the resin sealing portion 14 and bent along the resin sealing portion 14 so as to be the top of the resin sealing portion 14. A shield part 20 that covers a region corresponding to the signal processing integrated circuit 12 on the surface 14t, and an engagement part 21 that extends from the shield part 20 and is bent toward the bottom surface 14b to engage the shield part 20 with the resin sealing part 14. The engaging portion 21 is configured as a surface mount type terminal 15r.

  The engaging portion 21 is constituted by an extending direction bending portion 22 c that an extending portion 22 extended from the shield portion 20 in the extending direction Ds of the shield portion 20 has at the tip of the extending direction Ds of the shield portion 20. Therefore, the engaging portion 21 can be formed easily and with high accuracy by a simple folding structure.

  Further, an opening window portion 20 w for transmitting light to the light receiving surface of the light receiving element 11 is formed between the shield portion 20 and the extension portion 22. In the present embodiment, the opening window portion 20w is disposed so as to face the three sides of the light receiving element 11, but it may be configured to surround the light receiving element 11 as in the first embodiment. Is possible.

  Further, the extending direction bending portion 22c is bent in a bowl shape and arranged to face the bottom surface 14b. Therefore, the engagement strength of the engagement portion 21 (extension direction bending portion 22c) with respect to the resin sealing portion 14 can be reliably improved, and the shield portion 20 having high mechanical strength and high reliability and productivity can be obtained. The surface-mounted infrared light receiving unit 1 can be provided.

  Similar to the first embodiment, the surface-mount type infrared light receiving unit manufacturing method according to the present embodiment includes a light receiving element 11 that receives infrared light and a signal processing integrated circuit 12 that processes a signal photoelectrically converted by the light receiving element 11. The lead frame 13, the resin sealing portion 14 for resin-sealing the lead frame 13 including the light receiving element 11 and the signal processing integrated circuit 12, and the resin sealing portion extended from the lead frame 13 outside the resin sealing portion 14. A surface mount type terminal 15 bent toward the bottom surface 14 b of the portion 14, and a lead frame 13 extending from the outside of the resin sealing portion 14 and bent along the resin sealing portion 14 to be the top of the resin sealing portion 14. A shield part 20 that covers a region corresponding to the signal processing integrated circuit 12 on the surface 14t, and a seal that is extended from the shield part 20 and bent toward the bottom surface 14b. The parts 20 a method of manufacturing the surface-mounted infrared receiving unit 1 having an engaging portion 21 engaged with the resin sealing portion 14.

  Further, in the surface-mount type infrared light receiving unit manufacturing method according to the present embodiment, as in the first embodiment, the resin sealing portion forming step for forming the resin sealing portion 14 using the tie bar 13t of the lead frame 13 is used. A tie bar cutting step of cutting the tie bar 13t and dividing the tie bar 13t into individual surface mounted infrared light receiving units 1, and bending the portion extended from the lead frame 13 outside the resin sealing portion 14 to A bending step of forming the shield part 20.

  Therefore, the surface-mounted infrared light receiving unit 1 having the surface-mounted terminal 15 and the shield portion 20 formed by bending the portion extended from the lead frame 13 can be manufactured with high productivity and at low cost. That is, the process of attaching a retrofit shield case, which has been necessary in the past, is unnecessary, and productivity can be improved.

  Further, in the surface-mounted infrared light receiving unit 1 according to the present embodiment, the extension direction Dsf of the engaging portion 21 (extension portion 22, extension direction bending portion 22c) is the extension of the tie bar 13t before the bending step. The direction intersects the direction Dt. Therefore, the surface mount type terminal 15 and the shield part 20 can be bent easily and with high accuracy, and a highly productive surface mount type infrared light receiving unit manufacturing method can be obtained.

  Further, the engaging portion 21 (extending direction bending portion 22c) is configured as a surface mount type terminal 15r, similar to the engaging portion 21 (crossing direction bending portion 23c) in the first embodiment. That is, since the engaging portion 21 (extending direction bending portion 22c) can be formed in the same manner as the original surface-mounted terminal 15, the engaging portion 21 can be formed easily and with high accuracy.

  By forming a notch (notch groove: not shown) in advance at the position to be bent in the bending process, the bending can be performed easily and with high accuracy. For example, the depth of the notch is desirably 1/3 to 1/2 of the thickness of the lead frame 13.

