JP2012094668A - Light-receiving device and electronic apparatus - Google Patents

Light-receiving device and electronic apparatus Download PDF

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JP2012094668A
JP2012094668A JP2010240337A JP2010240337A JP2012094668A JP 2012094668 A JP2012094668 A JP 2012094668A JP 2010240337 A JP2010240337 A JP 2010240337A JP 2010240337 A JP2010240337 A JP 2010240337A JP 2012094668 A JP2012094668 A JP 2012094668A
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conductive member
light receiving
receiving device
integrated circuit
circuit element
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Masahiro Honbo
昌弘 本坊
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Sharp Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Abstract

PROBLEM TO BE SOLVED: To provide a light-receiving device capable of eliminating the need of an additional shield member to noise resistance, and downsizing a mounting area.SOLUTION: A second conductive member 2 is disposed so as to oppose the other surface 2b of the second conductive member 2 to one surface 1a of a first conductive member 1 and an integrated circuit element 3. Therefore, the integrated circuit element 3 is covered by the first conductive member 1 and the second conductive member 2 for electromagnetic shielding. A light-receiving element 4 is disposed on one surface 1a of the second conductive member 2. Therefore, the light-receiving element 4 and the integrated circuit element 3 are not disposed on the same surface, and can be disposed so as to overlap each other, thereby reducing the size in the surface direction of the first and second conductive members 1 and 2.

Description

この発明は、受光装置および電子機器に関する。   The present invention relates to a light receiving device and an electronic apparatus.

従来より、各種ＡＶ機器や携帯機器、小型電子機器等に、受光装置が使用されている。この受光装置の一例として、赤外線受光装置があり、この赤外線受光装置は、送信機側からの微弱な信号を受信するために高ゲインのアンプを内蔵し、微弱な赤外線信号を増幅させ、電子機器制御用等のデジタル信号を出力している。   Conventionally, a light receiving device has been used in various AV devices, portable devices, small electronic devices, and the like. As an example of this light receiving device, there is an infrared light receiving device. This infrared light receiving device has a built-in high gain amplifier to receive a weak signal from the transmitter side, amplifies the weak infrared signal, and an electronic device. Digital signals for control etc. are output.

このように、赤外線受光装置は、微弱な信号および高ゲインのアンプを取り扱っているがゆえに、各種ノイズに対して非常に敏感である。そのため、その赤外線受光装置については、シールドが不可欠となっている。   As described above, since the infrared light receiving apparatus handles a weak signal and a high gain amplifier, it is very sensitive to various noises. Therefore, shielding is indispensable for the infrared light receiving device.

そこで、従来、第１の赤外線受光装置としては、図１２に示すように、同一のリードフレーム１０１上に、受光素子１０２および信号処理用ＩＣチップ１０３を配置し、図１３に示すように、受光素子１０２および信号処理用ＩＣチップ１０３を赤外透過性樹脂１０４で封止し、金属製シールドケース１０５を被せたものがある。   Therefore, conventionally, as the first infrared light receiving device, as shown in FIG. 12, the light receiving element 102 and the signal processing IC chip 103 are arranged on the same lead frame 101, and as shown in FIG. In some cases, the element 102 and the signal processing IC chip 103 are sealed with an infrared transmitting resin 104 and covered with a metal shield case 105.

また、第２の赤外線受光装置としては、図１４に示すように、金属製シールドケースを被せる代わりに、導電性樹脂１０６でモールドしたものがある。   In addition, as shown in FIG. 14, the second infrared light receiving device includes a device molded with a conductive resin 106 instead of covering with a metal shield case.

さらに、第３の赤外線受光装置としては、受光素子と信号処理用ＩＣチップが搭載されたリードフレームの先端を折り曲げ、その先端で信号処理用ＩＣチップの上面に覆うようにし、シールド効果をもたせ赤外透過性樹脂で封止したものがある（特開平６−６９４０９号公報：特許文献１参照、特開平１０−７４９６２号公報：特許文献２参照）。   Further, as a third infrared light receiving device, the tip of the lead frame on which the light receiving element and the signal processing IC chip are mounted is bent, and the tip is covered with the upper surface of the signal processing IC chip to provide a shielding effect and red. Some are sealed with an externally permeable resin (see Japanese Patent Laid-Open No. 6-69409: Patent Document 1; Japanese Patent Laid-Open No. 10-76962: Patent Document 2).

ここで、赤外線受光装置は、上述したとおり、微弱な赤外線信号および高ゲインのアンプを取り扱っており、ノイズに敏感であり、そのため、シールドは不可欠となっている。他方、製品のデザイン優先化、薄型化、小型化が進む中、赤外線受光装置の実装エリアは限られてきており、実装エリアの小さい小型の赤外線受光装置が求められている。   Here, as described above, the infrared light receiving apparatus handles a weak infrared signal and a high gain amplifier, and is sensitive to noise, and thus a shield is indispensable. On the other hand, as product design priority, thinning, and miniaturization progress, the mounting area of the infrared light receiving device is limited, and a small infrared light receiving device with a small mounting area is required.

しかしながら、上記第１の赤外線受光装置では、基板上で金属製シールドケースをＧＮＤに落とす必要があるため、一定の実装エリアの確保が必要となってくる問題がある。また、小型化という面においても、受光素子と信号処理用ＩＣチップが同一リードフレーム上に搭載されているため、小型化にも制約が出てくる問題がある。   However, the first infrared light receiving device has a problem that it is necessary to secure a certain mounting area because it is necessary to drop the metal shield case onto the GND on the substrate. In terms of miniaturization, there is a problem that miniaturization is restricted because the light receiving element and the signal processing IC chip are mounted on the same lead frame.

上記第２、上記第３の赤外線受光装置では、シールドケースを必要としないため、一定の実装エリアの確保は必要でない。しかし、受光素子と信号処理用ＩＣチップが同一リードフレーム上に搭載されているため、小型化に制約が出てくる問題がある。   Since the second and third infrared light receiving devices do not require a shield case, it is not necessary to secure a certain mounting area. However, since the light receiving element and the signal processing IC chip are mounted on the same lead frame, there is a problem in that miniaturization is restricted.

特開平６−６９４０９号公報JP-A-6-69409 特開平１０−７４９６２号公報Japanese Patent Application Laid-Open No. 10-74662

そこで、この発明の課題は、耐ノイズ性に対して別途のシールド部材を不要にすると共に、実装エリアの小型化を図ることができる受光装置を提供することにある。   SUMMARY OF THE INVENTION An object of the present invention is to provide a light receiving device that eliminates the need for a separate shield member for noise resistance and can reduce the mounting area.

上記課題を解決するため、この発明の受光装置は、
リードフレームまたは基板からなる第１の導電部材と、
この第１の導電部材の一面に配置された集積回路素子と、
リードフレームまたは基板からなる第２の導電部材と、
この第２の導電部材の一面に配置された受光素子と
を備え、
上記第１の導電部材と上記第２の導電部材とは、電気的に接続され、
上記第２の導電部材は、上記第２の導電部材の他面が上記第１の導電部材の上記一面および上記集積回路素子に対向するように、配置されていることを特徴としている。 In order to solve the above problems, the light receiving device of the present invention is:
A first conductive member made of a lead frame or a substrate;
An integrated circuit element disposed on one surface of the first conductive member;
A second conductive member made of a lead frame or a substrate;
A light receiving element disposed on one surface of the second conductive member,
The first conductive member and the second conductive member are electrically connected,
The second conductive member is arranged such that the other surface of the second conductive member faces the one surface of the first conductive member and the integrated circuit element.

