JPH1052784A - Laser beam machine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laser beam machine capable of increasing the moving speed of a stage without changing the number of revolution and number of drive motors to move the stage on which a work is held. SOLUTION: A first operation part 6 is fixed to a first stage 2 on which a substrate 1 is held, and a ball screw 5 is arranged on a second stage 3 to hold the first stage 2, and a second operation part 7 is fixed to a fixed plate 4 to hold the second stage using the ball screw 5 in which the direction of the screws is opposite to each other in the middle, and the first operation part 6 and the second operation part 7 are screwed in a part where the direction of the screws is different, and the first stage 2 can be moved at the speed twice as the conventional speed to the fixed plate 4 by turning the ball screw 5 at the same speed as the conventional one.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing apparatus used for repairing a defect in, for example, a liquid crystal display device.

[0002]

2. Description of the Related Art FIG. 4 is a schematic view of a conventional laser processing apparatus. In the figure, reference numeral 11 denotes a stage for holding the substrate 1, 4 denotes a fixed plate, 12 denotes a ball screw which is disposed on the fixed plate 4 and has an operating portion 13, and 8 denotes a drive motor for rotating the ball screw 12. In FIG. Although the mechanism in the (Y direction) is described, a similar mechanism is installed in another direction (X direction) in an actual apparatus. Reference numeral 9 denotes a laser irradiation unit, and reference numeral 10 denotes a laser beam. The stage 11 fixed to the operating unit 13 slides along the surface of the fixed plate 4 by rotating the ball screw 12 by the drive motor 8, and the substrate 1 on the stage 11 is moved from the laser irradiation unit 9 at a predetermined position. Irradiated laser light 1
Processed with 0.

FIG. 5 shows a conventional machine tool disclosed in Japanese Patent Application Laid-Open No. 5-277793. In the figure,
Reference numeral 14 denotes a machine main body, 15 denotes a first headstock supported in a vertically movable state with respect to the machine body 14, and 16 denotes a second headstock supported in a vertically movable state with respect to the first headstock 15. Reference numeral 17 denotes a processing grindstone mounted on the second headstock, and reference numeral 18 denotes a stage for holding a workpiece. When the vertical surface of the workpiece is polished, the vertical movement of the second headstock 16 is added to the vertical movement of the first headstock 15, so that the vertical movement of the grinding wheel 17 is applied to the grinding wheel 17. The speed becomes high, the processing time can be shortened, and the processing accuracy can be improved. That is, the first headstock 15 and the second headstock 16
Is replaced with two stages, the stages can be moved at a high speed, and the processing time can be reduced.

[0004]

As described above, as a stage moving mechanism for holding a workpiece in a processing apparatus, several structures have been conventionally proposed, but none of them is effective. For example, in the apparatus shown in FIG. 4, the moving speed of the stage 11 is determined by the upper limit of the rotating speed of the driving motor 8, and in order to increase the moving speed of the stage 11, a high-performance driving motor having a high rotating speed is required. Or the pitch of the ball screw needs to be increased, resulting in problems such as high cost and increased frictional resistance with the screw to be screwed. In addition, the method shown in FIG. 5 requires two drive systems to move the first headstock 15 and the second headstock 16, thereby increasing costs and complicating control. was there.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a laser processing apparatus capable of increasing the moving speed of a stage without changing the rotation speed and the number of driving motors. Aim.

[0006]

SUMMARY OF THE INVENTION A laser processing apparatus according to the present invention holds a first stage for holding a substrate, and slidably holds the first stage, and slidably holds the first stage. A second stage connected to a driving source, a ball screw for horizontally moving the first stage and the second stage, and a laser emitting unit for emitting laser light onto the substrate. Further, the first stage and the second stage are configured to slide in the same direction at the same time. Further, the first stage and the second stage are configured to be moved by one ball screw connected to one drive source. The ball screw is formed such that the direction of the screw is reversed in the middle. Further, the first operating part attached to the first stage is screwed into the screw part in the predetermined direction of the ball screw, and the second operating part attached to the fixing plate is screwed into the screw part in the opposite direction to the ball screw. The parts are screwed together and a ball screw is attached to the second stage. Further, a stage for holding the substrate, a fixed plate for slidably holding the stage, and a screw driven by a driving source slidably supported by the fixed plate are formed so that the directions of the screws are reversed in the middle. A ball screw, a first operating portion screwed to a screw portion of the ball screw in a predetermined direction and attached to the stage, and a second operating portion screwed to a screw portion of the ball screw in the opposite direction and attached to the fixed plate It is provided with.

