JPH104247A - Circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To shorten the period of system development, and to cut down cost by a method wherein connection parts are arranged on the circumferential part of a main circuit board, a subordinate circuit board and an auxiliary circuit board and all the auxiliary connection parts are connected directly to the circum ferential part of the auxiliary circuit board. SOLUTION: Discrete parts 12 to/from which data are transferred from/to a semiconductor part 11 are dispersively arranged on a substrate. The connection part 4, which is disposed on the backside of an auxiliary circuit board 10 where the semiconductor part 11 is mounted, is connected to the connection part 4 of the main circuit board 2, and the auxiliary circuit board 10 is mounted on the main circuit board 2. The connection part 4 disposed on the backside of the auxiliary subordinate circuit board 3 is mounted on the main circuit board 2. As a result, a system, which can be correspond to the change of function, can be realized.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board mounted on a system for realizing a desired function, and more particularly to a system at an early stage of development which can flexibly respond to a change in function. A spare sub-circuit board on which a programmable semiconductor component whose logic circuit configuration can be changed in the field is mounted, and a main circuit board to which a plurality of spare sub-circuit boards can be connected, and the main circuit board is used in a system at a commercial stage The present invention relates to a circuit board on which high-performance semiconductor components can be mounted.

[0002]

2. Description of the Related Art FIG. 6 shows an example of a system configuration using a conventional circuit board having a main circuit board and a spare sub-circuit board in order to construct a system at an early stage of development capable of flexibly responding to a change in function. Show. In the figure, 1 is a system, 2 is a main circuit board on which semiconductor components (for example, a gate array LSI; not shown) are mounted, 3 is a spare sub-circuit board, 4 is a main circuit board 2
And 4 'are different types (types suitable for the shape of the semiconductor component) of the connection component 4 and the connection for mounting the semiconductor component on the main circuit board 2. The component 5 is another semiconductor component (for example, a programmable LSI such as an FPGA) having an electric property different from that of the semiconductor component mounted on the main circuit board 2, and 6 is a plurality of other semiconductors on the auxiliary sub circuit board 3. The connection switching component 7 that connects the components 5 to each other and can change the connection state. The connection switching component 7 has the same shape as the connection component 4 ′ in order to propagate a signal from the connection component 4 to the connection component 4 ′. Connection conversion parts,
Reference numeral 8 denotes a connection cable for connecting the connection component 4 and the connection conversion component 7, and 9 denotes a low-speed signal transmitted from the main circuit board 2 and transmitted to the other semiconductor components 5 and the connection switching component 6 on the auxiliary sub-circuit board 3. It is a speed conversion part for making it work.

In a conventional circuit board configuration, semiconductor components are not mounted on a sub-circuit board (not shown), but are connected to the main circuit board 2 via connecting components 4 '. Here, since the connection component 4 'on the main circuit board 2 for connecting the semiconductor component and the connection component 4 on the auxiliary sub circuit board 3 are not compatible as shown in the figure, the connection conversion component 7 and the connection cable 8 are connected. A configuration has been adopted in which the substrates are connected to each other by using the same. Therefore, the signal propagation delay between the main circuit board 2 and the auxiliary sub-circuit board 3 is large. Therefore, when a high-speed system employing semiconductor components capable of high-speed operation is targeted, the auxiliary sub-circuit board 3 Verification related to function change of above semiconductor components (Function verification)
Only used to. That is, in the configuration of the conventional circuit board, the spare sub-circuit board 3 is not suitable for the performance verification of the high-speed semiconductor component and the performance verification of the high-speed system when the function is changed. Further, when performing these performance verifications with a conventional circuit board configuration, a speed conversion component 9 that is unnecessary for the original semiconductor components is provided on the spare sub-circuit board 3, and the input signal group is stored in the spare sub-circuit board 3. Has to be developed into a low-speed and large-bit-width signal group, and control for matching the total throughput of signals on the main circuit board 2 and the auxiliary sub-circuit board 3 is required. In this case, another semiconductor component 5 and a connection switching component 6 are further required (for example, the number of components is twice as large as 1/2 of the speed conversion) by a multiple related to the speed conversion. Inevitably, it hinders high-speed operation of the substrate itself. Therefore, there is a disadvantage that the amount of hardware for the performance verification is greatly increased and the control for simulating the semiconductor component on the spare sub-circuit board 3 is complicated.

