JPH10581A - Work carrier robot - Google Patents

Abstract

PROBLEM TO BE SOLVED: To shorten the time required by eliminating useless motion of an arm at the time of changing a work. SOLUTION: First and second arms 2, 3 rotationally driven around a common shaft within flat surfaces parallel with each other by driving sources different from each other are provided, work support bases 5 are connected to other end parts of a pair of driven arms 2d, 3d one ends of which are respectively connected to one head end parts of both of the arms 2, 3 free to rotate, a work support base 6 is connected to the other end parts of a pair of driven arms 2e, 3e one ends of which are respectively connected to the other head end parts of both arms 3 free to rotate, and the driven arms 2d, 3d, 2e, 3e are respectively connected to the first and second arms 2, 3 so that both of the work support bases 5, 6 are arranged on the same side to each other with the shaft as their standard.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a work transfer robot, and more particularly, to a work transfer robot which is incorporated in a semiconductor device manufacturing system to transfer a semiconductor wafer to a desired process chamber for manufacturing a semiconductor device and to take in and out the semiconductor wafer. The present invention relates to a work transfer robot suitable for performing the work.

[0002]

2. Description of the Related Art A work transfer robot which incorporates a work transfer robot into a system for manufacturing a semiconductor device, transfers a semiconductor wafer to a process chamber for manufacturing a desired semiconductor device, and moves a semiconductor wafer in and out. (See Japanese Patent Publication No. 7-73833 and Japanese Patent Publication No. 7-504128).

[0003] The work transfer robot described in Japanese Patent Publication No. 7-73333 has a pair of joint linkages arranged at positions deviated from each other by 180 °, and has a drive source for operating each joint linkage. And a drive source for rotating both joint linkages in the same direction. Therefore, the joint linkages can be extended and contracted independently of each other, and both joint linkages can be rotated in the same direction, so that the semiconductor wafer can be transported to a desired semiconductor device manufacturing process chamber, and the semiconductor wafer can be moved in and out. It can be carried out.

[0004] The work transfer robot described in Japanese Patent Publication No. 7-504128 has a drive source for arranging a pair of joint linkages at positions shifted from each other by 180 ° and operating the respective joint linkages. Along with
It has a drive source for rotating both joint linkages in the same direction. Therefore, the joint linkages can be extended and contracted independently of each other, and both joint linkages can be rotated in the same direction, so that the semiconductor wafer can be transported to a desired semiconductor device manufacturing process chamber, and the semiconductor wafer can be moved in and out. It can be carried out.

[0005]

In any of the above-mentioned work transfer robots, the joint linkages are 180 ° relative to each other.
Since the semiconductor wafers are arranged at shifted positions, in exchanging the semiconductor wafers for any of the semiconductor device manufacturing process chambers, the semiconductor joint is taken out by expanding and contracting one of the joint linkages. A series of processes for inserting a semiconductor wafer by rotating both joint linkages by 180 ° and expanding and contracting the other joint linkage must be performed. As a result, the time required to rotate the joints by 180 ° is wasted time, and the processing speed of the entire semiconductor manufacturing system cannot be increased significantly.

Here, in a semiconductor device manufacturing system, generally, 4 to 5 process chambers for manufacturing a semiconductor device are provided, and an average of about eight times in and out of one semiconductor wafer. Since the processing time for one semiconductor wafer is about 1 to 3 minutes, and one semiconductor wafer is processed in 2 to 4 semiconductor device manufacturing process chambers, Would be a significant waste of time for the whole.

Further, when the corresponding joint linkage is expanded and contracted before and after rotating the both joint linkage by 180 °, an isolation gate valve for isolating the corresponding semiconductor device manufacturing process chamber from the work transfer robot installation space is provided. I have to open it
As a whole, the time during which the isolation gate valve is not closed is prolonged, and the cleanliness of the work transfer robot installation space is reduced, and the desired cleanliness may not be achieved. Since the degree of cleanness affects the process chamber for manufacturing semiconductor devices, it cannot be neglected in manufacturing semiconductor devices.

FIG. 17 is a diagram schematically showing a procedure for taking in and out a semiconductor wafer by a conventional work transfer robot, and FIG. 18 is a flowchart. As is apparent from these figures and flowcharts, the process waits for the processing of the semiconductor wafer A to be completed, then opens the isolation gate valve of the process chamber for manufacturing the semiconductor device, takes out the semiconductor wafer A, and closes the isolation gate valve. . And the joint of both joints is 180 °
After rotation, the isolation gate valve of the process chamber for manufacturing a semiconductor device is opened, the semiconductor wafer B is loaded, and the gate valve is closed.