この発明の受光装置によれば、上記第２の導電部材は、上記第２の導電部材の他面が上記第１の導電部材の上記一面および上記集積回路素子に対向するように、配置されているので、集積回路素子は、第１の導電部材と第２の導電部材とに覆われる。このため、第１の導電部材と第２の導電部材とは、集積回路素子に対して、シールド効果をもたらすことができる。したがって、金属性シールドケースや導電性樹脂などの別途のシールド部材で集積回路素子を覆う必要がなく、耐ノイズ性をもたらすことができる。   According to the light receiving device of the present invention, the second conductive member is disposed such that the other surface of the second conductive member faces the one surface of the first conductive member and the integrated circuit element. Therefore, the integrated circuit element is covered with the first conductive member and the second conductive member. For this reason, the first conductive member and the second conductive member can provide a shielding effect to the integrated circuit element. Therefore, it is not necessary to cover the integrated circuit element with a separate shield member such as a metallic shield case or conductive resin, and noise resistance can be provided.

また、上記受光素子は、上記第２の導電部材の上記一面に、配置されているので、受光素子と集積回路素子とは、同一面に配置されないで、重なるように配置できる。このため、第１、第２の導電部材の面方向の大きさを低減できる。   Further, since the light receiving element is arranged on the one surface of the second conductive member, the light receiving element and the integrated circuit element can be arranged so as to overlap each other without being arranged on the same surface. For this reason, the magnitude | size of the surface direction of a 1st, 2nd conductive member can be reduced.

したがって、耐ノイズ性に対して別途のシールド部材を不要にすると共に、実装エリアの小型化を図ることができる受光装置を実現できる。   Accordingly, it is possible to realize a light receiving device that eliminates the need for a separate shield member for noise resistance and can reduce the mounting area.

また、一実施形態の受光装置では、
上記第１の導電部材の上記一面と上記第２の導電部材の上記一面とは、平行であり、
上記受光素子と上記集積回路素子とは、上記第１の導電部材および上記第２の導電部材に直交する方向からみて、重なる。 In the light receiving device of one embodiment,
The one surface of the first conductive member and the one surface of the second conductive member are parallel to each other,
The light receiving element and the integrated circuit element overlap each other when viewed from a direction orthogonal to the first conductive member and the second conductive member.

この実施形態の受光装置によれば、上記第１の導電部材の上記一面と上記第２の導電部材の上記一面とは、平行であるので、集積回路素子に対するシールド効果が一層向上する。また、上記受光素子と上記集積回路素子とは、上記第１の導電部材および上記第２の導電部材に直交する方向からみて、重なるので、第１、第２の導電部材の面方向の大きさを一層低減できる。   According to the light receiving device of this embodiment, since the one surface of the first conductive member and the one surface of the second conductive member are parallel, the shielding effect on the integrated circuit element is further improved. Further, the light receiving element and the integrated circuit element overlap each other when viewed from the direction orthogonal to the first conductive member and the second conductive member, so that the size in the surface direction of the first and second conductive members is the same. Can be further reduced.

また、一実施形態の受光装置では、上記第１の導電部材と上記第２の導電部材とは、別体である。   In the light receiving device of one embodiment, the first conductive member and the second conductive member are separate.

この実施形態の受光装置によれば、上記第１の導電部材と上記第２の導電部材とは、別体であるので、集積回路素子を搭載する第１の導電部材と受光素子を搭載する第２の導電部材とをそれぞれ並行してダイボンドを行うことができて、効率的となる。   According to the light receiving device of this embodiment, since the first conductive member and the second conductive member are separate bodies, the first conductive member on which the integrated circuit element is mounted and the first conductive member on which the light receiving element is mounted. Die bonding can be performed in parallel with each of the two conductive members, which is efficient.

また、一実施形態の受光装置では、上記第１の導電部材と上記第２の導電部材とは、一体である。   In the light receiving device of one embodiment, the first conductive member and the second conductive member are integral.

この実施形態の受光装置によれば、上記第１の導電部材と上記第２の導電部材とは、一体であるので、第１の導電部材および第２の導電部材の材料費を低減できる。   According to the light receiving device of this embodiment, since the first conductive member and the second conductive member are integral, the material cost of the first conductive member and the second conductive member can be reduced.

また、一実施形態の受光装置では、上記第１の導電部材は、上記集積回路素子に接続されたワイヤーと上記受光素子に接続されたワイヤーとを導通するワイヤーボンドが設けられるボンド領域を有する。   In one embodiment, the first conductive member has a bond region in which a wire bond that conducts a wire connected to the integrated circuit element and a wire connected to the light receiving element is provided.

この実施形態の受光装置によれば、上記第１の導電部材は、上記ボンド領域を有するので、受光素子で受光した信号を、ボンド領域を介して、集積回路素子に伝えることができる。   According to the light receiving device of this embodiment, since the first conductive member has the bond region, a signal received by the light receiving element can be transmitted to the integrated circuit element through the bond region.

また、一実施形態の受光装置では、上記ボンド領域は、複数ある。   In one embodiment of the light receiving device, there are a plurality of the bond regions.

この実施形態の受光装置によれば、上記ボンド領域は、複数あるので、ワイヤーボンドのレイアウトの制約を受け難くなる。   According to the light receiving device of this embodiment, since there are a plurality of the bond regions, it is difficult to be restricted by the wire bond layout.

また、一実施形態の受光装置では、
上記第１の導電部材は、嵌合部を有し、
上記第２の導電部材は、上記第１の導電部材の上記嵌合部に嵌合される被嵌合部を有する。 In the light receiving device of one embodiment,
The first conductive member has a fitting portion,
The second conductive member has a fitted portion fitted to the fitting portion of the first conductive member.

この実施形態の受光装置によれば、上記第１の導電部材の上記嵌合部と、上記第２の導電部材の上記被嵌合部とは、嵌合するので、第１の導電部材と第２の導電部材との嵌合性が向上し、第１の導電部材と第２の導電部材との位置決めが容易になる。   According to the light receiving device of this embodiment, the fitting portion of the first conductive member and the fitted portion of the second conductive member are fitted to each other. The fitting property with the second conductive member is improved, and the positioning of the first conductive member and the second conductive member is facilitated.

また、一実施形態の受光装置では、
上記第１の導電部材の上記嵌合部は、凹部であり、
上記第２の導電部材の上記被嵌合部は、凸部である。 In the light receiving device of one embodiment,
The fitting portion of the first conductive member is a recess,
The fitted portion of the second conductive member is a convex portion.

この実施形態の受光装置によれば、上記第１の導電部材の上記嵌合部は、凹部であり、上記第２の導電部材の上記被嵌合部は、凸部であるので、嵌合部および被嵌合部を簡単な構成にできる。   According to the light receiving device of this embodiment, the fitting portion of the first conductive member is a concave portion, and the fitted portion of the second conductive member is a convex portion. And a to-be-fitted part can be made a simple structure.

