JPH1039239A - Spatial light modulation element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make it possible to set the driving circuit, etc., of a shutter on a substrate without degrading the numerical aperture by providing the element with the shutter for controlling the passage and non-passage of the light which is made incident on through-holes and is condensed by a lens. SOLUTION: The paralleled light is made incident on the microscopes 101 from a light source side and the incident light is made into parallel beams reduced in spot diameter by the microlenses 101. The apertures of the through- holes 103 of a substrate 104 are irradiate with these beams. The beams are so controlled as to pass or not pass the through-holes 103 by opening and closing the light shielding plates 105a of the shutter 105 of a flap type. In the close state, the shutter 105 is held closed and the apertures of the through-holes 103 of the substrate 104 are held closed by two sheets of the light shielding plates 105a to prohibit the beams from passing the through-holes 103. In the open state, electrostatic attraction force acts between the light shielding plates 105a and the walls 106 of the through-holes 103 when a potential difference is applied between both by a power source, by which the light shielding plates 105a are attracted to the walls 106 of the through-holes 103 and the beams are passed through the through-holes 103.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a spatial light modulator as a projection display device using a micromechanical shutter array or a micro galvanometer mirror array, and more particularly, to optical storage / recording, optical logic operation, that is, optical operation. The present invention relates to a spatial light modulator that can be applied to formation of an information processing image, image processing, image logical operation, and formation of a data pattern for optical computing.

[0002]

2. Description of the Related Art A first conventional example (Japanese Unexamined Patent Publication No. 4-230721) will be described with reference to FIGS. This spatial light modulating element has a large number of micro shutters 1701.
It consists of. The micro shutter 1701 is
A moving electrode 1702 and a beam 1703 connecting the micro shutter 1701 to a fixed end are provided. The movable electrode 1702 is made of a material that hardly transmits light in the visible region, such as Al or poly-Si. The micro shutter 1701 is grounded.

In FIG. 62, when a voltage is applied to an electrode 1705, a micro-shutter 1701
704 is located horizontally with respect to 704 and blocks incident light. When a voltage is applied to the electrode 1706, the micro shutter 1701 is inclined with respect to the substrate 1704,
When a voltage is applied to the electrode 1707, the substrate 1704
And the incident light passes through the spatial light modulator.

[0004] Light transmitted through a spatial light modulator having such a micro shutter 1701 in an array forms an image on a screen (not shown) by a lens (not shown). By controlling the opening and closing of the micro shutter 1701 as described above, an image or the like can be displayed on a screen. In the first conventional spatial light modulator, the opening 1708 occupies most of the area of the substrate 1704 in order to increase the aperture ratio. Opening 170
The eight walls 1708a are perpendicular to the substrate 1704. Therefore, when shifting the flap type shutter from the closed state to the open state, it is necessary to rotate the shutter by 90 degrees.

In order to realize a display capable of full-color display using the spatial light modulator of the first conventional example, as shown in FIG. 61, R, G, and B transmission filters 1709 are used.
Three micro shutters 1701 having
Make up the pixels. And each micro shutter 17
The full-color display is enabled by changing the time during which the 01 is open and in the transmission state.

Next, a second conventional example (E. Obermei)
er, J.A. Lin, V .; Sclicting, "
Design and Fabrication of
an electrostatically dri
ven micro-shutter ”, Techn
ical Digest of The 7th In
international Conference on
Solid-State Sensors and
Actuators, pp 132-135, 199
3) is shown in FIG. The device of the second conventional example has substantially the same configuration as that of the first conventional example, and includes a micro shutter 1701, a beam 1703 supporting the micro shutter 1701, and a moving electrode 1702 for opening and closing the micro shutter 1701. . Also, when a display capable of full-color display is configured, as described in the first conventional example, a display having R, G, and B transmission filters is used.
One pixel may be configured as a set of shutters.

Further, a third conventional example (“Eliminating the need for a color filter of a liquid crystal projection display”, Nikkei Electronics, 1995.1.30) will be described. The third conventional example relates to a projection type display, and its basic configuration is shown in FIG. 64, and an enlarged configuration diagram of a liquid crystal panel portion in FIG. 64 is shown in FIG. In this projection type display, the light from the light source 1710 is applied to the dichroic mirror 1
711 separates the light into three primary colors. The decomposed light is
The liquid crystal panel 1712 is irradiated from different directions. The liquid crystal panel 1712 has one micro lens 1714 for every three liquid crystal shutters 1713 as shown in FIG. Therefore, the light that has passed through the liquid crystal shutter 1713 is condensed on the screen 1717 by the Fresnel lens 1715 and the projection lens 1716 shown in FIG. 64, and an image or the like is displayed on the screen in full color. The micro lens 1714 focuses the light incident on the lens for each of the three primary colors on the liquid crystal shutter 1713, so that the effective aperture ratio does not decrease. In FIG. 65, reference numeral 1718 denotes a glass substrate.

[0008]

However, in the first and second conventional examples, most of the area of the substrate provided with the shutter in order to increase the aperture ratio is an opening, that is, a hole. However, there is a problem that the area for arranging circuits and wirings for driving on the substrate is insufficient. Therefore, it is necessary to separately provide a substrate having a control electrode for controlling the shutter in addition to the substrate having the micro shutter. When a separate substrate for the control electrode is provided,
It is necessary to perform an operation of accurately positioning the control electrode and the shutter and determining the bonding or mutual positional relationship between the two substrates. Therefore, the manufacturing process of the spatial light modulator becomes complicated, and if the positioning cannot be performed accurately, the spatial light modulator may malfunction.

Further, since the light also irradiates the gap around the micro shutter, even if the micro shutter is closed, the light leaks from this gap and is projected on the screen via the spatial light modulator. There is a problem that the contrast of an image is reduced.

Furthermore, since the opening area is increased to increase the aperture ratio, there is a problem that it is necessary to increase the moving distance of the shutter for opening and closing the opening.
The conventional micro shutter is opened and closed using electrostatic attraction because of its simple structure and the like. However, since the strength of the electrostatic attraction is inversely proportional to the square of the distance, increasing the moving distance of the shutter weakens the electrostatic attraction.
The driving voltage for generating the electrostatic attraction must be increased.

SUMMARY OF THE INVENTION The present invention has been made in view of the above, and enables a shutter drive circuit and the like to be provided on a substrate on which a shutter is provided without reducing the substantial aperture ratio of the substrate. It is a first object of the present invention to enable manufacturing with simpler processes.

It is a second object of the present invention to reduce malfunctions and to form a high-contrast image on a screen.

It is a second object of the present invention to reduce the moving distance of the shutter without substantially lowering the aperture ratio, and to make it easier to open and close the shutter by electrostatic attraction.

[0014]

To achieve the above object, a spatial light modulator according to a first aspect of the present invention comprises a lens for condensing light, and a light condensed by the lens. A substrate having a through hole through which the light passes, and a substrate provided on the substrate, for passing the light incident on the through hole.
And a shutter for controlling non-passage.

According to a second aspect of the present invention, there is provided the spatial light modulator according to the first aspect, wherein the substrate comprises a light-transmitting substrate that transmits the light and a light-transmitting substrate. A non-light-transmitting substrate that is formed thereon and does not transmit the light, wherein the non-light-transmitting substrate includes the through-hole and the shutter.

According to a third aspect of the present invention, there is provided the spatial light modulator according to the first or second aspect, wherein a wall surface inside the through hole is inclined with respect to the substrate surface. Things.

In the spatial light modulator according to a fourth aspect of the present invention, in the spatial light modulator according to the third aspect, the shutter is provided at an opening of the through hole to shield the light. A shutter for opening the shutter by applying a voltage between the shutter and the wall inside the through hole, the member comprising a member and a support member for pivotally supporting the light shielding plate in the direction of the wall surface inside the through hole. It is.

According to a fifth aspect of the present invention, there is provided a spatial light modulator according to any one of the first to fourth aspects, wherein the substrate provided with the shutter is a single crystal substrate; The through holes are formed in the single crystal substrate by crystal axis anisotropic etching.

The spatial light modulator according to claim 6 of the present invention is the spatial light modulator according to claim 5, wherein the single crystal substrate is made of single crystal silicon having a (110) plane orientation. And the shutter is provided on a side of the opening of the through hole parallel to the <110> axis of the single crystal substrate.

According to a seventh aspect of the present invention, there is provided the spatial light modulator according to the sixth aspect, wherein the through holes are arranged in a honeycomb shape in the single crystal substrate. .

The spatial light modulator according to claim 8 of the present invention is the spatial light modulator according to any one of claims 1 to 7, further comprising a lens substrate having a plurality of the lenses. A space between the substrate and the substrate on which the shutter is formed is sealed to form a vacuum or substantially a vacuum, and the shutter is positioned in the space.

The spatial light modulator according to a ninth aspect of the present invention is the spatial light modulator according to the eighth aspect, wherein the space on the lens substrate is sealed, and the pressure in the space is lower than the atmospheric pressure. And the pressure is set to be higher than the atmospheric pressure in the vacuum or the substantially vacuumed space.

According to a tenth aspect of the present invention, there is provided the spatial light modulator according to any one of the first to ninth aspects, wherein the lens substrate has a light-transmitting surface on the shutter side. A conductive layer is provided, and a predetermined voltage is applied to each of the light-transmitting conductive layer, the inner wall of the through hole, and the shutter to open and close the shutter.

The spatial light modulator according to claim 11 of the present invention is the spatial light modulator according to claim 10,
A substrate provided with the shutter includes a driving circuit for driving the shutter, electrically connecting the light-transmitting conductive layer to the driving circuit, and connecting the light-transmitting conductive layer to a reference of the driving circuit. A voltage or a power supply voltage is applied.

A spatial light modulator according to a twelfth aspect of the present invention is the spatial light modulator according to any one of the first or third to eleventh aspects, wherein the substrate is provided with the shutter. The low resistance layer is provided on the surface opposite to the surface.

A spatial light modulator according to a thirteenth aspect of the present invention is the spatial light modulator according to any one of the first or third to eleventh aspects, wherein the substrate is provided with the shutter. A light shielding layer is provided on the surface opposite to the surface.

According to a fourteenth aspect of the present invention, there is provided the spatial light modulator according to any one of the second to eleventh aspects, wherein the translucent substrate is provided on the non-translucent substrate. A light-transmitting conductive layer is provided on the contacting surface.

According to a fifteenth aspect of the present invention, there is provided a spatial light modulator according to any one of the second to fourteenth aspects, wherein the spatial light modulator is provided between the translucent substrate and the non-translucent substrate. Is provided with a low resistance layer.

The spatial light modulator according to a sixteenth aspect of the present invention is the spatial light modulator according to any one of the second to fourteenth aspects, wherein the spatial light modulator is provided between the light-transmitting substrate and the non-light-transmitting substrate. Is provided with a light shielding layer.

[0030]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the spatial light modulator according to the present invention will be described below in detail with reference to the drawings.

[Embodiment 1] The spatial light modulator according to Embodiment 1 allows a drive circuit for driving a shutter to be provided in a substrate provided with the shutter, thereby facilitating opening and closing of the shutter by electrostatic attraction. It is possible to do it. That is, the spatial light modulator according to the first embodiment is provided on a substrate having a lens for condensing light, a substrate provided with a through hole through which the light condensed by the lens enters, and through which the light passes. And a shutter for controlling passage / non-passage of the light incident on the through-hole. Hereinafter, the configuration of the spatial light modulator will be described in detail based on (first embodiment) and (second embodiment).

(First Example) FIG. 1 is a configuration diagram showing a configuration of a spatial light modulator according to a first example of the first embodiment. The spatial light modulator shown in FIG. 1 includes a microlens substrate 102 including a microlens 101 for condensing light from a light source (not shown), and a through hole 103 for passing the light condensed by the microlens 101. Provided substrate 104,
A flap-type shutter 105 for controlling the passage / non-passage of light passing through the through-hole 103.

The substrate 104 is made of a semiconductor such as Si, Ge, C, or a compound semiconductor (GaAs, GaP, GaInAs) composed of Ga, As, In, P, Al, or the like.
P, InP, etc.) or a compound semiconductor (ZnSe, CdS, C) composed of Zn, Te, S, Se, Cd, etc.
dTe etc.) can be used. Further, as the substrate 104, a light-transmitting substrate using quartz, borosilicate glass (for example, 7740 or 7070 manufactured by Corning Incorporated), low-melting glass, soda glass, or the like may be used.

2 to 4 show the structure of the flap type shutter 105 shown in FIG. 1, FIG. 2 is a plan view, and FIG.
2 is a sectional view taken along line AA ′ in FIG. 2, and FIG.
It is sectional drawing in -B '. The shutter 105 includes two light shielding plates 105a and a torsion bar 105b respectively supporting the two light shielding plates 105a. The torsion bar 105b is fixed to the surface of the substrate 104.

Next, the operation of the spatial light modulator according to the first embodiment having the above configuration will be described.

As shown in FIG. 1, the collimated light enters the microlens 101 from the light source side. The incident light becomes parallel light whose spot diameter is reduced by the microlens 101 and is applied to the opening of the through hole 103 of the substrate 104. The light applied to the opening of the through-hole 103 can be controlled to pass or not to pass through the through-hole 103 by opening and closing the light-shielding plate 105 a of the flap-type shutter 105.

That is, the shutter 10 shown in FIG.
5 is closed, the opening of the through hole 103 of the substrate 104 is optically closed by the two light shielding plates 105a, and light does not pass through the through hole 103 (closed state). on the other hand,
When a potential difference is applied between the light shielding plate 105a and the wall 106 of the through hole 103 by a power supply (not shown), an electrostatic attraction acts between the two, and as shown in FIG.
Adsorb to the wall 106 of No. 03 (open state). In the open state, light passes through the through-hole 103. When the voltage is not applied, the light shielding plate 105a is moved by the spring force of the torsion bar 105b as shown in FIG.
The state returns to the closed state shown in FIG.

Since the spot diameter of the light incident on the shutter 105 is made smaller than the period of the shutter 105 by the microlens 101, the spatial light modulator of the first embodiment has a smaller diameter than the conventional spatial light modulator than the conventional spatial light modulator.
Opening area can be reduced. Therefore, the interval P (see FIG. 1) with another adjacent shutter 105 can be increased. As a result, the adjacent shutter 1
A circuit for driving the shutter 105 can be arranged in a region between 05. Thus, there is no need to provide a substrate other than the substrate 104 and provide a drive circuit for the shutter 105 on this substrate, so that the configuration of the spatial light modulator and the manufacturing process can be simplified.