Therefore, the occurrence of the above-mentioned inconvenience can be understood. The case where the present invention is applied to a semiconductor device manufacturing system has been described above. However, in other systems,
Similar inconveniences occur when the present invention is applied to a system that needs to take in and out a work.

[0010]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and has no complicated structure, and has no need to rotate a joint linkage when a workpiece is moved in and out. It is an object of the present invention to provide a work transfer robot capable of shortening the required time and maintaining a high degree of cleanliness in a work transfer robot installation space when applied to a semiconductor device manufacturing system.

[0011]

According to a first aspect of the present invention, there is provided a workpiece transfer robot which is driven to rotate about a common axis in planes parallel to each other by different drive sources.
A work support is connected to the other end of a pair of driven arms, one end of which is rotatably connected to one end of both arms, and the other end of both arms is connected to the other end of the arm. A work support is connected to the other end of a pair of driven arms each having one end rotatably connected, and both work supports are driven to be disposed on the same side with respect to the axis. Arms are respectively connected to the first and second arms.

According to a second aspect of the present invention, there is provided a workpiece transfer robot having at least one of the first and second arms having arm portions extending in opposite directions with respect to a center of rotation, and both arm portions are different from each other. It is configured to rotate on a plane. In the work transfer robot according to claim 3, the driven arm includes:
The first and second arms are connected to both arms so as to rotate on a plane that does not interfere with the drive shafts of the first and second arms.

According to another aspect of the present invention, a plurality of process chambers for manufacturing a semiconductor device are provided corresponding to a predetermined rotational position of the work support around the axis. When the first and second arms are turned in the same direction and at an equal angle to each other in order to face the semiconductor device manufacturing process chamber, the semiconductor wafer is exchanged with the semiconductor device manufacturing process chamber. The first and second
Control means for controlling the drive source to rotate the arms in opposite directions.

[0014]

According to a first aspect of the present invention, there is provided a workpiece transfer robot having first and second arms that are driven to rotate about a common axis in planes parallel to each other by different drive sources. A pair of driven arms, one end of which is rotatably connected to the tip end, is connected to the other end of the driven arm, and the other end of both arms is rotatably connected, one end of each of which is connected. A work support is connected to the other end of the driven arm, and the driven arms are respectively connected to the first and second arms so that both work supports are disposed on the same side with respect to the axis. Because they are connected, by rotating both arms in the opposite direction,
One of the work supports can be moved in a direction away from the axis, and the other work support can be moved in the opposite direction. Of course, by rotating both arms in the same direction, the work support can be rotated to a desired rotation position. As a result, both arms are set at 180 °
It is not necessary to perform a useless operation such as rotation, and the replacement of the work can be achieved in a short time.

According to a second aspect of the present invention, there is provided a workpiece transfer robot.
At least one of the first and second arms has an arm portion extending in a direction opposite to each other with respect to a center of rotation, and both arm portions are configured to rotate on mutually different planes. , The arms can be operated without interfering with each other.

According to a third aspect of the present invention, there is provided a workpiece transfer robot.
As the driven arm, an arm that is connected to both arms so as to rotate on a plane that does not interfere with the drive shafts of the first and second arms is employed. The work support can be moved within the maximum movement range determined based on the operation range of the arm.

According to a fourth aspect of the present invention, there is provided a workpiece transfer robot.
A plurality of semiconductor device manufacturing process chambers are provided corresponding to predetermined rotation positions of the work support around the axis, and one of the work supports is directly connected to any of the semiconductor device manufacture process chambers. When the first and second arms are rotated in the same direction and at the same angle with each other, the first and second arms are replaced with each other when the semiconductor wafer is exchanged with the semiconductor device manufacturing process chamber. Since there is control means for controlling the drive source to rotate the arms in directions opposite to each other, the control means rotates the first arm and the second arm in directions opposite to each other, thereby supporting one of the workpieces. The table can be advanced in the radial direction, and the other work support table can be replaced in the radial direction. Of course, by rotating both arms in the same direction by the control means, both work supports can be rotated to a desired rotation position. As a result, it is not necessary to perform a useless operation of rotating both arms by 180 °, and the exchange of the work can be achieved in a short time. Also,
When the isolation gate valve of the process chamber for manufacturing a semiconductor device is opened once, the semiconductor wafer can be moved in and out, so that the isolation gate valve is opened and closed before and after rotating all the arms by 180 °. In comparison, the time during which the isolation gate valve is not closed can be reduced, impurity particles flowing out of the process chamber for manufacturing a semiconductor device can be reduced, and a high degree of cleanness can be achieved.