また、一実施形態の受光装置では、上記第１の導電部材の上記被嵌合部は、貫通穴である。   In one embodiment, the fitted portion of the first conductive member is a through hole.

この実施形態の受光装置によれば、上記第１の導電部材の上記被嵌合部は、貫通穴であるので、貫通穴の一方側の開口から第２の導電部材の嵌合部を導入し、貫通穴の他方側の開口から接着剤を導入することができ、接着剤の導入が容易になる。   According to the light receiving device of this embodiment, since the fitted portion of the first conductive member is a through hole, the fitting portion of the second conductive member is introduced from the opening on one side of the through hole. The adhesive can be introduced from the opening on the other side of the through hole, and the introduction of the adhesive is facilitated.

また、一実施形態の受光装置では、上記第１の導電部材の上記嵌合部と、上記第２の導電部材の上記被嵌合部とは、導電性接着剤によって、接着されている。   In one embodiment, the fitting portion of the first conductive member and the fitted portion of the second conductive member are bonded by a conductive adhesive.

この実施形態の受光装置によれば、上記第１の導電部材の上記嵌合部と、上記第２の導電部材の上記被嵌合部とは、導電性接着剤によって、接着されているので、第１の導電部材の電位と第２の導電部材の電位とを一層共通化できる。このため、一層シールド効果を得ることができて、耐ノイズ性を一層向上できる。   According to the light receiving device of this embodiment, the fitting portion of the first conductive member and the fitted portion of the second conductive member are bonded by a conductive adhesive. The potential of the first conductive member and the potential of the second conductive member can be made more common. For this reason, a further shielding effect can be obtained and noise resistance can be further improved.

また、一実施形態の受光装置では、上記導電性接着剤は、速硬化型の接着剤である。   In one embodiment, the conductive adhesive is a fast-curing adhesive.

この実施形態の受光装置によれば、上記導電性接着剤は、速硬化型の接着剤であるので、接着剤の硬化時間を短縮でき、生産効率を上げることができる。   According to the light receiving device of this embodiment, since the conductive adhesive is a fast-curing adhesive, the curing time of the adhesive can be shortened and the production efficiency can be increased.

また、一実施形態の受光装置では、
上記受光素子は、赤外線の信号を受光し、
上記集積回路素子は、上記受光素子が受光した赤外線の信号を増幅する高増幅率増幅器を有する。 In the light receiving device of one embodiment,
The light receiving element receives an infrared signal,
The integrated circuit element includes a high amplification factor amplifier that amplifies an infrared signal received by the light receiving element.

この実施形態の受光装置によれば、上記受光素子は、赤外線の信号を受光し、上記集積回路素子は、高増幅率増幅器を有するので、この受光装置は、微弱な赤外線の信号および高増幅率増幅器を取り扱う赤外線受光装置である。そして、この赤外線受光装置は、各種ノイズに対して非常に敏感となるが、別途のシールド部材を不要としても耐ノイズ性を有する。   According to the light receiving device of this embodiment, the light receiving element receives an infrared signal, and the integrated circuit element has a high amplification factor amplifier. Therefore, the light receiving device has a weak infrared signal and a high amplification factor. It is an infrared receiver that handles amplifiers. This infrared light receiving device is very sensitive to various types of noise, but has noise resistance even if a separate shield member is not required.

また、一実施形態の電子機器では、上記受光装置を有している。   Further, an electronic apparatus according to an embodiment includes the light receiving device.

この実施形態の電子機器によれば、実装エリアの小さい小型の上記受光装置を有しているので、設計の自由度を広げることができる。   According to the electronic apparatus of this embodiment, since the small light receiving device having a small mounting area is provided, the degree of freedom in design can be expanded.

この発明の受光装置によれば、上記第２の導電部材は、上記第２の導電部材の他面が上記第１の導電部材の上記一面および上記集積回路素子に対向するように、配置され、上記受光素子は、上記第２の導電部材の上記一面に、配置されているので、耐ノイズ性に対して別途のシールド部材を不要にすると共に、実装エリアの小型化を図ることができる。   According to the light receiving device of the present invention, the second conductive member is disposed such that the other surface of the second conductive member faces the one surface of the first conductive member and the integrated circuit element. Since the light receiving element is disposed on the one surface of the second conductive member, a separate shield member is not required for noise resistance, and the mounting area can be reduced in size.

本発明の受光装置の第１実施形態を示す側面図である。It is a side view which shows 1st Embodiment of the light-receiving device of this invention. 受光装置の底面図である。It is a bottom view of a light-receiving device. 第１の導電部材に第２の導電部材を組み付ける前の状態における第１の導電部材の正面図である。It is a front view of the 1st conductive member in the state before attaching the 2nd conductive member to the 1st conductive member. 第１の導電部材に第２の導電部材を組み付ける前の状態における第２の導電部材の正面図である。It is a front view of the 2nd conductive member in the state before attaching the 2nd conductive member to the 1st conductive member. 本発明の受光装置の第２実施形態を示す側面図である。It is a side view which shows 2nd Embodiment of the light-receiving device of this invention. 受光装置の底面図である。It is a bottom view of a light-receiving device. 第１の導電部材と第２の導電部材とを組み立てる前の状態における第１の導電部材および第２の導電部材の正面図である。It is a front view of the 1st conductive member and the 2nd conductive member in the state before assembling the 1st conductive member and the 2nd conductive member. 第１の導電部材と第２の導電部材とを組み立てる前の状態における第１の導電部材および第２の導電部材の側面図である。It is a side view of the 1st conductive member and the 2nd conductive member in the state before assembling the 1st conductive member and the 2nd conductive member. 本発明の受光装置の第３実施形態を示す側面図である。It is a side view which shows 3rd Embodiment of the light-receiving device of this invention. 受光装置の底面図である。It is a bottom view of a light-receiving device. 第１の導電部材と第２の導電部材とを組み立てる前の状態における第１の導電部材および第２の導電部材の正面図である。It is a front view of the 1st conductive member and the 2nd conductive member in the state before assembling the 1st conductive member and the 2nd conductive member. 本発明の受光装置の第４実施形態を示す側面図である。It is a side view which shows 4th Embodiment of the light-receiving device of this invention. 受光装置の底面図である。It is a bottom view of a light-receiving device. 第１の導電部材に第２の導電部材を組み付ける前の状態における第１の導電部材の正面図である。It is a front view of the 1st conductive member in the state before attaching the 2nd conductive member to the 1st conductive member. 本発明の受光装置の第５実施形態を示す底面図である。It is a bottom view which shows 5th Embodiment of the light-receiving device of this invention. 従来の第１の受光装置のリードフレームを示す正面図である。It is a front view which shows the lead frame of the conventional 1st light-receiving device. 従来の第１の受光装置を示す正面図である。It is a front view which shows the conventional 1st light-receiving device. 従来の第２の受光装置を示す正面図である。It is a front view which shows the conventional 2nd light-receiving device.

以下、この発明を図示の実施の形態により詳細に説明する。   Hereinafter, the present invention will be described in detail with reference to the illustrated embodiments.

