JPH1038971A - Apparatus for measuring surface-mounting-type electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable correct and highly reproducible measurement by bringing input/output terminals into electric contact with a transmission line layer of a micro strip line respectively and bringing other electrode terminals into electric contact with a measuring device substrate or a conductor groove member respectively. SOLUTION: A surface-mounting-type electronic part is positioned and mounted on a measuring device 25, and the electronic part is pressed and fixed by a pressing part with a pressing rod operated, so that a micro strip line 32 is brought into direct contact with input/output terminals of the electronic part or a conductor groove member 31 or a measuring device substrate 30 is brought into direct contact with other terminals (ground terminal) for electric connection. Then with a signal line of a measuring machine connected to a connector 26 for measuring electric characteristics of the surface-mounting-type electronic part, correct and highly reproducible measurement results can be obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a measuring device for efficiently and accurately measuring the electrical characteristics of a surface-mounted electronic component, and more particularly, to a surface-mounting device having a measuring jig capable of performing stable electrical connection. The present invention relates to a measuring device for electronic components.

[0002]

2. Description of the Related Art In recent years, with the increase in demand for small electronic devices such as wireless communication devices and mobile communication devices such as mobile phones, the electronic components used in them have been reduced in size, thickness and weight. It is required to support high-density mounting.
As such electronic components, the demand for surface-mounted electronic components has increased dramatically. As a result, how to accurately and easily measure the electrical characteristics of these surface-mounted electronic components has become an issue. Has become.

In a conventional measuring device for measuring the electrical characteristics of these surface-mounted electronic components, the surface-mounted electronic component to be measured is mounted on a measuring jig called a fixture connected to the measuring device. It is necessary to hold and electrically and mechanically connect. Above all, for surface mount electronic components for high frequency band, by mechanically holding the surface mount electronic components on the measurement jig, the ground electrode provided on the measurement jig substrate of the measurement jig is removed. The ground terminal of the surface-mount type electronic component is connected, and the non-coaxial transmission line of the measurement jig part, such as a microstrip line, to which the signal line of the measurement device is connected, and the input / output terminal of the surface-mount type electronic component. Is connected.

An example of such a conventional measuring device and a measuring jig will be described with reference to FIGS.

FIG. 6 is an external perspective view showing an example of a conventional measuring apparatus. In the measuring apparatus 1 shown in FIG. 6, 2 is a pedestal plate, 3 is a holding and measuring unit, and 4 is a holding and measuring unit for holding a surface-mounted electronic component. This is a pressing mechanism for fixing the pressing mechanism. 5 is a holding measuring unit 3
Reference numeral 6 denotes a measurement jig for holding and electrically connecting the surface mount type electronic component, 6 denotes a connector for electrically connecting to an external measurement device, and 7 denotes a pedestal of the measurement jig 5. is there. Reference numeral 8 denotes a holding unit for fixing the surface-mounted electronic component to the measuring jig unit 5 in the holding mechanism unit 4,
Reference numeral 9 denotes a holding rod for moving the holding portion 8 up and down.

[0006] With such a measuring apparatus 1, a surface mount type electronic component (not shown) is positioned and placed on the measurement jig section 5, and a holding rod 9 is operated to hold the surface mount type electronic component (not shown). The electronic component is pressed down and fixed, and the signal line of the measuring device is connected to the connector 6 to measure the electrical characteristics of the surface-mounted electronic component.

FIG. 7 is a partially enlarged perspective view of the measuring jig portion 5. In FIG. 1, reference numeral 10 denotes a measuring jig substrate made of a conductor such as a metal, and a concave portion 10a is formed substantially at the center of the measuring jig substrate 10. Around the recess 10a, a terminal plate or the like connected to the electrode terminals of the surface mount electronic component is arranged.
Is a metal terminal plate connected to the ground terminal among the electrode terminals of the electronic component, and 12 is a transmission line (microstrip line) connected to the input / output terminal of the electronic component.
Is an insulating substrate 12a made of a dielectric material such as ceramic,
The transmission line layer 12b is formed on the upper surface, and the ground conductor layer 12c is formed on the lower surface. The metal terminal plate 11 and the transmission line 12 are elastically attached to the measuring jig substrate 10 using a spring or the like in order to obtain flatness and connect to the electrode terminals of the electronic component. Reference numeral 13 denotes a guide plate for positioning electronic components, and reference numeral 14 denotes a connector holder for holding the connector 6. The metal terminal plate 11 is connected to ground (ground), and the connector 6
Is electrically connected to the transmission line 12 and connected to the signal line of the measuring instrument.