As shown in FIG. 5, in the spatial light modulator of the first embodiment, light is irradiated only on the light shielding plate 105a. Therefore, when the shutter 105 is closed, light leaks only from a part of the gap of the light shielding plate 105a. On the other hand, in the conventional spatial light modulator, light is applied to the entire gap between the light shielding plate and the opening as shown in FIG. Therefore, light leaks from the entire gap of the opening. As described above, the spatial light modulation device of the first embodiment has less leakage light when the shutter 105 is in the closed state, so that an image or the like projected on a screen via the spatial light modulation device is smaller than the conventional spatial light modulation device. Can be improved.

(Second Embodiment) FIG. 7 shows a second embodiment of the first embodiment.
FIG. 8 is a configuration diagram showing the configuration of the spatial light modulator according to the embodiment.
FIG. 9 is a plan view of the spatial light modulator shown in FIG. 7, and FIG. 9 is an explanatory diagram for explaining an open / close state of a shutter of the spatial light modulator shown in FIG.

The shutter 10 of the spatial light modulator shown in FIG.
Reference numeral 5 denotes a slide shutter provided with a beam 105c for horizontally moving the light shielding plate 105a on the surface of the substrate 104 instead of the torsion bar. Light shielding plate 105a and fixed electrode 1
At 07, a comb-shaped electrode is formed. Light shield 105
a is a power supply 11 via the anchor 108 and the wiring 109.
0, and the fixed electrode 107 is also connected to the power supply 110.

When a voltage is applied between the light-shielding plate 105a and the fixed electrode 107, an electrostatic attraction acts between them and the light-shielding plate 105a is applied.
a moves in the direction of the fixed electrode 107 (FIG. 9B). Thus, the shutter 105 is opened. When the application of the voltage is stopped, the light shielding plate 105a returns to the closed state due to the return force of the spring of the beam 105c (FIG. 9A).

In the spatial light modulator of the second embodiment shown in FIGS. 7 to 9, the torsion bar 105b of the first embodiment is also used.
The same effect as in the case of the shutter 105 using the same can be obtained. In addition, as described above, since the width of the through hole 103 of the substrate 104 is smaller than that of the related art, the shutter 105
Has the effect that the required moving distance can be reduced.

FIG. 10 is an explanatory diagram showing an application example of the spatial light modulator according to the first embodiment. The spatial light modulator shown in FIG. 10 includes a set of three shutters 105 for controlling the passage and non-passage of the light of the three primary colors of RGB. Thus, the light separated into the three primary colors of RGB from different angles is transmitted through the through-hole 103 through the microlens 101.
Irradiate the light of each color of R, G, B by the shutter 105 corresponding to each light.
Non-passage can be controlled. Therefore, by using the spatial light modulator shown in FIG. 10, a projection display capable of full-color display can be realized.

[Second Embodiment] In the spatial light modulator according to the first embodiment, the substrate 104 provided with the shutter 105 may have a thickness of at least about 200 μm in order to maintain mechanical rigidity. is necessary.
Further, in order to reduce the area of one spatial light modulator and increase the number of spatial light modulators obtained from one silicon wafer, the pitch of the shutter 105, that is, the pixel density must be increased. For example, in order to form a 30 mm square spatial light modulator, the pitch must be about 40 μm. In other words, the depth of the through-hole 103 becomes five times or more the two-dimensional size (length and width of the window) of the through-hole 103.

On the other hand, when the light incident by the microlens 101 provided on the substrate 104 is converted into parallel light and is incident on the through-hole 103, the light incident on the spatial light modulator is completely parallel light due to the performance of the lens. Instead, it has a slight radiation angle. Therefore, when the light incident at this angle is introduced into the through-hole 103 of the deep hole as described above, a part of the light is transmitted to the through-hole 10 as shown in FIG.
The third wall 106 will be hit. Wall 1 of through hole 103
Since 06 is not a mirror surface, the light hitting the wall 106 is scattered in random directions. Most of the scattered light is a projection lens (not shown) provided below the substrate 104.
Since the light is not incident on the screen, no image is formed on the screen, which causes a decrease in luminance. As a means for solving this, it is conceivable to reduce the thickness of the substrate 104 on which the shutter 105 is provided to several tens μm or less. In this case, the rigidity of the substrate 104 is extremely weak, and the substrate 104 may be easily broken. There is.

Therefore, the spatial light modulator according to the second embodiment forms an image on a screen via the spatial light modulator without reducing the mechanical rigidity of the spatial light modulator of the first embodiment. This is to improve the brightness and image quality of the image.

FIG. 12 is a configuration diagram showing a configuration of a spatial light modulator according to Embodiment 2 of the present invention. Note that FIG.
In the spatial light modulator shown in (1), the same components as those in the spatial light modulator of Embodiment 1 shown in FIG. 1 are denoted by the same reference numerals, and description thereof will be omitted.

The spatial light modulator shown in FIG.
4 comprises a glass substrate 201 which is a light-transmitting substrate and a silicon substrate 202 which is a non-light-transmitting substrate formed on the glass substrate 201, and a shutter 105 is provided on the silicon substrate 202. ing.

The silicon substrate 202 has a shutter 105
And a circuit for driving the same, and the thickness thereof is formed thinner than the glass substrate 201. Specifically, the thickness is preferably several tens μm or less, but is not limited thereto.

The silicon substrate 2 was used as a non-translucent substrate.
02, but not limited to silicon, a semiconductor such as Ge, C, or a compound semiconductor (GaAs, GaP, GaInAs) composed of Ga, As, In, P, Al, or the like.
P, InP, etc.) or a compound semiconductor (ZnSe, CdS, C) composed of Zn, Te, S, Se, Cd, etc.
dTe or the like may be used.

Since the glass substrate 201 needs to support the silicon substrate 202 which is thin and has low mechanical strength, the thickness is preferably several hundred μm or more, but is not limited to this. In addition, as the glass substrate, quartz, borosilicate glass (for example, 7740, 707 of Corning Co., Ltd.)
0), low melting point glass, soda glass, and other materials can be used.

Next, an outline of a method for manufacturing the spatial light modulator having the above configuration will be described. FIGS. 13 (a) to 13 (d)
FIG. 13 is an explanatory diagram for describing a manufacturing process of the spatial light modulation element according to the second embodiment.

First, in FIG. 13A, an n-type semiconductor layer 204 to be a silicon substrate 202 is formed on a p-type semiconductor substrate 203 by epitaxial growth. Then n
A circuit section 205 for driving the shutter 105 is formed in the mold semiconductor layer 204 by a CMOS process. Then n
After forming an oxide film (or a nitride film) 206 on the type semiconductor layer 204, a metal layer 207 such as aluminum is formed on the oxide film 206. Then, the metal layer 207 and the oxide film 206 are patterned. The metal layer 207 forms a wiring pattern with the shutter 105, and the oxide film 206 forms an opening window for forming the through-hole 103 by insulating the wiring and performing anisotropic etching.

Next, referring to FIG. 13B, the reinforcing plate 20 is formed on the patterned metal layer 207 and the oxide film 206.
8 is temporarily fixed, and the p-type semiconductor substrate 203 is etched by electrochemical etching. Etching stops at the pn junction surface, leaving the peripheral p-type semiconductor substrate 203. After the etching, a thin n-type semiconductor layer 204 remains.

In FIG. 13C, the glass substrate 209 serving as the above-described glass substrate 201 is bonded by anodic bonding, an ultraviolet-curing adhesive, a thermosetting adhesive, an anaerobic adhesive, or the like. . Subsequently, the reinforcing plate 208 is removed.

In FIG. 13D, the n-type semiconductor layer 20
4 is etched by wet etching to form a through hole 1
03 is formed. As a result, the silicon substrate 20 having the glass substrate 201, the through hole 103, and the shutter 105
2 are formed.

As described above, according to the spatial light modulator according to the second embodiment, since the thickness of the silicon substrate 202 is reduced, incident light is transmitted through the through hole 103 of the silicon substrate 202.
Can be prevented from hitting the wall 106. Further, the light that has passed through the through-hole 103 is incident on the glass substrate 201 having a high transmittance with respect to visible light, so that the transmitted light is not scattered here. Therefore, it is possible to prevent the scattered light from being incident on the projection lens and lowering the luminance.

Also, in the spatial light modulator according to the second embodiment, as shown in FIG.
As a set, and RGB from different angles as in prior art 3.
By entering the light decomposed into the three primary colors into the through-holes 103, each shutter 105 can control the light of the corresponding color. This makes it possible to realize a projection type display capable of performing full-color display with one spatial light modulation element.

Further, in the spatial light modulator according to the second embodiment, not only the flap-type shutter described in the first embodiment but also the slide-type shutter shown in FIGS. 7 to 9 can be used. Nor.

[Third Embodiment] In the spatial light modulator described in the first embodiment, the incident light is narrowed to be smaller than the lens diameter by the microlens 101 provided on the substrate 104, and is incident on the through hole 103. . The light incident on the through-hole 103 has a parallel light or a beam waist at a specific position. Generally, in the case of parallel light, the spot of the light (width of the parallel light) does not become several tens μm or less. Therefore, the width of the through hole 103 must be equal to or larger than the light spot. For example, the pitch of the through holes 103 is 50 μm.
Assuming that the number of pixels on one side of the spatial light modulation element is 2,000 at m, one side of the spatial light modulation element is 50 μm × 2000 = 10
0 mm, which is very large. In this case, the number of spatial light modulators obtained from one silicon wafer is about several, resulting in an increase in cost.

On the other hand, light having a beam waist (light condensed by a microlens) has a spot diameter of about several μm at the position of the beam waist. Therefore,
If such light is used, the aperture pitch can be reduced to about 10 μm, and the size of the spatial light modulator can be reduced to about 20 mm. That is, the number of spatial light modulators obtained from one silicon wafer increases, and the cost can be reduced.

However, when light having a beam waist is introduced, the light hits the wall 106 of the through hole 103 (so-called vignetting). Since the wall 106 of the through-hole 103 is not a mirror surface, light hitting the wall 106 is scattered in random directions. Most of the scattered light does not enter the projection lens and is not imaged on the screen. Therefore, it causes a decrease in luminance (see FIG. 11).

Therefore, the spatial light modulator according to the third embodiment reduces the size of the spatial light modulator and reduces the luminance of an image or the like formed on a screen via the spatial light modulator. It is something without. That is, the spatial light modulator according to the third embodiment has a configuration in which the wall surface inside the through hole is inclined with respect to the substrate surface in the spatial light modulators of the first and second embodiments. Hereinafter, the configuration of the spatial light modulator will be described in detail based on (first embodiment) to (fourth embodiment).

(First Example) FIG. 14 is a configuration diagram showing a configuration of a spatial light modulator according to a first example of the third embodiment. In the spatial light modulator shown in FIG. 14, the same components as those of the spatial light modulator of Embodiment 1 shown in FIG. 1 are denoted by the same reference numerals, and description thereof will be omitted.

The spatial light modulator shown in FIG. 14 is the same as the spatial light modulator described in the first embodiment except that the wall 301 of the through hole 103 is inclined with respect to the surface of the substrate 104.

In the spatial light modulator shown in FIG.
The light from the light source is collected by the microlens 101. The angle of inclination of the wall 301 of the through hole 103 is adjusted to the angle of the collected light. Therefore, through hole 1
The light incident on the through-hole 103 is entirely incident on the projection lens 302 without light being blocked by the wall 301 of 03. Further, since the light spot diameter can be reduced to about several μm by condensing the light with the micro lens 101, the interval between the shutters 105 can be reduced. That is, the size of the spatial light modulator can be reduced, and its manufacturing cost can be reduced.

(Second Example) FIG. 15 is a configuration diagram showing a configuration of a spatial light modulator according to a second example of the third embodiment. The spatial light modulator shown in FIG. 15 is the same as the spatial light modulator described in Embodiment 2 except that the silicon substrate 202
The wall 301 of the through hole 103 is inclined with respect to the surface.

By inclining the wall 301 of the through hole 103 in this manner, the same effect as that described in the first embodiment can be obtained. Also, in the spatial light modulator of the second embodiment, compared to the case where the wall 301 has no inclination,
Since the area where the silicon substrate 202 and the glass substrate 201 are in contact with each other can be increased, the bonding strength between the silicon substrate 202 and the glass substrate 201 can be increased.

(Third Example) FIG. 16 is a configuration diagram showing a configuration of a spatial light modulator according to a third example of the third embodiment. In the spatial light modulator shown in FIG. 16, a substrate 104 is joined to a microlens
And the interface of the microlens substrate 102. Therefore, it is possible to prevent light incident on the through hole 103 of the substrate 104 from being shaken by the wall 301 of the through hole 103.

(Fourth Embodiment) FIG. 17 is a configuration diagram showing a configuration of a spatial light modulator according to a fourth embodiment of the third embodiment. In the spatial light modulator shown in FIG. 17, the substrate 104 is bonded to the microlens substrate 102, and the focal point is set to the substrate 104.
In addition to the surface, the inclination of the wall 301 of the through hole 103 is opposite to that of the third embodiment. Therefore, the light incident on the through hole 103 of the substrate 104 is
It is possible to prevent shaking by the wall 301 of the through hole 103.

The through hole 1 having the inclined wall 301
No. 03 can be formed by dry etching in which oxygen is mixed with an etching gas using a photoresist as a masking film. Further, even in wet etching in which etching is performed while the masking film is retracted, the wall surface of the through-hole 103 can be inclined.

The spatial light modulator according to the third embodiment also has three shutters 105 as shown in FIG.
Are set as a set, and the light separated into the three primary colors of RGB is incident on each through-hole 103 from different angles, so that the passage and non-passage of each light of RGB can be controlled.
This makes it possible to realize a projection type display capable of performing full-color display with one spatial light modulation element.

Further, in the spatial light modulator according to the third embodiment, both the flap shutter and the slide shutter described in the first embodiment can be applied.