（第１の実施形態）
図１Ａは、この発明の受光装置の第１実施形態である側面図を示している。図１Ｂは、受光装置の底面図を示している。この受光装置は、例えば、ＴＶ、ＶＴＲ、オーディオコンポ、エアコン等の電子機器に取り付けられ、送信機からの信号を受信して各電子機器の制御信号およびデータ信号を発生する。 (First embodiment)
FIG. 1A shows a side view of a first embodiment of a light receiving device according to the present invention. FIG. 1B shows a bottom view of the light receiving device. The light receiving device is attached to an electronic device such as a TV, a VTR, an audio component, or an air conditioner, and receives a signal from a transmitter and generates a control signal and a data signal for each electronic device.

図１Ａと図１Ｂに示すように、上記受光装置は、リードフレームからなる第１の導電部材１と、この第１の導電部材１の一面１ａに配置された集積回路素子３と、リードフレームからなる第２の導電部材２と、この第２の導電部材２の一面２ａに配置された受光素子４とを有する。   As shown in FIGS. 1A and 1B, the light receiving device includes a first conductive member 1 made of a lead frame, an integrated circuit element 3 arranged on one surface 1a of the first conductive member 1, and a lead frame. A second conductive member 2 and a light receiving element 4 disposed on one surface 2a of the second conductive member 2.

上記第１の導電部材１と上記第２の導電部材２とは、電気的に接続されている。第２の導電部材２は、第２の導電部材２の他面２ｂが第１の導電部材１の一面１ａおよび集積回路素子３に対向するように、配置されている。   The first conductive member 1 and the second conductive member 2 are electrically connected. The second conductive member 2 is arranged so that the other surface 2 b of the second conductive member 2 faces the one surface 1 a of the first conductive member 1 and the integrated circuit element 3.

上記第１の導電部材１の上記一面１ａと上記第２の導電部材２の上記一面２ａとは、平行である。上記受光素子４と上記集積回路素子３とは、第１の導電部材１および第２の導電部材２に直交する方向からみて、重なる。   The one surface 1a of the first conductive member 1 and the one surface 2a of the second conductive member 2 are parallel to each other. The light receiving element 4 and the integrated circuit element 3 overlap each other when viewed from the direction perpendicular to the first conductive member 1 and the second conductive member 2.

上記受光素子４は、赤外線の信号を受光する。上記集積回路素子３は、信号処理用のＩＣチップである。集積回路素子３は、受光素子４が受光した赤外線の信号を増幅する高増幅率増幅器を有する。集積回路素子３は、微弱な赤外線の信号を増幅させて、電子機器制御用等のデジタル信号を出力する。受光素子４および集積回路素子３は、同一の透光性樹脂５に、封止されている。受光素子４および集積回路素子３は、ワイヤーにより、第１、第２の導電部材１，２に電気的に接続されている。   The light receiving element 4 receives an infrared signal. The integrated circuit element 3 is an IC chip for signal processing. The integrated circuit element 3 has a high amplification factor amplifier that amplifies the infrared signal received by the light receiving element 4. The integrated circuit element 3 amplifies a weak infrared signal and outputs a digital signal for electronic device control or the like. The light receiving element 4 and the integrated circuit element 3 are sealed in the same translucent resin 5. The light receiving element 4 and the integrated circuit element 3 are electrically connected to the first and second conductive members 1 and 2 by wires.

上記第１の導電部材１と上記第２の導電部材２とは、別体である。図２と図３に、第１の導電部材１に第２の導電部材２を組み付ける前の状態を示す。図２に示すように、第１の導電部材１には、集積回路素子３が予め搭載されている。図３に示すように、第２の導電部材２には、受光素子４が予め搭載されている。第２の導電部材２は、両側部に、足部２０を有し、この足部２０には、切れ目２１が設けられている。   The first conductive member 1 and the second conductive member 2 are separate bodies. 2 and 3 show a state before the second conductive member 2 is assembled to the first conductive member 1. As shown in FIG. 2, an integrated circuit element 3 is mounted in advance on the first conductive member 1. As shown in FIG. 3, the light receiving element 4 is mounted in advance on the second conductive member 2. The second conductive member 2 has foot portions 20 on both sides, and the foot portions 20 are provided with cuts 21.

そして、第１の導電部材１に第２の導電部材２を組み付けるとき、第２の導電部材２の足部２０を切れ目２１で折り曲げて起立させ、第２の導電部材２を集積回路素子３を覆うように配置して、足部２０の先端を第１の導電部材１に導電性接着剤によって接着する。これにより、第２の導電部材２は、第１の導電部材１に電気的に接続され、集積回路素子３は、第１の導電部材１と第２の導電部材２とに囲まれる。第１の導電部材１をＧＮＤ電位とすることにより、第２の導電部材２もＧＮＤ電位となり、集積回路素子３は、第１の導電部材１と第２の導電部材２とにより、電磁シールドされる。   Then, when the second conductive member 2 is assembled to the first conductive member 1, the foot portion 20 of the second conductive member 2 is bent at the cut line 21, and the second conductive member 2 is attached to the integrated circuit element 3. It arrange | positions so that it may cover, and the front-end | tip of the leg part 20 is adhere | attached on the 1st conductive member 1 with a conductive adhesive. As a result, the second conductive member 2 is electrically connected to the first conductive member 1, and the integrated circuit element 3 is surrounded by the first conductive member 1 and the second conductive member 2. By setting the first conductive member 1 to the GND potential, the second conductive member 2 is also set to the GND potential, and the integrated circuit element 3 is electromagnetically shielded by the first conductive member 1 and the second conductive member 2. The

上記構成の受光装置によれば、上記第２の導電部材２は、上記第２の導電部材２の上記他面２ｂが上記第１の導電部材１の上記一面１ａおよび上記集積回路素子３に対向するように、配置されているので、集積回路素子３は、第１の導電部材１と第２の導電部材２とに覆われる。このため、第１の導電部材１と第２の導電部材２とは、集積回路素子３に対して、シールド効果をもたらすことができる。したがって、金属性シールドケースや導電性樹脂などの別途のシールド部材で集積回路素子３を覆う必要がなく、耐ノイズ性をもたらすことができる。   According to the light receiving device having the above configuration, the second conductive member 2 has the other surface 2b of the second conductive member 2 facing the one surface 1a of the first conductive member 1 and the integrated circuit element 3. Thus, the integrated circuit element 3 is covered with the first conductive member 1 and the second conductive member 2. For this reason, the first conductive member 1 and the second conductive member 2 can provide a shielding effect to the integrated circuit element 3. Therefore, it is not necessary to cover the integrated circuit element 3 with a separate shield member such as a metallic shield case or conductive resin, and noise resistance can be provided.

また、上記受光素子４は、上記第２の導電部材２の上記一面１ａに、配置されているので、受光素子４と集積回路素子３とは、同一面に配置されないで、重なるように配置できる。このため、第１、第２の導電部材１，２の面方向の大きさを低減できる。   In addition, since the light receiving element 4 is disposed on the one surface 1a of the second conductive member 2, the light receiving element 4 and the integrated circuit element 3 can be disposed so as to overlap each other without being disposed on the same surface. . For this reason, the magnitude | size of the surface direction of the 1st, 2nd conductive members 1 and 2 can be reduced.