  The extending direction Dsf of the engaging portion 21 (extension portion 22, extending direction bending portion 22c) is set to intersect with the extending direction Dt of the tie bar 13t, and is arranged on the inner side with respect to the shield portion 20 in the extending direction Dt of the tie bar 13t. is doing. Therefore, since the device pitch DP2 in the extending direction Dt of the tie bar 13 is defined by the arrangement state in the shield portion 20, it can be made smaller than the device pitch DP1 in the first embodiment. Therefore, there is an advantage that the number of the surface-mounted infrared light receiving units 1 in the extension direction Dt of the tie bar 13t is larger than that in the case of the first embodiment.

  Further, since the extension direction Dsf of the extension part (engagement part 21: extension part 22, extension direction bending part 22c) of the lead frame 13 is arranged in a direction intersecting with the extension direction Dt of the tie bar 13t, the resin sealing part 14 It is possible to set the flow path of the sealing resin when forming the film relatively easily.

  In addition, since the engaging portion 21 is formed and arranged as a small number compared to the two in the case of the first embodiment, the surface mounting type terminal 15r is used as the GND terminal in a state where the bending process is simplified. It becomes possible to set.

<Embodiment 5>
Based on FIG. 9 and FIG. 10, the surface-mounting infrared light receiving unit and the surface-mounting infrared light receiving unit manufacturing method according to the present embodiment will be described. The basic configuration of this embodiment is a combination of the second embodiment with the surface-mounting infrared light receiving unit and the surface-mounting infrared light receiving unit manufacturing method shown in the fourth embodiment. The different points will be mainly described with reference to symbols.

  FIG. 9 is an explanatory diagram for explaining a state in which a resin sealing portion is formed on a lead frame in the manufacturing process of the surface-mount type infrared light receiving unit according to the fifth embodiment of the present invention, (A) is a plan view, (B) is a side view showing the outline of the sealing resin part seen from the arrow B direction of (A), (C) is a side view showing the outline of the sealing resin part seen from the arrow C direction of (A). It is. In FIGS. 9B and 9C, the lead frame that appears in the foreground is omitted in consideration of the visibility of the drawings.

  10A and 10B are explanatory views for explaining the assembled state of the surface-mounted infrared light receiving unit shown in FIG. 9, where FIG. 10A is a plan view, and FIG. 10B is a side view as viewed from the direction of arrow B in FIG. The figure and (C) are the side views seen from the arrow C direction of (A), (D) is the side view seen from the arrow D direction of (A).

  In the surface-mounted infrared light receiving unit 1 according to the present embodiment, the resin sealing portion 14 includes a protruding portion 14p on the side surface 14bt between the top surface 14t and the bottom surface 14b, and the extension portion 22 is provided on the protruding portion 14p. A fitting hole 22w to be fitted is provided.

  Therefore, the shield part 20 can be securely and firmly opposed to the resin sealing part 14 and fixed, and the surface-mounted infrared light receiving unit 1 having the shield part 20 with high reliability and productivity can be obtained. .

  Further, the surface-mounted infrared light receiving unit 1 according to the present embodiment can be provided with the features shown in FIG. 5 of the second embodiment as they are, and will be described with reference to FIG.

  That is, the protrusion 14p has an inclined surface 14s inclined outward with respect to the side surface 14bt (see FIG. 5). Therefore, the fitting hole 22w and the protrusion 14p can be easily fitted, and the surface mount infrared receiving unit 1 with high productivity can be obtained.

  Moreover, the protrusion part 14p has the circular arc surface 14c made into circular arc shape outside with respect to the side surface 14bt (refer FIG. 5). Therefore, the fitting hole 22w and the protrusion 14p can be easily fitted, and the surface mount infrared receiving unit 1 with high productivity can be obtained.

  Further, the extension portion 22 has a folding angle θ that is folded at a right angle with respect to the shield portion 20 (see FIG. 5). Therefore, the extension portion 22 (fitting hole portion 22w) can be securely fitted to the projection portion 14p, and the extension portion 22 (fitting hole portion 22w) is not easily detached from the projection portion 14p. Thus, the highly reliable surface-mounted infrared light receiving unit 1 can be obtained.

<Embodiment 6>
Based on FIG. 11, the surface-mounting infrared light receiving unit according to the present embodiment will be described. The basic configuration of the present embodiment is a combination of the third embodiment with the surface-mounted infrared light receiving unit shown in the fourth embodiment. Will be described. In addition, since the shape of the opening window part 20w differs, it is also a modification of Embodiment 3.

  FIG. 11 is a plan view of a surface-mounted infrared light receiving unit according to Embodiment 6 of the present invention.