On the other hand, FIG. 8 is an external perspective view showing an example of a surface-mounted electronic component measured by the measuring apparatus 1 as viewed from the lower surface (mounting surface) side. In FIG. , 16a and 16b are electrode terminals. In the electronic component 15, among the electrode terminals 16a and 16b, 16a is assigned to a ground terminal and 16b is assigned to an input / output terminal.
The surface mount electronic component 15 is connected to the measuring jig 5
The ground terminal 16a and the metal terminal plate 11, and the input / output terminal 16b and the transmission line layer 12b of the transmission line 12 are respectively positioned and mounted on the guide plate 6 and clamped and held by the holding portion 8. Contact and electrical connection.

FIGS. 9A and 9B are sectional views showing this connection state. FIG. 1A shows a cross section perpendicular to the transmission line 12, and FIG. 1B shows a cross section along the transmission line 12. As shown in these figures, the measuring jig unit 5
The surface-mounted electronic component 15 positioned and held by the guide plate 13 on the
1, and the transmission line layer 12 of the input / output terminal 16b and the transmission line 12.
b contact each other and become electrically connected.

[0010]

By the way, some surface mount electronic components have various electrode arrangements other than the arrangement of the electrode terminals as shown in FIG. For example, as shown in a surface mount type electronic component 17 shown in an external perspective view seen from the lower surface (mounting surface) side in FIG.
· 18b, of which 18a is a ground terminal, and input / output terminals are assigned to 18b arranged on opposite corners of two opposing sides, or a surface mount type similarly shown in an external perspective view in FIG. 11 Like the electronic component 19, there are electrode terminals 20a and 20b on three sides on the lower surface, of which 20a is assigned to a ground terminal, and 20b arranged on one side of two opposing sides is assigned to an input / output terminal. is there. In the surface-mounted electronic component 19, an example is shown in which the electrode terminals 20a and 20b are formed in a concave shape with respect to the lower surface of the electronic component body.

However, in the conventional measuring device 1, the surface-mounted electronic components having different electrode terminal arrangements as described above.
17 and 19, the transmission line 12 and the surface mount type electronic component 15 are arranged depending on the measurement jig 5 in which the concave portion 10a, the metal terminal plate 11, and the transmission line 12 are arranged according to the electrode terminal arrangement of the surface mount type electronic component 15. The input and output terminals of the parts cannot be electrically connected,
In each case, a measurement jig substrate formed by changing the shape and dimensions of the recess 10a and the arrangement of the transmission line 12 and the metal terminal plate 11 is prepared, and the measurement jig portion 5 on the pedestal 7 is connected to the connector 6 and the connector holder. Unless all 14 were replaced, there was a problem that those electronic components could not be measured.

In addition, since the metal terminal plate 11 is disposed on the measuring jig substrate 10 with elasticity via a spring or the like, the ground does not become the same potential due to the influence of the parasitic inductance. There was also a problem that measurement could not be performed.

SUMMARY OF THE INVENTION The present invention has been completed to solve the above problems, and has as its object the purpose of replacing a measuring jig substrate with a surface mount type electronic component having a different electrode terminal arrangement. The measurement device for surface mount type electronic components has a measurement jig that can measure with simple changes, and has a stable electrical connection between the ground terminal and the ground, and can perform accurate and reproducible measurements. To provide.

[0014]

According to the present invention, there is provided an apparatus for measuring a surface mount type electronic component, comprising: a surface mount type electronic component mounted on an upper surface and a pair of fitting grooves formed on an upper surface; A measuring jig substrate made of a grounded conductor, a pair of U-shaped conductor groove members having an opening at the upper side fitted and fixed in the fitting groove, and an electric The measurement jig substrate is arranged so as to be insulated from each other, and at least partly comes into contact with a pair of input / output terminals formed on the lower surface side of the surface mount electronic component mounted on the measurement jig substrate upper surface. The pair of microstrip lines exposed on the upper surface, the pair of conductor groove members and the pair of microstrip lines are attached, and the conductor groove members in which the microstrip lines are electrically insulated are disposed. Fitting of the measurement jig substrate Those formed by including an adjustment member for moving in order to fit the use grooves.

