JPH10340970A - Bga semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent short-circuit failures due to crush of a solder bump on a board, at the time of mounting. SOLUTION: On the surface of a heat dissipating plate 10 to which surface a semiconductor chip 1 has been fixed, a stiffener 8 is stuck by using an adhesive agent 9. A flexible tape 2 is stuck on the stiffener 8 by using an adhesive agent 7. The semiconductor chip 1 is electrically connected with a solder bump 6, via an inner lead 3, a land 5, etc., which are formed on a tape 2. In order to let a pressure generated inside the adhesive agent 7 escape to the outside, trenches 8a which open to the outer peripheral end of the stiffener 8 are formed, on the sticking surface of the stiffener 8 using the adhesive agent 7.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a ball grid array (BGA) type semiconductor device in which a semiconductor chip and a flexible tape are combined.

[0002]

2. Description of the Related Art It has been found that it is effective to use a very thin flexible material for a carrier in order to solve the problem of thermal expansion coefficient mismatch between a semiconductor chip and a carrier. As such a flexible material, a tape mainly composed of polyimide is generally used, and this type of BGA type semiconductor device is called a tape BGA.

FIG. 14 is a schematic sectional view showing the structure of a conventional tape BGA. As shown in FIG. 14, the tape BGA is composed of a tape 102, a reinforcing member 108, and a heat sink 1
10 are pasted on each other with adhesives 107 and 109. The reinforcing member 108 is also called a stiffener, and is used to prevent the warpage of the tape 102, which causes a mounting failure of the tape BGA on the mounting substrate 120, and is made of a material such as metal which is less deformable than the tape 102. Is done. A device hole is formed at the center of the tape 102 and the reinforcing member 108. Semiconductor chip 1
01 is stored in the device hole,
Is fixed to the heat radiating plate 110.

A plurality of lands 105 are formed on the tape 102 in a matrix as shown in FIG.
Then, as shown in FIG. 16, the lands 105 are formed via the wirings 103a formed on the tape 102 and the inner leads 103 projecting into the device holes 102a.
It is connected to the electrode 101a of the semiconductor chip 101.

Referring again to FIG. 14, the semiconductor chip 101 fixed to the heat sink 110 in the device hole and connected to the inner lead 103 is sealed with a resin 112. Further, solder bumps 106 are formed on lands 105 formed on the tape 102.

When mounting the tape BGA on the mounting substrate 120, a solder paste 122 is applied on the lands 121 of the mounting substrate 120, and the solder bumps 106 of the tape BGA are mounted on the lands 121 of the mounting substrate 120. It is positioned and heated to a temperature equal to or higher than the melting point of the solder bump 106. As a result, the tape BGA is mounted on the mounting substrate 120.

[0007]

The above-mentioned tape BGA
Then, at the time of mounting on a mounting substrate, the substrate is heated to 200 ° C. or higher. Therefore, when the adhesive between the tape and the reinforcing material absorbs moisture, as shown in FIG. 17, the moisture contained in the adhesive 107 boils and the tape 102 and the reinforcing material 108 Air bubbles 125 are generated in between. Tape 102
Are flexible, and when the tape BGA is mounted, the solder bumps 106 are melted by heating.
When 25 is generated, the pressure of the bubble 125 causes the tape 1
02 curves toward the mounting substrate 120, and the solder bumps 106 at that portion are crushed. Solder bump 1
When 06 is crushed, the solder bumps 106 spread in the in-plane direction of the mounting substrate 120 and, in the worst case, come into contact with the adjacent solder bumps 106 to cause a short circuit failure.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a BGA type semiconductor device for preventing a short circuit due to crushing of a solder bump during mounting.

[0009]

In order to achieve the above object, a BGA type semiconductor device according to the present invention comprises a semiconductor chip and a plurality of solder bumps electrically connected to the semiconductor chip. And a plate-like reinforcing material attached to the tape with an adhesive and supporting the tape, and a pressure generated inside the adhesive on at least one of the reinforcing material and the adhesive. Pressure release structure for releasing the pressure to the outside.

