JPH1058172A - Laser beam machine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laser beam machine in which a function for carrying an irradiated body is provided the irradiation means for emitting a laser beam to the body. SOLUTION: The machine is constituted of a laser generator 10; optical fiber 6 on which a laser beam emitted from the generator 10 is made incident and guided; kaleidoscope 5 on which the laser beam outgoing from the optical fiber 6 is made incident and emitted to form a spot diameter with a uniform energy density of the laser beam; XYZ robot 16 for holding the kaleidoscope 5 so that its end on the outgoing side is freely away from or nearer to an electronic component 15; and a pump 11 which takes in a gas from inside the cylinder of the kaleidoscope as well as supplying the gas into it.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an apparatus for laser processing.

[0002]

2. Description of the Related Art As a prior art, Japanese Patent Laid-Open Publication No.
Will be described. In the prior art, in order to accurately and surely irradiate a laser beam to a processing portion of an object to be irradiated, a wavelength in the visible region is set on the same optical axis as the laser beam in a kaleidoscope having a condenser lens at the tip. This is a laser irradiation device that superimposes the guide light, irradiates the laser light after confirming the irradiation of the processed part.

[0003]

However, since the prior art prior art has a structure for only emitting laser light and guide light, electronic components are mounted on, for example, an electric circuit board (hereinafter, referred to as a board). If the laser irradiation device described above is used as a heat source to melt the solder in the case of soldering, a transfer device for transferring the electronic components to the substrate may be newly installed, or a separate Since electronic components must be temporarily fixed to the board during the process, the overall size and complexity of the device will be increased, and additional equipment and man-hours will be required due to additional processes. There is.

The present invention has been made based on the above circumstances, and an object of the present invention is to provide a laser processing method in which an irradiation means for irradiating a laser beam to an irradiation object has a function of transporting the irradiation object. Device is provided.

[0005]

According to a first aspect of the present invention, there is provided a laser oscillator, a light guide for inputting and guiding a laser beam emitted from the laser oscillator, and a laser beam emitted from the light guide. Incident and emitted so that the energy density of the laser beam has a uniform spot diameter, and a cylindrical irradiating means having an opening at the emitting end of the laser light; Moving means for holding the irradiating means so as to be freely attached to and detached from the body, and suction and inhalation means for inhaling gas inside the cylindrical part of the irradiating means and supplying gas to the cylindrical part; It is characterized by having.

According to the first aspect of the present invention, for example, when an electronic component is soldered in accordance with a pattern on a substrate, the electronic component mounted on a stocker or the like in advance is illuminated. The irradiating means is moved by the moving means so that the emission side end is in contact with the electronic part, and when the emission side end and the electronic component are in contact with each other, the suction / inhalation means is operated to a suction state to suck and hold the electronic component by the emission side end of the irradiation means. At the same time, the irradiating means is moved while the electronic component is sucked and held by the moving means, and the electronic component is brought into contact with a predetermined position on the substrate, that is, a position where cream solder or spare solder is previously placed and the electronic component is to be soldered. Let it.

Then, a laser beam is oscillated from a laser light oscillator in a state where the electronic component is pressed against the substrate by the irradiating means, the laser light is guided to the irradiating means via the light guiding means, and the energy density is transmitted from the emission end of the irradiating means. The laser light is emitted to irradiate the electronic component so that it has a uniform spot diameter, the electronic component is heated by the laser light, and the solder is heated by transmitting the heat of the laser light to the solder through the electronic component. Melt and stop the irradiation when the solder is sufficiently melted, cool the solder for a certain time, and solidify.

[0008] This completes the soldering of the electronic component to the substrate. During the irradiation with the laser light, the position with the pattern on the substrate is secured, and if the laser light does not leak from between the irradiation means and the electronic component, the suction by the suction and air supply means is continued. Alternatively, the electronic component may be pressed against the substrate by stopping the intake by the intake and air supply means.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be specifically described below with reference to the drawings. (Embodiment Mode 1) This embodiment mode is a laser processing apparatus for soldering an object to be processed by using heat generated by a laser beam. Specifically, an electronic component to be irradiated is heated by a laser beam. Then, heat is transmitted to the solder via the electronic component to melt the solder and solder the electronic component to the substrate.

