JPH1038920A - Probe unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a probe unit capable of coping with the miniaturization of members being detection objects, and free from noise and imperfect contact caused by the difference between thermal expansion coefficients. SOLUTION: This probe unit has a probe pin 1 for detecting an electric characteristic of an electronic component, a pipe 2 for holding the probe pin 1, and a pipe supporting base 3 into which the pipe 2 is inserted. In this case, the pipe supporting base 3 is made of photosensitive glass. It does not matter if the pipe 2 is conductor, and in addition if a conductive pattern being in continuity with the pipe 2 and for leading the output from the probe pin 1 to outside is formed on the pipe supporting base 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a probe unit for detecting electrical characteristics of an electronic component such as an IC.

[0002]

2. Description of the Related Art For example, a probe unit is used to detect electrical characteristics of device components such as various semiconductor elements. FIG. 5 shows an example of a conventional probe unit.
In FIG. 5, holes 43a are formed by machining in an insulating pipe support base 43 made of an acrylic resin, aromatic polyester, or the like. A probe 50 is provided on the inner surface of the hole 43a. The probe 50 has a pipe 42 on the outer periphery, the pipe 42 penetrates the hole 43a, and the outer peripheral surface of the pipe 42 is fixed to the inner peripheral surface of the hole 43a. The upper and lower 2
Peripheral grooves 42a and 42b are formed at locations by drawing, and by forming these peripheral grooves 42a and 42b, the pipe 4
A convex portion is formed on the inner peripheral surface of No. 2.

A spring 45 is provided inside the pipe 42.
Is inserted. The lower end of the spring 45 is the circumferential groove 42
The protrusion a is brought into contact with the protrusion a, and is supported by the protrusion without falling down. Further, a cylindrical connector 46 is press-fitted and fixed inside the pipe 42 and below the convex portion formed by the peripheral groove 42a. Further, a probe pin 41 is inserted from the upper end side of the pipe 42. Probe pin 41
Is a part to be applied to a terminal or a check land of a device part such as a semiconductor element.
It protrudes above 2 and has a sharp shape. The lower end of the probe pin 41 located inside the pipe 42 is held in contact with one end of a spring 45. Therefore, when the probe pin 41 is biased downward against the elastic force of the spring 45, the probe pin 41 sinks downward, that is, into the pipe.
Note that a lead wire 44 is drawn out from the lower end of the probe pin 41. The lead wire 44 is inserted through the spring 45 and the inner circumference of the pipe 46, is drawn out from the lower side of the pipe 42, and is connected to a characteristic evaluation device (not shown). Therefore, a device signal detected from the probe pin 41 is sent to the characteristic evaluation device via the lead wire 44.

A plurality of probes 50 having the above-described configuration are provided on a pipe support base 43. A probe unit is constituted by such a pipe support base 43 and a plurality of probes 50 provided on the pipe support base 43.

[0005]

As described above, in the conventional probe unit, a plurality of holes are formed on a pipe support base 43 made of acrylic resin, aromatic polyester or the like by machining or the like, and the plurality of holes are formed. The probe 50 is formed by arranging a plurality of pins. In recent years, with the miniaturization of device components, the mutual spacing of the holes 43a formed in the pipe support base 43 and the diameter and the like of the holes 43a have also been reduced, and the arrangement density of the probes 50 has tended to increase. In such cases, there is a limit in reducing the diameter of the hole 43a, and the hole 43a can be formed only up to a certain size. The thickness of the pipe support base 43 can be reduced to further reduce the size of the hole 43a. However, on the other hand, the contact portion between the outer peripheral surface of the pipe 42 and the pipe support base 43 is reduced. The perpendicularity of the probe 50 is deteriorated.

In general, silicon, glass or the like is used as a material of a base of a device component or the like, but an insulator such as an acrylic resin or an aromatic polyester is used as a material for a pipe support base 43 of a probe unit. Is done. The substrate such as the device component and the pipe support base 43 do not have the same thermal expansion coefficient.
Has a higher coefficient of thermal expansion and tends to be warped. Therefore, when the pipe support base 43 is warped, a contact portion of the probe 50 with a device component or the like may be shifted and measurement may not be possible.