The BGA type semiconductor device is heated to 200 ° C. or higher, which is higher than the melting point of the solder bump, when mounted on the mounting substrate. At this time, if moisture is contained in the adhesive for attaching the reinforcing plate and the tape, the moisture is boiled to generate air bubbles, and a pressure due to the air bubbles is generated inside the adhesive. Here, the BGA type semiconductor device of the present invention includes:
Since at least one of the reinforcing member and the adhesive is provided with a pressure release structure for releasing the pressure to the outside, the air bubbles escape to the outside from the pressure release structure. Thereby, the deformation of the tape due to the pressure of the bubbles is prevented, and as a result, the crushing of the solder bumps is prevented.

[0011] The pressure release structure may be formed by a groove formed on the surface of the reinforcing member to which the adhesive is adhered, the opening being formed at an outer peripheral end of the reinforcing member. In this case, in order to stabilize the contact between the solder bumps and the probe pins of the tester when performing the electrical characteristic test, the width of the groove is made smaller than the diameter of the land on which the solder bumps are formed, or the above pressure is applied. In order to ensure a path for the groove to escape, the depth of the groove should be such that the groove is not completely filled even when the adhesive is extruded into the groove due to the pressure of both when the reinforcing material and the tape are attached. Is preferred.

Alternatively, a heat radiating plate for releasing heat of the semiconductor chip is attached to the surface opposite to the surface to which the tape of the reinforcing material is attached by an adhesive, and the reinforcing material has a plurality of through holes. Is formed along the outer shape of the reinforcing material, and the adhesive for attaching the reinforcing material and the heat radiating plate is provided in a region inside the through hole, and a gap is formed between the heat radiating plate and the reinforcing material outside the region. The pressure release structure may be formed with these through holes and gaps. In this case, a through-hole may be formed at the same position as the through-hole formed in the reinforcing material in the adhesive for attaching the reinforcing material and the tape. Preferably, the diameter of the through hole is smaller than the diameter of the land on which the solder bump is formed.

Alternatively, the adhesive may be provided in a pattern that forms a passage leading to the outer peripheral end of the adhesive between the reinforcing material and the tape, and this passage may constitute a pressure release structure. Also in this case, it is preferable that the width of the passage is smaller than the diameter of the land where the solder bump is formed.

Alternatively, a heat radiating plate for releasing heat of the semiconductor chip is attached to the surface opposite to the surface to which the reinforcing material tape is attached by an adhesive, and the reinforcing material and the reinforcing material and the tape are bonded together. At least the reinforcing material of the adhesive to be attached may have a cutout portion extending inward from the outer peripheral end of the reinforcing material, and the cutout portion may constitute a pressure release structure. Also in this case, the width of the cutout
It is preferable that the diameter is smaller than the diameter of the land on which the solder bump is formed.

[0015]

Next, embodiments of the present invention will be described with reference to the drawings.

(First Embodiment) FIG. 1 shows a BG according to the present invention.
FIG. 1 is a schematic sectional view of a first embodiment of an A-type semiconductor device.
FIG. 2 is a plan view of a reinforcing member used in the BGA type semiconductor device shown in FIG. The cross section shown in FIG. 1 is a cross section at a portion corresponding to the line AA in FIG.

The BGA type semiconductor device of the present embodiment comprises a semiconductor chip 1, a tape 2 having a function as a substrate on which the semiconductor chip 1 is mounted, and a stiffener supporting the tape 2 for suppressing the deformation of the tape 2. And a radiating plate 10 for releasing heat generated by the operation of the semiconductor chip 1 to the outside.

The semiconductor chip 1 is fixed to a central portion of a heat radiating plate 10 by a heat radiating paste 11. A reinforcing material 8 is adhered to the surface of the heat sink 10 to which the semiconductor chip 1 is fixed with an adhesive 9, and a tape 2 is adhered to the surface of the reinforcing material 8 with an adhesive 7.
Device holes are respectively formed in the central portions of the reinforcing member 8 and the tape 2, and the semiconductor chip 1 is accommodated therein. The semiconductor chip 1 housed in the device hole is
It is sealed with resin 12.

