JPH10513611A - Z軸電導フィルムを含むマイクロ電子組立体 - Google Patents
Z軸電導フィルムを含むマイクロ電子組立体Info
- Publication number
- JPH10513611A JPH10513611A JP9513771A JP51377197A JPH10513611A JP H10513611 A JPH10513611 A JP H10513611A JP 9513771 A JP9513771 A JP 9513771A JP 51377197 A JP51377197 A JP 51377197A JP H10513611 A JPH10513611 A JP H10513611A
- Authority
- JP
- Japan
- Prior art keywords
- film
- metal
- holes
- hole
- assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0657—Stacked arrangements of devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/492—Bases or plates or solder therefor
- H01L23/4922—Bases or plates or solder therefor having a heterogeneous or anisotropic structure
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- H—ELECTRICITY
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5385—Assembly of a plurality of insulating substrates
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- H—ELECTRICITY
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
- H05K3/462—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar double-sided circuit boards
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06513—Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
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- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/0652—Bump or bump-like direct electrical connections from substrate to substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06527—Special adaptation of electrical connections, e.g. rewiring, engineering changes, pressure contacts, layout
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01006—Carbon [C]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01013—Aluminum [Al]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01014—Silicon [Si]
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- H01L2924/01015—Phosphorus [P]
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01022—Titanium [Ti]
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01028—Nickel [Ni]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01032—Germanium [Ge]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01074—Tungsten [W]
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- H01L2924/01078—Platinum [Pt]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15172—Fan-out arrangement of the internal vias
- H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0116—Porous, e.g. foam
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Non-Insulated Conductors (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (11)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US439495P | 1995-09-27 | 1995-09-27 | |
US440295P | 1995-09-27 | 1995-09-27 | |
US439695P | 1995-09-27 | 1995-09-27 | |
US439195P | 1995-09-27 | 1995-09-27 | |
US441595P | 1995-09-27 | 1995-09-27 | |
US60/004,396 | 1995-09-27 | ||
US60/004,415 | 1995-09-27 | ||
US60/004,394 | 1995-09-27 | ||
US60/004,402 | 1995-09-27 | ||
US60/004,391 | 1995-09-27 | ||
PCT/US1996/016023 WO1997012397A1 (en) | 1995-09-27 | 1996-09-27 | Microelectronic assemblies including z-axis conductive films |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH10513611A true JPH10513611A (ja) | 1998-12-22 |
Family
ID=27533065
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9513771A Ceased JPH10513611A (ja) | 1995-09-27 | 1996-09-27 | Z軸電導フィルムを含むマイクロ電子組立体 |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP0811245A4 (zh) |
JP (1) | JPH10513611A (zh) |
CN (1) | CN1165584A (zh) |
AU (1) | AU703591B2 (zh) |
BR (1) | BR9606658A (zh) |
CA (1) | CA2205810A1 (zh) |
TW (1) | TW321789B (zh) |
WO (1) | WO1997012397A1 (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011525052A (ja) * | 2008-06-20 | 2011-09-08 | アルカテル−ルーセント ユーエスエー インコーポレーテッド | 伝熱構造体 |