The details of the laser processing apparatus according to the present embodiment will be described with reference to FIGS. FIG.
FIG. 2 is a side view showing the entire laser processing apparatus in the present embodiment, and FIG. 2 is an enlarged cross-sectional view of a main part of FIG. As shown in FIG. 1, on the upper surface of the base 1, a stocker 9 for mounting an electronic component 15 and a processing table 8 for mounting a substrate 14 are arranged side by side. Y of the XYZ robot 16 which is a moving means composed of an X-axis arm 2 juxtaposed on the base 1, a Z-axis arm 4 erected on the X-axis arm 2, and a Y-axis arm 3 attached to the Z-axis arm 4 A circular tube scope 5 fixed to the shaft arm 3 and movable in the XYZ directions is arranged.

The callide scope 5 includes a laser oscillator 10 installed in the base 1 and an optical fiber 6 serving as light guiding means.
And functions as an irradiating means for irradiating a laser beam incident from a laser oscillator 10 via an optical fiber 6 to an electronic component 15 which is an object to be illuminated. As shown in FIG. 2, the upper end 5a fixes the optical fiber 6 in a sealed state, and the emission end 5b is slightly smaller than the outer shape of the electronic component.

Further, the upper end 5a and the output side end 5a of the calliscope 5 are communicated with the inside of the cylindrical shape of the calliscope 5.
b, a flexible intake and exhaust pipe 7 is fixed so as to communicate with the inside of the carbide scope 5, and this intake and exhaust pipe 7 is, as shown in FIG. 1 is connected to a pump 11 which is a suction and air supply means installed in the inside.

The pump 11 is connected to a control device 12 installed in the base 1 and has a function of switching between intake and air supply in accordance with a command from the control device 12.
2 connects the laser oscillator 10 and the XYZ robot 16 in addition to the pump 11, and controls the operation thereof. Next, soldering processing of the electronic component 15 by laser light using the laser processing apparatus having the above configuration will be described with reference to FIG.

First, the control device 12 shown in FIG. 1 previously stores the electronic components 1 on the stocker 9 to be soldered.
5, the position of the electronic component 15 on the stocker 9, the soldering position of the electronic component 15 on the substrate 14 on the processing table 8, the operation timing of the XYZ robot 16, Input the values required for processing, such as operation timing.

In addition, the electronic components 15 to be soldered are supplied to the stocker 9 in advance, and the board 14 on which cream solder or spare solder (each not shown) is previously applied is processed at a location where the electronic components 15 are to be soldered. It is supplied to the table 8. Then, first, an operation switch (not shown) of the control device 12 is turned on, and the XYZ robot 16 is operated to put the exit side end 5b of the carbide scope 5 into the stocker 9.
The electronic component 15 is brought into contact with the upper electronic component 15, the pump 11 is suction-operated, and the electronic component 15 is
, The XYZ robot 16 is operated again, and at a predetermined position of the substrate 14 placed on the processing table 8, that is,
In order to solder the electronic component 15, the electronic component 15 is adjusted to a position where cream solder or spare solder is previously placed.
, The pump 11 is stopped, and the electronic component 15 is pressed against the substrate 14 by the kaleidoscope 5 with such a force that the position of the electronic component 15 and the substrate 14 is maintained.

In this state, the laser light is oscillated by the laser oscillator 10 and guided into the carbide scope 5 by the optical fiber 6, and as shown in FIG. As shown by the arrow 17, light is emitted from the emission side end 5b while making the energy density uniform while performing multiple reflections. The laser light emitted from the emission side end 5b irradiates the electronic component 15 as a circular spot having a uniform energy density and the same shape as the inner diameter of the kaleidoscope 5, thereby irradiating the electronic component 15. The component 15 is heated, and the heat in contact with the electronic component 15 is melted by the heat transmitted through the electronic component 15.

Here, in the present embodiment, the electronic component 15
The shape of the irradiation side end 5b is made slightly smaller than the outer shape of the electronic component 15 in order to surely attract
5 is irradiated with a laser beam to transfer heat to the solder through the electronic component 15 to melt the solder.
The shape of b is formed so as to form a gap between the electronic component 15 and the laser light is irradiated in the same manner as described above, so that the gap formed between the irradiation side end 5b and the electronic component 15 is removed. The emitted laser light may be directly applied to the solder.