[0007]

BEST MODE FOR CARRYING OUT THE INVENTION

Embodiment 1 FIG. Hereinafter, a laser processing apparatus according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of a laser processing apparatus according to the present invention, and FIG. 2 is a perspective view of a ball screw mounted on the apparatus. In FIG. 1, 1 is a substrate, 2 is a first stage for holding the substrate, 3 is a second stage for holding the first stage, 4 is a fixed plate,
5 is a ball screw arranged on the second stage 3, which is shown in FIG.
As shown in the figure, the direction of the screw is formed so as to be reversed in the middle, and the first operating unit 6 and the second operating unit 7 are screwed into portions having different spiral directions, respectively.
By rotating, the first operating unit 6 and the second operating unit 7 are configured to move in opposite directions. Here, the first operating unit 6 is attached to the first stage 2, and the second operating unit 7 is attached to the fixed plate 4. Reference numeral 8 denotes a drive motor for rotating a ball screw, 9 denotes a laser irradiation unit, and 10 denotes a laser beam. By rotating the ball screw 5 by the drive motor 8, the first stage 2 attached to the first operating unit 6 moves with respect to the second stage 3 attached with the ball screw 5, and On the contrary, the second stage 3 causes the fixed plate 4 to move in a direction opposite to the moving direction of the first stage 2 by the operating unit 7 moving the fixed plate 4 to which the second operating unit 7 is attached. Moves in the same direction as the first stage 2.

According to the present invention, the moving speed of the first stage 2 is doubled without changing the rotational speed and the number of the driving motors 8 for moving the first stage 2 holding the substrate 1 from the conventional one. Can be accelerated.

Embodiment 2 FIG. 3 is a perspective view of a laser processing apparatus according to Embodiment 2 of the present invention. In the figure, reference numeral 11 denotes a stage which holds the substrate and is slidably held by the fixed plate 4. The same parts as those in FIG. 1 are denoted by the same reference numerals, and description thereof will be omitted. Here, the first operating unit 6 is attached to the stage 11, the second operating unit 7 is attached to the fixed plate 4, and the ball screw 5
Are slidably supported on the fixed plate 4 together with the drive motor 8. By rotating the ball screw 5 by the drive motor 8, the stage 11 attached to the first operating unit 6 moves with respect to the ball screw 5, and the second operating unit 7 is attached to the fixed plate 4. For,
Conversely, the ball screw 5 is moved in the same direction as the moving direction of the stage 11. According to the present embodiment, the same effects as in the first embodiment can be obtained with the load on the drive motor 8 reduced.

[0010]

As described above, according to the present invention, the moving speed of the stage is doubled without changing the rotation speed and the number of the driving motors for moving the stage holding the workpiece from the conventional one. Therefore, the tact time of the laser processing device can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a laser processing apparatus according to a first embodiment of the present invention.

FIG. 2 is a perspective view showing a ball screw according to Embodiment 1 of the present invention.

FIG. 3 is a perspective view showing a laser processing apparatus according to a second embodiment of the present invention.

FIG. 4 is a perspective view showing a conventional laser processing apparatus of this type.

FIG. 5 is a schematic view showing a conventional machine tool.

[Explanation of symbols]

1 substrate, 2nd stage, 3rd stage,
4 fixed plate, 5 ball screw, 6 first operating unit, 7 second operating unit, 8 drive motor, 9 laser irradiation unit, 10 laser light, 11 stage.

Claims (6)

[Claims] A first stage for holding a substrate, a second stage for slidably holding the first stage, and slidably held for a fixed plate; and a second stage connected to a drive source. A laser processing apparatus comprising: a ball screw for horizontally moving one stage and the second stage; and a laser emitting unit for emitting laser light on the substrate. 2. The laser processing apparatus according to claim 1, wherein the first stage and the second stage are configured to slide in the same direction at the same time. 3. The apparatus according to claim 1, wherein the first stage and the second stage are configured to be moved by one ball screw connected to one drive source. Laser processing equipment. 4. The ball screw according to claim 1, wherein the direction of the screw is reversed in the middle.
The laser processing device according to any one of claims 1 to 3. 5. A first operating portion attached to a first stage is screwed into a screw portion in a predetermined direction of the ball screw, and a screw portion in a direction opposite to the ball screw is attached to a fixing plate. While screwing the second moving part,
The laser processing apparatus according to claim 4, wherein the ball screw is mounted on a second stage. 6. A stage for holding a substrate, a fixing plate for slidably holding the stage, and driven by a driving source slidably supported by the fixing plate so that the direction of the screw is reversed in the middle. A formed ball screw, a first operating portion screwed to a screw portion of the ball screw in a predetermined direction and mounted to the stage, and screwed to a screw portion of the ball screw in a reverse direction and mounted to the fixing plate. A laser processing apparatus comprising a second operating unit.