According to the surface mount type electronic component measuring apparatus of the present invention, a pair of microstrip lines to be brought into contact with a pair of input / output terminals of the surface mount type electronic component are formed in a U-shape having openings on the upper side. A pair of conductor groove members are electrically insulated from the conductor groove members, and are arranged on an electrically grounded measuring jig substrate made of a conductor so as to correspond to the input / output terminals of the surface mount electronic component. Since the input and output terminals of the surface-mounted electronic component are in electrical contact with the transmission line layer of the microstrip line, and the other electrode terminals (ground) Terminals) are electrically connected directly to a measuring jig substrate made of a grounded conductor or a conductor groove member having the same electric potential as the substrate, so that the respective electric connections are stabilized. Good measurement of accurate and reproducible Te becomes possible.

According to the measuring device of the present invention, the pair of microstrip lines and the pair of conductor groove members can be formed by the adjusting member having the conductor groove member to be fitted into the fitting groove and the microstrip line attached thereto. Can be moved in accordance with the formation position of the fitting groove, so that even for surface-mounted electronic components with different electrode terminal arrangements, the measurement jig board can be used according to the shape and dimensions of the electronic component to be measured. Prepare and replace a measuring jig substrate in which a fitting groove is formed corresponding to the arrangement of the input / output terminals at the upper holding position, and replace the measuring jig substrate with the conductor groove member and the microstrip line according to the positional relationship of the fitting groove. By adjusting the position, it is possible to respond to the arrangement of input / output terminals of each surface-mounted electronic component, and it is possible to easily measure the electrical characteristics of various surface-mounted electronic components It made.

As a result, according to the surface mount type electronic component measuring apparatus of the present invention, even a surface mount type electronic component having a different electrode terminal arrangement can be measured with a simple change such that the measurement jig substrate is replaced. It is possible to provide a measuring device for a surface mount type electronic component having a measuring jig portion capable of performing accurate and reproducible measurement with stable electrical connection between a ground terminal and a ground. it can.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a measuring device for a surface-mounted electronic component according to the present invention will be described in detail with reference to the drawings.

FIG. 1 is an external perspective view similar to FIG. 6 showing an embodiment of a measuring device for a surface-mounted electronic component of the present invention, and FIG. 2 shows an embodiment of a measuring jig in the measuring device. FIG. 8 is a partially enlarged perspective view similar to FIG.

In FIGS. 1 and 2, reference numeral 21 denotes a measuring device for surface-mounted electronic components, 22 denotes a pedestal plate, 23 denotes a holding / measuring unit, and 24 denotes a holding / measuring unit.
Is a pressing mechanism for fixing the surface-mounted electronic component to the holding and measuring unit 23. Reference numeral 25 denotes a holding / measuring unit 23 for holding and electrically connecting the surface mount type electronic component, 26 a connector for electrically connecting to an external measuring device, and 27 a measuring jig unit. The pedestal 27 includes fixed pedestals 27a and 27c, a movable pedestal 27b, a connecting member 27d, and the like. Reference numeral 28 denotes a pressing unit for fixing the surface-mounted electronic component to the measuring jig unit 25 in the pressing mechanism unit 24, and reference numeral 29 denotes a pressing bar for moving the pressing unit 28 up and down.

Reference numeral 30 denotes a measuring jig substrate made of a rectangular parallelepiped conductor such as a metal, which is electrically grounded and extends from two sides to a central electronic component holding position. Mating groove 30 for mating and fixing
a is formed. 31 is a U-shaped conductor groove member made of a conductor such as metal and having an opening on the upper side, 32 is a conductor groove member 31
A microstrip line which is in contact with input / output terminals of an electronic component disposed electrically insulated therein, and the microstrip line 32 is formed on an insulating base 32a made of a dielectric material such as ceramics and an upper surface thereof. Transmission line layer 32
b and a ground conductor layer 32c formed on the lower surface. The conductor groove member 31 and the microstrip line 32 are measured and measured so that the conductor groove member 31 is fitted into the fitting groove 30a, and the tip thereof corresponds to the input / output terminal of the electronic component at the electronic component holding position. The microstrip line is fixed from the opening of the conductor groove member 31 so that the input / output terminals of the electronic component and the transmission line layer 32b are in contact with each other when the surface-mounted electronic component is mounted and fixed. 32 is elastically combined so as to slightly protrude and be exposed on the upper surface of the measurement jig substrate 30. The conductor groove member 31 is connected to the ground wire of the connector 26 and the measurement jig substrate 30
Is electrically connected to ground by mating with
The signal line of the connector 26 is electrically connected to the microstrip line 32 and connected to the signal line of the measuring instrument.