Specifically, for example, when the shape of the electronic component 15 is elongated, the inner diameter of the irradiation-side end 5 b is set to be larger than the short direction of the electronic component 15 and to be longer than the longitudinal direction of the electronic component 15. It is also conceivable to use a circular shape that also has a small diameter. In this case, the substrate 14 is an object to be irradiated together with the electronic component 15, but since the solder is directly irradiated with laser light and heated, the solder is melted more efficiently than transmitting heat to the solder through the electronic component 15. be able to.

Next, when the solder is sufficiently melted, the emission of the laser beam is stopped, and the electronic component 15 is pressed against the substrate 14 by the carbide scope 5 for a certain period of time. The XYZ robot 16 returns the carbide scope 5 to the initial position, and discharges the soldered substrate 14 from the laser processing apparatus.

Thereafter, a new substrate 14 and electronic components 15
Is supplied to the processing table 8 and the stocker 9 as necessary, and the above-mentioned soldering process is repeated. According to the present embodiment,
The irradiating means has the function of adsorbing the electronic components, which are the objects to be irradiated, and the irradiating means is fixed to the moving means, so a dedicated device for transport is not required, and the electronic components are pressed onto the substrate. Since the laser beam can be irradiated in a state where the soldering is performed, accurate and reliable soldering can be performed, automation can be performed, and mass production can be easily performed.

In this embodiment, the description has been given of the case where the suction operation of the pump is used. However, if the pump is set to the air supply state at the time of irradiation and the inert gas is supplied to the inside of the kaleidoscope, the oxidation of the solder may be performed. Can be prevented, and the processing device can be protected from flux or metal vapor. Furthermore, in the present embodiment, an example has been described in which laser light emitted from an optical fiber is directly guided to a kaleidoscope to irradiate an electronic component. The electronic component may be reflected and irradiated on the substrate.

In this case, it is very effective to protect the optical fiber serving as the light guiding means from the contamination of the flux and the vapor of the metal. Further, in the present embodiment,
Although the shape of the electronic component is circular, the shape of the electronic component can be suctioned and held according to the shape of the electronic component.
For example, the shape may be a quadrangle, other polygonal or elliptic cylinders.

(Embodiment 2) This embodiment is a laser processing apparatus for soldering electronic parts, as in Embodiment 1, but the moving means of the irradiation means is manually operated. This is different from the first embodiment. Details of the present embodiment will be described with reference to FIG.

FIG. 3 is a side view showing the entire laser processing apparatus according to this embodiment. As shown in FIG. 3, a shaft 40 erected on a base 100 has a compression coil spring 41 mounted thereon.
L-shaped angle 42, which is urged upward by the above, is slidable in the direction of arrow A which is the axial direction along the shaft 40, and is rotatable around the axis of the shaft 40. ing.

The angle 42 is provided with a guide groove 43 parallel to the upper surface of the base 100.
Holder 5 fixing a guide pin (not shown) fitted in guide groove 43 so as to be slidable along 3
1 is provided so as to be slidable along the guide groove 43 in the direction of arrow B, that is, in parallel with the upper surface of the base 100.

A kaleidoscope 50 similar to that of the first embodiment is fixed to the holder 51 with its emission side end 50a facing downward. And is connected to a laser oscillator (not shown) to supply gas into the kaleidoscope 50 through the air supply pipe 70 and to inhale gas in the kaleidoscope 50. It is connected to a pump (not shown) as a means.

The holder 51 for fixing the kaleidoscope 50 has a grip 52 which can be gripped with one hand by an operator, and has a trigger 53 which can be operated with one hand while the grip 52 is gripped. The trigger 53 is connected to a control device (not shown) together with the laser oscillator. When the trigger 53 is pulled, the laser oscillator is operated via the control device, and the laser is emitted from the calliscope 50 via the optical fiber for a predetermined time. It is configured to emit light.

A stocker 90 on which the electronic components 15 are mounted is provided on a base 100 located below the calliscope 50. The substrate 14 is mounted on the side of the stocker 90. Table 80 is provided adjacent to the stocker 90 in the direction of movement of the kaleidoscope 50, and on the side of the processing table 80, there is a suction port connected to the control device so as to suction the pump. Switch 20
0 and an air supply switch 300 connected to the control device to operate the pump for air supply.