[0018]

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a perspective view schematically showing a main part of a work transfer robot of the present invention, FIG. 2 is a longitudinal sectional view at the center, FIG. 3 is a sectional view taken along line III-III of FIG. 2, FIG. FIG. 4 is a longitudinal sectional view showing a mechanism for moving a work transfer robot up and down. FIG. 4 shows a state in which both work supports are vertically opposed.

In this work transfer robot, the first and second arms 2 and 3 can be independently rotated by the rotary shaft unit 1 having a concentric two-axis configuration. In addition, the rotating shaft unit 1 and each arm may be directly connected. However, when the rotating shaft unit 1 is used for an application requiring high cleanliness, for example, as shown in JP-A-6-241237, It is preferable that the rotating shaft unit 1 and each arm are connected by a magnetic coupler through the vacuum vessel wall.

Each rotating shaft 1 of the rotating shaft unit 1
a and 1b are connected to reduction gears 2b and 3b provided on arm rotation motors 2a and 3a by belts 2c and 3c. Of course, the arm rotation motors 2a,
The rotation direction and rotation speed of 3a are controlled by a control unit (not shown). The base of the driven arm 2 d is rotatably connected to the upper surface of the one end of the first arm 2, and the base of the driven arm 3 d is rotatably connected to the upper surface of the one end of the second arm 3. I have. A first work support 5 is provided at the distal end of each of the driven arms 2d and 3d. Here, the driven arms 2d and 3d are rotatably connected to the first work support 5 and the tips of the driven arms are engaged with the gears in the first work support 5 (see FIG. 6), or The first work support base 5 is always connected in parallel to the radial direction about the rotation axis by being connected by a belt crossing (see FIG. 7).

The base of the driven arm 2e is rotatably connected to the lower surface of the other end of the first arm 2 and the driven arm 3e is the lower surface of the other end of the second arm 3.
Are rotatably connected. A second work support 6 is provided at the distal ends of the driven arms 2e and 3e. Here, the driven arms 2e and 3e are rotatably connected to the second work support 6, and the tips of the driven arms are engaged with the gears in the first work support 5 or the belt is crossed. And always connected to the first
The work support 5 can maintain a posture parallel to the radial direction about the rotation axis.

The first arm 2 has arm portions 21 and 22 extending in opposite directions from each other with the connecting portion 20 for the rotation shaft 1a as a boundary.
Are formed stepwise and parallel to each other.
Further, the second arm 3 is connected to the connecting portion 30 with respect to the rotation shaft 1b.
Parts 31 and 3 extending in opposite directions to each other
2, and the two arm portions 31, 32 are formed parallel to each other (the two arm portions 31, 32 may be different from each other, but need not be different). The arm portion 21 is located above the second arm 3, and the arm portion 22 is located below the second arm 3. Therefore, the two arms 2 and 3 can rotate in opposite directions within a sufficiently large angle range without interfering with each other.

Further, all the driven arms are formed in the shape of "", but there is no inconvenience even if they are linear.
The rotating shaft unit 1 and the arm rotating motors 2a and 3
a, the reduction gears 2b, 3b are housed in a casing 8 mounted in a hanging state on a robot mounting base 7 so as to be able to move up and down by a guide rail 9, and a linear motor 8a provided at a predetermined position of the casing 8. Is engaged with a ball screw nut 8d provided at a predetermined position of the arm rotation motor support substrate 8c. Therefore, by operating the linear motor 8a, the rotating shaft unit 1, the arm rotating motors 2a, 3
a, The reduction gears 2b and 3b can be raised and lowered. Of course, it is preferable that the upper surface plate 8e of the casing 8 and the rotary shaft unit 1 are hermetically engaged.

FIG. 8 shows both arms 2 and 3 and driven arms 2d and 2d.
FIG. 9 is a plan view schematically showing the relationship between 3d, 2e, 3e and the two work supports 5, 6, and FIG. 9 shows an angle (clockwise) formed by the second arm 3 with respect to a plane connecting the rotation center axis and the center of the work support. Work support bases 5 and 6 with respect to the change in the angle θ)
FIG. 7 is a diagram showing a change in a distance R (mm) between a base portion of the first embodiment and a rotation center axis. FIG. 9 corresponds to a case where the length of each arm portion of the first and second arms 2 and 3 is set to 315 mm, and the length of each driven arm is set to 285 mm. The unit of the vertical axis is mm, and the unit of the horizontal axis is °. A indicates the first work support 5 and B indicates the second work support 6, respectively.