The adhesives 7, 9 are thermosetting or thermoplastic, and the heat radiating plate 10 and the reinforcing material 8, and the reinforcing plate 8 and the tape 2 are adhered by a thermocompression bonding method.

The tape 2 is mainly composed of polyimide and has flexibility. The tape 2 includes an inner lead 3 protruding into the device hole and connected to an electrode (not shown) of the semiconductor chip 1, and a solder serving as a terminal when the BGA type semiconductor device is mounted on a mounting substrate (not shown). The lands 5 on which the bumps 6 are formed and the wiring (not shown) for connecting the inner leads 3 to the lands 5 are formed. As a result, the semiconductor chip 1 is electrically connected to the solder bumps 6 via the inner leads 3, the wirings and the lands 5.

The reinforcing member 8 is made of a material that is less deformable than the tape 2, for example, metal. As shown in FIG. 2, a plurality of grooves 8a are formed in a lattice shape on the surface of the reinforcing material 8 to be attached to the tape 2. Each groove 8a is opened at the outer peripheral end of the reinforcing member 8, and when the reinforcing member 8 is attached to the tape 2 with the adhesive 7, the area where the groove 8a is formed communicates with the outside of the BGA type semiconductor device. It has a configuration. The groove 8a can be formed by etching or the like.

By forming the groove 8a in the reinforcing member 8 as described above, when the adhesive 7 for attaching the reinforcing member 8 and the tape 2 absorbs moisture, it is added when mounting the BGA type semiconductor device. Even if the moisture is boiled by the applied heat and bubbles are generated, the bubbles can escape to the outside of the BGA type semiconductor device through the groove 8a. As a result, the tape 2 does not deform,
Since the crushing of the solder bumps 6 does not occur, short-circuit failure due to contact between adjacent solder bumps at the time of mounting the BGA type semiconductor device can be prevented.

When an electrical characteristic test of the BGA type semiconductor device is performed, a probe pin of the tester is pressed against the solder bumps 6 to electrically connect the tester and the BGA type semiconductor device. Here, as shown in FIG. 3, when the width of the groove 8a 'formed in the reinforcing member 8' is larger than the diameter of the land 5 'of the tape 2', the position of the groove 8a 'and the position of the land 5' are different. If they match, the tape 2 'may bend over the groove 8a' and the solder bump 6 'over the groove 8a' may not be in good contact with the probe pin 18. As a result, conduction between the probe pins 18 and the solder bumps 6 'becomes unstable, and an accurate electrical characteristic test cannot be performed.

Therefore, as shown in FIG. 1, the width of the groove 8a is made smaller than the diameter of the land 5, and even when the position of the groove 8a coincides with the position of the land 5, at least a part of the land 5 is a reinforcing material. 8 was adopted. Thereby, it is possible to prevent the contact failure between the solder bumps 6 and the probe pins due to the bending of the tape 2 when performing the electrical characteristic test.

The width of the groove 8a is 1 / the pitch of the groove 8a.
2, and the depth of the groove 8a is larger than twice the thickness of the adhesive 7. As described above, the reinforcing member 8 and the tape 2 are attached by a thermocompression bonding method using a thermosetting or thermoplastic adhesive 7. In the state before the thermocompression bonding, as shown in FIG. 4A, the adhesive 7 does not enter into the groove 8a formed in the reinforcing member 8, but due to the pressure between the reinforcing member 8 and the tape 2, The adhesive 7 is crushed by the reinforcing material 8. When the adhesive 7 is crushed, the excess adhesive 7 is pushed into the groove 8a, and the groove 8a is gradually filled with the adhesive 7.