Next, a description will be given of a soldering process of an electronic component by a laser beam using the laser processing apparatus having the above configuration. First, in FIG. 3, the relationship between the operation of the trigger 53 and the emission time of the laser beam by the laser oscillator is input to the control device in advance. In the present embodiment, the trigger 53 is pulled once (operated). ) And laser light is emitted for a certain period of time, that is, a time period in which the electronic component to be soldered is sufficiently heated to sufficiently melt the cream solder or the spare solder previously placed on the substrate. The program was input to the control device so that

In addition, the electronic components 15 to be soldered are supplied to the stocker 90 in advance, and the substrate 14 on which cream solder or preliminary solder is preliminarily applied is supplied to the processing table 80 at a location where the electronic components 15 are to be soldered. Keep it. Then, by gripping the grip 52 and manually sliding the guide pin along the guide groove 43, the holder 51 is moved in the direction of arrow B, and the angle 42 is moved in the direction of arrow A, which is the axial direction of the shaft 40. By sliding, the emission side end 50a, which is the tip of the carbide scope 50, comes into contact with the electronic component 15.

Next, the air intake switch 200 is pressed once, the pump is operated, and the electronic component 15 is sucked and held on the emission side end 50a of the carbide scope 50, and the angle 42 and the holder are manually operated in the same manner as described above. -51 is moved in the directions of arrows A and B, and is moved to a predetermined position on the substrate 14, that is,
In order to solder the electronic component 15, the electronic component 15 is brought into contact with a position where cream solder or spare solder is previously placed, and again while the electronic component 15 is pressed against the board 14 by the calliscope 50. The suction switch 200 is pressed to stop the pump, and the suction holding of the electronic component 15 is released.

In this state, the air supply switch 300 is pressed, the pump is operated to supply inert gas into the kaleidoscope 50, and the trigger 53 is pulled once to oscillate laser light from the laser oscillator for a predetermined time. Then, the electronic component 15 is irradiated with laser light via the optical fiber 60 and the carbide scope 50. The action of the carbide scope 50 on the laser beam is the same as in the first embodiment.

When the solder is sufficiently melted by the laser beam irradiation and the laser beam irradiation is stopped,
In a state where the electronic component 15 is pressed against the substrate 14 by the pressure of 0, the solder is maintained until it solidifies by cooling. When the solder is sufficiently solidified, the calliscope 50 is raised in the direction of the arrow A and retracted from the substrate. , Angle 4
2 is rotated about the axis of the shaft 40 to avoid the angle 42 and the kaleidoscope 50 from above the substrate 14 and eject the substrate 14 from the laser processing apparatus.

According to the present embodiment, the first embodiment
Since the moving means is configured without using the XYZ robot, the structure is simpler, and a small and inexpensive device can be provided. (Embodiment 3) This embodiment is the same as Embodiment 1 or Embodiment 2 except that the configurations of the kaleidoscopes 5 and 50 are different from those of Embodiment 1 or Embodiment 2. Therefore, the description of the overlapping points will be omitted.

FIG. 4 is a sectional view of the kaleidoscope according to the present embodiment. As shown in FIG. 4, the kaleidoscope 55 has a circular cylindrical shape, and has a large diameter portion 55a and a small diameter portion 55b.
The suction air pipe 71 is connected to the outer diameter side of the large diameter portion 55a so as to communicate with the inside of the cylindrical shape, and the outer diameter side of the small diameter portion 55b is connected to the large diameter portion 55b. Part 55a and a compression spring 57 provided therebetween (always arrow C).
(Direction) is provided.

The lower end of the cushion cylinder 56 is connected to the emission-side ends 5b, 5b in the first and second embodiments.
0a, and an elongated hole 59 guided by a pin 58 fixed to the small-diameter portion 55b by press-fitting so as to protrude in the outer-diameter direction of the small-diameter portion 55b. It is provided to extend.