As is apparent from FIG. 9, when θ is set to 90 °, both the work supports 5 and 6 approach the rotation center axis and face up and down. The rotary shaft unit 1, the arm rotation motors 2a and 3a, and the reduction gears 2b and 3b are housed in a casing 8 mounted in a hanging state on a robot mounting base 7 by a guide rail 9 so as to be able to move up and down. A ball screw 8b rotated by a translation motor 8a provided at a predetermined position 8 is engaged with a ball screw nut 8d provided at a predetermined position on the arm rotation motor support substrate 8c. Therefore, the rotation shaft unit 1, the arm rotation motors 2a and 3a, and the reduction gears 2b and 3b can be moved up and down by operating the linear motor 8a. Of course, it is preferable that the upper surface plate 8e of the casing 8 and the rotary shaft unit 1 are hermetically engaged.

FIG. 10 is a plan view schematically showing the configuration of a semiconductor device manufacturing system incorporating the work transfer robot having the above-described configuration. This system comprises four semiconductor device manufacturing process chambers 11a, 11b, 11c, 11d around a central chamber 11, the inside of which is maintained in a vacuum.
And a carry-in section 11e for carrying in the semiconductor wafer and a carry-out section 11f for carrying out the semiconductor wafer. Note that an isolation gate valve is provided in each of the semiconductor device manufacturing process chamber, the loading section, and the unloading section.

The operation of the semiconductor device manufacturing system having the above configuration will be described with reference to the operation explanatory diagram of FIG. 11 and the flowchart of FIG. In steps SP1 and SP2, the semiconductor device manufacturing process chamber 11b is held in a state where the semiconductor wafer is supported on the second work support table 6.
Wait until the processing in is completed. In this state, the first and second arms 2 and 3 are both rotated so as to be substantially perpendicular to a plane connecting the rotation center axis and the center of the work support, and the first and second work supports are provided. The work supports 5 and 6 are vertically opposed (see FIG. 11A) while the work supports 5 and 6 both approach the rotary shaft unit 1 to some extent.

Process chamber 11b for manufacturing a semiconductor device
Is completed, the isolation gate valve is opened without operating the work transfer robot in step SP3 (see (B) in FIG. 11). Next, in step SP4, the first and second arms 2, 3
Are rotated in a direction approaching a plane connecting the rotation center axis and the center of the work support, thereby causing the first work support 5 to enter the process chamber 11b for manufacturing a semiconductor device and operating the linear motor 8a. As a result, both the work support tables 5 and 6 are raised together with the rotary shaft unit 1 to support the processed semiconductor wafer on the work support table 5. By the above operation of the first and second arms 2 and 3,
The second work support 6 is moved in a direction approaching the rotation center axis (see FIG. 11C). After the processed semiconductor wafer is supported on the first work support table 5,
The first and second arms 2 and 3 are rotated in the opposite directions to move the first work support 5 backward, and the two work supports 5 and 6 are vertically opposed {(D) in FIG. reference}.

Next, in step SP5, the second work supporting table 6 enters the semiconductor device manufacturing process chamber 11b by rotating the second and third arms 3 and 4 in the rotation direction opposite to the rotation direction of step SP4. By operating the linear motion motor 8a, both the work support tables 5 and 6 are lowered together with the rotary shaft unit 1, and the semiconductor wafer to be processed is processed in the semiconductor device manufacturing process chamber 1.
1b. The first work support 5 is moved in a direction approaching the rotation center axis by the above-described operation of the first and second arms 2 and 3 (see FIG. 11E). And
After supplying the processed semiconductor wafer to the semiconductor device manufacturing process chamber 11b, the first and second arms 2, 3
Is rotated in the opposite direction to the above, so that the second work support table 6 is retracted, and both work support tables 5 and 6 are vertically opposed (see (F) in FIG. 11).

Then, in step SP6, the isolation gate valve is closed without operating the work transfer robot (see (G) in FIG. 11). After that, by rotating the first and second arms by the same angle in the same direction to each other, the two work supports 5, 6 are directly opposed to the other semiconductor device manufacturing process chamber, and the same processing as described above is performed. The replacement of the semiconductor wafer can be performed.