したがって、耐ノイズ性に対して別途のシールド部材を不要にすると共に、実装エリアの小型化を図ることができる受光装置を実現できる。   Accordingly, it is possible to realize a light receiving device that eliminates the need for a separate shield member for noise resistance and can reduce the mounting area.

また、上記第１の導電部材１の上記一面１ａと上記第２の導電部材２の上記一面２ａとは、平行であるので、集積回路素子３に対するシールド効果が一層向上する。また、上記受光素子４と上記集積回路素子３とは、上記第１の導電部材１および上記第２の導電部材２に直交する方向からみて、重なるので、第１、第２の導電部材２の面方向の大きさを一層低減できる。   Further, since the one surface 1a of the first conductive member 1 and the one surface 2a of the second conductive member 2 are parallel, the shielding effect for the integrated circuit element 3 is further improved. Further, the light receiving element 4 and the integrated circuit element 3 overlap each other when viewed from the direction perpendicular to the first conductive member 1 and the second conductive member 2. The size in the surface direction can be further reduced.

また、上記第１の導電部材１と上記第２の導電部材２とは、別体であるので、集積回路素子３を搭載する第１の導電部材１と受光素子４を搭載する第２の導電部材２とをそれぞれ並行してダイボンドを行うことができて、効率的となる。ただし、第２の導電部材２を集積回路素子３の上に覆うようにするための位置決め用の冶具が必要になってくるが、第１の導電部材１と第２の導電部材２とを別体にすることにより、現存の金型および装置などの大掛かりな変更が必要なく、設備投資を抑制できる。   Further, since the first conductive member 1 and the second conductive member 2 are separate bodies, the first conductive member 1 on which the integrated circuit element 3 is mounted and the second conductive member on which the light receiving element 4 is mounted. Die bonding can be performed in parallel with the member 2, which is efficient. However, although a positioning jig for covering the second conductive member 2 on the integrated circuit element 3 is necessary, the first conductive member 1 and the second conductive member 2 are separated from each other. By making it into a body, there is no need for major changes in existing molds and devices, and capital investment can be suppressed.

また、上記受光素子４は、赤外線の信号を受光し、上記集積回路素子３は、高増幅率増幅器を有するので、この受光装置は、微弱な赤外線の信号および高増幅率増幅器を取り扱う赤外線受光装置である。そして、この赤外線受光装置は、各種ノイズに対して非常に敏感となるが、別途のシールド部材を不要としても耐ノイズ性を有する。   The light receiving element 4 receives an infrared signal, and the integrated circuit element 3 has a high amplification factor amplifier. Therefore, the light receiving device handles a weak infrared signal and a high amplification factor amplifier. It is. This infrared light receiving device is very sensitive to various types of noise, but has noise resistance even if a separate shield member is not required.

また、上記構成の電子機器によれば、実装エリアの小さい小型の上記受光装置を有しているので、設計の自由度を広げることができる。   In addition, according to the electronic apparatus having the above configuration, since the small light receiving device having a small mounting area is provided, the degree of freedom in design can be expanded.

（第２の実施形態）
図４Ａと図４Ｂは、この発明の受光装置の第２の実施形態を示している。上記第１の実施形態と相違する点を説明すると、この第２の実施形態では、第１の導電部材および第２の導電部材の構成が相違する。なお、この第２の実施形態において、上記第１の実施形態と同一の符号は、上記第１の実施形態と同じ構成であるため、その説明を省略する。 (Second Embodiment)
4A and 4B show a second embodiment of the light receiving device of the present invention. The difference from the first embodiment will be described. In the second embodiment, the configurations of the first conductive member and the second conductive member are different. In the second embodiment, the same reference numerals as those in the first embodiment are the same as those in the first embodiment, and the description thereof is omitted.

図４Ａと図４Ｂに示すように、第１の導電部材１Ａと第２の導電部材２Ａとは、一体である。第１の導電部材１Ａおよび第２の導電部材２Ａは、上記第１の実施形態の第１、第２の導電部材１，２と同様の位置に、配置されている。このため、耐ノイズ性に対して別途のシールド部材を不要にすると共に、実装エリアの小型化を図ることができる受光装置を実現できる。   As shown in FIGS. 4A and 4B, the first conductive member 1A and the second conductive member 2A are integrated. The first conductive member 1A and the second conductive member 2A are disposed at the same positions as the first and second conductive members 1 and 2 of the first embodiment. Therefore, it is possible to realize a light receiving device that eliminates the need for a separate shield member for noise resistance and can reduce the mounting area.

図５と図６に、第１の導電部材１Ａと第２の導電部材２Ａとを組み立てる前の状態を示す。図５と図６に示すように、第１の導電部材１Ａには、集積回路素子３が予め搭載されている。第２の導電部材２Ａには、受光素子４が予め搭載されている。第２の導電部材２Ａは、左右両側部に、足部２０Ａを有し、上下一側部に、連結部２２Ａを有する。この連結部２２Ａの先端は、第１の導電部材１に、一体に接続している。連結部２２Ａには、切れ目２１Ａが設けられている。   5 and 6 show a state before assembling the first conductive member 1A and the second conductive member 2A. As shown in FIGS. 5 and 6, the integrated circuit element 3 is mounted in advance on the first conductive member 1A. The light receiving element 4 is mounted in advance on the second conductive member 2A. The second conductive member 2 </ b> A has a foot portion 20 </ b> A on both left and right side portions, and has a connecting portion 22 </ b> A on one vertical side. The leading end of the connecting portion 22 </ b> A is integrally connected to the first conductive member 1. The connecting portion 22A is provided with a cut 21A.

そして、第１の導電部材１Ａと第２の導電部材２Ａとを組み立てるとき、第２の導電部材２Ａの連結部２２Ａを切れ目２１Ａで折り曲げて起立させ、第２の導電部材２Ａを集積回路素子３を覆うように配置して、足部２０Ａの先端を第１の導電部材１Ａに導電性接着剤によって接着する。これにより、第２の導電部材２Ａは、第１の導電部材１Ａに電気的に接続され、集積回路素子３は、第１の導電部材１Ａと第２の導電部材２Ａとに囲まれる。第１の導電部材１ＡをＧＮＤ電位とすることにより、第２の導電部材２ＡもＧＮＤ電位となり、集積回路素子３は、第１の導電部材１Ａと第２の導電部材２Ａとにより、電磁シールドされる。   Then, when the first conductive member 1A and the second conductive member 2A are assembled, the connecting portion 22A of the second conductive member 2A is bent at the cut 21A to stand up, and the second conductive member 2A is made to be integrated circuit element 3 The tip of the foot 20A is adhered to the first conductive member 1A with a conductive adhesive. Accordingly, the second conductive member 2A is electrically connected to the first conductive member 1A, and the integrated circuit element 3 is surrounded by the first conductive member 1A and the second conductive member 2A. By setting the first conductive member 1A to the GND potential, the second conductive member 2A is also set to the GND potential, and the integrated circuit element 3 is electromagnetically shielded by the first conductive member 1A and the second conductive member 2A. The