According to the above configuration, the cushion cylinder 56 is
The long hole 59 is slidable in the axial direction by being guided by the pin 58, and the amount of movement is regulated by the axial length of the long hole 59. By being locked to the upper end, a downward drop is regulated. According to the present embodiment, when the cushion cylinder is brought into contact with the electronic component to suck the electronic component,
Alternatively, since the impact force when the electronic component or the like adsorbed by the cushion cylinder is brought into contact with the substrate or the like is reduced by the cushion cylinder and the compression spring, the electronic component and the substrate, and further,
This has the effect of preventing damage to components of the laser processing apparatus including the kaleidoscope.

Further, since the cushion cylinder can be replaced, it is sufficient to replace the cushion cylinder with an appropriate cushion cylinder according to the size and shape of the electronic component, and there is an effect that the same carbide scope can be used for various types. (Embodiment 4) This embodiment is the same as Embodiment 1 or Embodiment 2 except that the configurations of the kaleidoscopes 5 and 50 are different from those of Embodiment 1 or Embodiment 2. Therefore, the description of the overlapping points will be omitted.

FIG. 5 is a sectional view of the kaleidoscope according to the present embodiment. As shown in FIG. 5, the kaleidoscope 54 according to the present embodiment has a hollow (cylinder) narrowed toward an emission side end 54a. ) Conical shape. According to the present embodiment, the resistance of the inner wall of the carbide scope is not increased during suction and the suction force is not adversely affected, as compared with the case where the entire carbide scope is made thinner. When picking up components, etc., the electronic components can be sucked and held securely.When setting electronic components, etc., in a place where the surroundings are mixed with other components, etc., the electronic components do not interfere with surrounding components. The effect that parts can be set can be obtained.

Further, since the diameter of the side of the Callidoscope opposite to the end on the exit side is made larger than the end on the Exit side, the installation of the suction air pipe is easier than in the case where the entire side of the callidoscope is made thinner. Become. In the above description, each of the above embodiments is an example in which the laser processing device of the present invention is applied to soldering. However, the laser processing device of the present invention is not limited to this. For example, it may be used as a handling arm when aligning parts or assembling parts.

In this case, the laser beam can be radiated while irradiating the laser beam while the component is sucked and held by the irradiating means, so that the processing stress remaining inside the component can be removed. At the same time as the transfer, heat treatment such as stress removal can be performed on the component. Specifically, for example, a pressed product punched and formed by a press from a cold-rolled steel sheet is suction-held by an air-intake means and an irradiation means, and while being conveyed by a moving means, the pressed product is irradiated with laser light. Embodiments in which the stress remaining inside the press product is removed and the press product is aligned with the stocker, or the press product is directly supplied to the assembling process by using the irradiation means as it is as a handling arm are conceivable.

[0042]

As described above, according to the present invention,
The irradiation means has a transfer function, so there is no need to install a dedicated transfer device, and there is no need to add a separate process for temporarily fixing components to the board. Laser processing by light irradiation can be performed.

Further, since the object to be irradiated is irradiated with laser light in a state where the object to be irradiated is brought into close contact by suction at the exit side end of the irradiating means, the laser light is not diffused from the exit side end and is accurate and reliable. Laser processing can be performed.

[Brief description of the drawings]

FIG. 1 is a side view illustrating an entire laser processing apparatus according to a first embodiment.

FIG. 2 is an enlarged cross-sectional view of a main part of FIG.

FIG. 3 is a side view illustrating an entire laser processing apparatus according to a second embodiment.

FIG. 4 is a sectional view of a kaleidoscope according to a third embodiment.

FIG. 5 is a sectional view of a kaleidoscope according to a fourth embodiment.

[Explanation of symbols]

 Reference Signs List 6 optical fiber 10 laser oscillator 11 pump 12 controller 14 substrate 15 electronic component 16 XYZ robot 5, 50, 54, 55 Callidescope

Claims (1)

[Claims] 1. A laser oscillator, a light guide means for receiving and guiding laser light emitted from a laser oscillator, and a laser light emitted from the light guide means for making the energy density of the laser light uniform A cylindrical irradiating means which emits the laser beam so as to have a spot diameter and which has an opening at an emitting end of the laser beam, and an irradiating means so that the emitting end of the irradiating means can be freely attached to and detached from an object to be irradiated. An apparatus for laser processing, comprising: moving means for holding means; and suction / intake means for sucking gas inside the cylindrical portion of the irradiation means and supplying gas to the inside of the cylindrical portion.