Reference numeral 33 denotes a guide plate for positioning the surface-mounted electronic component, and reference numerals 34a and 34b denote a pair of conductor groove members 31 and a pair of microstrip lines 32 on which the measurement jig substrate 30 is mounted and fixed. Is an adjusting member for moving them in accordance with the fitting groove 30a,
Each is mounted on a pedestal 27 to perform its function.
In this example, one of the adjusting members 34b is connected to the movable base 27b.
The movable pedestal 27b is moved in the direction of the connecting member 27d, and the adjusting member 34b is moved in the vertical direction on the movable pedestal 27b, whereby the movable pedestal 27b can be moved in the direction of the arrow in the drawing, and can be moved in the same plane. The other adjustment member 34 above
The relative position between the conductor groove member 31 and the microstrip line 32 attached to both can be adjusted according to the position where the fitting groove 30a of the measuring jig substrate 30 is provided. can do.

By changing the movable range and the mechanism of the pedestal 27, the fitting groove 30a is moved to the position adjacent to the measuring jig substrate 30.
It is possible to easily cope with the case where it is formed on the side.

According to the surface mount type electronic component measuring apparatus 21 of the present invention, the surface mount type electronic component (not shown) is positioned and placed on the measuring jig section 25, and the pressing rod 29 is provided. And press and fix the surface-mount type electronic component by the holding portion 28, and the microstrip line 32 is used as the input / output terminal of the surface-mount type electronic component, and the conductor groove member 31 or the other terminal (ground terminal) is used. The measurement jig substrate 30 is brought into direct contact and electrically connected, and the signal line of the measurement device is connected to the connector 26 to measure the electric characteristics of the surface mount type electronic component.

The measuring jig 25 in the measuring apparatus 21 of the present invention
3 (a) and 3 (b) are cross-sectional views similar to those of FIG. FIG.
(A) shows a cross section perpendicular to the microstrip line 32, and (b) shows a cross section along the microstrip line 32. Further, as the surface-mounted electronic component, the surface-mounted electronic component 15 shown in FIG. 8 is shown as an example. As shown in these figures, the guide plate 33 is placed on the measuring jig 25.
Electronic component 15 positioned and held by
Are the ground terminal 16a and the conductor groove member 31 or the measuring jig substrate 30, and the input / output terminal 16b and the microstrip line.
The 32 transmission line layers 32b come into contact with each other and become electrically connected. Although FIG. 3A shows an example in which the ground terminal 16a is in contact with the measurement jig substrate 30, the conductor groove member 31 is formed to have a wide shape as described above and the ground terminal 16a and the conductor groove member 31 may be contacted.

According to the surface mount type electronic component measuring apparatus of the present invention, the arrangement of the electrode terminals of the surface mount type electronic component is different from that of the surface mount type electronic component 17 shown in FIG. 10 and the surface mount type electronic component 17 shown in FIG. Input / output terminals 18b / 20b of the surface-mounted electronic components 17/19
The measurement jig substrate 30 provided with the fitting groove 30a at a position corresponding to the arrangement of the microstrip line 32 is prepared by adjusting the position of the adjusting member 34b in accordance with the position of the fitting groove 30a.
, The electrical characteristics of the surface-mounted electronic components 17 and 19 can be similarly measured by electrically connecting the input / output terminals 18b and 20b to the microstrip line 32. .

FIG. 4 is a perspective view showing the external appearance of an electronic component main body in which input / output terminals to be measured are provided at diagonal positions of two opposing sides of the electronic component main body. Like a part of the measuring jig part 35, a fitting groove is provided from the diagonal position of two opposing sides of the rectangular parallelepiped conductor to the holding position of the electronic part in the center so as to correspond to the input / output terminals of the electronic part.
The formation of the conductor groove member at the diagonal position by forming 36a
The microstrip line 37 and the microstrip line 38 can be arranged and fixed. In this way, surface-mounted electronic components having various electrode terminal arrangements can be easily measured.