Further, the plurality of probes 50 provided in the probe unit are provided with the leads 44, respectively. However, since the leads 44 are wired in a large number, the cost is high and noise is likely to enter. And the signal detected from the probe pin 41 was adversely affected.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems of the prior art, and can cope with downsizing of a member to be detected such as a semiconductor device. It is an object of the present invention to provide a probe unit that eliminates noise.

[0009]

According to the first aspect of the present invention,
A probe unit having a probe pin for detecting electrical characteristics of an electronic component, a pipe holding the probe pin, and a pipe support base into which the pipe is inserted, wherein the pipe support base is formed of photosensitive glass. It is characterized by the following.

The invention according to claim 2 is characterized in that the pipe is a conductor, and a conductive pattern is formed on the pipe support base to conduct the output from the probe pin to the outside by conducting with the pipe. And

According to a third aspect of the present invention, there is provided a probe unit having a probe pin for detecting an electrical characteristic of an electronic component, and a probe pin support base on which the probe pin is inserted and the probe pin is slidably supported. The probe pin support base is formed of photosensitive glass.

According to a fourth aspect of the present invention, in the third aspect of the present invention, at a position parallel to the probe pin support base,
A receiving member support base made of photosensitive glass and provided with a receiving member is provided, and an urging member is interposed between the probe pin and the receiving member.

According to a fifth aspect of the present invention, in the fourth aspect, the receiving member is a conductor, and the receiving member supporting base is formed with a pattern for guiding the output from the probe pin to the outside. Features.

According to a sixth aspect of the present invention, in the fourth aspect of the present invention, the receiving member is made of a conductor, and penetrates the receiving member support base and protrudes to the opposite side from the probe pin support base. It has a protruding part, and the tip of the protruding part is connected to a conductive pattern provided on the surface of a wiring board made of photosensitive glass parallel to the receiving member support base.

According to a seventh aspect of the present invention, in the third aspect of the present invention, an urging member supporting base made of photosensitive glass is provided at a position parallel to the probe pin supporting base. An urging member is interposed between the support bases, and the urging member is connected to a conductive pattern provided on the urging member support base.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a probe unit according to the present invention will be described with reference to the drawings. In FIG. 1, a pipe support base 3 made of photosensitive glass and having a conductive pattern of an appropriate shape formed thereon.
Is provided with a hole 3a. The end of the conductive pattern is located at the position where the hole 3a is formed, and the end of the conductive pattern extends to the inner peripheral surface of the hole 3a. like this,
A pipe 5 is passed through and fixed to the inner surface of the hole 3a. Since the pipe 5 is formed from a conductive material, the conductive pattern formed on the pipe support base 3 is electrically connected to the pipe 5.

On the outer peripheral surface of the pipe 5 below the pipe support base 3, two circumferential grooves 2a and 2b are formed by drawing at upper and lower locations. A circumferential groove 2a on the outer peripheral surface of the pipe 5,
By providing 2b, a convex portion is formed on the inner peripheral surface of the pipe 5 at the same position as the peripheral grooves 2a, 2b. One end of the coil-shaped spring 5 is in contact with a projection formed on the inner peripheral surface of the pipe 5 by the formation of the peripheral groove 2a. The spring 5 is supported without falling downward by a convex portion formed by the formation of the circumferential groove 2a.
The probe pin 1 is in contact with the upper end of the spring 5. The upper portion of the probe pin 1 protrudes above the pipe 5, and the upper end applied to a device component or the like has a pointed shape. Further, since the probe pin 1 is in contact with one end of the spring 5, the probe pin 1 sinks downward by pushing the probe pin 1 against the elastic force of the spring 5. Further, the probe pin 1 that has sunk downward can be returned to the original position by the elastic force of the spring 5. Although not shown, the probe pin 1 is prevented from dropping from the pipe 5 by an appropriate stopper. The spring 5 and the probe pin 1 are made of a conductive member.
The protrusion formed by the formation of a is always in contact with the pipe 5. For this reason, the conductive pattern provided on the pipe support base 3 is electrically connected to the probe pin 1 via the pipe 2 and the spring 5. Therefore, a signal detected by applying the probe pin 1 to a device component or the like is guided to the conductive pattern on the pipe support base 3 via the spring 5 and the pipe 2 and the conductive pattern on the pipe support base 3. To a characteristic evaluation device (not shown).

Although FIG. 1 shows only one probe pin 1, a large number of probe pins 1 are arranged at predetermined intervals depending on an object to be detected or measured. The evaluated signal is evaluated.