  In the surface-mounted infrared light receiving unit 1 according to the present embodiment, the shield portion 20 includes a bridging portion 20b in an opening window portion 20w opened corresponding to the light receiving element 11. Accordingly, it is possible to prevent the entry of external noise (electromagnetic noise) into the light receiving element 11 and to improve the mechanical strength of the shield part 20 and the opening window part 20w, and thus the shield part 20 and the opening window part 20w. It becomes possible to improve the reliability.

<Embodiment 7>
Based on FIG. 12, the surface-mounted infrared light receiving unit and the surface-mounted infrared light receiving unit manufacturing method according to the present embodiment will be described. The basic configuration of the present embodiment is the same as that of the surface-mounted infrared light receiving unit and the surface-mounted infrared light receiving unit manufacturing method shown in the first and fourth embodiments. , Mainly different items will be described.

  12A and 12B are explanatory diagrams for explaining a surface-mounted infrared light receiving unit according to Embodiment 7 of the present invention, in which FIG. 12A is a side view showing a tongue piece portion of the engaging portion, and FIG. It is a side view which shows the state of the tongue piece part in the state bent toward the bottom face. In addition, the case where it applies to Embodiment 1 and the case where it applies to Embodiment 4 are shown collectively.

  When this Embodiment is applied with respect to Embodiment 1, the cross direction bending part 23c has the tongue piece part 23t formed in parallel with the cross direction bending part 23c, and inclined toward the bottom face 14b side. Since the tongue piece 23t is formed in parallel with the cross-direction bent portion 23c and is inclined toward the bottom surface 14b, the tongue piece 23t has a spring property.

  Therefore, it is possible to relieve the stress applied to the resin sealing portion 14 (bottom surface 14b) from the cross-direction bending portion 23c when the cross-direction bending portion 23c is bent toward the resin sealing portion 14, thereby improving yield and productivity. A high surface-mount infrared receiving unit 1 can be obtained.

  When this Embodiment is applied with respect to Embodiment 4, the extension direction bending part 22c has the tongue piece part 22t formed in parallel with the extension direction bending part 22c, and inclined toward the bottom face 14b side. Since the tongue piece 22t is formed in parallel with the extending-direction bending portion 22c and is inclined toward the bottom surface 14b, the tongue piece 22t has a spring property.

  Accordingly, it is possible to relieve the stress applied from the extension direction bending portion 22c to the resin sealing portion 14 (bottom surface 14b) when the extension direction bending portion 22c is bent toward the resin sealing portion 14, thereby improving the yield and productivity. A high surface-mount infrared receiving unit 1 can be obtained.

<Eighth embodiment>
An electronic apparatus (not shown) according to the present embodiment is mounted with the surface-mount type infrared light receiving unit 1 shown in the first to seventh embodiments. Examples of electronic devices include AV devices (TVs, VTRs, audio components, etc.), household electric devices such as air conditioners, personal electronic devices such as portable devices and small electronic devices.

  In addition, the surface-mounted infrared light receiving unit 1 is disposed in an electronic device and includes the light receiving element 11 and the signal processing integrated circuit 12 as described in the first to seventh embodiments. The light receiving element 11 is configured to receive and photoelectrically convert an infrared signal as a control signal from a remote controller for the electronic device. Further, the signal processing integrated circuit 12 is configured to generate a control signal and a data signal by performing processing on an electric signal generated by photoelectric conversion of the light receiving element 11.

  That is, the electronic device according to the present embodiment is an electronic device on which the surface-mounted infrared light receiving unit 1 is mounted, and the surface-mounted infrared light receiving unit 1 is one of the first to seventh embodiments. This is a surface-mounted infrared light receiving unit 1.

  Therefore, since the mechanically and electrically stable shield part 20 is provided and the shield function is stable, an electronic device having high noise resistance and high reliability can be obtained.

