JPH10329233A - Method and apparatus for altering material width in cutting and laminating steps of strip-like material - Google Patents

Method and apparatus for altering material width in cutting and laminating steps of strip-like material

Info

Publication number
JPH10329233A
JPH10329233A JP9146597A JP14659797A JPH10329233A JP H10329233 A JPH10329233 A JP H10329233A JP 9146597 A JP9146597 A JP 9146597A JP 14659797 A JP14659797 A JP 14659797A JP H10329233 A JPH10329233 A JP H10329233A
Authority
JP
Japan
Prior art keywords
width
strip
shaped material
conveyor
cutting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9146597A
Other languages
Japanese (ja)
Other versions
JP3449887B2 (en
Inventor
Kazue Miura
和重 三浦
Shiyounosuke Motomiya
祥之亮 本宮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yokohama Rubber Co Ltd
Original Assignee
Yokohama Rubber Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yokohama Rubber Co Ltd filed Critical Yokohama Rubber Co Ltd
Priority to JP14659797A priority Critical patent/JP3449887B2/en
Publication of JPH10329233A publication Critical patent/JPH10329233A/en
Application granted granted Critical
Publication of JP3449887B2 publication Critical patent/JP3449887B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To provide a method and apparatus for altering material width in cutting and laminating steps of a strip-like material by conveying the material without bending a corner of the material even when the material width is altered, omitting replacing labor hour of replacing operation, and upgrading operability and productivity. SOLUTION: A transfer unit 3 of a strip-like material controllable at a moving amount via a controller 10 is installed between a conveying unit 1 and a conveyor 5. The unit 3 sucks and holds the material Wa cut in a predetermined width by a cutter 2 on the unit 1, conveys a center line of the material in a width direction to a predetermined position of the conveyor 5, i.e., a position coincident with a center line P-P of a winding shaft, and then drops it.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】この発明は、帯状材料の切
断,貼合せ工程における材料幅変更方法及びその装置に
係わり、更に詳しくは糸入りゴムシート等の帯状材料を
バイアスに切断して順次端末部を貼り合わせる工程で、
材料幅が変更になった場合にも、帯状材料の角部が折れ
曲がりを防止すると共に、貼替え作業の手間を省略で
き、作業性及び生産性を向上させた帯状材料の切断,貼
合せ工程における材料幅変更方法及びその装置に関する
ものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for changing a material width in a cutting and laminating process of a band-shaped material, and more particularly, to cutting a band-shaped material such as a thread-containing rubber sheet into a bias to sequentially terminate a terminal portion. In the bonding process,
Even when the material width is changed, the corners of the band-shaped material can be prevented from being bent, and the labor for re-sticking can be omitted, thereby improving the workability and productivity in the cutting and laminating process of the band-shaped material. The present invention relates to a material width changing method and a device thereof.

【0002】[0002]

【従来の技術】従来、糸入りゴムシート等の帯状材料を
所定の巾にバイアスに切断し、該帯状材料の端末部を順
次端末部を貼り合わせて巻取る方法としては、例えば、
図3及び図4に示すように、コンベヤ装置1により搬送
されて来た帯状材料Wをバイヤスカッター等の切断装置
2により所定の巾に切断する。
2. Description of the Related Art Conventionally, a method of cutting a band-shaped material such as a thread-containing rubber sheet into a predetermined width with a bias, and laminating a terminal portion of the band-shaped material in sequence with a terminal portion is performed by, for example,
As shown in FIGS. 3 and 4, the strip material W conveyed by the conveyor device 1 is cut to a predetermined width by a cutting device 2 such as a bias cutter.

【0003】そして、切断された帯状材料Wをトランス
ファー装置3により吸着保持して、帯状材料Wの側縁部
を貼り合わせ装置4(スプライス装置)を備えた搬送コ
ンベヤ5の基準位置X−Xまで搬送して落下し、この帯
状材料Wの端末部と先に搬送されている帯状材料Wの端
末部と貼り合わせ装置4により貼合わせる。そして、貼
合わされた帯状材料Wは、搬送コンベヤ5上に設置され
た移動可能なガイド部6によりガイドされ、かつガイド
ローラ7及びガイド部8を通してプリッキング装置9で
エアー抜き穴を開けた後、図示しない巻取り装置で巻取
るようにしている。
Then, the cut strip-shaped material W is sucked and held by the transfer device 3, and the side edge of the strip-shaped material W is moved to the reference position XX of the transport conveyor 5 provided with the bonding device 4 (splice device). After being transported and dropped, the terminal portion of the strip-shaped material W and the terminal portion of the strip-shaped material W being transported earlier are bonded by the bonding device 4. The bonded strip material W is guided by a movable guide unit 6 installed on a transport conveyor 5, and after punching an air vent hole with a precking device 9 through a guide roller 7 and a guide unit 8, Winding is performed by a winding device (not shown).