Next, a method of forming the hole 3a for attaching the pipe 2 to the pipe support base 3 made of photosensitive glass will be described. In order to form the hole 3a in the pipe support base 3 made of photosensitive glass, exposure → development (heat treatment) →
It goes through each process of etching → re-exposure.

First, in the exposure step, a mask on which a pattern of the holes 3a to be formed is placed is placed on the photosensitive glass whose both surfaces are polished, and the portion on which the mask is placed is irradiated with ultraviolet rays. By irradiating with ultraviolet rays, a latent image of the pattern is formed in the photosensitive glass.

In the next development (heat treatment) step, the photosensitive glass on which the latent image has been formed is subjected to a heat treatment at a temperature of, for example, 450 to 600 ° C. to develop the latent image obtained in the previous exposure step. By performing the heat treatment in this manner, the latent image portion is crystallized and easily dissolved in acid.

In the next etching step, the developed portion, that is, the portion crystallized by the heat treatment is removed with an acid to form a hole 3a to which the pipe 2 is attached. In this case, the depth of the hole 3a can be adjusted by changing the etching time. In the present invention,
The etching is performed for a time sufficient for the holes 3a to be formed through the photosensitive glass substrate.

In the next re-exposure step, unexposed portions of the photosensitive glass are irradiated with ultraviolet rays, for example, at 700 to 750 ° C.
By performing the heat treatment again at the above temperature, a glass ceramic having excellent physical and chemical durability can be obtained. A completed pipe support base 3 is formed by drawing a conductive pattern on such a material by, for example, screen printing or the like.

According to the probe unit having the above-described configuration, the pipe support base 3 for supporting the pipe 2 is made of photosensitive glass, and the hole 3a provided on the pipe support base 3 is provided with a photosensitive member. After exposure to ultraviolet light by applying a mask depicting the shape and arrangement pattern of the holes 3a to the non-conductive glass, the exposed portion (latent image portion) is crystallized and developed by heat treatment, and the crystallized portion, that is,
Because it is formed by etching the developed part with acid,
It is formed straight, that is, exactly perpendicular to the conductive pattern forming surface, and with extremely high dimensional accuracy. Further, by forming the hole 3a in the pipe support base 3 made of photosensitive glass using such a method, it is possible to secure a high accuracy (vertical accuracy and dimensional accuracy) while maintaining an extremely narrow pitch and an extremely small diameter. Hole 3a can be formed,
It is possible to improve the arrangement density of the probes on the pipe support base 3 and sufficiently cope with miniaturized device parts.

Silicon or glass is used as a material of the base of the device parts and the like. However, since the material of the pipe support base 3 of the probe unit is a photosensitive glass close to the base of the device parts, the device parts and the probe The difference in the coefficient of thermal expansion between the unit and the pipe support base 3 is reduced, so that unstable contact is eliminated and stable measurement can be performed.

The probe unit has no lead wire, and a signal detected by the probe pin 1 is output to the conductive pattern 3 on the pipe support base 3 via the spring 5 and the pipe 3a. It has a leadless structure that is sent to a characteristic evaluation device that does not. Therefore, the probe unit can be provided at a low cost because the lead wire is unnecessary. Further, since it is not necessary to use a lead wire that easily picks up noise, the influence of noise on the detection signal can be reduced, and the detection characteristics of the probe unit can be improved.
Further, by adopting the leadless structure, the arrangement density of probes on the pipe support base 43 can be increased, and a probe unit in which probes are arranged at an extremely narrow pitch can be provided.

Although the probe unit is a unit type with a pipe, there is also a type without a pipe. Next, an embodiment of a probe unit having no such a pipe will be described.

In FIG. 2, the plate-shaped probe pin support base 13 is made of photosensitive glass and has a hole 13a into which the probe pin 11 is inserted. The holes 13a are formed in the probe pin support base 13 made of a photosensitive gas through the above-described steps of exposure, development (heat treatment), etching, and re-exposure. Moreover, it is formed with high dimensional accuracy.

On the other hand, a receiving member support base 17 is provided below the probe pin support base 13 so as to be parallel to the probe pin support base 13. The receiving member support base 17 is also made of photosensitive glass similarly to the probe pin support base 13, and has a hole 17a at a position vertically overlapping the hole 13a. Similarly to the hole 13a, the hole 17a is exposed to light → developed (heat treated) → etched →
It is formed by going through each step of re-exposure. Therefore, they are formed with an extremely narrow pitch and high dimensional accuracy.