BRIEF DESCRIPTION OF THE DRAWINGS It is explanatory drawing explaining the surface mount type infrared light receiving unit which concerns on Embodiment 1 of this invention, (A) is a top view, (B) is the side view seen from the arrow B direction of (A), (C ) Is a side view seen from the arrow C direction of (A). It is a top view which shows the state which formed the resin sealing part in the lead frame in the manufacturing process of the surface mount type infrared light receiving unit shown in FIG. It is explanatory drawing explaining the state which formed the resin sealing part in the lead frame in the manufacturing process of the surface mount type infrared light receiving unit concerning Embodiment 2 of this invention, (A) is a top view, (B) is ( A side view which shows the outline of the sealing resin part seen from the arrow B direction of A), (C) is the side view which shows the outline of the sealing resin part seen from the arrow C direction of (A). It is explanatory drawing explaining the assembled state of the surface mount type infrared light receiving unit shown in FIG. 3, (A) is a top view, (B) is a side view seen from the arrow B direction of (A), (C ) Is a side view seen from the arrow C direction of (A). It is explanatory drawing explaining the projection part with which the resin sealing part of the surface mount type infrared light reception unit shown in FIG. 3 is equipped, (A) is a case where a projection part has an inclined surface, (B) is a projection part circularly. It is a side view which shows the case where each has a surface. It is a top view of the surface-mount type infrared light receiving unit according to Embodiment 3 of the present invention. It is explanatory drawing explaining the surface mount type infrared light receiving unit which concerns on Embodiment 4 of this invention, (A) is a top view, (B) is the side view seen from the arrow B direction of (A), (C ) Is a side view seen from the arrow C direction of (A), and (D) is a side view seen from the arrow D direction of (A). It is a top view which shows the state which formed the resin sealing part in the lead frame at the manufacturing process of the surface mount type infrared light receiving unit shown in FIG. It is explanatory drawing explaining the state which formed the resin sealing part in the lead frame at the manufacturing process of the surface mount type infrared light receiving unit concerning Embodiment 5 of this invention, (A) is a top view, (B) is ( A side view which shows the outline of the sealing resin part seen from the arrow B direction of A), (C) is the side view which shows the outline of the sealing resin part seen from the arrow C direction of (A). It is explanatory drawing explaining the assembled state of the surface mount type infrared light reception unit shown in FIG. 9, (A) is a top view, (B) is a side view seen from the arrow B direction of (A), (C ) Is a side view seen from the arrow C direction of (A), and (D) is a side view seen from the arrow D direction of (A). It is a top view of the surface mount-type infrared light receiving unit according to Embodiment 6 of the present invention. It is explanatory drawing explaining the surface mount type infrared rays light receiving unit which concerns on Embodiment 7 of this invention, (A) is a side view which shows the tongue piece part which an engaging part has, (B) is an engaging part on a bottom face It is a side view which shows the state of the tongue piece part in the state bent toward. It is explanatory drawing explaining the outline of the surface mount type infrared light receiving unit which concerns on the prior art example 1, (A) is a top view, (B) is a side view in the arrow B direction of (A), (C) is ( It is a side view in the arrow C direction of A). It is explanatory drawing explaining the outline of the surface mount type infrared light receiving unit which concerns on the prior art example 2, (A) is a top view, (B) is a side view in the arrow B direction of (A), (C) is ( It is a side view in the arrow C direction of A).

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Surface mount type infrared light receiving unit 11 Light receiving element 12 Signal processing integrated circuit 13 Lead frame 13t Tie bar 14 Resin sealing part 14b Bottom surface 14c Arc surface 14bt Side surface 14p Protrusion part 14s Inclined surface 14t Top surface 15 Surface mount type terminal 15r Surface mount type Terminal (engagement part)
20 shield part 20b bridging part 20w opening window part 21 engagement part 22 extension part 22c extension direction bending part (engagement part)
22t tongue piece 22w fitting hole 23 cross extension 23c cross direction bending part (engagement part)
23t Tongue piece Ds Extension direction Dt Extension direction Dsf Extension direction θ Folding angle

Claims (18)