Fourth Embodiment In the first and second prior art spatial light modulators described above, the shutter is driven by electrostatic attraction. The reason for using the electrostatic attraction is that the required structure of the electrodes and the like is simple and the energy density in the order of micrometers is high. However, since the strength of the electrostatic attraction is inversely proportional to the square of the distance, when the fixed electrode and the shutter are arranged at a long distance, the obtained electrostatic attraction is weak, which is sufficient unless a high driving voltage is applied. The movement of the shutter 105 cannot be caused. On the other hand, in the first and second conventional examples, a flap type shutter is used to increase the aperture ratio when the shutter is opened, that is, to increase the brightness of an image formed on a screen via a spatial light modulator. It must be rotated 90 degrees.
Therefore, in order to obtain a drive voltage of about 30 V or less,
A large shutter having a torsion bar length of 150 μm or more must be used. When the spatial light modulator using the shutter is used for displaying a video image, one side of the spatial light modulator becomes as large as 300 mm or more.

The spatial light modulator of the fourth embodiment is designed to reduce the size of the shutter without lowering the aperture ratio and without increasing the drive voltage of the flap type shutter.

FIGS. 18 to 20 are configuration diagrams showing the configuration of the spatial light modulator according to the fourth embodiment. FIG. 18 is a plan view, and FIG. 19 is a view taken along line CC 'of FIG. FIG. 20 is a cross-sectional view taken along line DD ′ of FIG. In the fourth embodiment, the same components as those of the spatial light modulators of the first to third embodiments are denoted by the same reference numerals, and detailed description thereof will be omitted.

The spatial light modulator shown in FIGS.
The flap-type shutter 105 described in the first embodiment is provided, and the wall 401 inside the through-hole 103 is the substrate 104.
The light shielding plate 105 a of the shutter 105 is connected to the surface of the substrate 104 by a torsion bar 105 b provided on one side of the opening of the through hole 103.

In the spatial light modulator having such a configuration, the wall 401 inside the through hole 103 and the light shielding plate 105a
A drive voltage is applied by the power supply 402 during the period. When a voltage is applied between the wall 401 inside the through-hole 103 and the light-shielding plate 105a, an electrostatic attraction acts between the two and the light-shielding plate 10a.
5a is adsorbed on the wall 401 and the shutter 105 is opened.

In the conventional spatial light modulator, the angle between the shutter and the wall inside the through hole when the shutter is closed is 90 degrees. In the case of the spatial light modulator according to the fourth embodiment, the wall 401 inside the through hole 103 is formed to be inclined at a predetermined angle. Here, it is assumed that the inclination angle of the wall 401 is 45 degrees. When the same drive voltage is applied to the case where the inclination angle of the wall 401 is 90 degrees and the case where the inclination angle of the walls 401 is 45 degrees, the 45-degree wall has about four times the electrostatic attraction as compared with the 90-degree wall. Obtainable. As a result, the torsion spring constant of the torsion bar 105b can be quadrupled. That is, when the torsion bars 105b have the same sectional shape, the length can be reduced to 1/4. Therefore, the size of the shutter 105 can be reduced, the size of the spatial light modulator can be reduced, and the manufacturing cost can be reduced.

Although not shown in FIGS. 18 to 20, the spatial light modulator according to the fourth embodiment is shown in FIGS. 14 to 16 (third embodiment) in combination with a microlens or a glass substrate. It can be configured similarly to the spatial light modulator shown.

Also in the spatial light modulator of the fourth embodiment, as shown in FIG. 10, three shutters 105 are formed as one set, and light separated into three primary colors of RGB from different angles as in the prior art 3 is used. By entering, each shutter 1
At 05, light of the corresponding color can be controlled. This makes it possible to realize a projection type display capable of performing full-color display with one spatial light modulation element.

[Fifth Embodiment] As a method for forming the through-hole having the inclined wall described in the fourth embodiment in single-crystal silicon, a mixed solution of fluorine, nitric acid, water and ethyl alcohol is used as an etchant. Is etched, or RIE is performed using a mixed gas of SF ₆ , CCl ₄ , and oxygen as a resist masking film.
(Reactive Ion Etching) is a method of etching silicon. However,
These methods have a low etching speed, and the through-hole 103 formed by these methods has a problem in shape accuracy. For this reason, problems such as malfunction of the shutter 105 and increase in processing cost occur.

Therefore, the spatial light modulator according to the fifth embodiment has a through-hole which can be formed at a high etching speed and has a high shape accuracy.

In the spatial light modulator of the fifth embodiment, a single crystal substrate such as silicon is used as the substrate 104.
The through-hole 103 formed in the substrate 104, particularly the through-hole 103 having the inclined wall 501, is formed by using an etching solution having an etching rate that varies depending on the orientation of the crystal plane of the substrate 104. For example, when the single crystal silicon is etched by the etchant shown in Table 1, the etch rate of the (100) plane is at least 15 times that of the (110) plane, and about 600 times if it is large.

[0086]

[Table 1] (Table 1 shows the substrate and etching solution (etchant)
Are shown. )

FIGS. 21 to 23 show examples in which a spatial light modulator is formed by utilizing anisotropic etching of single crystal silicon. 21 to 23 are configuration diagrams showing the configuration of the spatial light modulator according to the fifth embodiment. FIG. 21 is a plan view, FIG.
2 is a cross-sectional view taken along line EE 'of FIG. 21, and FIG.
It is sectional drawing in line FF 'of FIG. 21 to 23
In the spatial light modulator shown in FIG. 1, a single crystal silicon substrate is used as the substrate 104, and this single crystal silicon substrate is (10
0) through-hole 1 with plane orientation and parallel to (110) axis
The torsion bar 105b is connected to the side 03.

By etching the single crystal substrate with an etchant as shown in Table 1, the accuracy of the shape is high and the inner wall 501 inclined at a high etching speed is obtained.
Can be formed, and a low-cost spatial light modulator with less malfunction can be obtained.

In the spatial light modulator according to the fifth embodiment as well, as shown in FIG. 10, three shutters 105 are formed as one set, and light separated into three primary colors of RGB from different angles as in the prior art 3 is used. By entering, each shutter 1
At 05, light of the corresponding color can be controlled. This makes it possible to realize a projection type display capable of performing full-color display with one spatial light modulation element.

[Sixth Embodiment] In the spatial light modulator of the fourth embodiment shown in FIGS.
In order to increase the electrostatic attraction for rotating the light shielding plate 105a, it is sufficient that the wall 601 of the through hole 103 parallel to the axis serving as the rotation center of the light shielding plate 105a is inclined. Therefore, the through hole 103 orthogonal to the rotation axis of the light shielding plate 105a
The inclination of the wall 602 is unnecessary, and if it is present, the interval between the adjacent through-holes 103 increases, and the size of the spatial light modulator increases. Therefore, there is a problem that the cost increases.

Therefore, the spatial light modulator according to the sixth embodiment is designed to reduce the size of the entire device.

27 to 29 are structural diagrams showing the structure of the spatial light modulator according to the sixth embodiment. FIG. 27 is a plan view, and FIG. 28 is a sectional view taken along line II 'of FIG. 2
FIG. 9 is a sectional view taken along line JJ ′ of FIG. In addition,
In the spatial light modulator of the sixth embodiment, the first embodiment
The same components as those of the spatial light modulator described in 5 are denoted by the same reference numerals, and description thereof will be omitted.

In the spatial light modulator according to the sixth embodiment, a single crystal silicon substrate is used as the substrate 104. The single crystal silicon substrate 104 has a plane orientation of the (110) plane, and is provided with a torsion bar 105b parallel to the <1 bar 10> axis, and a light shielding plate 105a is connected to the torsion bar 105b.

In the spatial light modulator according to the sixth embodiment, the light shielding plate 105a of the shutter 105 and the through hole 103
Walls 603 face each other at an angle of 35.26 degrees. Therefore, since the angle is smaller than the inclination angle (54.74 degrees) when using single crystal silicon having the (100) plane orientation, the electrostatic attraction is 2 when the same voltage is applied.
About 2.5 times larger. Therefore, the shutter 105 can be driven with a lower voltage (about 0.6 times that in the case of the (100) plane).

The wall 604 of the through hole 103 on the side parallel to the <1 bar 12> axis and the <1 bar 1 bar 2> axis is perpendicular to the surface of the substrate 104. Therefore, FIG.
When the shutters 105 are arranged in an array as shown in FIG.
The interval between the shutters 105 can be made narrower than when the (100) plane shown in FIG. 31 is used. Accordingly, since the density of the shutter 105 can be increased, the size of the spatial light modulator can be reduced, and the cost can be reduced.

In the spatial light modulator of the sixth embodiment, as shown in FIG. 10, three shutters 105 are formed as a set, and light separated into three primary colors of RGB from different angles as in the prior art 3 is used. By entering, each shutter 1
At 05, light of the corresponding color can be controlled. This makes it possible to realize a projection type display capable of performing full-color display with one spatial light modulation element.

[Embodiment 7] Embodiment 1 shown in FIG.
In the spatial light modulator of the above, the microlens substrate 102 is provided on the substrate 104 on which the shutter 105 is provided. When the spatial light modulator is configured as described above, the shutter 105 and the microlens 101 are two-dimensionally arranged in an array. Due to problems such as diffraction occurring around the microlens 101, the performance of the microlens 101 is higher when it is circular. On the other hand, to increase the aperture ratio, it is necessary to increase the ratio of the area occupied by the microlenses 101 to the area of the microlens substrate 102 on which the microlenses 101 are arranged. For this purpose, the ratio can be maximized by arranging the circular microlenses 101 in a honeycomb shape on a glass substrate, that is, by closest packing. Therefore, it is necessary to arrange the shutter 105 in a honeycomb shape in accordance with the arrangement of the microlenses 101.
Also, with regard to the through holes 103, the dimensions of the spatial light modulator can be reduced by arranging the through holes 103 in the substrate 104 at a high density so as to reduce the distance between the through holes 103 when they are arranged in a honeycomb shape. By arranging the micro lens 101 and the shutter 105 in this way, if the size of the spatial light modulator is the same, the size of the shutter 105 can be increased, and the micro lens 101 and the shutter 1 can be enlarged.
05 can be set lower.

Therefore, in a seventh embodiment, a configuration in which spatial light modulation elements are arranged in a honeycomb shape will be described. In the spatial light modulator of the seventh embodiment, the same components as those of the spatial light modulator described in the first to sixth embodiments are denoted by the same reference numerals, and description thereof will be omitted.

The microlens 101 is generally a substrate 1
04 when viewed from above. By arranging the microlenses 101 on the surface of the substrate 104 with the highest density, more light can be collected on the shutter 105. In order to fill the circular micro lenses 101 at the highest density, they must be arranged in a honeycomb shape as shown in FIG. In addition, the shutter 105 is mounted on the substrate 10 in accordance with the arrangement of the microlenses 101 shown in FIG.
4 must be lined up.

However, for example, as shown in FIG. 33, a shutter 10 using a (100) plane of a single crystal silicon substrate is used.
5 are arranged in a honeycomb shape, the shape of the through hole 103 below the shutter 105 is rectangular.
The corner of 3 becomes a dead space. On the other hand, when the shutters 105 using the (110) plane of the single crystal silicon substrate are arranged in a honeycomb shape as shown in FIG. 34, the dead space is reduced because the shape of the through hole 103 is hexagonal, and
0) The packing can be performed at a higher density than in the case of the plane. Therefore, the spatial light modulator can be made smaller, and the cost can be reduced. Also, (100)
When the shutter 105 of the (110) plane is arranged at the same density as that of the plane, the size of one shutter 105 can be increased, so that the spot diameter of the light narrowed down by the microlens 101 can be increased. A margin can be given to the design of the micro lens 101.

In the spatial light modulator of the seventh embodiment as well, as shown in FIG. 10, three shutters 105 are formed as a set, and light separated into three primary colors of RGB from different angles as in the prior art 3 is used. By entering, each shutter 1
At 05, light of the corresponding color can be controlled. This makes it possible to realize a projection display capable of performing full-color display with one spatial light modulator (FIG. 35).

[Eighth Embodiment] In the spatial light modulator of the first to seventh embodiments, the size of the shutter 105 is at most about several tens of μm. Therefore, since the mass of the shutter 105 is very small, the operation speed and the response become slow due to the viscosity of the air. In order to prevent the shutter 105 from being corroded by oxygen or moisture in the air, the entire spatial light modulator is usually sealed using a window material for sealing, and a vacuum or an inert gas such as argon, helium, or nitrogen is used. At a very low pressure. However, if the sealing window material is provided so as to surround the outside of the spatial light modulator, the optical performance of the spatial light modulator deteriorates due to reflection and scattering of light by the window material.

Therefore, the spatial light modulator according to the eighth embodiment is designed so that the operating speed and response of the shutter are not reduced, and that the optical performance is not reduced.

The spatial light modulator according to the eighth embodiment seals the space between the microlens substrate and the substrate on which the shutter is formed to a vacuum or almost a vacuum, and locates the shutter in the space. It is. The spatial light modulator having such a configuration will be described below (first embodiment), (second embodiment).
(Example) and (Third Example) will be described in detail in this order. In the spatial light modulator of the eighth embodiment, the same components as those of the spatial light modulator described in the first to seventh embodiments are denoted by the same reference numerals, and description thereof will be omitted.

(First Example) FIG. 36 is a configuration diagram showing a configuration of a first example of the spatial light modulator according to the eighth embodiment. Silicon substrate 202 on glass substrate 201
Are the microlens substrate 102 and the solder glass 801
Is sealed. A lead frame 802 is inserted between the microlens substrate 102 and the glass substrate 201, and electrically connects a circuit (not shown) on the silicon substrate 202 and the outside together with the bonding wires 803.

The region (sealing region) 804 where the silicon substrate 202 is sealed is in a state of being filled with a vacuum or a very dilute inert gas (nitrogen, argon, helium, etc.). In such a state, the shutter 10
Since the resistance due to the viscosity of the gas does not act on the movement of the shutter 5, the operation speed of the shutter 105 can be improved as compared with the case where the security is not sealed (when the configuration of the eighth embodiment is not used). The problem of element deterioration due to dust and humidity in the atmosphere can be solved.

Further, in the spatial light modulator of the first embodiment,
The sealing is performed by the microlens substrate 102 and the glass substrate 201 and the solder glass 801 which are the minimum required as the spatial light modulator. That is, since no window material is separately provided, light reflection, diffraction, and scattering by the window material do not occur. Therefore, it is possible to prevent the deterioration of the projected image due to these.

(Second Example) FIG. 37 is a configuration diagram showing a configuration of a second example of the spatial light modulator according to the eighth embodiment. In the spatial light modulator of the second embodiment, the N.V. A. (Numerical appert
ure: numerical aperture). Therefore, it is necessary to keep the distance between the microlens substrate 102 and the silicon substrate 202 small and with high accuracy.