【0004】[0004]

【発明が解決しようとする課題】ところで、帯状材料W
の切断,貼合せ工程中に、帯状材料Wの幅が変更となっ
て、先に搬送されている帯状材料Wの幅に対して、図3
及び図4の一点鎖線に示すように変更後の帯状材料Wa
が幅広になった場合(または幅狭となった場合)、帯状
材料Waの幅方向の一側縁側に幅余り部分Wxが集中す
る。
By the way, the strip material W
During the cutting and laminating process, the width of the band-shaped material W is changed.
And the band material Wa after the change as shown by the dashed line in FIG.
Becomes wider (or narrower), the excess width portion Wx concentrates on one side edge side in the width direction of the band-shaped material Wa.

【0005】このため、プリッキング装置9のガイド部
8を通す時に、幅余り部分Wxのコーナ部分がガイド部
8に当接して折れ曲がってしまうことがあり、この折れ
曲がりを防止するため、一度装置全体を停止させてプリ
ッキング装置9のドラム上で帯状材料Wの幅方向中心に
対して変更後の帯状材料Waの中心を一致させるように
貼り直す作業を行っていた。
Therefore, when the guide portion 8 of the precking device 9 is passed through, the corner portion of the excess width portion Wx may come into contact with the guide portion 8 and bend. Was stopped, and re-sticking was performed on the drum of the precking device 9 so that the center of the band material Wa after the change was aligned with the center of the band material W in the width direction.

【0006】このため、帯状材料Wの幅変更時には、ト
ラブルが発生する場合が多い上に貼替え作業に多くの手
間と時間を要し、生産性の向上を図ることが難しいと言
う問題があった。この発明の目的は、帯状材料の切断,
貼合せ工程において帯状材料の幅変更を行う場合にも、
帯状材料のコーナー部分が折れ曲がることなく搬送する
ことが出来、この結果、貼替え作業の手間を省略して作
業性及び生産性の向上を図ることが出来る帯状材料の切
断,貼合せ工程における材料幅変更方法及びその装置を
提供することにある。
For this reason, when the width of the band-shaped material W is changed, troubles often occur, and the replacement work requires much labor and time, and it is difficult to improve the productivity. Was. An object of the present invention is to cut a strip material,
Even when changing the width of the band material in the laminating process,
The width of the material in the cutting and laminating process of the band-shaped material can be conveyed without bending the corner portion of the band-shaped material, and as a result, the labor and the productivity of the band-shaped material can be improved without the labor of the lamination work. An object of the present invention is to provide a changing method and an apparatus therefor.

【0007】[0007]

【課題を解決するための手段】この発明は上記目的を達
成するため、搬送されて来る帯状材料を所定の巾でバイ
ヤスに切断し、該切断された帯状材料をトランスファー
装置により搬送コンベヤ上に移載させて帯状材料の端末
部同志を順次貼り合わせながら巻取り工程まで搬送させ
る方法において、帯状材料の幅が変更になった時、変更
後の切断された帯状材料を、トランスファー装置により
搬送コンベヤ上に移載して貼り合わせる際、該帯状材料
の幅方向のセンターラインを、巻取り軸のセンターライ
ンに一致させるようにトランスファー装置の移動量を制
御することを要旨とするものである。
SUMMARY OF THE INVENTION In order to achieve the above object, the present invention cuts a conveyed strip-shaped material into a predetermined width and transfers the cut strip-shaped material onto a conveyor by a transfer device. When the width of the band-shaped material is changed, the cut and cut band-shaped material after the change is transferred onto a conveyor by a transfer device. In this case, the amount of movement of the transfer device is controlled so that the center line in the width direction of the band-shaped material coincides with the center line of the winding shaft.

【0008】また、この発明は帯状材料を所定の巾でバ
イヤスに切断する切断装置を備えたコンベヤ装置と、こ
のコンベヤ装置と交差し、かつ巻取り装置と接続する貼
り合わせ装置を備えた搬送コンベヤと、コンベヤ装置と
搬送コンベヤとの間に、制御装置を介して移動量の制御
可能な帯状材料のトランスファー装置を設置したことを
要旨とするものである。
The present invention also relates to a conveyor device having a cutting device for cutting a strip-shaped material into a predetermined width, and a conveying conveyor having a bonding device intersecting with the conveyor device and connecting to a winding device. And that a transfer device of a belt-shaped material whose movement amount can be controlled via a control device is installed between the conveyor device and the transport conveyor.