Since the relationship between the width and the pitch of the groove 8a and the relationship between the depth of the groove 8a and the thickness of the adhesive 7 are defined as described above, as shown in FIG. Even if the adhesive 7 is completely squashed between the reinforcing member 8 and the tape 2 and all the adhesive 7 is extruded into the groove 8a, the groove 8a
Is not completely buried, leaving a space, and a space for air bubbles to escape when air bubbles are generated in the adhesive 7 during mounting is secured. Note that the relationship between the width and pitch of the groove 8a and the relationship between the depth of the groove 8a and the thickness of the adhesive 7 are not limited to the above values, and the adhesive 7 between the reinforcing member 7 and the tape 2 is not limited to the above value. It is sufficient that the groove 8a is defined so as not to be completely buried even if all of the groove 8a is extruded into the groove.

Further, in the present embodiment, as shown in FIG. 2, an example is shown in which the reinforcing material 8 in which a plurality of grooves 8a are formed in a lattice shape is used, but the shape and arrangement of the grooves 8a are not limited thereto. It is not limited. For example, as shown in FIG. 5, a reinforcing member 15 having a plurality of grooves 15a extending inward from the outer peripheral end may be used.

(Second Embodiment) FIG. 6 shows a BG of the present invention.
FIG. 5 is a schematic sectional view of a second embodiment of the A-type semiconductor device.
FIG. 7 is a plan view of a reinforcing member used in the BGA type semiconductor device shown in FIG. The cross section shown in FIG. 6 is a cross section at a portion corresponding to line BB in FIG.

In this embodiment, as shown in FIG. 7, a reinforcing member 28 having a plurality of through holes 28a is used.
The through hole 28a is formed along the outer shape of the reinforcing member 28 at a substantially intermediate portion between the outer peripheral end of the reinforcing member 28 and the device hole 28b. The through hole 28a can be formed by etching, punching, or the like. The diameter of the through hole 28 a is smaller than the diameter of the land 25 formed on the tape 22. This is similar to the first embodiment.
This is to prevent a contact failure of the probe pin at the time of the electrical characteristic test of the A-type semiconductor device.

The adhesive 29 for attaching the reinforcing member 28 and the heat radiating plate 30 is provided only in a region inside the through hole 28a. Thereby, a gap is formed between the reinforcing member 28 and the heat radiating plate 30 in a region outside the through hole 28a, and the through hole 28a communicates with the outside through this gap.

In addition, the semiconductor chip 21 is fixed to the heat radiating plate 30, the reinforcing member 28 is attached to the tape 22 by an adhesive 27, and the tape 22 has inner leads 23 and lands 25 formed thereon. The fact that the solder bumps 26 are formed on the lands 25 and that the semiconductor chip 1 is sealed with the resin 32 are the same as in the first embodiment.

By forming the through-holes 28a in the reinforcing member 28 as described above, when the adhesive 27 for attaching the reinforcing member 28 and the tape 22 absorbs moisture, the mounting of the BGA type semiconductor device may be prevented. Even if the moisture is boiled by the applied heat and bubbles are generated, the bubbles are formed in the through hole 28a and the heat sink 3
It is possible to escape to the outside of the BGA type semiconductor device through the gap between the reinforcing member 28 and the zero. As a result, the tape 22
Is not deformed and the solder bumps 26 are not crushed, so that short-circuit failure due to contact between adjacent solder bumps at the time of mounting the BGA type semiconductor device can be prevented.

(Third Embodiment) FIG. 8 shows a BG according to the present invention.
It is a schematic sectional drawing of 3rd Embodiment of A type semiconductor device.
FIG. 9 is a plan view of a reinforcing material to which an adhesive has been transferred, which is used in the BGA type semiconductor device shown in FIG. In addition,
The cross section shown in FIG. 8 is a cross section at a portion corresponding to line CC in FIG.

In this embodiment, as the reinforcing member 48, a plate-like member having a device hole for accommodating the semiconductor chip 41 formed only at the center is used, and the reinforcing member 48 and the tape 42 are attached. The pattern of the adhesive 47 is characteristic.