Between the microlens substrate 102 and the silicon substrate 202, there is provided a sealing material for keeping confidentiality and a seal and spacer 805 which also serves as a spacer for keeping the distance between them both constant. And the silicon substrate 20
A sealing region 804 is formed by a part of the two surfaces, the microlens substrate 102, and the sealing material / spacer 805. Also, the bonding wire 803 and the silicon substrate 2
The area outside the sealing area 804 of No. 02 is protected by the sealing material 806.

In the second embodiment, as in the first embodiment, the sealing region 804 is in a state of being filled with a vacuum or a very dilute inert gas (nitrogen, argon, helium, etc.). In such a state, the shutter 1
Since the resistance due to the viscosity of the gas does not act on the movement of the shutter 05, the operation speed of the shutter 105 can be improved as compared with the case where the security is not sealed (the case where the configuration of the eighth embodiment is not used). The problem of element deterioration due to dust and humidity in the atmosphere can be solved.

Further, in the spatial light modulator of the second embodiment,
The micro lens substrate 102 and the glass substrate 201 which are the minimum required as a spatial light modulator, and a seal / spacer 805
And sealing is performed. That is, since no window material is separately provided, light reflection, diffraction, and scattering by the window material do not occur. Therefore, it is possible to prevent the deterioration of the projected image due to these.

(Third Example) FIG. 38 is a configuration diagram showing a configuration of a third example of the spatial light modulator according to the eighth embodiment. The spatial light modulator of the third embodiment is configured such that the flat surface of the microlens substrate 102 of the spatial light modulator of the first embodiment is outside, and the spatial light modulator of the first embodiment is different from the spatial light modulator of the first embodiment. Similar effects can be obtained. In addition, making the flat surface of the microlens substrate 102 outward can be applied to the second embodiment. Further, the spatial light modulator according to the third embodiment has micro lenses 101 on both sides.
The present invention can also be applied to the microlens substrate 102 on which the irregularities are formed.

The solder glass 801 used in the spatial light modulators of the first and third embodiments includes a low-melting glass 7583 for sealing manufactured by Iwaki Glass Co., Ltd. and a glass manufactured by Nippon Electric Glass Co., Ltd. LS-0110, LS-0803, XS-1175 manufactured by Owens Ili Noise Co., Ltd., and KC-402 manufactured by Kyoto Ceramics Co., Ltd. can be used.
Further, an epoxy resin or the like can be used for the sealing material 806 of the second embodiment.

Further, in the spatial light modulator according to the eighth embodiment, as shown in FIG.
As a set, and RGB from different angles as in prior art 3.
When the light separated into the three primary colors is incident, each shutter 105 can control the light of the corresponding color. As a result, with one spatial light modulator,
A projection display capable of full-color display can be realized.

[Ninth Embodiment] In the spatial light modulator of the first to seventh embodiments described above, for example, when it is desired to enter parallel light whose spot diameter is narrowed by the microlens 101 into the through hole 103, the microlens substrate 102 It is necessary to reduce the thickness. As shown in FIG. 39, when a part of the light (a) condensed from the microlens 101 on the light source side enters the corresponding microlens 101 on the shutter 105 side, it enters the through hole 103 as parallel light. However, when the thickness of the microlens substrate 102 is large, some of the other light (b) does not become parallel light, and the adjacent microlens 1
01. Therefore, the light (b) becomes stray light, which causes a decrease in contrast and brightness of an obtained image.

In order not to generate the light (b), the microlens substrate 102 may be thinned. That is, the microlens 101 on the light source side and the shutter 105
Since the distance from the microlens 101 on the light source side becomes shorter, all the light once condensed by the microlens 101 on the light source side enters the corresponding microlens 101 on the shutter 105 side, and the above-described problem occurs. Absent.

On the other hand, when the configuration described in the eighth embodiment is applied to a spatial light modulator in which the microlens substrate 102 is thin, the microlens substrate 102 is deformed because the rigidity of the microlens substrate 102 is low. Problems occur in the optical characteristics.

Thus, the spatial light modulator according to the ninth embodiment has a problem in optical characteristics even when the thin microlens substrate 102 is used for the spatial light modulator described in the eighth embodiment. Is to prevent it from happening.

That is, the spatial light modulator according to the ninth embodiment differs from the spatial light modulator according to the eighth embodiment in that the space on the microlens substrate 102 is sealed and the pressure in the space is made lower than the atmospheric pressure. In addition, the pressure is higher than the pressure in a vacuum or a substantially evacuated space (sealing region 804). Hereinafter, the configuration of the spatial light modulator according to Embodiment 9 will be described in detail based on (First Example), (Second Example), and (Third Example).

(First Example) FIG. 40 is a configuration diagram showing a configuration of a first example of the spatial light modulator according to the ninth embodiment. The spatial light modulator according to the ninth embodiment is effective when the thickness of the microlens substrate 102 is prioritized over the degradation of image quality due to the provision of the window material 901 as shown in FIG. . In the spatial light modulation device of the first example, the second sealing region 902 is provided on the sealing region 804 (referred to as the first sealing region) of the first example (FIG. 36) of the eighth embodiment. It has become. That is, in the spatial light modulator of the first embodiment, the spatial light modulator of the eighth embodiment is mounted on a glass pedestal 903, and a window material 901 is arranged on the microlens substrate 102. A glass pedestal 903 is joined with a solder glass 904. Therefore, the second sealing region 902
Is formed in a region surrounded by the window material 901, the glass pedestal 903 and the solder glass 904.

As described above, the first sealing region 804 is in a state of being filled with a vacuum or a very dilute inert gas (such as nitrogen, argon, or helium). In such a state, since the resistance due to the viscosity of the gas does not act on the movement of the shutter 105, the operation speed of the shutter 105 is lower than that in the case where the security is not sealed (when the configuration of the ninth embodiment is not used). Can be improved, and the problem of element deterioration due to dust and humidity in the air can be solved.

Further, the second sealing region 902 has a pressure outside the first sealing region 804 and the second sealing region 902, that is, a pressure intermediate the pressure of the outside air. Since the silicon substrate 202 has already been protected by the first sealing region 804, the gas filling the second sealing region 902 may be air, but the same inert gas (nitrogen , Argon, helium, etc.) are preferred. By providing the second sealing region 902, the pressure difference applied to the microlens substrate 102 can be made smaller than in the case of the eighth embodiment. Therefore, even when the microlens substrate 102 is thinned, The distortion of the substrate 102 can be reduced. Therefore, the optical characteristics do not deteriorate, and the quality of the image projected by the spatial light modulator does not deteriorate.

(Second Example) FIG. 41 is a configuration diagram showing a configuration of a second example of the spatial light modulator according to the ninth embodiment. The spatial light modulator of the second embodiment is a glass substrate 20
In the first embodiment, the glass pedestal 903 described in the first embodiment has a role. In the spatial light modulator of the second embodiment, the same effect as that of the spatial light modulator of the first embodiment can be obtained.

(Third Embodiment) FIG. 42 is a configuration diagram showing a configuration of a third embodiment of the spatial light modulator according to the ninth embodiment. The spatial light modulator of the third example uses the spatial light modulator of the second example (FIG. 37) of the eighth embodiment. In other words, the spatial light modulator of the third embodiment is equivalent to the N.F. A. (Numerical a
Since the “perature: numerical aperture” is increased, it is effective when the distance between the microlens substrate 102 and the silicon substrate 202 needs to be small and maintained with high accuracy.
In the spatial light modulator of the third embodiment, the same effect as that of the spatial light modulator of the first embodiment can be obtained.

In the spatial light modulator according to the ninth embodiment, as shown in FIG.
As a set, and RGB from different angles as in prior art 3.
When the light separated into the three primary colors is incident, each shutter 105 can control the light of the corresponding color. As a result, with one spatial light modulator,
A projection display capable of full-color display can be realized.

[Embodiment 10] In the spatial light modulator according to any one of Embodiments 1 to 9, when the shutter 105 is changed from the closed state to the open state, the shutter 105 and the through hole 103 are used.
The shutter 105 is brought closer to the inner wall of the through hole 103 by using an electrostatic attraction generated by a potential difference between the inner wall and the inner wall, and the shutter 105 is opened. The shutter 105 at this time
The response speed of the torsion bar 105 depends on the inertial force of the mass of the shutter 105 itself, which tries to keep the shutter 105 in the closed state, in response to the electrostatic attraction that tries to open the shutter 105.
It is determined by the sum of the return forces of the spring b. That is, in order to increase the response of the shutter 105, the electrostatic attraction is increased, that is, the applied voltage may be increased.

However, when returning the shutter 105 from the open state to the closed state, the electrostatic attraction does not move, and the force for returning the shutter 105 to the closed state is only the return force of the spring of the torsion bar 105b. This spring constant is determined by the size and material of the torsion bar 105b. In particular, the dimensions are often limited by other factors such as the density required for the shutter 105, and cannot be freely set to a high value (strong spring force).
Therefore, the speed when the shutter 105 shifts from open to closed is slower than the speed when the shutter 105 shifts from close to open. This is a problem particularly when a high shutter speed is required, such as when displaying a moving image.

Therefore, in the spatial light modulator according to the tenth embodiment, even when the shutter 105 is changed from open to closed, the shutter moves at a sufficient response speed.

That is, the spatial light modulator according to Embodiment 10 is different from the spatial light modulator according to Embodiments 1 to 9 in that a light-transmitting conductive film is provided on the shutter-side surface of the microlens substrate. A predetermined voltage is applied to the photoconductive film, the wall inside the through hole, and the shutter to open and close the shutter. Hereinafter, the configuration of this spatial light modulator will be described as (first embodiment), (second embodiment) and (third embodiment).
It will be described in detail based on.

(First Example) FIG. 43 is a diagram showing a tenth embodiment.
1 is a configuration diagram illustrating a configuration of a first embodiment of a spatial light modulation device according to the present invention. In the spatial light modulator shown in FIG. 43, a voltage Vs is applied to a conductive light shielding plate 105a of a shutter 105 via a conductive torsion bar 105b, and a voltage is applied to a wall inside the through hole 103 via a silicon substrate 202. A bias voltage Vb is applied. A transparent conductive film 1001 that is transparent to visible light and is conductive to visible light is provided on the surface of the microlens substrate 102 on the shutter 105 side, and a voltage Vt is applied to the transparent conductive film 1001. As materials for the transparent conductive film 1001, In and Sn
Film made of a compound of O and O (typically Sn
O ₂ to be able to use IT film (In ₂ O _3), SnO ₂ film is a compound of 5 wt% including one) or In and Sn.

The operation of the spatial light modulator having the above configuration will be described. FIG. 44 is a timing chart showing the operation timing of the spatial light modulator of the first embodiment.
FIG. 3 is an explanatory diagram for explaining an operation of the spatial light modulator of the first embodiment. Here, Vs is set to a rectangular voltage fluctuating between the positive voltage Vh and the ground voltage, Vt is set to the ground voltage, and Vb is set to a constant positive voltage Vh.

At the time shown in FIG. 44, Vs = Vh, Vt
= 0 and Vb = Vh, there is a potential difference between the light shielding plate 105 a of the shutter 105 and the transparent conductive film 1001. Therefore, an electrostatic attraction Ft acts between the light shielding plate 105a and the transparent conductive film 1001, and the shutter 105 is connected to the transparent conductive film 1 of the microlens substrate 102 as shown in FIG.
001 is closed while being drawn.

Next, at the time of FIG. 44, Vs = 0,
Since Vt = 0 and Vb = Vh, there is a potential difference between the light blocking plate 105a and the wall inside the through hole 103. Therefore, an electrostatic attraction Fb acts between the light shielding plate 105a and the wall inside the through hole 103 (FIG. 45B), and the light shielding plate 105a is drawn to the wall inside the through hole 103. That is, the shutter 105 shifts from the closed state to the open state.

Further, at the time of FIG. 44, Vs = V
h, Vt = 0 and Vb = Vh, the light shielding plate 105a
And the transparent conductive film 1001 have a potential difference. Therefore, due to the electrostatic attraction Ft acting between the light shielding plate 105a and the transparent conductive film 1001 (FIG. 45 (c)), the light shielding plate 105a
Is attracted in the direction of the transparent conductive film 1001. That is, the shutter 105 shifts from the open state to the closed state.

As described above, even when the shutter 105 shifts from the open state to the closed state, the light shielding plate 105a and the transparent conductive film
001 and the torsion bar 1
The speed at which the shutter 105 shifts from the open state to the closed state can be increased as compared with the case where the light shielding plate 105a moves only by the return force of the spring 05b.

Second Example Next, a second example of the spatial light modulator according to the tenth embodiment will be described. FIG. 46 is a timing chart showing the operation timing of the spatial light modulator of the second embodiment, and FIG. 47 is an explanatory diagram for explaining the operation of the spatial light modulator of the second embodiment. The spatial light modulator of the second embodiment is the same as the spatial light modulator of the first embodiment except that the potential Vt applied to the transparent conductive film 1001 is a rectangular voltage.

The operation of the spatial light modulator according to the second embodiment will be described below.

At the time shown in FIG. 46, Vs = Vh, Vt = V
Since h and Vb = Vh, there is no potential difference between the light blocking plate 105a and the walls inside the transparent conductive film 1001 and the through-hole 103, and no electrostatic attraction works. Therefore, the spatial light modulator remains in the state shown in FIG.

At the next time, Vs = 0, Vt = 0, Vb
= Vh, there is a potential difference between the light blocking plate 105a and the wall inside the through hole 103. Therefore, the light shielding plate 105
a and the wall inside the through-hole 103, an electrostatic attraction Fb acts, and the light-shielding plate 105 a is drawn to the wall inside the through-hole 103. Here, the shutter 105 shifts from the closed state to the open state (FIG. 47B).

At time, Vs = Vh, Vt = 0, Vb =
Vh, the light shielding plate 105a and the transparent conductive film 1001
And there is a potential difference. Therefore, the electrostatic attraction Ft acts between the light shielding plate 105a and the transparent conductive film 1001, and the light shielding plate 105a is drawn to the transparent conductive film 1001. Here, the shutter 105 shifts from the open state to the closed state (FIG. 47C).