上記構成の受光装置によれば、上記第１の導電部材１Ａと上記第２の導電部材２Ａとは、一体であるので、第１の導電部材１Ａおよび第２の導電部材２Ａの材料費を低減できる。また、第２の導電部材２Ａを集積回路素子３の上に折り曲げて覆うようにするため、第１の導電部材１Ａと第２の導電部材２Ａとの位置決めも容易となる。ただし、第１の導電部材１Ａと第２の導電部材２Ａとが一体になっているが故に、第１の導電部材１Ａおよび第２の導電部材２Ａの両面にダイボンドを行う必要が出てくるため、新規装置やリードフレーム折り曲げ設備の導入などが必要となってくるが、人手の介在する工程が少なくなるため、工数的には、有利である。   According to the light receiving device having the above configuration, the first conductive member 1A and the second conductive member 2A are integrated, so that the material cost of the first conductive member 1A and the second conductive member 2A is reduced. it can. Further, since the second conductive member 2A is bent and covered on the integrated circuit element 3, positioning of the first conductive member 1A and the second conductive member 2A is facilitated. However, since the first conductive member 1A and the second conductive member 2A are integrated, it is necessary to perform die bonding on both surfaces of the first conductive member 1A and the second conductive member 2A. However, it is necessary to introduce a new apparatus and a lead frame bending equipment, but it is advantageous in terms of man-hours because the number of steps involving manpower is reduced.

（第３の実施形態）
図７Ａと図７Ｂは、この発明の受光装置の第３の実施形態を示している。上記第２の実施形態と相違する点を説明すると、この第３の実施形態では、第１の導電部材の構成が相違する。なお、この第３の実施形態において、上記第２の実施形態と同一の符号は、上記第２の実施形態と同じ構成であるため、その説明を省略する。 (Third embodiment)
7A and 7B show a third embodiment of the light-receiving device of the present invention. The difference from the second embodiment will be described. In the third embodiment, the configuration of the first conductive member is different. In the third embodiment, the same reference numerals as those of the second embodiment have the same configurations as those of the second embodiment, and the description thereof is omitted.

図７Ａと図７Ｂに示すように、第１の導電部材１Ｂは、集積回路素子３に接続されたワイヤー６と受光素子４に接続されたワイヤー６とを導通するワイヤーボンドが設けられるボンド領域Ｚ１を有する。   As shown in FIG. 7A and FIG. 7B, the first conductive member 1B includes a bond region Z1 in which a wire bond that conducts the wire 6 connected to the integrated circuit element 3 and the wire 6 connected to the light receiving element 4 is provided. Have

図８に、上記第１の導電部材１Ｂと上記第２の導電部材２Ｂとを組み立てる前の状態を示す。図８に示すように、第１の導電部材１Ｂと第２の導電部材２Ｂとは、一体に接続されている。そして、第１の導電部材１Ｂの長手方向の長さにおいて、集積回路素子３よりも長手方向一方側（図中下側）の長さは、集積回路素子３よりも長手方向他方側（図中上側）の長さよりも、長い。上記ボンド領域Ｚ１は、集積回路素子３よりも長手方向一方側（図中下側）に位置する。   FIG. 8 shows a state before assembling the first conductive member 1B and the second conductive member 2B. As shown in FIG. 8, the first conductive member 1B and the second conductive member 2B are integrally connected. The length in the longitudinal direction of the first conductive member 1B is longer on the one side in the longitudinal direction (lower side in the figure) than the integrated circuit element 3 and on the other side in the longitudinal direction from the integrated circuit element 3 (in the figure). It is longer than the length of the upper side. The bond region Z1 is located on one side in the longitudinal direction (lower side in the figure) of the integrated circuit element 3.

上記構成の受光装置によれば、上記第１の導電部材１Ｂは、上記ボンド領域Ｚ１を有するので、受光素子４で受光した信号を、ボンド領域Ｚ１を介して、集積回路素子３に伝えることができる。なお、上記ボンド領域Ｚ１を複数設けてもよく、ワイヤーボンドのレイアウトの制約を受け難くなる。   According to the light receiving device having the above configuration, since the first conductive member 1B has the bond region Z1, a signal received by the light receiving element 4 can be transmitted to the integrated circuit element 3 through the bond region Z1. it can. Note that a plurality of the bond regions Z1 may be provided, and the wire bond layout is not easily restricted.

（第４の実施形態）
図９Ａと図９Ｂは、この発明の受光装置の第４の実施形態を示している。上記第１の実施形態と相違する点を説明すると、この第４の実施形態では、第１の導電部材の構成が相違する。なお、この第４の実施形態において、上記第１の実施形態と同一の符号は、上記第１の実施形態と同じ構成であるため、その説明を省略する。 (Fourth embodiment)
9A and 9B show a fourth embodiment of the light-receiving device of the present invention. The difference from the first embodiment will be described. In the fourth embodiment, the configuration of the first conductive member is different. In the fourth embodiment, the same reference numerals as those in the first embodiment are the same as those in the first embodiment, and the description thereof is omitted.

図９Ａと図９Ｂに示すように、第１の導電部材１Ｃは、集積回路素子３に接続されたワイヤー６と受光素子４に接続されたワイヤー６とを導通するワイヤーボンドが設けられるボンド領域Ｚ２を有する。   As shown in FIGS. 9A and 9B, the first conductive member 1C includes a bond region Z2 in which a wire bond that conducts the wire 6 connected to the integrated circuit element 3 and the wire 6 connected to the light receiving element 4 is provided. Have

図１０に、上記第１の導電部材１Ｃに上記第２の導電部材２Ｃを組み付ける前の状態を示す。図１０に示すように、第１の導電部材１Ｃと第２の導電部材２Ｃとは、別体である。そして、第１の導電部材１Ｃの長手方向の長さにおいて、集積回路素子３よりも長手方向一方側（図中下側）の長さは、集積回路素子３よりも長手方向他方側（図中上側）の長さよりも、長い。上記ボンド領域Ｚ２は、集積回路素子３よりも長手方向他方側（図中上側）に位置する。   FIG. 10 shows a state before the second conductive member 2C is assembled to the first conductive member 1C. As shown in FIG. 10, the first conductive member 1C and the second conductive member 2C are separate bodies. And, in the length in the longitudinal direction of the first conductive member 1C, the length on one side in the longitudinal direction (lower side in the figure) from the integrated circuit element 3 is the other side in the longitudinal direction from the integrated circuit element 3 (in the figure). It is longer than the length of the upper side. The bond region Z2 is located on the other side in the longitudinal direction (upper side in the drawing) of the integrated circuit element 3.

上記構成の受光装置によれば、上記第１の導電部材１Ｃは、上記ボンド領域Ｚ２を有するので、受光素子４で受光した信号を、ボンド領域Ｚ２を介して、集積回路素子３に伝えることができる。なお、上記ボンド領域Ｚ２を複数設けてもよく、ワイヤーボンドのレイアウトの制約を受け難くなる。   According to the light receiving device having the above configuration, since the first conductive member 1C has the bond region Z2, the signal received by the light receiving element 4 can be transmitted to the integrated circuit element 3 through the bond region Z2. it can. Note that a plurality of the bond regions Z2 may be provided, and the wire bond layout is not easily restricted.