That is, as shown in FIG.
Are dispersed and arranged in a matrix on the reinforcing member 48.
Such a reinforcing material 48 is created by transferring the adhesive 47 arranged in the pattern shown in FIG. As a result, between the reinforcing member 48 and the tape 42, the outside of the BGA type semiconductor device (specifically, the outer periphery of the adhesive 47) has the same pattern as the groove 8a of the reinforcing member 8 shown in FIG. A passage 48a leading to the end is formed. The width of the passage 48a is smaller than the diameter of the land 45 formed on the tape 42 in order to stabilize the contact between the solder bump 46 and the probe pin during the electrical characteristic test.

Therefore, the moisture in the adhesive 47 is
Even if bubbles are generated in the adhesive 47 by boiling due to heat applied at the time of mounting the semiconductor device, the generated bubbles are
It can escape to the outside through 8a. As a result, deformation of the tape 42 does not occur, and short-circuit failure due to contact between adjacent solder bumps can be prevented.

The rest of the configuration is the same as in the first embodiment, and a description thereof will be omitted.

In the present embodiment, as shown in FIG. 9, an example is shown in which the reinforcing material 48 to which the adhesive 47 is transferred in a pattern such that the passages 48a are formed in a lattice pattern is used. The shape and arrangement, that is, the pattern of the adhesive 47 is not limited to this. For example, as shown in FIG. 10, a reinforcing material 55 to which an adhesive 56 is transferred in a pattern in which a plurality of passages 55a extend inward from the outer peripheral end may be used.

(Fourth Embodiment) FIG.
It is a schematic sectional drawing of 4th Embodiment of GA type semiconductor device. FIG. 12 is a plan view showing a state in which the reinforcing material and the adhesive used in the BGA type semiconductor device shown in FIG. 11 are bonded together. Note that the cross section shown in FIG. 11 is a cross section at a portion corresponding to line DD in FIG.

In this embodiment, the shape of the reinforcing member 68 and the adhesive 6 for attaching the reinforcing member 68 and the tape 62 are used.
Characteristic is the shape of 7. That is, the reinforcing member 68 is formed with a plurality of cutouts 68a extending inward from the outer peripheral end. The adhesive 67 also has a plurality of cutouts 67a extending inward from the outer peripheral end in the same pattern as the reinforcing material 68, and the reinforcing material 68 and the adhesive 67 have the same shape. Such a reinforcing material 68 and an adhesive 67 can be formed by punching both at the same time. The width of the cutouts 67a and 68a is smaller than the diameter of the land 65 formed on the tape 62 in order to stabilize the contact between the solder bump 66 and the probe pin during the electrical characteristic test.

The other configuration is the same as that of the first embodiment, and a description thereof will be omitted. Note that FIG.
The semiconductor chip is not shown in FIG. 11 because it is a cross section at a position deviated from the device hole. However, the semiconductor chip is fixed to the central portion of the heat sink 70 and the inner leads (not Land 65 via the illustrated)
Is connected to the same as in the above-described embodiments.

As described above, the adhesive 67 and the reinforcing material 68
By forming cutout portions 67a and 68a in FIG.
As shown in FIG. 7, a passage 76 communicating with the outside is formed between the adhesive 69 for attaching the heat radiating plate 70 and the reinforcing member 68 to the tape 62. Therefore, even if the moisture in the adhesive 67 boils due to the heat applied at the time of mounting the BGA type semiconductor device to generate bubbles in the adhesive 67, the generated bubbles may escape to the outside through the passage 76. it can.
As a result, no deformation of the tape 62 occurs, and short-circuit failure due to contact between adjacent solder bumps can be prevented.

In this embodiment, the cutout portions 67a, 68a are formed in both the adhesive 67 and the reinforcing material 68. However, even if the cutout portions 68a are provided only in the reinforcing material 68, the cutout portions 68a are obtained. The same effect as that of the first embodiment can be obtained.