At the time, Vs = Vh, Vt = Vh, Vb
= Vh, the light shielding plate 105a and the transparent conductive film 100
1 and the wall inside the through hole 103, there is no potential difference,
No electrostatic attraction works. Therefore, the spatial light modulator remains in the state shown in FIG.

As described above, even when the shutter 105 shifts from the open state to the closed state, the light shielding plate 105a and the transparent conductive film
001 and the torsion bar 1
The speed at which the shutter 105 shifts from the open state to the closed state can be increased as compared with the case where the light shielding plate 105a moves only by the return force of the spring 05b. Further, since the light shielding plate 105a does not remain attracted to the transparent conductive film 1001 in the closed state, the gap between the two light shielding plates 105a becomes large, light leaks, and the contrast of the projected image decreases. Can be prevented.

(Third Example) Next, a third example of the spatial light modulator according to the tenth embodiment will be described. FIG. 48 is a timing chart showing the operation timing of the spatial light modulator of the third embodiment, and FIG. 49 is an explanatory diagram for explaining the operation of the spatial light modulator of the third embodiment. The spatial light modulator of the third embodiment is similar to the spatial light modulator of the second embodiment except that the potential Vt applied to the transparent conductive film 1001 is a rectangular voltage, and the others are the spatial light modulator of the first embodiment. It is the same as the modulation element.

Hereinafter, the operation of the spatial light modulator of the third embodiment will be described.

At the time shown in FIG. 48, Vs = Vh, Vt = V
Since h and Vb = Vh, there is no potential difference between the light blocking plate 105a and the walls inside the transparent conductive film 1001 and the through-hole 103, and no electrostatic attraction works. Therefore, the spatial light modulator remains in the state shown in FIG.

Next, at time, Vs = 0, Vt = 0, Vb
= Vh, there is a potential difference between the light blocking plate 105a and the wall inside the through hole 103. Therefore, the light shielding plate 105
a and the wall inside the through-hole 103, an electrostatic attraction Fb acts, and the light-shielding plate 105 a is drawn to the wall inside the through-hole 103. Here, the shutter 105 shifts from the closed state to the open state (FIG. 49B).

At time, Vs = 0, Vt = Vh, Vb =
Vh, the light shielding plate 105a and the transparent conductive film 1001
In addition, there is a potential difference between both the light shielding plate 105a and the wall inside the through hole 103. However, since the light shielding plate 105a is located very close to the wall inside the through hole 103, the light shielding plate 1
05a attracts to the transparent conductive film 1001
The electrostatic attraction Fb that draws the light-shielding plate 105a toward the wall inside the through hole 103 is larger. Therefore, the light shielding plate 10
Reference numeral 5a keeps the open state without leaving the inner wall of the through hole 103 (FIG. 49 (c)).

At the time, Vs = Vh, Vt = 0, Vb =
Vh, the light shielding plate 105a and the transparent conductive film 1001
And there is a potential difference. Therefore, the electrostatic attraction Ft acts between the light shielding plate 105a and the transparent conductive film 1001, and the light shielding plate 105a is drawn to the transparent conductive film 1001. Here, the shutter 105 shifts from the open state to the closed state (FIG. 49D).

At the time, Vs = Vh, Vt = Vh, Vb
= Vh, the light shielding plate 105a and the transparent conductive film 100
1 and the wall inside the through hole 103, there is no potential difference,
No electrostatic attraction works. Therefore, the spatial light modulator remains in the state shown in FIG.

As described above, even when the shutter 105 shifts from the open state to the closed state, the light shielding plate 105a and the transparent conductive film
001 and the torsion bar 1
The speed at which the shutter 105 shifts from the open state to the closed state can be increased as compared with the case where the light shielding plate 105a moves only by the return force of the spring 05b. Further, since the light shielding plate 105a does not remain attracted to the transparent conductive film 1001 in the closed state, the gap between the two light shielding plates 105a becomes large, light leaks, and the contrast of the projected image decreases. Can be prevented.

In the spatial light modulator of the first to third embodiments, the above-described operation can be performed even if Vh and 0 of each voltage are exchanged, that is, the voltage polarity is made negative.

In the spatial light modulator according to the tenth embodiment, as shown in FIG.
5 as one set, and RG from different angles as in prior art 3.
By inputting the light separated into the three primary colors B, each of the shutters 105 can control the light of the corresponding color. As a result, it is possible to realize a projection type display capable of performing full-color display with one spatial light modulation element.

[Eleventh Embodiment] The first embodiment described above.
In the invention of No. 0, the silicon substrate 202 on which the shutter 105 is formed includes not only the shutter 105 but also a transistor configured to apply a voltage to the shutter 105 and a wiring configured to input a signal and power to the transistor. The circuit is located. On the other hand, the silicon substrate 202 is provided with a through-hole 103 for transmitting light. Therefore, the presence of the through hole 103 causes the silicon substrate 20
2, the area for arranging the driving circuits on the second substrate is reduced. In particular, when the wiring width of the power supply and the GND line is small, the wiring resistance becomes high, which causes a malfunction.

Therefore, the spatial light modulator according to the eleventh embodiment is different from the spatial light modulator according to the tenth embodiment in that the drive circuit is provided with a margin and the power supply or the G
This is to reduce the erroneous operation by lowering the wiring resistance of the ND wiring.

FIG. 50 is a configuration diagram showing the configuration of the spatial light modulator according to the eleventh embodiment. The spatial light modulator shown in FIG. 50 has a transparent conductive film 1 on the surface of a silicon substrate 202.
001 and an electrode 1102 that connects between driving circuits 1101 provided on the silicon substrate 202.

The electrode 1102 also has a function as a spacer for determining the distance between the shutter 105 and the micro lens substrate 102. The electrode 1102 is connected to a ground potential of an external circuit and a power source (not shown) via a transparent conductive film 1001 provided on the microlens substrate 102. Since the transparent conductive film 1001 is at the ground potential as described above, a ground reference potential can be supplied from the electrode 1102 to the drive circuit 1101.

Therefore, according to the spatial light modulator of the eleventh embodiment, since it is not necessary to provide a wiring (so-called GND line) for supplying a ground potential on the silicon substrate 202, the transistor on the silicon substrate 202 and other Allowance for wiring layout. Further, since the transparent conductive film 1001 is present on the entire surface of the microlens substrate 102, the wiring resistance from the periphery of the microlens substrate 102 to the drive circuit 1101 of each shutter 105 is made much smaller than when the wiring is formed on the silicon substrate 202. be able to. Therefore, the malfunction of the spatial light modulator due to the high-resistance GND line can be reduced.

In the spatial light modulator shown in FIG. 50, since the transparent conductive film 1001 is at the ground potential, the shutter 105 can be opened and closed using the method described in the first example of the tenth embodiment. it can.

Further, the transparent conductive film 1001 can be used not only as a GND line but also as a power supply line for supplying a power supply voltage to the drive circuit 1101 on the silicon substrate 202.

[Twelfth Embodiment] In the spatial light modulator according to the first to eleventh embodiments, not only the shutter 105 but also the shutter 1 is mounted on the substrate on which the shutter 105 is formed.
A drive circuit including a transistor for applying a voltage to 05 and wiring for inputting a signal and a power supply to the transistor 05 is arranged. On the other hand, a through hole 103 for transmitting light is formed in the substrate on which the shutter 105 is formed. Therefore, the area for disposing the drive circuit is reduced due to the presence of the through-hole 103. In particular, when the wiring width of the power supply and the GND line is small, the wiring resistance becomes high, which causes a malfunction.

Therefore, the spatial light modulator according to the twelfth embodiment has a margin in the arrangement of the drive circuit, and lowers the power supply or GND wiring resistance to reduce malfunction.

FIG. 51 is a configuration diagram showing the configuration of the spatial light modulator according to the twelfth embodiment, and shows an example in which the spatial light modulator according to the eleventh embodiment is used. In the spatial light modulator according to the twelfth embodiment, the same components as those of the spatial light modulator according to the eleventh embodiment are denoted by the same reference numerals, and the description of the configuration and operation is omitted.

In the spatial light modulator shown in FIG. 51, a low resistance layer 1201 is provided on the back surface of the silicon substrate 202. The low resistance layer 1201 is connected to a power supply potential (Vdd) (not shown) at a peripheral portion of the silicon substrate 202. Power is supplied from the low resistance layer 1201 to the drive circuit 1101 via the silicon substrate 202 and the via electrode 1202.

FIG. 52 is a configuration diagram showing a schematic configuration of the drive circuit 1101. In FIG. 52, the silicon substrate 20
2, a digital circuit comprising CMOS gates 1206, 1208 is used as the drive circuit 1101. FIG. 52 shows only one gate for convenience of explanation. Here, as the low resistance layer 1201, a diffusion layer in which an n-type impurity is doped at a high concentration on the back surface of the silicon substrate 202 is used.

The power supply voltage supplied from the low-resistance layer 1201 is applied to the p-type through the n-type substrate 1203 and the via electrode 1202.
-Mos transistor 1206. Also, as described in Embodiment 11, the n-mos transistor 1208 in the p-well layer 1207 includes the electrode 1101 and the transparent conductive film 1 on the microlens substrate 102.
001 is connected to GND. Note that 120
Reference numerals 9 and 1210 denote gate electrodes, and reference numeral 1211 denotes a CMOS gate input terminal.

As described above, according to the spatial light modulator according to the twelfth embodiment, since it is not necessary to provide a wiring for supplying a power supply voltage on the silicon substrate 202, the silicon substrate 2
There is room for transistors and other wiring on the transistor 02. Further, since the low-resistance layer 1201 is present on the entire back surface of the silicon substrate 202, the wiring resistance from the periphery of the silicon substrate 202 to the drive circuit 1101 of each shutter 105 can be made much smaller than when wiring is performed on the silicon substrate 202. it can. Therefore, the malfunction of the spatial light modulator due to the high-resistance GND line can be reduced.

The low resistance layer 1201 can be used not only as a power supply voltage line but also as a GND line for supplying a ground potential to the drive circuit 1101 on the silicon substrate 202. In this case, the silicon substrate 202 is a p-type substrate, and the p-type substrate is formed in the n-well layer.
What is necessary is just to manufacture an -mos transistor and an n-mos transistor in a p-type substrate.

In the spatial light modulator shown in FIG. 51,
Although the transparent conductive film 1001 as a GND line is provided on the microlens substrate 102, the above-described effect can be obtained even without this.

The spatial light modulator according to the eleventh embodiment also has three shutters 10 as shown in FIG.
5 as one set, and RG from different angles as in prior art 3.
By inputting the light separated into the three primary colors B, each of the shutters 105 can control the light of the corresponding color. This makes it possible to realize a projection type display capable of performing full-color display with one spatial light modulation element.

[Embodiment 13] Embodiments 1 to 11
According to the invention, a substrate (semiconductor substrate) made of a semiconductor material such as silicon is used to provide a drive circuit on the substrate on which the shutter 105 is formed. However, semiconductor materials generally have higher transmittance to visible light than metal materials. In particular, when a semiconductor substrate having a small thickness is used, a problem arises in that the transmittance for visible light is high. For example, 20 μm
When the shutter is to be provided at intervals of, through holes cannot be formed unless the thickness of the semiconductor substrate is set to about 5 μm.
Is 24% for light having the wavelength of.

On the other hand, the light condensed or converted into parallel light by the microlens 101 and introduced into the through hole 103 may partially irradiate the semiconductor substrate. When the transmittance of the semiconductor substrate is the above-mentioned value, this light transmits through the semiconductor substrate and becomes stray light, which causes a decrease in contrast and brightness of an image on a screen.

On the substrate on which the shutter 105 is formed, not only the shutter 105 but also a drive circuit 1101 composed of a transistor for applying a voltage to the shutter 105 and a wiring for inputting a signal and power to the transistor is provided. Have been. On the other hand, a through hole 103 is formed in the substrate. Therefore, the area for disposing the drive circuit is reduced due to the presence of the through-hole 103. In particular, when the wiring width of the power supply and the GND line is small, the wiring resistance becomes high, which causes a malfunction.

The spatial light modulator according to the thirteenth embodiment is
An object of the present invention is to improve the image quality of a projection display using a spatial light modulator and to reduce malfunctions. That is, the spatial light modulator according to the thirteenth embodiment has a structure in which a light-shielding layer is provided on a surface of a substrate on which a shutter is formed, on a surface opposite to a surface on which the shutter is provided. Hereinafter, the configuration of the spatial light modulator will be described in detail based on (first embodiment) and (second embodiment).

(First Embodiment) FIG. 53 is a configuration diagram showing a configuration of a spatial light modulator according to a first embodiment. The spatial light modulator shown in FIG. 53 includes a light shielding layer 1301 that does not transmit visible light in portions other than the through holes 103 of the silicon substrate 202.
Is provided. By providing the light-blocking layer 1301, visible light transmitted through the thin silicon substrate 202 can be prevented from leaking from a portion other than the through-hole 103. Therefore, the contrast of the projected image can be improved.

The materials for the light-shielding layer that absorbs visible light include InAs, GaSb, InSb, PbS, and PbT.
e, Te or IR-DIB, IR-DI manufactured by Toshiba Corporation
A or the like can be used.

(Second Embodiment) FIG. 54 is a configuration diagram showing a configuration of a spatial light modulator according to a second embodiment. In the spatial light modulator shown in FIG. 54, the light shielding layer 1 of the first embodiment is used.
Instead of 301, a conductive light-shielding layer / low-resistance layer 1302 is provided. By using the light-shielding layer and low-resistance layer 1302, in addition to the role of shielding light transmitted through the silicon substrate 202, the low-resistance layer 1201 provided in the spatial light modulator according to the twelfth embodiment (see FIG. 51). ).

The light-shielding layer and low-resistance layer 1302 is connected to a power supply potential (Vdd) (not shown) at the periphery of the silicon substrate 202, and is connected to the light-shielding layer and low-resistance layer 1302 via the silicon substrate 202 and via electrode 1202. , Drive circuit 1
Power is supplied to 101.

As described above, according to the spatial light modulator of the second embodiment, since it is not necessary to provide a wiring for supplying a power supply voltage on the silicon substrate 202, the arrangement of transistors and other wiring on the silicon substrate 202 is not required. Can have a margin. Further, since the light-shielding layer / low-resistance layer 1302 is formed on the entire back surface of the silicon substrate 202, the driving circuit 1101 of each shutter 105 is arranged from the periphery of the silicon substrate 202.
Wiring resistance can be made much smaller than when wiring is formed on the silicon substrate 202. Therefore, the malfunction of the spatial light modulator due to the high-resistance power supply voltage line can be reduced.