（第５の実施形態）
図１１は、この発明の受光装置の第５の実施形態を示している。上記第１の実施形態と相違する点を説明すると、この第５の実施形態では、第１の導電部材および第２の導電部材の構成が相違する。なお、この第５の実施形態において、上記第１の実施形態と同一の符号は、上記第１の実施形態と同じ構成であるため、その説明を省略する。 (Fifth embodiment)
FIG. 11 shows a fifth embodiment of the light-receiving device of the present invention. The difference from the first embodiment will be described. In the fifth embodiment, the configurations of the first conductive member and the second conductive member are different. In the fifth embodiment, the same reference numerals as those in the first embodiment are the same as those in the first embodiment, and the description thereof is omitted.

図１１に示すように、第１の導電部材１Ｄは、嵌合部１３Ｄを有し、第２の導電部材２Ｄは、上記第１の導電部材１Ｄの上記嵌合部１３Ｄに嵌合される被嵌合部２３Ｄを有する。第１の導電部材１Ｄおよび第２の導電部材２Ｄは、上記第１の実施形態に示すように別体であってもよく、または、上記第２の実施形態に示すように一体であってもよい。   As shown in FIG. 11, the first conductive member 1D has a fitting portion 13D, and the second conductive member 2D is fitted to the fitting portion 13D of the first conductive member 1D. It has a fitting part 23D. The first conductive member 1D and the second conductive member 2D may be separate as shown in the first embodiment, or may be integrated as shown in the second embodiment. Good.

上記第１の導電部材１Ｄの上記嵌合部１３Ｄは、凹部であり、上記第２の導電部材２Ｄの上記被嵌合部２３Ｄは、凸部である。したがって、嵌合部１３Ｄおよび被嵌合部２３Ｄを簡単な構成にできる。   The fitting portion 13D of the first conductive member 1D is a concave portion, and the fitted portion 23D of the second conductive member 2D is a convex portion. Therefore, the fitting portion 13D and the fitted portion 23D can be configured simply.

上記第１の導電部材１Ｄの上記嵌合部１３Ｄと、上記第２の導電部材２Ｄの上記被嵌合部２３Ｄとは、導電性接着剤によって、接着されている。したがって、第１の導電部材１Ｄの電位と第２の導電部材２Ｄの電位とを一層共通化できる。このため、一層シールド効果を得ることができて、耐ノイズ性を一層向上できる。   The fitting portion 13D of the first conductive member 1D and the fitted portion 23D of the second conductive member 2D are bonded by a conductive adhesive. Therefore, the potential of the first conductive member 1D and the potential of the second conductive member 2D can be made more common. For this reason, a further shielding effect can be obtained and noise resistance can be further improved.

上記導電性接着剤は、速硬化型の接着剤であることが好ましく、接着剤の硬化時間を短縮でき、生産効率を上げることができる。また、速硬化の性能を考慮して、ワイヤーボンドを行う際のヒーターブロックの温度およびワイヤーボンド時間で接着硬化できるようにすれば、さらに、効率が向上する。   The conductive adhesive is preferably a fast-curing adhesive, can shorten the curing time of the adhesive, and can increase production efficiency. Further, in consideration of fast curing performance, the efficiency can be further improved if the adhesive block can be cured by the temperature of the heater block and the wire bonding time when wire bonding is performed.

上記構成の受光装置によれば、上記第１の導電部材１Ｄの上記嵌合部１３Ｄと、上記第２の導電部材２Ｄの上記被嵌合部２３Ｄとは、嵌合するので、第１の導電部材１Ｄと第２の導電部材２Ｄとの嵌合性が向上し、第１の導電部材１Ｄと第２の導電部材２Ｄとの位置決めが容易になる。また、第２の導電部材２Ｄを集積回路素子３を覆うように配置するとき、第２の導電部材２Ｄを集積回路素子３やワイヤー６に当接することなく配置できる。   According to the light receiving device having the above configuration, since the fitting portion 13D of the first conductive member 1D and the fitted portion 23D of the second conductive member 2D are fitted, the first conductive The fitting property between the member 1D and the second conductive member 2D is improved, and the positioning of the first conductive member 1D and the second conductive member 2D is facilitated. Further, when the second conductive member 2 </ b> D is disposed so as to cover the integrated circuit element 3, the second conductive member 2 </ b> D can be disposed without contacting the integrated circuit element 3 or the wire 6.

なお、上記第１の導電部材１Ｄの上記被嵌合部２３Ｄを、貫通穴としてもよく、貫通穴の一方側の開口から第２の導電部材２Ｄの嵌合部１３Ｄを導入し、貫通穴の他方側の開口から接着剤を導入することができ、接着剤の導入が容易になる。   The fitted portion 23D of the first conductive member 1D may be a through hole, and the fitting portion 13D of the second conductive member 2D is introduced from the opening on one side of the through hole to The adhesive can be introduced from the opening on the other side, and the introduction of the adhesive becomes easy.

なお、この発明は上述の実施形態に限定されない。例えば、上記第１から上記第５の実施形態のそれぞれの特徴点を様々に組み合わせてもよい。また、この発明の受光装置としては、赤外線以外の波長の光を受光する受光装置であってもよい。また、上記第１、上記第２の導電部材は、リードフレームでなく、基板であってもよく、この場合、基板は、配線部材などによって、導電性を有するものとする。   In addition, this invention is not limited to the above-mentioned embodiment. For example, the feature points of the first to fifth embodiments may be variously combined. The light receiving device of the present invention may be a light receiving device that receives light of a wavelength other than infrared rays. Further, the first and second conductive members may be substrates instead of lead frames. In this case, the substrate is made conductive by a wiring member or the like.

また、上記第１の導電部材の上記一面と上記第２の導電部材の上記一面とを、平行でなく、交差するように配置してもよい。また、上記受光素子と上記集積回路素子とを、上記第１の導電部材に直交する方向からみて、重ならないように、配置してもよい。   Further, the one surface of the first conductive member and the one surface of the second conductive member may be arranged so as to intersect with each other instead of being parallel. Further, the light receiving element and the integrated circuit element may be arranged so as not to overlap each other when viewed from a direction orthogonal to the first conductive member.

また、上記複数のボンド領域を、上記第１の導電部材における集積回路素子の上下左右何れの位置に、設けてもよい。また、上記第１の導電部材の嵌合部を凸部とし、上記第２の導電部材の被嵌合部を凹部としてもよい。   In addition, the plurality of bond regions may be provided at any position on the integrated circuit element in the first conductive member. The fitting portion of the first conductive member may be a convex portion, and the fitted portion of the second conductive member may be a concave portion.

また、上記集積回路素子と上記受光素子とを別の樹脂で封止するようにしてもよい。例えば、集積回路素子を第１樹脂で一次封止したあとに、この第１樹脂と受光素子とを第２樹脂で二次封止するようにしてもよい。   The integrated circuit element and the light receiving element may be sealed with different resins. For example, after the integrated circuit element is primarily sealed with a first resin, the first resin and the light receiving element may be secondarily sealed with a second resin.