As is clear from the above description, since the two work supports 5 and 6 are located on the same side with respect to the rotary shaft unit 1, the semiconductor wafer is inserted into the process chamber for manufacturing a semiconductor device. In the replacement, the operation of rotating the work support by 180 ° is not required, and the semiconductor wafer can be supplied immediately after the semiconductor wafer is taken out, so that the overall processing time can be reduced. Further, since the number of times of opening and closing the isolation gate valve can be halved as compared with the conventional apparatus, the time during which the isolation gate valve is not closed can be shortened. Impurity particles coming out of the chamber through the isolation gate valve can be reduced, and high cleanliness can be maintained. Of course, the first and second arms 2 and 3 are driven by the motor.
Is driven, it is possible to prevent the configuration from becoming complicated.

FIG. 13 is a longitudinal sectional view showing another embodiment of the work transfer robot of the present invention. This embodiment differs from the above-described embodiment in that both arm portions 21 and 22 of the first arm 2 are not stepped but extend in opposite directions on the same plane. A point that is disposed above the second arm 3, a point that one end of the second arm 3 extends in parallel with the rotation axis, and the driven arm 3 d is rotatably connected above the first arm 2, Followed arm 3 on the lower surface of the other end of two arm 3
e is rotatably connected.

Therefore, when this embodiment is adopted, the structure of the first arm 2 can be simplified, and the connection structure between the arms 2 and 3 and the rotary shaft unit 1 can be simplified. Can be. And the same effect as the above embodiment can be achieved. In any of the above embodiments, if the lengths of the two arms 2 and 3 and the lengths of the driven arms 2d, 3d, 2e and 3e are set as described above, the bases of the work supports 5 and 6 and the rotation center A region where the distance from the axis becomes negative occurs. Here, in a region where the distance is smaller than the radius of the rotary shaft unit 1 (including a negative region), any work support collides with the rotary shaft unit 1 and cannot move any further. Since it is a region, it is preferable to prevent such a region from occurring by setting the lengths of the driven arms 2d, 3d, 2e, and 3e long, for example.

FIG. 14 is a longitudinal sectional view showing still another embodiment of the work transfer robot of the present invention. This embodiment is different from the embodiment of FIG. 2 in that one end of the second arm 3 is extended in parallel with the rotation axis and is located above the rotation axis unit 1 (more precisely, from the rotation axis unit 1). (The upper part and the side part), the other end of the first arm 2 is extended in parallel with the rotation axis, and the driven arm 2 e is rotated above the second arm 3. It is the only point that is freely connected.

Therefore, when this embodiment is adopted, the two work supporting tables 5 and 6 are configured so as not to collide with the rotary shaft unit 1 at all, so that the lengths of the two arms 2 and 3 and the driven arm The lengths of 2d, 3d, 2e, 3e can be set arbitrarily, and both work supports 5, 6 are moved in the entire range determined by both arms 2, 3 and driven arms 2d, 3d, 2e, 3e. be able to.

FIG. 15 is a longitudinal sectional view showing still another embodiment of the work transfer robot of the present invention, and FIG. 16 is a plan view showing the structure of the second arm 3. In this embodiment, the arm portion 31 of the second arm 3 is directly connected to the connecting portion 30.
And the arm portion 32 is connected to the base of the arm portion 31 via an arc-shaped portion 33 centered on the connecting portion 30. The first arm 2 has a vertical portion in which one arm portion can pass through a gap between the connecting portion 30 and the arc-shaped portion 33, and one arm portion has a lower portion under the second arm 3.
The other arm portion is configured to rotate above the second arm 3.

Therefore, the two arms 2 and 3 have a sufficiently large angle range without interference with each other (an angle range larger than 180 ° and smaller than 360 °, more preferably larger than 270 °). (In an angle range smaller than 360 °). As a result, the same operation as in the embodiment of FIG. 2 can be achieved.

Although only the case where the present invention is applied to a semiconductor device manufacturing system has been described above, the present invention is similarly applied to a device which needs to exchange a work for one processing unit. Can be
It is possible to reduce the time required for work replacement.

[0039]

According to the first aspect of the present invention, all the arms are 18
There is no need to perform a useless operation such as rotating by 0 °, and a unique effect is achieved in that the replacement of the work can be achieved in a short time. According to the second aspect of the present invention, the two arms can be operated without interfering with each other, and have the same effect as the first aspect.