In FIG. 4, reference numeral 39 denotes a guide plate for positioning the surface-mounted electronic component, and the microstrip line 38 comprises an insulating base 38a, a transmission line layer 38b formed on the upper surface thereof, and a lower surface. And a ground conductor layer 38c formed on the substrate.

The surface mount type electronic component 19 shown in FIG.
When the electrode terminals 20a and 20b are formed in a concave shape with respect to the lower surface of the electronic component body as shown in FIG. By forming a fitting groove 40a corresponding to the terminal 20b and forming a convex portion 40b at a position corresponding to the ground terminal 20a, the input / output terminal 20b, the transmission line layer of the microstrip line and the ground terminal 20a are grounded. The electrical contact of each of the measurement jig substrates 40 thus obtained can be favorably performed. FIG. 11 shows only the measurement jig substrate 40. The area indicated by the dotted line on the upper surface of the measurement jig substrate 40 is a portion where the guide plate is attached and becomes a holding position of the electronic component.

Then, according to the measuring apparatus 21 of the present invention, the positions of the conductor groove member 31 and the microstrip line 32 are adjusted by replacing the measuring jig substrate 30 of the measuring jig section 25 with the measuring jig substrate 40. This makes it possible to easily cope with the surface-mounted electronic component 19 and perform accurate and reproducible measurement.

In the surface mount type electronic component measuring apparatus of the present invention, the measuring jig substrates 30, 36, and 40 are made of metal or the like, and are used for fitting and fixing the conductor groove members 31 and 37 to each other. The grooves 30a, 36a, and 40a are formed and are adapted to the arrangement of the electrode terminals of the surface mount electronic component and the structure of the lower surface side. The conductor groove members 31 and 37 positioned by the movable pedestal 27b and the adjustment member 34 are provided. It is fitted and held by being fitted into an L-shaped adjusting member 34 using a conductor such as a metal. Further, the fitting grooves 30a and 36a are provided with conductor groove members 31 corresponding to the positions of the input / output terminals of the surface mount electronic component.
The conductor groove members 31 and 37 may be formed so as to have the same depth as the conductor groove members 31 and 37 or a depth such that the conductor groove members 31 and 37 protrude slightly.

The conductor groove members 31 and 37 may be made of a conductor such as a metal, and may have a position and a size such that the upper surface on the opening side is flat and surrounds the microstrip line disposed therein.
The ground wire of the connector 26 is connected with solder or the like.

The microstrip lines 32 and 38 are
A dielectric material having a high dielectric constant such as ceramic is provided on the insulating substrates 32a and 38a, and the transmission line layers 32b and 38b and the ground conductor
A metal conductor such as copper is used for c and 38c.
The connection between the signal line and the transmission line layers 32b and 38b and the ground line of the connector 26 and the ground conductor layers 32c and 38c is performed by soldering or the like.

The connector 26 is, for example, an SMA connector, and is attached to the adjusting member 34 with screws or solder, and is connected to an external measuring device.

The guide plates 33 and 39 are arranged so that the electronic components can be positioned so that the input / output terminals of the surface mount type electronic components and the microstrip lines 32 and 38 are in contact with each other and are electrically connected. Various shapes and dimensions may be used as long as the electronic component can be held and positioned, and the electronic component may be fixed to the measurement jig substrate with screws or an adhesive.

On the other hand, in the holding mechanism 24, the holding portion 28
For example, a flat shape may be used so that the electronic component can be held and fixed using plastic or the like, and the measurer operates the holding rod 29 to hold the surface-mounted electronic component with the holding / measuring unit 23. Then, each input / output terminal and the microstrip line, and the ground terminal and the conductor groove member or the measuring jig substrate are stably contacted and electrically connected.

[0037]

As described above, according to the apparatus for measuring a surface-mounted electronic component of the present invention, a pair of microstrip lines to be brought into contact with a pair of input / output terminals of the surface-mounted electronic component are respectively provided with openings on the upper side. A pair of U-shaped conductor groove members having a conductor groove member electrically insulated from the conductor groove member, and are arranged on the upper surface of a measuring jig substrate made of an electrically grounded conductor at a center holding position of the substrate. The microstrip line is fitted and fixed in a pair of fitting grooves formed over the pair, and at least a part of the microstrip line is formed on a lower surface side of a surface mount electronic component mounted on the upper surface of the measurement jig substrate. The configuration is such that the input and output terminals of the surface-mounted electronic component are securely in contact with the transmission line layer of the microstrip line and are electrically connected to each other because the configuration is such that the input and output terminals are exposed on the upper surface of the measurement jig substrate so as to contact the output terminals. And the other electrode terminals (ground terminals) are in direct contact with and electrically connected to the measuring jig substrate made of a grounded conductor or a conductor groove member having the same electric potential as the substrate. , Each can be easily and stably electrically connected,
Accurate and reproducible measurement has become possible.