[0004]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and solves the above-mentioned problems relating to the performance verification of a high-speed system, and is an early development stage capable of flexibly responding to a change in function. It is an object of the present invention to provide a circuit board for realizing the above system. Still another object of the present invention is to provide a circuit board which can be used in a system at a commercial stage in which a high-performance semiconductor component is mounted on the circuit board, thereby contributing to a reduction in system development period and cost.

[0005]

In order to achieve the above object, a circuit board according to the present invention comprises (1) a main circuit board, a sub-circuit board, and a spare sub-circuit board, and (2) is required for realizing functions. (3) The same type of connecting parts are mounted on the main circuit board so that the main circuit board can be directly connected to the sub-circuit board or the spare sub-circuit board.
(4) A spare sub-circuit board is provided on the sub-circuit board and the spare sub-circuit board, and (4) a spare connection component for transmitting a signal between the main circuit board and another spare sub-circuit board via a predetermined spare sub-circuit board. (5) connecting parts are provided on the main circuit board,
The main feature is that the peripheral parts on the sub-circuit board and the spare sub-circuit board and the spare connection parts are arranged so as to be directly connected to the peripheral parts on the spare sub-circuit board.
The difference from the prior art is that a main circuit board and a plurality of spare sub-circuit boards can be directly connected and connected via connecting parts and spare connecting parts.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a diagram illustrating a first embodiment of the present invention. 6, the same reference numerals as those in FIG. 6 correspond to the same parts in FIG. Reference numeral 10 denotes a sub-circuit board, and 11 denotes a semiconductor component mounted on the sub-circuit board 10, which corresponds to, for example, a gate array LSI. Reference numeral 12 denotes an individual component for exchanging data with the semiconductor component 11, which is a memory or the like. Also in a conventional circuit board, the individual components 12 are dispersedly arranged on the board. A broken line portion A is an area where the sub-circuit board 10 or the spare sub-circuit board 3 is mounted. In FIG. 1, a sub-circuit board 1 on which a semiconductor component 11 is mounted is shown.
The connection component 4 disposed on the back surface of the main circuit board 2 is connected to the connection component 4 of the main circuit board 2, and the sub-circuit board 10 is mounted on the main circuit board 2. Further, the connection component 4 provided on the back surface of the spare sub-circuit board 3 on which another semiconductor component 5 corresponding to an FPGA or the like is mounted is connected to the connection component 4 of the main circuit board 2, and the spare sub-circuit board 3 is Mounted on the main circuit board 2. Therefore,
Since the connection cable 8 and the like in the conventional example become unnecessary, high-speed signal propagation between the main circuit board 2 and the spare sub-circuit board 3 and between the main circuit board 2 and the sub-circuit board 10 can be performed.

FIGS. 2 (a) and 2 (b) show a second embodiment of the present invention, and are views seen from the back surface of the substrate, illustrating two types of configuration examples of the auxiliary sub-circuit substrate 3. FIG. . In the figure, the same reference numerals as those in FIGS. 1 and 6 correspond to the same parts in FIGS. 2A and 2B, a plurality of other semiconductor components 5 are mounted on the front and back surfaces of the spare sub-circuit board 3 in order to realize the function of the semiconductor component 11. It is characterized in that a connection switching circuit 6 that can change the connection state between them is also mounted. As a result, the function of the semiconductor component 11 having a medium gate size can be realized by the spare sub-circuit board 3.

FIG. 3 shows a third embodiment of the present invention. FIG. 3 is a diagram showing a configuration example for realizing the function of the semiconductor component 11 having a larger gate size on the spare sub-circuit board 3 as viewed from above the board. It is. In the figure, the same reference numerals as those in FIGS. 1 and 6 correspond to the same parts in FIGS. FIG. 3 is characterized in that connection parts 4 are mounted on both front and back surfaces of the main circuit board 2, and all or a part of the connection parts 4 are electrically connected to each other through the main circuit board 2. in this case,
In the figure, the connection parts 4 in the shaded area are provided on the main circuit board 2, and the connection parts 4 in the area without the shaded area are provided on the auxiliary sub-circuit board 3. As a result, data can be exchanged between the auxiliary sub-circuit boards 3 connected to the front and back surfaces of the main circuit board 2 via the connection parts 4, and the two auxiliary sub-circuit boards 3 are used. The function can be realized. Although not shown in the present embodiment, the spare sub-circuit board 3 adopts the configuration (FIG. 2) of the second embodiment of the present invention, which also belongs to the category of the present invention.