JPWO2016098865A1 (ja) * | 2014-12-19 | 2017-09-21 | 富士フイルム株式会社 | 多層配線基板 |
US11032942B2 (en) | 2013-09-27 | 2021-06-08 | Alcatel Lucent | Structure for a heat transfer interface and method of manufacturing the same |
JP2021515385A (ja) * | 2018-03-02 | 2021-06-17 | ノースロップ グラマン システムズ コーポレーション | 高い横方向熱伝導率を有する熱ガスケット |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6512300B2 (en) | 2001-01-10 | 2003-01-28 | Raytheon Company | Water level interconnection |
DE102005020453B4 (de) | 2005-04-29 | 2009-07-02 | Infineon Technologies Ag | Halbleiterbauteil mit einer Flachleiterstruktur und Verfahren zur Herstellung einer Flachleiterstruktur und Verfahren zur Herstellung eines Halbleiterbauteils |
DE102007055017B4 (de) * | 2007-11-14 | 2010-11-04 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum Verbinden zweier Fügeflächen und Bauteil mit zwei verbundenen Fügeflächen |
KR101944898B1 (ko) | 2012-06-11 | 2019-02-01 | 에스케이케미칼 주식회사 | 폴리아릴렌 설파이드 수지 조성물 및 이의 제조 방법 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4283464A (en) * | 1979-05-08 | 1981-08-11 | Norman Hascoe | Prefabricated composite metallic heat-transmitting plate unit |
JPS6148952A (ja) * | 1984-08-16 | 1986-03-10 | Toshiba Corp | 半導体装置 |
EP0284820A3 (en) * | 1987-03-04 | 1989-03-08 | Canon Kabushiki Kaisha | Electrically connecting member, and electric circuit member and electric circuit device with the connecting member |
JPS6412406A (en) * | 1987-07-07 | 1989-01-17 | Nitto Denko Corp | Directional conductor and manufacture thereof |
JP3047986B2 (ja) * | 1990-07-25 | 2000-06-05 | 株式会社日立製作所 | 半導体装置 |
EP0501358B1 (en) * | 1991-02-25 | 1997-01-15 | Canon Kabushiki Kaisha | Connecting method and apparatus for electric circuit components |
JPH0547219A (ja) * | 1991-08-13 | 1993-02-26 | Ricoh Co Ltd | 異方性導電膜およびそれを用いた電子部品の接続方法 |
US5213868A (en) * | 1991-08-13 | 1993-05-25 | Chomerics, Inc. | Thermally conductive interface materials and methods of using the same |
EP0537965B1 (en) * | 1991-10-12 | 1997-03-05 | Sumitomo Special Metals Company Limited | Process of manufacturing a heat-conductive material |
-
1996
- 1996-09-27 WO PCT/US1996/016023 patent/WO1997012397A1/en not_active Application Discontinuation
- 1996-09-27 JP JP9513771A patent/JPH10513611A/ja not_active Ceased
- 1996-09-27 CA CA 2205810 patent/CA2205810A1/en not_active Abandoned
- 1996-09-27 EP EP96936229A patent/EP0811245A4/en not_active Ceased
- 1996-09-27 CN CN 96191124 patent/CN1165584A/zh active Pending
- 1996-09-27 AU AU73932/96A patent/AU703591B2/en not_active Ceased
- 1996-09-27 BR BR9606658A patent/BR9606658A/pt not_active IP Right Cessation
- 1996-10-03 TW TW85112057A patent/TW321789B/zh not_active IP Right Cessation
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011525052A (ja) * | 2008-06-20 | 2011-09-08 | アルカテル−ルーセント ユーエスエー インコーポレーテッド | 伝熱構造体 |
US8963323B2 (en) | 2008-06-20 | 2015-02-24 | Alcatel Lucent | Heat-transfer structure |
US9308571B2 (en) | 2008-06-20 | 2016-04-12 | Alcatel Lucent | Heat-transfer structure |
US11032942B2 (en) | 2013-09-27 | 2021-06-08 | Alcatel Lucent | Structure for a heat transfer interface and method of manufacturing the same |
JPWO2016098865A1 (ja) * | 2014-12-19 | 2017-09-21 | 富士フイルム株式会社 | 多層配線基板 |
JP2021515385A (ja) * | 2018-03-02 | 2021-06-17 | ノースロップ グラマン システムズ コーポレーション | 高い横方向熱伝導率を有する熱ガスケット |
Also Published As
Publication number | Publication date |
---|---|
EP0811245A4 (en) | 1998-11-18 |
CA2205810A1 (en) | 1997-04-03 |
TW321789B (zh) | 1997-12-01 |
BR9606658A (pt) | 1997-11-04 |
MX9703780A (es) | 1998-05-31 |
AU703591B2 (en) | 1999-03-25 |
CN1165584A (zh) | 1997-11-19 |
AU7393296A (en) | 1997-04-17 |
EP0811245A1 (en) | 1997-12-10 |
WO1997012397A1 (en) | 1997-04-03 |
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