Further, according to the surface mount type electronic component measuring apparatus of the present invention, the measuring jig substrate is placed and fixed, and the adjusting member to which the conductor groove member to be fitted into the fitting groove is attached is provided. Since the relative position of the conductor groove member can be adjusted in the same plane, the shape and dimensions of the electronic component to be measured and the By simply preparing and replacing a measuring jig substrate having a fitting groove at a position corresponding to the arrangement, adjusting the positions of the conductor groove member and the microstrip line according to the positional relationship of the fitting groove, respectively Thus, the arrangement of the input / output terminals of the surface-mounted electronic component can be supported, and the measurement of the electrical characteristics of various surface-mounted electronic components can be easily performed.

As a result, according to the surface mount type electronic component measuring apparatus of the present invention, even a surface mount type electronic component having a different electrode terminal arrangement can be measured with a simple change such that the measurement jig substrate is replaced. It is possible to provide a measuring device for a surface mount type electronic component having a measuring jig portion capable of performing accurate and reproducible measurement with stable electrical connection between a ground terminal and a ground. did it.

[Brief description of the drawings]

FIG. 1 is an external perspective view showing an embodiment of a measuring device for a surface-mounted electronic component of the present invention.

FIG. 2 is a partially enlarged perspective view showing one embodiment of a measuring jig section of the measuring device for a surface-mounted electronic component of the present invention.

FIGS. 3A and 3B are cross-sectional views showing a connection state between a measuring jig unit and a surface-mounted electronic component in the surface-mounted electronic component measuring apparatus according to the present invention.

FIG. 4 is an external perspective view showing another embodiment of the measuring jig portion of the measuring device for a surface-mounted electronic component of the present invention.

FIG. 5 is an external perspective view showing another embodiment of the measuring jig substrate of the measuring device for a surface-mounted electronic component of the present invention.

FIG. 6 is an external perspective view showing an example of a conventional measuring device for surface mount electronic components.

FIG. 7 is a partially enlarged perspective view showing a measuring jig portion of a conventional measuring device for surface-mounted electronic components.

FIG. 8 is an external perspective view showing an example of a surface mount electronic component.

FIGS. 9A and 9B are cross-sectional views showing a connection state between a measuring jig unit and a surface-mounted electronic component in a conventional measuring apparatus for surface-mounted electronic components.

FIG. 10 is an external perspective view showing another example of the surface mount electronic component.

FIG. 11 is an external perspective view showing another example of the surface mount electronic component.

[Explanation of symbols]

15, 17, 19 ... Surface mount electronic components 16, 18, 20 ... Electrode terminals 16b, 18b, 20b ... Input / output terminals 21 ... ······ Surface mount type electronic component measurement device 25, 35 ····· Measurement jig unit 30, 36, 40 ····· Measurement jig substrate 30a , 36a, 40a Fitting grooves 31, 37 ... Conductor groove members 32, 38 ... Microstrip lines 34a, 34b ... ... Measurement jig substrate holder

Claims (1)

[Claims] 1. A surface-mounted electronic component is mounted on an upper surface,
And a measuring jig substrate made of an electrically grounded conductor having a pair of fitting grooves formed on the upper surface thereof, and a U-shaped having an upper opening to be fitted and fixed in the fitting grooves. A pair of conductor groove members, and a pair of input grooves formed on the lower surface side of the surface mount type electronic component placed on the upper surface of the measurement jig substrate and electrically insulated in the pair of conductor groove members. A pair of microstrip lines, at least a part of which is exposed on the upper surface of the measurement jig substrate so as to be in contact with the output terminal, a pair of the conductor groove members and a pair of the microstrip lines are attached, and the microstrip is internally provided. A measuring device for a surface-mounted electronic component, comprising: an adjusting member for moving the conductor groove member, in which a line is electrically insulated and arranged, into a fitting groove of the measuring jig substrate.