FIG. 4 shows a fourth embodiment of the present invention, in which one or more functions realized by a plurality of semiconductor components 11 are realized by one spare sub-circuit board 3. FIG. In the figure, the same reference numerals as those in FIGS. 1 and 6 correspond to the same parts in FIGS. That is, a large number of connection components 4 are arranged on the surface of the main circuit board 2 so as to sandwich the area A on which the sub-circuit board 10 is mounted. on the other hand,
A large number of other semiconductor components 5 are arranged on the front surface of the auxiliary sub-circuit board 3, and a large number of connection components 4 are arranged on the back surface of the auxiliary sub-circuit board 3. Also, the individual component 12 is a spare sub-circuit board 3
Are dispersedly arranged on the front and back surfaces. In FIG. 4, the main circuit board 2 and the auxiliary sub-circuit board 3 are connected by the connection component 4, similarly to the embodiment of the present invention described so far. Although not shown in the present embodiment, the spare sub-circuit board 3 adopts the configuration (FIG. 2) of the second embodiment of the present invention, which also belongs to the category of the present invention.

FIGS. 5 (a), 5 (b) and 5 (c) show a fifth embodiment of the present invention, in which a plurality of semiconductor components 11 having a very large gate size are mounted on a main circuit board 2. FIG. FIG. 5 is a diagram for explaining a circuit board configuration example corresponding to the case where
5A is a partially cutaway perspective view showing the system, FIG. 5B is a view of the main circuit board and the auxiliary sub circuit board viewed from above, and FIG.
(C) is a perspective view of the auxiliary sub-circuit board. In the circuit board configuration of the present embodiment, the main circuit board 2 and the plurality of auxiliary sub-circuit boards 3 are arranged close to each other in the same system. In the figure, the same reference numerals as those in FIGS. 1 and 6 correspond to the same parts in FIGS. Reference numeral 13 denotes a spare connection component mounted on the spare sub-circuit board 3. The spare connection parts 13 arranged on the front and back of the spare sub circuit board 3 are electrically connected to each other through the spare sub circuit board 3. The connection component 4 is disposed on the back surface of the auxiliary sub-circuit board 3 on which the auxiliary connection component 13 is mounted.
Further, the individual components 12 are dispersedly arranged on the front and back surfaces of the spare sub-circuit board 3. 5A, 5B, and 5C, the rightmost spare sub-circuit board 3 mounted on the system 1 is a spare connection component provided on the second spare sub-circuit board 3 from the right. It is electrically connected to main circuit board 2 only through 13 and connecting parts 4. Therefore, according to the present embodiment,
A plurality of auxiliary sub-circuit boards 3 on which a large number of programmable LSIs such as FPGAs are mounted can be connected to the main circuit board 2 in a form having the smallest signal propagation delay. High-speed performance equivalent to that of the main circuit board 2 having the circuit board 10 can be obtained, and the function to be realized can be easily changed. Although not shown in the present embodiment, the spare sub-circuit board 3 adopts the configuration (FIG. 2) of the second embodiment of the present invention, which also belongs to the category of the present invention.

As described above, the embodiment of the present invention includes a circuit board having the following features. (1) On a circuit board mounted on a system and realizing one or more functions, L (L is an integer of 1 or more) semiconductor parts necessary for realizing the functions are distributed and mounted on M substrates ( (M ≦ L, M is an integer of 1 or more) a sub-circuit board, a main circuit board to which M sub-circuit boards are directly connected via connection components, and electrical characteristics different from those of the semiconductor component K (N ≧ L / K, K is an integer of 1 or more) spare sub-circuit boards on which N (N is an integer of 1 or more) other semiconductor components for realizing the function are provided. A main circuit board which has a board and the same type of connecting parts mounted on the spare sub-circuit board, and on which the M sub-circuit boards are not mounted; A circuit board directly connected to said spare sub-circuit board.

(2) On a spare sub-circuit board on which N is mounted two or more other semiconductor parts, a connection switching part for interconnecting the other semiconductor parts and changing the connection state is mounted. (1) The circuit board according to (1).

(3) In the main circuit board, connecting parts are mounted on both front and back surfaces of the main circuit board, and a part of the connecting parts is electrically connected to each other through the main circuit board. The circuit board according to 1) or 2).