The light-shielding layer and low-resistance layer 1302 is used not only as a power supply voltage line but also as a silicon substrate 20.
G for supplying the ground potential to the drive circuit 1101 on
It can also be used as an ND line.

The materials of the light-shielding layer / low-resistance layer 1302 include InAs, GaSb, InSb, PbS, and PbS.
bTe, Te doped with impurities for lowering resistance, or Ag, Au, Cd, Pb, C
u, Pd, Pt, Sn, Zn, particularly preferably Al, Co, Cr, Fe, M having good adhesion to silicon oxide.
g, Mo, Ni, Ta, Ti, V, W, Zr, etc. can be used.

In the spatial light modulator according to the thirteenth embodiment, as shown in FIG.
5 as one set, and RG from different angles as in prior art 3.
By inputting the light separated into the three primary colors B, each of the shutters 105 can control the light of the corresponding color. This makes it possible to realize a projection type display capable of performing full-color display with one spatial light modulation element.

[Embodiment 14] Embodiments 2 to 11
In the spatial light modulation device according to the above, the electrostatic attraction acting on the shutter 105 is increased to increase the
, Ie, downsizing of the spatial light modulator, and improvement of the shutter response speed. One way to increase the electrostatic attraction is to increase the applied voltage.
There are limitations due to problems such as the withstand voltage of the drive circuit 1101 and the discharge between the fixed electrode (the wall inside the through hole 103) facing the shutter 105.

Therefore, the spatial light modulator according to the fourteenth embodiment increases the electrostatic attraction acting on the shutter, drives the shutter with a lower driving voltage, reduces the size of the spatial light modulator, and improves the response speed of the shutter. It is intended. That is, the spatial light modulator according to the fourteenth embodiment has a transparent conductive film formed on the surface of the glass substrate (light-transmitting substrate) on the side in contact with the silicon substrate (non-light-transmitting substrate).
Hereinafter, the configuration of the spatial light modulator will be described in detail based on (first embodiment) and (second embodiment).

(First Example) FIG. 55 shows a fourteenth embodiment.
FIG. 2 is a configuration diagram illustrating a configuration of a spatial light modulation device according to a first example of the first embodiment. In FIG. 55, a silicon substrate 202 is formed on a translucent glass substrate 201 as described in Embodiment Mode 2. A transparent conductive film 1401 is formed between the glass substrate 201 and the silicon substrate 202. Since this transparent conductive film 1401 is transparent to visible light, the glass substrate 20 including the exit portion of the through hole 103 is formed.
1 and the silicon substrate 202.

The transparent conductive film 1401 is formed on the silicon substrate 202
, It has the same potential as the silicon substrate 202, and therefore has the same potential as the wall inside the through hole 103. Therefore, the surface of the transparent conductive film 1401 exposed on the through-hole 103 on the glass substrate 201 has the same potential as the wall inside the through-hole 103.

In such a configuration, the shutter 105
When the light-shielding plate 105a of FIG.
The light-shielding plate 105a is moved toward the wall inside the through-hole 103 not only by the electrostatic attraction with the wall inside the through-hole 103 but also by the electrostatic attraction with the transparent conductive film 1401 exposed in the through-hole 103. Gravitate. Therefore, the electrostatic attraction applied to the light-shielding plate 105a from the closed state to the open state can be further increased, so that the response speed of the shutter 105 can be improved, the size of the shutter can be reduced, or the applied voltage can be reduced. it can.

Further, the transparent conductive film 1401 is formed on the glass substrate 2
01 is connected to the power supply voltage Vdd. Since the power supply voltage Vdd is applied to the transparent conductive film 1401 in this manner, the power supply voltage can be supplied to the drive circuit 1101 through the transparent conductive film 1401. Therefore, since it is not necessary to provide a wiring (so-called power supply line) for supplying a power supply voltage on the silicon substrate 202, it is possible to provide a margin for the arrangement of transistors and other wirings on the silicon substrate 202. Also, the transparent conductive film 140
1 is provided on the entire surface of the glass substrate 201, so that the glass substrate 201
The wiring resistance from the periphery to the drive circuit 1101 of each shutter 105 can be made much smaller. This can reduce the malfunction of the spatial light modulator due to the high-resistance power supply line.

(Second Embodiment) FIG. 56 shows a fourteenth embodiment.
FIG. 6 is a configuration diagram illustrating a configuration of a spatial light modulation element according to a second embodiment of the present invention. As described in the thirteenth embodiment, the spatial light modulator according to the second embodiment has an improved shutter response speed and the like while preventing a deterioration in image quality due to light transmitted through the silicon substrate 202. .

In the spatial light modulator shown in FIG. 56, a transparent conductive film 1401 is provided at the exit of the through hole 103, and a light shielding layer is provided between the glass substrate 201 and the silicon substrate 202 except for the exit of the through hole 103. A low resistance layer 1402 is provided. The light-shielding layer / low-resistance layer 1402 is connected to the power supply potential (Vdd) at the periphery of the glass substrate 201 or the silicon substrate 202. Therefore, the silicon substrate 202, the via electrode 1
Power is supplied to the drive circuit 1101 via 202.

The transparent conductive film 1401 also has a power supply potential (V) around the glass substrate 201 or the silicon substrate 202.
dd). Therefore, the glass substrate 12
02 is exposed through the through-hole 103.
It has the same potential as the inner wall. In such a configuration, when the light-shielding plate 105a of the shutter 105 shifts from the closed state to the open state, the light-shielding plate 105a is exposed to the through-hole 103 as well as the electrostatic attractive force between the light-shielding plate 105a and the wall inside the through-hole 103. The transparent conductive film 1401 is also attracted to the inner wall of the through hole 103 by the electrostatic attraction. Therefore, the electrostatic attraction applied to the light-shielding plate 105a when the shutter is changed from the closed state to the open state can be further increased, so that the response speed of the shutter 105 can be improved, the size of the shutter can be reduced, and the applied voltage can be reduced.

Since the light-shielding layer / low-resistance layer 1402 is present on almost the entire surface of the glass substrate 201, the silicon substrate 2
The wiring resistance from the periphery of the glass substrate 201 to the drive circuit 1101 of each shutter 105 can be made much smaller than in the case where wiring is performed on the substrate 02. This can reduce the malfunction of the spatial light modulator due to the high-resistance power supply line.

Further, by partially overlapping the transparent conductive film 1401 provided at the exit of the through hole 103 and the light-shielding layer / low-resistance layer 1402, the transparent conductive film 1401 can be directly formed, particularly, from the periphery of the glass substrate 201 or the silicon substrate 202. The need to supply power can be eliminated.

The above described first and second embodiments shown in FIGS.
In the spatial light modulator of the second embodiment, the transparent conductive film 1001 as a GND line is formed on the microlens substrate 102.
(See Embodiment 10) is provided, but the above effects can be obtained even without it. Further, even if the power is not supplied to the drive circuit 1101 on the silicon substrate 202 via the transparent conductive film 1401 or the light-shielding layer / low-resistance layer 1402, the response speed of the shutter 105 can be improved, the size of the shutter can be reduced, and the like. It goes without saying that the effect of reducing the applied voltage can be obtained.

The spatial light modulator according to the fourteenth embodiment also has three shutters 10 as shown in FIG.
5 as one set, and RG from different angles as in prior art 3.
By inputting the light separated into the three primary colors B, each of the shutters 105 can control the light of the corresponding color. This makes it possible to realize a projection type display capable of performing full-color display with one spatial light modulation element.

[Embodiment 15] As described in Embodiment 2, the substrate used for the spatial light modulator is made of Si.
In some cases, it is desirable to stack a non-transmissive substrate made of a semiconductor material such as glass and a light-transmitting substrate such as glass that transmits visible light. In order to obtain such a substrate, it is necessary to bond the non-light-transmitting substrate and the light-transmitting substrate in the manufacturing process. As a method of this bonding, there is a so-called anodic bonding in which a voltage is applied between a semiconductor, particularly silicon and glass, and heated to about 300 ° C. to perform bonding. However, since the voltage applied when performing anodic bonding is about 1 kV, when a voltage is applied from the surface of the semiconductor substrate, that is, the surface on which the shutter 105 is formed, the driving circuit and the shutter formed on the surface are high. It may be destroyed by the energy of the voltage.

The non-translucent substrate on which the shutter 105 is formed includes not only the shutter 105 but also the shutter 10.
5, a transistor for applying a voltage to the
Driving circuit 11 composed of wiring and the like for supplying power
01 is arranged. On the other hand, the non-light-transmitting substrate on which the shutter 105 is formed has a through-hole 103 for transmitting light. Therefore, the area in which the drive circuit 1101 is arranged on the non-light-transmitting substrate is reduced due to the presence of the through-hole 103. In particular, when the wiring width of the power supply and the GND line is narrow, the wiring resistance increases, which causes a malfunction of the spatial light modulator.

Therefore, the spatial light modulator according to the fifteenth embodiment improves the luminance and image quality of an image obtained using the spatial light modulator without reducing the mechanical rigidity of the spatial light modulator. At the time of anodic bonding for joining a non-light-transmitting substrate such as a semiconductor and a light-transmitting substrate such as glass, the shutter and the driving circuit are prevented from being destroyed, the driving circuit is provided with a margin, and a power supply is provided. Alternatively, the wiring resistance of the GND wiring is reduced.

FIG. 57 is a configuration diagram showing the configuration of the spatial light modulator according to the fifteenth embodiment. In the spatial light modulator shown in FIG. 57, a silicon substrate 202 which is a non-light-transmitting substrate on which a shutter 105 is formed is a low-resistance layer 1501
Is bonded to a glass substrate 201 which is a light-transmitting substrate. The low resistance layer 1501 is a diffusion layer formed by doping an n-type impurity at a high concentration.
02 is connected to a power supply potential (Vdd) (not shown) at a peripheral portion of the device. From the low resistance layer 1501 to the silicon substrate 20
2. Power is supplied to the drive circuit 1101 via the via electrode 1202. Note that the mechanism for supplying power from the low-resistance layer 1501 to the drive circuit 1101 has been described in Embodiment Mode 12 with reference to FIG. 52, and a description thereof will not be repeated.

As described above, according to the spatial light modulator of the fifteenth embodiment, since it is not necessary to provide a wiring for supplying a power supply voltage on the silicon substrate 202, the silicon substrate 202
A margin can be given to the arrangement of the upper transistor and other wirings. The low-resistance layer 1501 is formed on the silicon substrate 2
02, the wiring resistance from the periphery of the silicon substrate 202 to the drive circuit of each shutter can be made much smaller than when wiring is performed on the silicon substrate 202. This can reduce the malfunction of the spatial light modulator due to the high-resistance power supply line.

The glass substrate 201 and the silicon substrate 2
02 is often bonded by anodic bonding because of the strength of bonding and the need for an adhesive as described above. The anodic bonding is performed by applying a voltage of about 1 kV from the silicon side between the silicon substrate 202 and the glass substrate 201 in an atmosphere of 300 ° C. in a zero atmosphere. At this time, a circuit on the silicon substrate 202 may be broken by a high voltage of 1 kV. This is for applying a voltage via a circuit on the silicon substrate 202.

In the spatial light modulator of the fifteenth embodiment, the low-resistance layer 1501 is
58, a high voltage can be applied between the low-resistance layer 1501 and the glass substrate 201 as shown in FIG. Therefore, it is not necessary to apply a high voltage from the circuit on the silicon substrate 202, and it is possible to prevent the circuit on the silicon substrate 202 from being broken in the anodic bonding step. Reference numeral 1502 denotes a bonding electrode.

Further, the low resistance layer 1501 can be used not only as a power supply voltage line but also as a GND line for supplying a ground potential to the drive circuit 1101 on the silicon substrate 202. In this case, the silicon substrate 202 is made p-type, and the p-m
As the os transistor, an n-mos transistor may be manufactured in a p-type substrate (see FIG. 52).

In the spatial light modulator shown in FIG.
Although the transparent conductive film 1001 is provided on the microlens substrate 102 as a GND line, the above-described effect can be obtained even without this. In addition, the low resistance layer 1501
It is needless to say that the effect of improving the yield at the time of anodic bonding can be obtained without using a configuration in which power is supplied to the drive circuit 1101 on the silicon substrate 202 via the substrate.

In addition, the bonding between a non-transparent substrate represented by a silicon substrate and a translucent substrate represented by a glass substrate is performed as follows.
In addition to anodic bonding, bonding can be performed using an ultraviolet-effect adhesive, a thermosetting adhesive, an anaerobic adhesive, or the like.

Further, in addition to Si, semiconductors such as Ge and C, Ga, A
s, In, P, compound semiconductor (G
aAs, GaP, GaInAsP, InP, etc.), Zn,
A compound semiconductor (such as ZnSe, CdS, or CdTe) composed of Te, S, Se, Cd, or the like can be used. In addition, as the light-transmitting substrate, quartz, borosilicate glass (for example, 7740 or 7070 manufactured by Corning Incorporated), low-melting glass, soda glass, or the like may be used.

In the spatial light modulator according to the fifteenth embodiment, as shown in FIG.
5 as one set, and RG from different angles as in prior art 3.
By inputting the light separated into the three primary colors B, each of the shutters 105 can control the light of the corresponding color. This makes it possible to realize a projection type display capable of performing full-color display with one spatial light modulation element.

[Embodiment 16] Embodiments 1 to 11
In the present invention, since a drive circuit for driving the shutter 105 is provided, a substrate (semiconductor substrate) made of a semiconductor material such as silicon is used as a substrate on which the shutter 105 is formed. However, semiconductor materials generally have higher transmittance to visible light than metal materials. In particular, when a semiconductor substrate having a small thickness is used, a problem arises in that the transmittance for visible light is high. For example, when shutters are provided at intervals of 20 μm, through holes cannot be formed unless the thickness of the semiconductor substrate is set to about 5 μm. However, the transmittance for light having a wavelength of 700 nm in silicon having a thickness of 5 μm is 2 μm.
4%.

On the other hand, the light condensed or made parallel by the microlenses 101 and introduced into the through holes 103 may partially irradiate the semiconductor substrate. When the transmittance of the semiconductor substrate is the above-mentioned value, this light transmits through the semiconductor substrate and becomes stray light, which causes a decrease in contrast and brightness of an image on a screen.