A spacer 18 is interposed between the probe pin support base 13 and the receiving member support base 17. Since the spacer 18 is interposed between the probe pin support base 13 and the receiving member support base 17, the dimension between the probe pin support base 13 and the receiving member support base 17 becomes constant, and the probe pin support base Table 13 and receiving member support base 1
7 are maintained parallel to each other. The spacer 18 has holes larger in diameter than the holes 13a and 17a at positions facing the holes 13a and 17a. Therefore, the hole 13a is located between the hole 13a and the hole 17a.
A space A having a diameter larger than the diameter of the hole 17a is generated.

A probe pin 11 made of a conductive material is inserted into a hole 13a formed in the probe pin support base 13. The probe pin 11 has a pointed upper end portion to be attached to a device component or the like. A flange 11a is provided on the outer periphery of the lower end of the probe pin 11.
Is provided. In such a probe pin 11, a pointed portion at the upper end from the space A is inserted into the hole 13a,
The upper end protrudes from the upper surface of the probe pin support base 13. The flange 11a of the probe pin 11 abuts on the outer edge of the hole 13a, so that the rising limit of the probe pin 11 is defined and the probe pin 11 is prevented from coming off.

On the other hand, a receiving member 21 made of a conductive material is inserted into a hole 17a formed in the receiving member support base 17. The receiving member 21 has a shape in which the probe pin 11 is inverted, and has a sharp lower end. A flange 21a is provided on the outer periphery of the upper end of the receiving member 21. Such a receiving member 21
The lower end is inserted into the hole 17 a from the space A, and the lower end protrudes from the lower surface of the hole 17 a of the receiving member support base 17. The receiving member 21 has its flange 21
When a contacts the outer edge of the hole 17a, the hole 17a is prevented from coming off.

Between the probe pin 11 and the receiving member 17, a spring 15, which is an urging member, made of a conductive member is interposed. Due to the return force of the spring 15, the probe pin 11 and the receiving member 21 are urged in directions opposite to each other, and the flange 11a of the probe pin 11 is connected to the edge of the hole 13a and the flange 2 of the receiving member 21.
1a can abut on the edge of the hole 17a, respectively.

A wiring board 20 is provided below the receiving member support base 17 and the receiving member 21. Wiring board 20
Is formed of photosensitive glass, and a hole 20a is formed at a position corresponding to the sharp tip of the receiving member 21. The holes 20a are formed through the steps of exposure, development (heat treatment), etching, and re-exposure, similarly to the holes 13a and 17a. For this reason, it is formed with an extremely narrow pitch and high dimensional accuracy.

As shown in FIG. 3 (a), one end of the conductive pattern in which a conductive pattern of an appropriate shape is formed on the surface of such a wiring board 20 has a lower edge portion of the hole 20a, and , The inner peripheral surface of the hole 20a and the upper edge of the hole 20a. Therefore, when the sharp tip of the receiving member 21 is inserted into the hole 20a of the wiring board 20, the tapered surface of the receiving member 21 and the conductive pattern 22 provided on the upper edge portion of the hole 20a come into contact with each other, and The members are electrically connected. The receiving member 21 is made of a conductive material and is in contact with the spring 15. Since the spring 15 is in contact with the probe pin 11, the probe pin 11 is interposed between the spring 15 and the receiving member 21.
Is electrically connected to the conductive pattern on the wiring board 20 via the. The receiving member 21 is formed in the hole 2 of the wiring board 20.
The dimensions of each part are set such that the flange 21a of the receiving member 21 rises up from the receiving member support base 17 in a state where the flange 21a is in contact with the peripheral edge of Oa.

In the probe unit having the above-described configuration, a signal is detected by applying a pointed portion at the upper end of the probe pin 11 to a device component or the like. The detection signal is output from the probe pin 11 to the conductive pattern 22 on the wiring board 20 via the spring 15 and the receiving member 21, and is output from the conductive pattern 22 to the characteristic evaluation device.
When the probe pin 11 abuts against a device component or the like, the probe pin 11 sinks downward, that is, sinks toward the receiving member 21 against the return force of the spring 15.