According to a third aspect of the present invention, both work supports can be operated without interfering with the drive shaft, and the movement of the work support within a maximum movement range determined based on the operation range of the arm is achieved. Claim 1
Alternatively, an effect similar to that of the second aspect is obtained. According to the fourth aspect of the present invention, it is not necessary to perform a useless operation such as rotating both arms by 180 °, the work can be replaced in a short time, and the isolation of a process chamber for manufacturing a semiconductor device can be achieved. Since the in / out of the semiconductor wafer can be achieved in a state where the gate valve is opened once, the isolation gate valve is more open and closed before and after rotating all the arms by 180 °. It is possible to reduce the time of non-closing, reduce impurity particles flowing out of the semiconductor device manufacturing process chamber,
This has a unique effect that a high degree of cleanliness can be achieved.

[Brief description of the drawings]

FIG. 1 is a perspective view schematically showing a main part of a work transfer robot of the present invention.

FIG. 2 is a central vertical sectional view of the same.

FIG. 3 is a sectional view taken along line III-III of FIG. 2;

FIG. 4 is a plan view of the work transfer robot of the present invention.

FIG. 5 is a vertical sectional view showing a mechanism for moving the work transfer robot up and down.

FIG. 6 is a schematic view showing an example of a connection configuration of a pair of driven arms.

FIG. 7 is a schematic diagram showing another example of a connection configuration of a pair of driven arms.

FIG. 8 is a plan view schematically showing a relationship between both arms, a driven arm, and both work supports.

FIG. 9 is a diagram illustrating a change in the distance between the bases of the two work supports and the rotation center axis with respect to a change in the angle θ formed by the second arm with respect to a plane connecting the rotation center axis and the center of the work support.

FIG. 10 is a plan view schematically showing a configuration of a semiconductor device manufacturing system incorporating a work transfer robot.

FIG. 11 is a diagram illustrating the operation of the work transfer robot.

FIG. 12 is a flowchart illustrating the operation of the work transfer robot.

FIG. 13 is a longitudinal sectional view showing another embodiment of the work transfer robot of the present invention.

FIG. 14 is a longitudinal sectional view showing still another embodiment of the work transfer robot of the present invention.

FIG. 15 is a longitudinal sectional view showing still another embodiment of the work transfer robot of the present invention.

FIG. 16 is a plan view showing a configuration of a second arm.

FIG. 17 is an operation explanatory view of a conventional work transfer robot.

FIG. 18 is a flowchart illustrating an operation of a conventional work transfer robot.

[Explanation of symbols]

2 First arm 3 Second arm 2a, 3a Arm rotation motor 2d, 3d, 3
e, 4e driven arm 5 first work support 6 second work support 11a, 11b, 11c, 11d Process chamber for semiconductor device manufacturing

Claims (4)

[Claims] 1. A first and a second arm (2) and (3) that are driven to rotate about a common axis in planes parallel to each other by different driving sources (2a) and (3a). (2) A pair of driven arms (2d) and (3d) each having one end rotatably connected to one end of (3).
A work support (5) is connected to the other end of the pair of driven arms (2e) and (3e), one end of which is rotatably connected to the other end of both arms (3). A work support (6) is connected to the end, and the driven arms (2d) (3d) are arranged such that the two work supports (5) and (6) are disposed on the same side with respect to the axis. (2e)
(3e) The first and second arms (2) and (3) are respectively connected to the work transfer robot. 2. At least one of the first and second arms (2) and (3) has an arm portion extending in a direction opposite to each other with respect to a center of rotation, and both arm portions have different planes. The work transfer robot according to claim 1, wherein the work transfer robot is configured to rotate above. 3. The driven arm (2d) (3d) (2
e) and (3e) are connected to both arms (2) and (3) so as to rotate on a plane that does not interfere with the drive shafts of the first and second arms (2) and (3). Claim 2
The workpiece transfer robot according to 1. 4. A work support (5) about the axis.
A plurality of semiconductor device manufacturing process chambers (11a) (11b) (11) corresponding to the predetermined rotational position of (6).
c) (11d) is provided, and in order to directly face one of the work supporting tables to one of the process chambers for manufacturing a semiconductor device, the first and second arms (2) and (3) are connected to each other. The first and second arms (2) are rotated in the same direction and by the same angle to exchange a semiconductor wafer with a process chamber for manufacturing a semiconductor device.
Drive source (2a) to rotate (3) in opposite directions
4. The work transfer robot according to claim 1, further comprising control means for controlling (3a).