On the substrate on which the shutter 105 is formed, not only the shutter 105 but also a transistor for applying a voltage to the shutter 105 and a driving circuit including wiring for inputting a signal and power to the transistor are arranged. ing.
On the other hand, a through hole 103 is formed in the substrate. Therefore, the area for disposing the drive circuit is reduced due to the presence of the through-hole 103. In particular, when the wiring width of the power supply and the GND line is small, the wiring resistance becomes high, which causes a malfunction.

Further, as described in the second embodiment, as the substrate used for the spatial light modulator, a non-translucent substrate made of a semiconductor material such as Si and a transparent material such as glass are used. It may be desirable to stack certain translucent substrates. In order to obtain such a substrate, it is necessary to bond the non-light-transmitting substrate and the light-transmitting substrate in the manufacturing process. As a method of this bonding, there is a so-called anodic bonding in which a voltage is applied between a semiconductor, particularly silicon and glass, and heated to about 300 ° C. to perform bonding. However, since the voltage applied when performing anodic bonding is about 1 kV,
When a voltage is applied from the surface of the semiconductor substrate, that is, the surface on which the shutter is formed, the drive circuit and the shutter formed on the surface may be damaged by the energy of the high voltage.

Therefore, the spatial light modulator according to the sixteenth embodiment is intended to improve the image quality of a projection display using the spatial light modulator, and to improve the image quality of a non-translucent substrate such as a semiconductor and a translucent substrate such as glass. In the case of anodic bonding, the shutter and the drive circuit are prevented from being destroyed, and furthermore, the power supply or GND is prevented.
The wiring resistance of the wiring is reduced. That is, the spatial light modulator according to the sixteenth embodiment has a light-blocking layer provided between a light-transmitting substrate and a non-light-transmitting substrate. Hereinafter, the configuration of the spatial light modulator will be described in detail based on (first embodiment) and (second embodiment).

(First Embodiment) As described in the second embodiment, in order to improve the optical characteristics of the spatial light modulator, the substrate 104 must be formed of a two-layer structure of a substrate on which a shutter is formed and a glass substrate. It is desirable to have a structure. Embodiment 1
The spatial light modulator according to the sixth embodiment is obtained by applying the spatial light modulator according to the thirteenth embodiment to the spatial light modulator according to the second embodiment. Therefore, description of the points already described in the second and thirteenth embodiments will be omitted.

FIG. 59 is a configuration diagram showing the configuration of the spatial light modulator according to the first example of the sixteenth embodiment. A silicon substrate 202 which is a non-light-transmitting substrate on which the shutter 105 is manufactured is bonded to a glass substrate 201 which is a light-transmitting substrate via a light-shielding layer 1601. Light shielding layer 1601
Is provided between the glass substrate 201 and the silicon substrate 202 and in a portion other than the opening of the through hole 103 formed in the silicon substrate 202.

By providing the light-shielding layer 1601 as described above, it is possible to prevent visible light transmitted through the thin silicon substrate 202 from leaking from a portion other than the through hole 103.
Therefore, the contrast of the image projected from the spatial light modulator can be improved.

The light shielding layer 1601 for absorbing visible light is provided with InAs, GaSb, InSb, PbS, and PbT.
e, Te or IR-DIB, IR-DI manufactured by Toshiba Corporation
Materials such as A can be used.

As the non-light-transmitting substrate as the silicon substrate 202, a semiconductor such as Ge or C,
a, As, In, P, Al, and other compound semiconductors (GaAs, GaP, GaInAsP, InP
Etc.) or compound semiconductors composed of Zn, Te, S, Se, Cd, etc. (ZnSe, CdS, CdTe, etc.)
Etc. can be used.

As the light-transmitting substrate serving as the glass substrate 201, a material such as quartz, borosilicate glass (for example, 7740 or 7070 of Corning), low-melting glass, soda glass, or the like can be used.

(Second Embodiment) FIG. 60 shows the configuration of the sixteenth embodiment.
FIG. 6 is a configuration diagram illustrating a configuration of a spatial light modulation element according to a second embodiment of the present invention. In the spatial light modulator of the second embodiment, the low-resistance layer 1201 (see FIG. 51) described in the twelfth embodiment is applied, and the light-shielding layer 1601 of the first embodiment is replaced with a conductive light-shielding layer and low-resistance layer. A layer 1602 is provided.

The light-shielding layer and low-resistance layer 1602 is provided at a peripheral portion of the silicon substrate 202 at a power supply potential (Vdd) (not shown).
It is connected to the. Therefore, the silicon substrate 202, the via electrode 1202
Is supplied to the drive circuit 1101 via the. In this manner, since it is not necessary to provide a wiring for supplying a power supply voltage on the silicon substrate 202, it is possible to allow a margin for the arrangement of the transistors and other wiring on the silicon substrate 202. Further, the light-shielding layer and low-resistance layer 1602 is a silicon substrate 2
02, the wiring resistance from the periphery of the silicon substrate 202 to the drive circuit 1101 of each shutter 105 can be made much smaller than when the wiring is formed on the silicon substrate 202. This can reduce the malfunction of the spatial light modulator due to the high-resistance power supply voltage line.

The light-shielding layer / low-resistance layer 1602 is used not only as a power supply voltage line but also as a silicon substrate 202.
GN for supplying a ground potential to the upper drive circuit 1101
It can also be used as a D line.

As the material of the light-shielding layer / low-resistance layer 1602, InAs, GaSb, InSb, PbS, PbT
e, Te doped with impurities for lowering resistance, and metallic materials such as Ag, Au, Cd, Pb, Cu, P
d, Pt, Sn, Zn, particularly preferably Al, Co, Cr, Fe, Mg, M which has good adhesion to silicon oxide.
o, Ni, Ta, Ti, V, W, Zr, etc. can be used.

The light-shielding layer and low-resistance layer 1602 also has a function as an adhesive for bonding between the non-light-transmitting substrate and the light-transmitting substrate. As a material in this case, an epoxy conductive adhesive or an alloy solder shown in Table 2 can be used.

[0223]

[Table 2]

When the light shielding layer and low resistance layer 1602 is used,
When anodically bonding the silicon substrate 202 and the glass substrate 201, a high voltage can be applied between the light shielding layer / low resistance layer 1602 and the glass substrate 201 using the light shielding layer / low resistance layer 1602 as an electrode. There is no need to apply a high voltage to the circuit formed on 202 (see FIG. 58).
reference). Therefore, when the glass substrate 201 and the silicon substrate 202 are anodically bonded, the circuit on the silicon substrate 202 is less likely to be broken, and the yield is improved.

In the spatial light modulators of the first and second embodiments shown in FIGS. 59 and 60, the transparent conductive film 1001 as a GND line is formed on the microlens substrate 102.
Is provided, but the above-described effect can be obtained even without this.

Also, in the spatial light modulator according to the fifteenth embodiment, as shown in FIG.
5 as one set, and RG from different angles as in prior art 3.
By inputting the light separated into the three primary colors B, each of the shutters 105 can control the light of the corresponding color. This makes it possible to realize a projection type display capable of performing full-color display with one spatial light modulation element.

[0227]

As described above, according to the spatial light modulator of the present invention (claim 1), a lens for condensing light, and a through-hole through which the light condensed by the lens enters and passes the light. And a shutter provided on the substrate and controlling the passage and non-passage of light incident on the through-hole, so that the substrate surface at the opening of the through-hole without lowering the aperture ratio. The ratio to the whole can be made lower than that of the conventional one, and a space for providing a drive circuit and the like on the substrate can be secured. Further, the moving distance of the shutter can be reduced, and the shutter opening / closing operation can be easily performed by the electrostatic attraction. Therefore, it is possible to obtain a spatial light modulator that can be manufactured by simpler steps and has less malfunction. According to this spatial light modulator, an image or the like with high contrast can be formed on the screen.

According to the spatial light modulator of the present invention, the substrate is a light transmitting substrate, wherein the substrate comprises a light transmitting substrate and a light transmitting substrate. Formed of a non-translucent substrate that does not transmit light,
Since the non-light-transmitting substrate includes the through-hole and the shutter, it is possible to prevent the light incident on the through-hole from being scattered by the wall surface inside the through-hole. Therefore, it is possible to improve the luminance and the image quality of the image obtained by using the spatial light modulator.

According to the spatial light modulator of the present invention (claim 3), in the spatial light modulator of claim 1 or 2, the wall surface inside the through hole is inclined with respect to the substrate surface. Therefore, light having a smaller beam waist spot diameter can be incident on the opening. Therefore,
The size of the spatial light modulator can be reduced, and the brightness and brightness of the image obtained using this spatial light modulator can be reduced.
Image quality can be improved.

According to the spatial light modulator of the present invention, in the spatial light modulator of the third aspect, the shutter is provided at the opening of the through hole to shield the light. And a support member for rotatably supporting the light-shielding plate in the direction of the wall surface inside the through-hole. The shutter is opened by applying a voltage between the shutter and the wall inside the through-hole. The electrostatic attraction acting between the inner wall and the inner wall can be increased. Therefore, it is possible to reduce the size of the shutter and reduce the size and cost of the spatial light modulator without lowering the aperture ratio and increasing the driving voltage of the flap type shutter.

According to the spatial light modulator of the present invention (claim 5), in the spatial light modulator of any one of claims 1 to 4, the substrate provided with the shutter is a single crystal substrate. Since the through holes are formed in the single crystal substrate by the crystal axis anisotropic etching, the through holes can be formed at a high etching speed.
A through hole with high shape accuracy can be obtained. Therefore, a low-cost spatial light modulation element with less malfunction can be obtained.

According to the spatial light modulator of the present invention, the single crystal substrate is made of a single crystal silicon having a (110) plane orientation. Since the shutter is provided on the side of the opening of the through hole parallel to the <110> axis of the single crystal substrate, the density of the through hole in the substrate can be increased. Therefore, the size and cost of the spatial light modulator can be reduced.

According to the spatial light modulator of the present invention, the through holes are arranged in a honeycomb shape in the single crystal substrate. , Shutters can be arranged at higher density,
The aperture ratio can be increased. As a result, the brightness of the image projected on the screen via the spatial light modulator can be improved. In addition, it is possible to reduce the size of the spatial light modulator, and when the shutters are not arranged at a very high density, the performance required for the shutter and the lens is reduced, so that the design and design of the spatial light modulator can be freely performed. The degree can be increased.

According to the spatial light modulator of the present invention (claim 8), the spatial light modulator according to any one of claims 1 to 7 is provided with a lens substrate having a plurality of lenses. The space between the substrate and the substrate on which the shutter is formed is sealed or evacuated to a vacuum or substantially vacuum, and the shutter is positioned in the space to prevent a reduction in the operating speed and response of the shutter and corrosion. And the deterioration of the optical performance of the spatial light modulator can be prevented.

Further, according to the spatial light modulator of the present invention (claim 9), in the spatial light modulator of claim 8, the space on the lens substrate is sealed, and the pressure in the space is lower than the atmospheric pressure. The shutter is formed between the microlens substrate even when a thin and low rigidity microlens substrate is used because the pressure is set lower and higher than the pressure in the vacuum or almost vacuum space. It can be placed in a vacuum or near vacuum area. Therefore, it is possible to prevent a reduction in the operating speed and response of the shutter, corrosion, and the like, and also prevent a reduction in the optical performance of the spatial light modulator.

The spatial light modulator of the present invention (claim 1)
According to 0), in the spatial light modulator according to any one of claims 1 to 9, the lens substrate includes a light-transmitting conductive layer on a surface on the shutter side, and the light-transmitting conductive layer and the inside of the through hole are provided. Since a predetermined voltage is applied to the wall and the shutter to open and close the shutter, the shutter moves at a high response speed required for displaying a moving image even when the shutter changes from open to closed. be able to.

The spatial light modulator of the present invention (claim 1)
According to 1), in the spatial light modulator according to claim 10, the substrate provided with the shutter includes a drive circuit for driving the shutter, and electrically connects the light-transmitting conductive layer and the drive circuit. Since the reference voltage or the power supply voltage of the driving circuit is applied to the translucent conductive layer, the driving circuit can be provided with a margin and the power supply or GND can be provided.
The wiring resistance of the wiring can be reduced. Therefore,
Malfunctions of the spatial light modulator can be reduced.

The spatial light modulator of the present invention (claim 1)
According to 2), in the spatial light modulator according to any one of claims 1 and 3 to 11, the substrate includes the low-resistance layer on a surface opposite to a surface on which the shutter is provided. In addition, it is not necessary to provide a wiring (so-called GND line) for supplying a ground potential or a power supply line on the substrate. Therefore, there is room for transistors and other wiring on the substrate, and wiring resistance to the drive circuit can be reduced. Therefore, the degree of freedom in designing the spatial light modulator can be improved, and the malfunction of the spatial light modulator can be reduced.

The spatial light modulator of the present invention (Claim 1)
According to 3), in the spatial light modulator according to any one of claims 1 or 3 to 11, the substrate is provided with a light shielding layer on a surface opposite to a surface on which the shutter is provided. It is possible to prevent the stray light from transmitting through the semiconductor substrate and lowering the contrast and brightness of the image on the screen. In addition, since there is no need to provide a wiring (so-called GND line) for supplying a ground potential or a power supply line on the substrate, there is room for transistors and other wiring on the substrate, and the wiring resistance to the drive circuit is reduced. can do. Therefore, it is possible to improve the image quality of the projection type display provided with the spatial light modulator and to reduce malfunction.

The spatial light modulator of the present invention (claim 1)
According to 4), in the spatial light modulator according to any one of claims 2 to 11, the light-transmitting substrate is provided with the light-transmitting conductive layer on a surface in contact with the non-light-transmitting substrate. ,
The electrostatic attraction acting on the shutter can be increased without increasing the driving voltage. Therefore, a shutter operation at a lower driving voltage can be realized, so that the spatial light modulator can be downsized and the response speed can be improved.

The spatial light modulator of the present invention (claim 1)
According to 5), in the spatial light modulator according to any one of claims 2 to 14, a low-resistance layer is provided between the light-transmitting substrate and the non-light-transmitting substrate. The light-transmitting substrate and the non-light-transmitting substrate can be joined by anodic bonding, and the circuit on the light-non-transmitting substrate can be prevented from being damaged by applying a high voltage to the circuit. . Therefore, the manufacturing yield of the spatial light modulator can be improved. Further, since there is no need to provide a wiring (so-called GND line) or a power supply line for supplying a ground potential on the non-translucent substrate, there is room for transistors and other wiring on the non-translucent substrate, and even a driving circuit. Can be reduced. Therefore, the mechanical rigidity of the spatial light modulator can be prevented from lowering, the degree of freedom in design can be improved, malfunctions can be reduced, and the brightness and image quality of the image obtained using the spatial light modulator can be improved. Can be.