The probe unit having the above configuration is
Probe pin support base 1 on which probe pins 11 are supported
3, and the receiving member support base 17 on which the receiving member 21 is supported is made of photosensitive glass, and furthermore, the hole 13a provided on the probe pin support base 13 and the receiving portion support base 17 The holes 17a provided are exposed to ultraviolet light by applying a mask to a photosensitive glass serving as a base member, and then heat-treated to crystallize and develop an exposed portion (latent image portion), and to crystallize the portion, that is, the crystallized portion, Since the developed portion can be formed by etching with an acid, it can be formed straight, that is, exactly perpendicular to the conductive pattern forming surface, and with extremely high dimensional accuracy. Therefore, by forming the holes 13a and the holes 17a in the probe pin support base 13 and the receiving portion support base 17 made of photosensitive glass using such a method, high accuracy (vertical accuracy and dimensional accuracy) can be obtained. The holes 13a and 17a having an extremely small pitch and an extremely small diameter can be formed while ensuring a sufficient space, so that the density of arrangement of the probes on the pipe support base 3 can be improved, and the device can sufficiently cope with miniaturized device parts. be able to.

FIG. 2 shows only one set of the probe pin 11, the spring 15, the receiving member 21, and the like. However, a plurality of sets are arranged at predetermined intervals in accordance with the objects to be detected and measured to constitute a probe unit. I have.

The device parts and the like are made of silicon, glass or the like as a base material. The probe pin support base 13, the receiving part support base 17, and the wiring board 20 are made of a material close to this, that is, a photosensitive material. Glass was used. Therefore, since the difference in thermal expansion coefficient between the device component and the probe unit lobe support base 13, the receiving unit support base 17, the wiring board 20, and the like is small, unstable contact is eliminated and stable measurement can be performed.

The probe unit has no lead wire, and a detection signal from the probe pin 11 is output to the characteristic evaluation device by a receiving member 21 connected to the conductive pattern 22 provided on the wiring board 20. You. Therefore, the probe unit can be provided at a low cost because the lead wire is unnecessary. Also, since it is not necessary to use a lead wire that easily picks up noise, the effect of noise is eliminated,
The detection characteristics of the probe unit can be improved. Further, by adopting the leadless structure, the arrangement density of the probes can be increased, and a high-density probe unit can be provided.

The above-mentioned probe unit is the same as that shown in FIG.
As shown in (a), one end of the conductive pattern 22 is pulled out to the inner peripheral surface of the hole 20a and the edges of both surfaces, and the pointed portion of the receiving member 21 is inserted into the hole 20a, and the tapered surface of the receiving member 21 is inserted. The electrical connection is made by connecting one end of the conductive pattern 22 extending to the upper edge of the hole 20a. However, it is not limited to this. For example, as shown in FIG. 3B, the inside of the hole 20a is filled with a conductive member 23, and the conductive member 23 is
Connected to one end of the upper conductive pattern 24 and
A pointed portion of the receiving member 21 may be applied to the conductive member 23 exposed to the outside from a to achieve electrical connection. Even in such a configuration, a leadless structure without a lead wire is provided, so that it is possible to provide an inexpensive probe unit with reduced cost and to eliminate noise. Further, since there is no lead wire, the arrangement density of the probes can be improved.

In FIGS. 3A and 3B, the conductive pattern is formed on the lower surface of the wiring board 20, but the present invention is not limited to this. It may be formed on the upper surface, or may be formed on both the upper surface and the lower surface. In addition, a conductive pattern is formed on the receiving member support base 17 and the receiving member 21 having conductivity is provided.
The receiving member support base 17 may be configured to be brought into contact with the conductive pattern of the receiving member support base 17 and a detection signal is output to an external characteristic evaluation device through the conductive pattern of the receiving member support base 17.

Further, still another embodiment of the probe unit will be described. The probe unit shown in FIG. 4 includes a probe pin 11, a probe pin support base 13,
It has a spacer 18, a spring 15, and the like, and these members have a configuration similar to the probe unit shown in FIG. Therefore, the probe pin support base 13 is made of photosensitive glass, and the holes 13a are formed through the steps of exposure, development (heat treatment), etching, and re-exposure. However, the probe unit shown in FIG. 4 does not have the wiring board 20 in the example shown in FIG. 2, and the urging member support base 27 is provided on the lower end surface of the spacer 18, and the conductive pattern 25 is formed on the surface. The spring unit 15 is different from the probe unit shown in FIG. 2 in that the spring 15 is supported by the biasing member support base 27 described above.