(Fifth Embodiment) FIG.
It is a schematic sectional drawing of 5th Embodiment of a GA type semiconductor device.

This embodiment is an application of the second embodiment, and is characterized by the shape of the adhesive 87 for attaching the reinforcing member 88 and the tape 82 as compared with the second embodiment. That is, the through hole 87a is formed in the adhesive 87 at the same position as the through hole 88a formed in the reinforcing member 88, and the reinforcing member 88 and the adhesive 87 have the same shape. Such reinforcing material 88 and adhesive 87 are
It can be created by punching both at the same time. The adhesive 89 for attaching the reinforcing member 88 and the heat sink 90 is
It is provided only in the area inside the through holes 87a and 88a. As a result, a gap is formed between the reinforcing member 88 and the heat radiating plate 90 in a region outside the through holes 87a, 88a, and the through holes 87a, 88a communicate with the outside via the gap. The other configuration is the same as that of the second embodiment, and the description is omitted.

As described above, the adhesive 87 and the reinforcing member 88
By forming the through holes 87a, 88a in the through hole, a passage communicating with the outside is formed between the adhesive 89 and the tape 82 by the through holes 87a, 88a and the gap between the reinforcing member 88 and the heat sink 90. You. Therefore, even if moisture in the adhesive 87 boils due to the heat applied during mounting of the BGA type semiconductor device and bubbles are generated in the adhesive 87, the generated bubbles pass through the through holes 87a and 88a and the gap. To escape to the outside. As a result, no deformation of the tape 82 occurs, and short-circuit failure due to contact between adjacent solder bumps can be prevented.

[0047]

As described above, the BGA type semiconductor device of the present invention is provided with the pressure release structure for releasing the pressure generated inside the adhesive for attaching the reinforcing material and the tape to the outside. Accordingly, it is possible to prevent the tape from being deformed due to the pressure generated inside the adhesive when the tape is mounted on the mounting substrate. As a result, the solder bumps are not crushed, and a short circuit due to the crushing of the solder bumps can be prevented.

The pressure release structure includes a groove formed in the reinforcing material, a through hole formed in at least the reinforcing material out of the reinforcing material and the adhesive, a passage formed in the pattern of the adhesive, or
It can be constituted by a cutout formed in at least the reinforcing material of the reinforcing material and the adhesive. In particular, by making the width of the groove, the diameter of the through hole, the width of the passage, and the width of the cut-out portion smaller than the diameter of the land on which the solder bump is formed, The contact between the probe pins of the tester and the solder bumps can be stabilized.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view of a first embodiment of a BGA type semiconductor device of the present invention.

FIG. 2 is a plan view of a reinforcing member used in the BGA type semiconductor device shown in FIG.

FIG. 3 is a diagram for explaining a contact failure between a solder bump and a probe pin when performing an electrical characteristic test.

FIG. 4 is a cross-sectional view showing a state before and after thermocompression bonding of a reinforcing material and a tape of the BGA type semiconductor device shown in FIG. 1;

FIG. 5 is a plan view of a modified example of the reinforcing member used in the first embodiment of the BGA type semiconductor device of the present invention.

FIG. 6 is a schematic sectional view of a second embodiment of the BGA type semiconductor device of the present invention.

FIG. 7 is a plan view of a reinforcing member used for the BGA type semiconductor device shown in FIG.

FIG. 8 is a schematic sectional view of a third embodiment of the BGA type semiconductor device of the present invention.

FIG. 9 is a plan view of a reinforcing material to which an adhesive is transferred, which is used in the BGA type semiconductor device shown in FIG.

FIG. 10 is a plan view of a modified example of a reinforcing material to which an adhesive has been transferred, used in a second embodiment of the BGA type semiconductor device of the present invention.

FIG. 11 is a schematic sectional view of a fourth embodiment of the BGA type semiconductor device of the present invention.

12 is a plan view showing a state in which a reinforcing material and an adhesive used in the BGA type semiconductor device shown in FIG. 11 are bonded together.