(4) In the spare sub-circuit board, a signal is transmitted from the main circuit board to another spare sub-circuit board via a predetermined spare sub-circuit board, so that the spare sub-circuit board and the other spare sub-circuit are transmitted. The circuit board according to (1), (2) or (3), further comprising a spare connection component for connecting the board.

(5) The main circuit board and the K auxiliary sub-circuit boards are all directly connected to each other and connected by using the connecting parts and the spare connecting parts. (1), (2),
The circuit board according to (3) or (4).

(6) The connection parts and the auxiliary connection parts are arranged on the main circuit board, the sub-circuit board, and the peripheral part on the auxiliary sub-circuit board. (1), (2), (3),
The circuit board according to (4) or (5).

(7) Another semiconductor component mounted on the spare sub-circuit board is a programmable semiconductor component whose realizable logic circuit configuration can be changed in the field. (1), (2), (3) ), (4), (5) or (6)
The described circuit board.

[0018]

As described above, according to the circuit board of the present invention, the signal propagation delay between the boards is the smallest.
In addition, for example, since a system equipped with a large number of programmable LSIs can be constructed, there is an advantage that a system capable of flexibly responding to a change in function can be realized.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a first embodiment of the present invention.

FIGS. 2A and 2B are perspective views showing a second embodiment of the present invention.

FIG. 3 is a top view showing a third embodiment of the present invention.

FIG. 4 is a perspective view showing a fourth embodiment of the present invention.

5A and 5B show a fifth embodiment of the present invention, wherein FIG. 5A is a perspective view of a system, FIG. 5B is a top view of a main circuit board and a spare sub-circuit board, and FIG. It is a perspective view.

FIG. 6 is a perspective view showing a system configuration using a conventional circuit board.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... System, 2 ... Main circuit board, 3 ... Spare auxiliary circuit board,
Reference numeral 4 denotes a connection component, 4 ': a connection component for mounting a semiconductor component on the main circuit board 2 of a type different from the connection component 4 (a type adapted to the shape of the semiconductor component), and 5: a main circuit board 2
Other semiconductor components (for example, programmable LSI such as FPGA) having electrical properties different from the semiconductor components mounted on the semiconductor device; 6, a connection switching component; 7, a connection conversion component;
Connection cable, 9: speed conversion component, 10: sub-circuit board,
11: semiconductor parts, 12: individual parts, 13: spare connection parts.

Claims (7)

[Claims] 1. A circuit board which is mounted on a system and realizes one or more functions, wherein L (L is an integer of 1 or more) semiconductor components necessary for realizing the functions are distributed and mounted. A number of sub-circuit boards (M ≦ L, M is an integer of 1 or more), a main circuit board to which M sub-circuit boards are directly connected via connection components, and an electric power different from the semiconductor components K (N ≧ L / K, K is an integer of 1 or more) spare sub-circuit boards on which N (N is an integer of 1 or more) other semiconductor components for realizing the function according to the characteristic are provided; A main circuit board having the sub-circuit board and the same type of connecting parts mounted on the spare sub-circuit board, and the M sub-circuit boards not being mounted, through the same type of connecting parts; A circuit board directly connected to and connected to the K spare sub-circuit boards. 2. A spare sub-circuit board on which another semiconductor component in which N is 2 or more is mounted with a connection switching component that interconnects the other semiconductor components and that can change the connection state. The circuit board according to claim 1, wherein: 3. The main circuit board, wherein connection parts are mounted on both front and back surfaces of the main circuit board, and a part of the connection parts is electrically connected to each other through the main circuit board. 3. The circuit board according to 1 or 2. 4. The spare sub-circuit board and another spare sub-circuit board for transmitting a signal from the main circuit board to another spare sub-circuit board via a predetermined spare sub-circuit board. 4. The circuit board according to claim 1, further comprising a spare connection component for connecting the circuit board. 5. The main circuit board and the K auxiliary sub-circuit boards are all directly connected to each other and connected, using the connecting parts and the spare connecting parts.
The described circuit board. 6. The method according to claim 1, wherein the connecting parts and the auxiliary connecting parts are arranged on the peripheral parts on the main circuit board, the sub-circuit board and the auxiliary sub-circuit board. Circuit board. 7. The semiconductor device according to claim 1, wherein the other semiconductor component mounted on the spare sub-circuit board is a programmable semiconductor component whose realizable logic circuit configuration can be changed in a field. Or the circuit board according to 6.