The spatial light modulator of the present invention (claim 1)
According to 6), in the spatial light modulator according to any one of claims 2 to 14, a light shielding layer is provided between the light transmitting substrate and the light non-transmitting substrate. It is possible to eliminate the need to provide a wiring (so-called GND line) or a power supply line for supplying a ground potential. Therefore, there is room for transistors and other wiring on the non-translucent substrate, and wiring resistance to the drive circuit can be reduced. Therefore, it is possible to improve the design flexibility and reduce malfunction without lowering the mechanical rigidity of the spatial light modulator, and to improve the brightness, image quality, and contrast of an image obtained by using the spatial light modulator. Can be done. Further, anodic bonding between the non-light-transmitting substrate and the light-transmitting substrate can be performed using the light-shielding layer as an electrode. Therefore, it is not necessary to apply a high voltage to the circuit on the non-translucent substrate.
The circuit is not destroyed, and the production yield can be improved. Further, the non-light-transmitting substrate and the light-transmitting substrate can be joined by using the light-shielding layer as an adhesive layer. In this case, it is not necessary to apply a high voltage, so that the production yield can be further improved.

[Brief description of the drawings]

FIG. 1 is a configuration diagram showing a configuration of a first example of a spatial light modulator according to Embodiment 1 of the present invention.

FIG. 2 is a plan view showing a configuration of a flap-type shutter constituting the spatial light modulator shown in FIG.

FIG. 3 is a cross-sectional view of the flap type shutter shown in FIG. 2 taken along line AA ′, where (a) is a state in which the shutter is closed,
(B) shows a state where the shutter is opened.

4 is a cross-sectional view of the flap-type shutter shown in FIG. 2, taken along line BB ′.

FIG. 5 is an explanatory diagram for explaining a leak light amount in a closed state of a shutter in the spatial light modulator according to Embodiment 1 of the present invention.

FIG. 6 is an explanatory diagram for explaining a leakage light amount in a conventional spatial light modulation element when a shutter is closed.

FIG. 7 is a configuration diagram showing a configuration of a second example of the spatial light modulator according to the first embodiment of the present invention.

8 is a plan view of the spatial light modulator shown in FIG.

9A and 9B are explanatory diagrams for explaining an open / close state of a shutter constituting the spatial light modulator shown in FIG. 7; FIG. 9A illustrates a state in which the shutter is closed, and FIG. Is shown.

FIG. 10 is an explanatory diagram showing an application example of the spatial light modulator according to Embodiment 1 of the present invention.

FIG. 11 is an explanatory diagram illustrating a state of light incident on an opening in the spatial light modulator according to Embodiment 1 of the present invention.

FIG. 12 is a configuration diagram showing a configuration of a spatial light modulator according to a second embodiment of the present invention.

FIG. 13 is an explanatory diagram for describing a manufacturing process of the spatial light modulator according to the second embodiment of the present invention.

FIG. 14 is a configuration diagram showing a configuration of a first example of the spatial light modulator according to the third embodiment of the present invention.

FIG. 15 is a configuration diagram showing a configuration of a second example of the spatial light modulator according to the third embodiment of the present invention.

FIG. 16 is a configuration diagram showing a configuration of a third example of the spatial light modulator according to the third embodiment of the present invention.

FIG. 17 is a configuration diagram showing a configuration of a fourth example of the spatial light modulator according to the third embodiment of the present invention.

FIG. 18 is a plan view showing a configuration of a spatial light modulator according to Embodiment 4 of the present invention.

19 is a sectional view taken along line C-C 'in FIG.

FIG. 20 is a sectional view taken along line D-D ′ of FIG. 19;

FIG. 21 is a plan view showing a configuration of a spatial light modulator according to Embodiment 5 of the present invention.

FIG. 22 is a sectional view taken along line E-E ′ in FIG. 21;

FIG. 23 is a sectional view taken along line F-F ′ of FIG. 21;

FIG. 24 is an explanatory diagram for describing a problem to be solved in the spatial light modulator according to Embodiment 6 of the present invention.

FIG. 25 is a sectional view taken along line G-G ′ of FIG. 24;

FIG. 26 is a sectional view taken along line H-H ′ in FIG. 24;

FIG. 27 is a plan view showing a configuration of a spatial light modulator according to Embodiment 6 of the present invention.

FIG. 28 is a sectional view taken along line I-I 'of FIG.

29 is a sectional view taken along line J-J 'of FIG.

FIG. 30 is an explanatory diagram illustrating a state in which spatial light modulation elements according to Embodiment 6 of the present invention are arranged in an array.

FIG. 31 is an explanatory diagram showing a state in which spatial light modulation elements using a (100) plane of a single crystal silicon substrate are arranged in an array.

FIG. 32 is an explanatory diagram illustrating a state in which micro lenses are arranged in a honeycomb shape in the spatial light modulator according to Embodiment 7 of the present invention.

FIG. 33 is an explanatory diagram for explaining a state in which shutters using the (100) plane of a single crystal silicon substrate are arranged in a honeycomb shape.

FIG. 34 is an explanatory diagram for explaining a state in which shutters using the (110) plane of a single crystal silicon substrate are arranged in a honeycomb shape in the spatial light modulator according to the seventh embodiment of the present invention.

FIG. 35 is an explanatory diagram for describing a configuration in a case where the spatial light modulator according to Embodiment 7 of the present invention is applied to a projection display capable of performing full-color display.

FIG. 36 is a configuration diagram showing a configuration of a first example of the spatial light modulation element according to the eighth embodiment of the present invention.

FIG. 37 is a configuration diagram showing a configuration of a second example of the spatial light modulation element according to the eighth embodiment of the present invention.

FIG. 38 is a configuration diagram showing a configuration of a third example of the spatial light modulation element according to the eighth embodiment of the present invention.

FIG. 39 is an explanatory diagram for describing a problem to be solved in the spatial light modulator according to Embodiment 9 of the present invention.

FIG. 40 is a configuration diagram showing a configuration of a first example of the spatial light modulator according to Embodiment 9 of the present invention.

FIG. 41 is a configuration diagram showing a configuration of a second example of the spatial light modulator according to Embodiment 9 of the present invention.

FIG. 42 is a configuration diagram showing a configuration of a third example of the spatial light modulator according to Embodiment 9 of the present invention.

FIG. 43 is a configuration diagram showing a configuration of a first example of the spatial light modulator according to the tenth embodiment of the present invention.

FIG. 44 is a timing chart showing operation timings of the spatial light modulator shown in FIG. 43.

FIG. 45 is an explanatory diagram for describing an operation of the spatial light modulator shown in FIG. 43.

FIG. 46 is a timing chart showing operation timings of the spatial light modulator of the second example in the spatial light modulator according to the tenth embodiment of the present invention.

FIG. 47 is an explanatory diagram for explaining the operation of the spatial light modulator of the second example in the spatial light modulator according to the tenth embodiment of the present invention.

FIG. 48 is a timing chart showing operation timings of the spatial light modulator of the third example in the spatial light modulator according to the tenth embodiment of the present invention.

FIG. 49 is an explanatory diagram for explaining the operation of the spatial light modulator of the third example in the spatial light modulator according to the tenth embodiment of the present invention.

FIG. 50 is a configuration diagram showing a configuration of a spatial light modulator according to Embodiment 11 of the present invention.

FIG. 51 is a configuration diagram showing a configuration of a spatial light modulator according to Embodiment 12 of the present invention.

FIG. 52 is a configuration diagram showing a schematic configuration of a drive circuit in the spatial light modulator according to Embodiment 12 of the present invention.

FIG. 53 is a configuration diagram showing a configuration of a first example of the spatial light modulator according to Embodiment 13 of the present invention;

FIG. 54 is a configuration diagram showing a configuration of a second example of the spatial light modulator according to Embodiment 13 of the present invention.

FIG. 55 is a configuration diagram showing a configuration of a first example of the spatial light modulator according to Embodiment 14 of the present invention.

FIG. 56 is a configuration diagram showing a configuration of a second example of the spatial light modulator according to Embodiment 14 of the present invention.

FIG. 57 is a configuration diagram showing a configuration of a spatial light modulator according to Embodiment 15 of the present invention.

FIG. 58 is an explanatory diagram for explaining a method of applying a voltage when the spatial light modulator shown in FIG. 57 is manufactured using anodic bonding.

FIG. 59 is a configuration diagram illustrating a configuration of a first example of the spatial light modulation element according to Embodiment 16 of the present invention;

FIG. 60 is a configuration diagram showing a configuration of a second example of the spatial light modulator according to Embodiment 16 of the present invention.

FIG. 61 is an explanatory diagram for describing a configuration of a conventional spatial light modulator.

FIG. 62 is an explanatory diagram for describing a configuration of a conventional spatial light modulator.

FIG. 63 is an explanatory diagram for describing a configuration of a conventional spatial light modulator.

FIG. 64 is an explanatory diagram for describing a configuration of a projection display.

FIG. 65 is an explanatory diagram for describing a configuration of a projection display.

[Explanation of symbols]

Reference Signs List 101 micro lens 102 micro lens substrate 103 through hole 104 substrate 105 shutter 105a light shielding plate 105b torsion bar 105c beam 106 wall 107 fixed electrode 108 anchor 109 wiring 110 power supply 201 glass substrate 202 silicon substrate 203 p-type semiconductor substrate 204 n-type semiconductor layer 205 Circuit section 206 Oxide film (or nitride film) 207 Metal layer 208 Reinforcement plate 209 Glass substrate 301, 401, 601, 602, 603, 604
Wall 801 Solder glass 802 Lead frame 803 Bonding wire 804 Sealing area (first sealing area) 805 Seal / spacer 806 Sealing material 901 Window material 902 Second sealing area 903 Glass pedestal 904 Solder glass 1001 Transparent conductive film 1101 Drive Circuit 1102 electrode 1201 low resistance layer 1202 via electrode 1203 n-type substrate 1206 p-mos transistor 1207 p-well layer 1208 n-mos transistor 1209,1210 gate electrode 1211 CMOS gate input terminal 1301,1601 light shielding layer 1302 light shielding layer and low resistance Layer 1401 Transparent conductive film 1402, 1602 Light shielding layer / low resistance layer 1501 Low resistance layer 1502 Bonding electrode 1701 Micro shutter 1702 Moving electrode 1703 Beam 1704 Substrate 1705, 1706, 1707 Electrode 1708 Opening 1708a Wall 1709 Filter 1710 Light source 1711 Dichroic mirror 1712 Liquid crystal panel 1713 Liquid crystal shutter 1714 Micro lens 1715 Fresnel lens 1716 Projection lens 1717 Screen 1718 Glass substrate

Claims (16)

[Claims] 1. A lens for condensing light, a substrate provided with a through hole through which the light condensed by the lens enters, and through which the light passes, and a substrate provided on the substrate and incident on the through hole And a shutter for controlling passage / non-passage of the light. 2. The spatial light modulator according to claim 1, wherein said substrate is formed on said light-transmitting substrate and said non-light-transmitting substrate is formed on said light-transmitting substrate. A spatial light modulation device comprising a substrate, wherein the non-light-transmitting substrate includes the through hole and the shutter. 3. The spatial light modulator according to claim 1, wherein a wall surface inside the through-hole is inclined with respect to the substrate surface. 4. The spatial light modulator according to claim 3, wherein the shutter is provided in an opening of the through-hole to shield the light, and the light-shielding plate is provided in a wall direction inside the through-hole. And a support member for rotatably supporting the shutter, and applying a voltage between the shutter and a wall inside the through hole to open the shutter. 5. The spatial light modulator according to claim 1, wherein the substrate provided with the shutter is a single-crystal substrate, and the through-hole is formed by the crystal axis anisotropic etching. A spatial light modulation element formed in a crystal substrate. 6. The spatial light modulator according to claim 5, wherein the single crystal substrate is made of single crystal silicon having a plane orientation of a (110) plane, and the shutter is formed of the single crystal silicon at an opening of the through hole. A spatial light modulation device provided on a side parallel to a <110> axis of a crystal substrate. 7. The spatial light modulator according to claim 6, wherein the through holes are arranged in a honeycomb shape in the single crystal substrate. 8. The spatial light modulator according to claim 1, further comprising a lens substrate having a plurality of lenses, wherein a space between the lens substrate and the substrate on which the shutter is formed is provided. A spatial light modulation device, wherein the device is sealed to make a vacuum or substantially a vacuum, and the shutter is located in the space. 9. The spatial light modulator according to claim 8, wherein the space on the lens substrate is sealed, and the pressure in the space is lower than the atmospheric pressure and higher than the pressure in the vacuum or the substantially vacuumed space. A spatial light modulation element. 10. The spatial light modulator according to claim 1, wherein the lens substrate includes a light-transmitting conductive layer on a surface on the shutter side, and the light-transmitting conductive layer and the through hole are provided. A spatial light modulator, wherein a predetermined voltage is applied to a wall inside a hole and the shutter to open and close the shutter. 11. The spatial light modulator according to claim 10, wherein the substrate provided with the shutter includes a drive circuit for driving the shutter, and electrically connects the light-transmitting conductive layer and the drive circuit. A spatial light modulation element connected to the light transmitting conductive layer and applying a reference voltage or a power supply voltage of the driving circuit to the light transmitting conductive layer. 12. The spatial light modulator according to claim 1, wherein the substrate has a low-resistance layer on a surface opposite to a surface on which the shutter is provided. Characteristic spatial light modulator. 13. The spatial light modulator according to claim 1, wherein the substrate includes a light-shielding layer on a surface opposite to a surface on which the shutter is provided. A spatial light modulator. 14. The spatial light modulator according to claim 2, wherein the light-transmitting substrate has a light-transmitting conductive layer on a surface in contact with the non-light-transmitting substrate. Characteristic spatial light modulator. 15. The spatial light modulator according to claim 2, wherein a low resistance layer is provided between the light-transmitting substrate and the non-light-transmitting substrate. element. 16. The spatial light modulator according to claim 2, wherein a light-shielding layer is provided between the light-transmitting substrate and the non-light-transmitting substrate. .