また、上記第１から上記第５の実施形態の何れの受光装置を電子機器に搭載してもよい。この場合、この電子機器は、実装エリアの小さい小型の受光装置を有することになるため、電子機器の設計の自由度を広げることができる。このように、昨今の市場動向にあるような電子機器のデザイン優先や小型化等で部品の実装エリアが限られてくる市場において、ニーズにあった受光装置を提供できる。   Any of the light receiving devices of the first to fifth embodiments may be mounted on an electronic device. In this case, since the electronic device has a small light receiving device with a small mounting area, the degree of freedom in designing the electronic device can be expanded. As described above, in a market where the mounting area of parts is limited due to the design priority or miniaturization of electronic devices as in the recent market trend, it is possible to provide a light receiving device that meets the needs.

１，１Ａ，１Ｂ，１Ｃ，１Ｄ 第１の導電部材
１ａ 一面
１３Ｄ 嵌合部
２，２Ａ，２Ｂ，２Ｃ，２Ｄ 第２の導電部材
２ａ 一面
２ｂ 他面
２０，２０Ａ，２０Ｄ 足部
２１，２１Ａ 切れ目
２２Ａ 連結部
２３Ｄ 被嵌合部
３ 集積回路素子
４ 受光素子
５ 透光性樹脂
６ ワイヤー
Ｚ１，Ｚ２ ボンド領域 1, 1A, 1B, 1C, 1D First conductive member 1a One side 13D Fitting portion 2, 2A, 2B, 2C, 2D Second conductive member 2a One side 2b Other side 20, 20A, 20D Foot 21, 21A Cut 22A Connecting part 23D Mated part 3 Integrated circuit element 4 Light receiving element 5 Translucent resin 6 Wire Z1, Z2 Bond area

Claims (13)

リードフレームまたは基板からなる第１の導電部材と、
この第１の導電部材の一面に配置された集積回路素子と、
リードフレームまたは基板からなる第２の導電部材と、
この第２の導電部材の一面に配置された受光素子と
を備え、
上記第１の導電部材と上記第２の導電部材とは、電気的に接続され、
上記第２の導電部材は、上記第２の導電部材の他面が上記第１の導電部材の上記一面および上記集積回路素子に対向するように、配置されていることを特徴とする受光装置。 A first conductive member made of a lead frame or a substrate;
An integrated circuit element disposed on one surface of the first conductive member;
A second conductive member made of a lead frame or a substrate;
A light receiving element disposed on one surface of the second conductive member,
The first conductive member and the second conductive member are electrically connected,
The light receiving device, wherein the second conductive member is disposed so that the other surface of the second conductive member faces the one surface of the first conductive member and the integrated circuit element. 請求項１に記載の受光装置において、
上記第１の導電部材の上記一面と上記第２の導電部材の上記一面とは、平行であり、
上記受光素子と上記集積回路素子とは、上記第１の導電部材および上記第２の導電部材に直交する方向からみて、重なることを特徴とする受光装置。 The light receiving device according to claim 1,
The one surface of the first conductive member and the one surface of the second conductive member are parallel to each other,
The light receiving device, wherein the light receiving element and the integrated circuit element overlap each other when viewed from a direction orthogonal to the first conductive member and the second conductive member. 請求項１または２に記載の受光装置において、
上記第１の導電部材と上記第２の導電部材とは、別体であることを特徴とする受光装置。 The light receiving device according to claim 1 or 2,
The light receiving device, wherein the first conductive member and the second conductive member are separate bodies. 請求項１または２に記載の受光装置において、
上記第１の導電部材と上記第２の導電部材とは、一体であることを特徴とする受光装置。 The light receiving device according to claim 1 or 2,
The light receiving device, wherein the first conductive member and the second conductive member are integrated. 請求項１から４の何れか一つに記載の受光装置において、
上記第１の導電部材は、上記集積回路素子に接続されたワイヤーと上記受光素子に接続されたワイヤーとを導通するワイヤーボンドが設けられるボンド領域を有することを特徴とする受光装置。 The light receiving device according to any one of claims 1 to 4,
The light-receiving device, wherein the first conductive member has a bond region in which a wire bond that conducts a wire connected to the integrated circuit element and a wire connected to the light-receiving element is provided. 請求項５に記載の受光装置において、
上記ボンド領域は、複数あることを特徴とする受光装置。 The light receiving device according to claim 5,
A light receiving device having a plurality of the bond regions. 請求項１から６の何れか一つに記載の受光装置において、
上記第１の導電部材は、嵌合部を有し、
上記第２の導電部材は、上記第１の導電部材の上記嵌合部に嵌合される被嵌合部を有することを特徴とする受光装置。 The light receiving device according to any one of claims 1 to 6,
The first conductive member has a fitting portion,
The light receiving device, wherein the second conductive member has a fitted portion fitted to the fitting portion of the first conductive member. 請求項７に記載の受光装置において、
上記第１の導電部材の上記嵌合部は、凹部であり、
上記第２の導電部材の上記被嵌合部は、凸部であることを特徴とする受光装置。 The light receiving device according to claim 7,
The fitting portion of the first conductive member is a recess,
The light receiving device, wherein the fitted portion of the second conductive member is a convex portion. 請求項８に記載の受光装置において、
上記第１の導電部材の上記被嵌合部は、貫通穴であることを特徴とする受光装置。 The light receiving device according to claim 8,
The light receiving device, wherein the fitted portion of the first conductive member is a through hole. 請求項８または９に記載の受光装置において、
上記第１の導電部材の上記嵌合部と、上記第２の導電部材の上記被嵌合部とは、導電性接着剤によって、接着されていることを特徴とする受光装置。 The light-receiving device according to claim 8 or 9,
The light receiving device, wherein the fitting portion of the first conductive member and the fitted portion of the second conductive member are bonded by a conductive adhesive. 請求項１０に記載の受光装置において、
上記導電性接着剤は、速硬化型の接着剤であることを特徴とする受光装置。 The light receiving device according to claim 10,
The light-receiving device, wherein the conductive adhesive is a fast-curing adhesive. 請求項１から１１の何れか一つに記載の受光装置において、
上記受光素子は、赤外線の信号を受光し、
上記集積回路素子は、上記受光素子が受光した赤外線の信号を増幅する高増幅率増幅器を有することを特徴とする受光装置。 The light receiving device according to any one of claims 1 to 11,
The light receiving element receives an infrared signal,
The light receiving device, wherein the integrated circuit element includes a high gain amplifier for amplifying an infrared signal received by the light receiving element. 請求項１から１２の何れか一つに記載の受光装置を備えることを特徴とする電子機器。   An electronic apparatus comprising the light receiving device according to any one of claims 1 to 12.
JP2010240337A 2010-10-27 2010-10-27 Light-receiving device and electronic apparatus Pending JP2012094668A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9648734B2 (en) 2013-03-13 2017-05-09 Taiwan Semiconductor Manufacturing Company, Ltd. Wafers, panels, semiconductor devices, and glass treatment methods

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9648734B2 (en) 2013-03-13 2017-05-09 Taiwan Semiconductor Manufacturing Company, Ltd. Wafers, panels, semiconductor devices, and glass treatment methods

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