In FIG. 4, the urging member support base 27 is made of photosensitive glass. A hole 2 is provided at a position of the urging member support base 27 corresponding to the hole 13a of the probe pin support base 13.
7a is provided. The holes 27a are formed by subjecting the urging member support base 27 made of photosensitive glass to exposure → development (heat treatment) → etching → re-exposure similarly to the holes 13a. The hole 27a is on the upper side,
That is, the spacer 18 has a large diameter portion, and the lower portion has a small diameter portion.

The diameter of the large diameter portion of the hole 27a is set to be substantially the same as or larger than the diameter of the spring 15. For this reason, the lower end of the spring 15 is
The spring 15 is inserted into the large-diameter portion of the hole 27a and supported by a stepped portion between the large-diameter portion and the small-diameter portion of the hole 27a.

A conductive pattern 25 having an appropriate shape is provided on the lower surface of the urging member support base 27. One end of the conductive pattern 25 is connected to a characteristic evaluation device (not shown) provided outside. The other end of the conductive pattern 25 reaches the inner peripheral surface of the hole 27a. More specifically, it extends to the inner peripheral surface of the small diameter portion of the hole 27a, the upper surface of the step between the large diameter portion and the small diameter portion, and the large diameter portion. Therefore, hole 2
The lower end of the urging member 15 is inserted into the large-diameter portion
The conductive pattern 25 and the spring 15 are electrically connected by supporting the spring 15 at the step between the large diameter portion and the small diameter portion of a. Further, since the spring 15 is also electrically connected to the probe pin 11,
The probe pin 11 is electrically connected to the conductive pattern 25 provided on the urging member support base 27 via the spring 15.

According to the probe unit having the above structure, the probe pin support base 1 on which the probe pins 11 are supported
3, and a biasing member support base 27 on which the spring 15 is supported is made of photosensitive glass. In addition, a hole 13a provided in the probe pin support base 13 and a biasing member support base 27 are provided on the biasing member support base 27. The holes 27a can be formed by exposing a photosensitive glass as a base member to a mask by exposing the mask to a mask and performing an etching process. Therefore, the holes 27a are precisely perpendicular to the conductive pattern forming surface and have extremely high dimensional accuracy. Can be formed. Therefore, the holes 13a and 17a having an extremely narrow pitch and an extremely small diameter can be formed while securing high accuracy (vertical accuracy and dimensional accuracy), and by improving the arrangement density of the probes, it is possible to reduce the size of device parts. Can cope well.

Silicon or glass is used as a material of the base of the device parts and the like. As a material of the probe pin support base 13 and the urging member support base 27, photosensitive glass similar to the above base material is used. Due to the use, the difference in thermal expansion coefficient between the base of the device component and the probe pin support base 13, the urging member support base 17, the wiring board 20, etc. of the probe unit is small, and the unstable contact occurs even when the temperature changes. Is eliminated, and stable measurement can be performed.

The probe unit does not have a lead wire, and the detection signal from the probe pin 11 is transmitted by the spring 15 electrically connected to the conductive pattern 25 provided on the biasing member support base 27. Since the output can be output to the characteristic evaluation device, the probe unit can be provided at a low cost because the lead wire is unnecessary. In addition, since it is not necessary to use a lead wire that easily picks up noise, noise can be eliminated. Further, by adopting the leadless structure, the arrangement density of the probes can be increased, and a high-density probe unit can be provided.

Further, since the conductive pattern 25 is formed directly on the biasing member support base 27 for supporting the spring 15, there is no need to prepare a separate wiring board.
This can contribute to cost reduction.

[0051]

According to the first aspect of the present invention, in the probe unit having the probe pins with pipes, the pipe support base is formed of photosensitive glass, so that the base member to be detected and the pipe support base are formed. The difference in the coefficient of thermal expansion between the base and the table is reduced, so that poor contact due to a change in temperature can be eliminated, thereby preventing measurement failure.
In addition, since the pipe support base is made of photosensitive glass, a small-diameter hole for mounting a pipe can be formed with high accuracy, and a probe with an extremely narrow pitch and a small diameter can be arranged. It is possible to sufficiently cope with the miniaturization of the member.