A lead frame including a light receiving element that receives infrared light and a signal processing integrated circuit that processes a signal photoelectrically converted by the light receiving element, and the lead frame including the light receiving element and the signal processing integrated circuit are resin-sealed. A surface-mounting infrared light receiving unit comprising a resin-sealed portion and a surface-mounted terminal extended from the lead frame outside the resin-sealed portion and bent toward the bottom surface of the resin-sealed portion,
A shield part that extends from the lead frame outside the resin sealing part and is bent along the resin sealing part to cover a region corresponding to the signal processing integrated circuit on the top surface of the resin sealing part;
An engagement portion extending from the shield portion and bent toward the bottom surface to engage the shield portion with a resin sealing portion,
The engagement portion is configured as the surface mount type terminal. The surface mount type infrared light receiving unit. The surface-mounted infrared light receiving unit according to claim 1,
The engagement portion has a cross extension extending in a direction intersecting with the extension direction of the shield portion between the extension portion extended in the extension direction of the shield portion from the shield portion and the shield portion. A surface-mounting type infrared light receiving unit, characterized in that the surface mounting type infrared light receiving unit is constituted by a cross-direction bent portion. The surface-mounted infrared light receiving unit according to claim 2,
The cross-extending portion is extended in two directions which are opposite to each other. The surface-mounted infrared light receiving unit according to claim 2 or 3,
The surface-mounting type infrared light receiving unit, wherein the cross-direction bent portion is bent in a bowl shape and arranged to face the bottom surface. A surface-mounted infrared light receiving unit according to any one of claims 2 to 4,
The surface-mount type infrared light receiving unit, wherein the cross-direction bent portion includes a tongue piece portion formed in parallel with the cross-direction bend portion and inclined toward the bottom surface side. The surface-mounted infrared light receiving unit according to claim 1,
The surface mount type, wherein the engaging portion is formed by an extending direction bending portion having an extending portion extending from the shield portion in the extending direction of the shield portion at a distal end in the extending direction of the shield portion. Infrared light receiving unit. The surface-mounted infrared light receiving unit according to claim 6,
The surface-mounting type infrared light receiving unit, wherein the extension-direction bending portion is bent in a bowl shape and arranged to face the bottom surface. The surface-mounted infrared light receiving unit according to claim 6 or 7,
The surface-mounting type infrared light receiving unit, wherein the extension-direction bending portion includes a tongue piece portion formed in parallel with the extension-direction bending portion and inclined toward the bottom surface side. A surface-mounting infrared light receiving unit according to any one of claims 2 to 8,
The resin sealing portion includes a protrusion on a side surface between the top surface and the bottom surface,
The surface-mount type infrared light receiving unit, wherein the extension portion includes a fitting hole portion to be fitted into the protrusion portion. The surface-mounted infrared light receiving unit according to claim 9,
The projection has an inclined surface that is inclined outward with respect to the side surface. The surface-mounted infrared light receiving unit according to claim 9,
The surface mount type infrared light receiving unit, wherein the protrusion has an arcuate surface that is arcuate outward from the side surface. A surface-mounted infrared light receiving unit according to any one of claims 9 to 11,
The surface-mount type infrared light receiving unit, wherein the extension part has a folding angle that is folded from a right angle with respect to the shield part. A surface-mounting infrared light receiving unit according to any one of claims 1 to 12,
The surface mount type infrared light receiving unit, wherein the shield part includes a bridging part in an opening window part opened corresponding to the light receiving element. A lead frame including a light receiving element that receives infrared light and a signal processing integrated circuit that processes a signal photoelectrically converted by the light receiving element, and the lead frame including the light receiving element and the signal processing integrated circuit are resin-sealed. A resin-encapsulated portion; a surface-mounted terminal extended from the lead frame outside the resin-encapsulated portion and bent toward the bottom surface of the resin-encapsulated portion; and the lead frame outside the resin-encapsulated portion A shield portion that extends from the bent portion along the resin sealing portion and covers a region corresponding to the signal processing integrated circuit on the top surface of the resin sealing portion, and is bent toward the bottom surface extending from the shield portion. Manufacturing method of a surface-mounting infrared light receiving unit for manufacturing a surface-mounting infrared light receiving unit including an engagement portion in which the shield portion is engaged with a resin sealing portion There is,
A resin sealing portion forming step of forming the resin sealing portion using a tie bar included in the lead frame;
A tie bar cutting step of cutting the tie bar and dividing it into the individual surface-mounted infrared light receiving units;
A method of manufacturing a surface-mounted infrared light receiving unit, comprising: a step of bending a portion extending from the lead frame outside the resin sealing portion to form the surface-mounted terminal and the shield portion. A method for producing a surface-mounted infrared light receiving unit according to claim 14,
The surface-mounting type infrared light receiving unit manufacturing method according to claim 1, wherein an extending direction of the engaging portion is a direction parallel to an extending direction of the tie bar in a state before the bending step. A method for producing a surface-mounted infrared light receiving unit according to claim 14,
The surface-mounting type infrared light receiving unit manufacturing method according to claim 1, wherein an extending direction of the engaging portion is a direction intersecting with an extending direction of the tie bar in a state before the bending step. A surface-mounting type infrared light receiving unit manufacturing method according to any one of claims 14 to 16,
In the bending step, the engaging portion is bent in the same manner as the surface-mounted terminal. An electronic device equipped with a surface-mount infrared receiving unit,
14. The electronic apparatus according to claim 1, wherein the surface-mounting infrared light receiving unit is the surface-mounting infrared light receiving unit according to any one of claims 1 to 13.

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