FIG. 13 is a schematic sectional view of a fifth embodiment of the BGA type semiconductor device of the present invention.

FIG. 14 is a schematic sectional view showing the structure of a conventional tape BGA.

15 is a plan view of the tape of the tape BGA shown in FIG.

16 is a schematic plan view of a main part for describing connection between the tape of the tape BGA shown in FIG. 14 and a semiconductor chip;

17 is a cross-sectional view illustrating a short-circuit failure of a solder bump of the tape BGA shown in FIG.

[Explanation of symbols]

1,21,41 Semiconductor chip 2,22,42,62,82 Tape 3,23 Inner lead 5,25,45,65 Land 6,26,46,66,86 Solder bump 7,9,27,29,47 , 56, 67, 69, 87,
89 Adhesive 8, 15, 28, 48, 55, 68, 88 Reinforcement 8a, 15a Groove 10, 30, 70 Heatsink 11 Heatsink 28a, 87a, 88a Through hole 28b Device hole 48a, 55a, 76 Passage 67a, 68a cutout

Claims (11)

[Claims] 1. A semiconductor chip, a flexible tape on which a plurality of solder bumps electrically connected to the semiconductor chip are formed, and a tape attached to the tape with an adhesive to support the tape. A BGA-type semiconductor device, comprising: a plate-shaped reinforcing member; and at least one of the reinforcing member and the adhesive, which is provided with a pressure release structure for releasing pressure generated inside the adhesive to the outside. 2. The BGA type semiconductor device according to claim 1, wherein the pressure release structure is a groove formed on a surface of the reinforcing member to which the adhesive is adhered, the opening being formed at an outer peripheral end of the reinforcing member. . 3. The BGA type semiconductor device according to claim 2, wherein said solder bump is formed on a land formed on said tape, and said groove has a width smaller than a diameter of said land. 4. The depth of the groove is such that the groove is not completely buried even when the adhesive is extruded into the groove by pressurization of the reinforcing material and the tape when both are adhered. The BGA type semiconductor device according to claim 2 or 3. 5. A radiating plate for releasing heat of the semiconductor chip is attached to a surface of the reinforcing member opposite to a surface to which the tape is attached, using an adhesive. A through hole is formed along the outer shape of the reinforcing member, and an adhesive for adhering the reinforcing member and the heat sink is provided in a region inside the through hole, and the heat sink outside the region. 2. The BGA type semiconductor device according to claim 1, wherein a gap is formed between the reinforcing member and the reinforcing member, and wherein the pressure release structure includes the through hole and the gap. 6. The BGA type semiconductor device according to claim 5, wherein a through-hole is formed at the same position as a through-hole formed in said reinforcing material, in an adhesive for bonding said reinforcing material and said tape. . 7. The BGA type semiconductor device according to claim 5, wherein the solder bump is formed on a land formed on the tape, and a diameter of the through hole is smaller than a diameter of the land. 8. The adhesive according to claim 1, wherein the adhesive is provided between the reinforcing member and the tape in a pattern forming a passage communicating with an outer peripheral end of the adhesive, and the passage constitutes the pressure release structure. 2. The BGA type semiconductor device according to 1. 9. The BGA type semiconductor device according to claim 8, wherein the solder bump is formed on a land formed on the tape, and a width of the passage is smaller than a diameter of the land. 10. A heat radiating plate for releasing heat of the semiconductor chip is attached to a surface of the reinforcing member opposite to a surface to which the tape is attached, with an adhesive,
At least the reinforcing material of the reinforcing material and the adhesive for attaching the reinforcing material and the tape is formed with a cutout portion extending inward from an outer peripheral end of the reinforcing material, and the pressure release structure is formed by the cutout portion. The BGA type semiconductor device according to claim 1, wherein: 11. The BGA type semiconductor device according to claim 10, wherein said solder bump is formed on a land formed on said tape, and a width of said cutout is smaller than a diameter of said land.