According to the second aspect of the present invention, the pipe is a conductor, and the pipe support base is electrically connected to the pipe.
Since the conductive pattern for guiding the output from the probe pin to the outside is formed, the signal detected from the probe pin can be guided to the outside via the pipe and the conductive pattern without providing a lead wire. However, it is possible to reduce the cost because of unnecessary, and it is possible to eliminate the influence of noise.

According to the third aspect of the present invention, in the probe unit having the pipeless probe pins,
Since the probe pin support base is made of photosensitive glass, the difference in the coefficient of thermal expansion between the base member to be detected and the probe pin support base is reduced, eliminating poor contact due to temperature changes and making measurement impossible. Can be prevented. In addition, since the probe pin support base is formed of photosensitive glass, holes for supporting the probe pins can be formed with high precision, the probes can be arranged at an extremely narrow pitch, and It is possible to sufficiently cope with downsizing of members.

According to the fourth aspect of the present invention, a photosensitive glass is provided at a position parallel to the probe pin support base,
In addition, a receiving member support base provided with a receiving member is provided, and an urging member is interposed between the probe pin and the receiving member. It can be taken out through the member, the receiving member, and the receiving member support base.

According to the fifth aspect of the present invention, the receiving member is a conductor, and the receiving member supporting base is formed with a pattern for guiding the output from the probe pin to the outside. Since it can be electrically connected to the receiving member via the biasing member, and can output a signal to the outside through the pattern of the receiving member and the receiving member support base, a lead wire becomes unnecessary and cost can be reduced. And the effect of noise can be eliminated.
Similarly, the invention according to claim 6 does not require a lead wire, so that cost can be reduced and noise can be eliminated.

According to the present invention, an urging member supporting base made of photosensitive glass is provided at a position parallel to the probe pin supporting base, and between the probe pin and the urging member supporting base. Since the urging member is interposed and the urging member is connected to the conductive pattern provided on the urging member support base, the probe pins are provided on the urging member support base via the urging member. Can be electrically connected to the applied conductive pattern and can output a signal from the biasing member support base to the outside, so that a lead wire is unnecessary, cost can be reduced, and noise can be reduced. Can be eliminated.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an embodiment of a probe unit according to the present invention.

FIG. 2 is a cross-sectional view showing another embodiment of the probe unit according to the present invention.

FIG. 3 is an enlarged cross-sectional view showing a main part of the probe unit.

FIG. 4 is a sectional view showing still another embodiment of the probe unit according to the present invention.

FIG. 5 is a sectional view showing an example of a conventional probe unit.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Probe pin 2 Pipe 3 Pipe support base

Claims (7)

[Claims] 1. A probe unit having a probe pin for detecting electrical characteristics of an electronic component, a pipe holding the probe pin, and a pipe support base into which the pipe is inserted, wherein the pipe support base is A probe unit formed of photosensitive glass. 2. The pipe according to claim 1, wherein the pipe is a conductor, and the pipe support base is formed with a conductive pattern that conducts with the pipe and guides an output from the probe pin to the outside. The described probe unit. 3. A probe unit, comprising: a probe pin for detecting an electrical characteristic of an electronic component; and a probe pin support base on which the probe pin is inserted and on which the probe pin is slidably supported. A probe unit, wherein the support base is formed of photosensitive glass. 4. A receiving member supporting base made of photosensitive glass and provided with a receiving member is provided at a position parallel to the probe pin supporting base. The probe unit according to claim 3, wherein an urging member is interposed between the probe units. 5. The receiving member is a conductor, and a pattern for guiding an output from the probe pin to the outside is formed on the receiving member support base.
The described probe unit. 6. The receiving member is made of a conductor, and
It has a protrusion penetrating the receiving member support base and protruding on the opposite side to the probe pin support base, and the tip of the protrusion is a photosensitive glass parallel to the receiving member support base. 5. The probe unit according to claim 4, wherein the probe unit is in contact with a conductive pattern provided on a surface of the wiring board made of: 7. An urging member supporting base made of photosensitive glass is provided at a position parallel to the probe pin supporting base, and an urging member is provided between the probe pin and the urging member supporting base. The probe unit according to claim 3, wherein the urging member is interposed and connected to a conductive pattern provided on the urging member support base.