【0009】このように、この発明では帯状材料の切
断,貼合せ工程において帯状材料の幅変更を行う場合に
も、変更後の帯状材料の幅方向のセンターラインを巻取
り装置の巻取り軸のセンターラインに一致させるように
トランスファー装置の移動量を制御して移載すると共に
貼合わせるので、帯状材料のコーナー部分が折れ曲がる
ことなく搬送することが出来、この結果、貼替え作業の
手間を省略して作業性及び生産性の向上を図ることが出
来る。
As described above, according to the present invention, even when the width of the strip material is changed in the cutting and laminating process of the strip material, the center line in the width direction of the changed strip material is connected to the winding shaft of the winding device. Since the transfer unit is controlled and moved so that it coincides with the center line, it is transferred and bonded, so that the corners of the strip-shaped material can be transported without bending, and as a result, the labor of the re-laying work is omitted. Thus, workability and productivity can be improved.

【0010】[0010]

【発明の実施の形態】以下、添付図面に基づき、この発
明の実施形態を説明する。なお、従来例と同一構成要素
は、同一符号を付して説明は省略する。図1は、この発
明の帯状材料Wの搬送工程における材料幅変更方法を実
施するための切断,貼合せ工程の切断,貼合せ装置を備
えた材料幅変更装置の平面図、図2は材料幅平行時にお
ける制御方法の説明図であって、前記材料幅変更装置
は、帯状材料Waを所定の巾でバイヤスに切断するバイ
ヤスカッター等の切断装置2を備えたコンベヤ装置1
と、このコンベヤ装置1と直交する向きに交差し、かつ
図示しない巻取り装置と接続する貼り合わせ装置4(ス
プライス装置)を備えた搬送コンベヤ5とが設置されて
いる。
Embodiments of the present invention will be described below with reference to the accompanying drawings. The same components as those of the conventional example are denoted by the same reference numerals, and description thereof will be omitted. FIG. 1 is a plan view of a material width changing device provided with a cutting and laminating device for carrying out a method of changing a material width in a conveying process of a strip material W of the present invention, and FIG. FIG. 4 is an explanatory view of a control method in a parallel state, wherein the material width changing device is a conveyor device 1 provided with a cutting device 2 such as a bias cutter for cutting a band-shaped material Wa into a predetermined width.
And a transport conveyor 5 having a bonding device 4 (splice device) that intersects with the conveyor device 1 in a direction orthogonal to the conveyor device and is connected to a winding device (not shown).

【0011】前記コンベヤ装置1と搬送コンベヤ5との
間には、制御装置10を介して移動量の制御可能な帯状
材料のトランスファー装置3が設置してあり、このトラ
ンスファー装置3は、コンベヤ装置1上で切断装置2に
より所定の巾に切断された帯状材料Waを吸着保持して
搬送コンベヤ5の所定位置、即ち、この発明では帯状材
料Waの巾方向のセンターラインを巻取り軸のセンター
ラインP−Pに一致させる位置まで搬送して落下させ
る。
Between the conveyor device 1 and the transport conveyor 5, there is provided a transfer device 3 of a strip-shaped material, the amount of movement of which can be controlled via a control device 10, and the transfer device 3 is a conveyer device 1 The strip material Wa cut to a predetermined width by the cutting device 2 is sucked and held at a predetermined position of the conveyor 5, that is, in the present invention, the center line in the width direction of the strip material Wa is set to the center line P of the winding shaft. Convey and drop to the position that matches -P.

【0012】前記貼り合わせ装置4は、搬送コンベヤ5
上に載置されている先の帯状材料Wの端末部(後端部)
と、後の切断されて移載され帯状材料Waの端末部(先
端部)とを貼り合わせて接合させるもので、貼り合わせ
位置は、常に巻取り軸のセンターラインP−P上で直線
的に貼り合わされるものである。貼り合わせ装置4の後
方(帯状材料Wの搬送方向側)には、搬送コンベヤ5の
幅方向の両側部に、巻取り装置の幅方向の中心P−Pに
対して同期して接近離反可能な幅調整可能な一対のガイ
ド部6a,6bが設置してあり、このガイド部6a,6
bは、帯状材料Wの幅が変更になった場合に任意に幅調
整が可能になっている。
The laminating device 4 includes a conveyor 5
The end portion (rear end portion) of the strip-shaped material W placed on the top
And the end portion (tip portion) of the later cut and transferred strip-shaped material Wa is bonded and joined, and the bonding position is always linear on the center line PP of the winding shaft. It is to be stuck. Behind the laminating device 4 (on the side in the conveying direction of the strip-shaped material W), it is possible to approach and separate on both sides in the width direction of the conveyor 5 in synchronization with the center PP in the width direction of the winding device. A pair of guide portions 6a and 6b whose width can be adjusted are provided.
The width b can be arbitrarily adjusted when the width of the band-shaped material W is changed.

【0013】また、ガイド部6a,6bの後方には、ガ
イドローラ7及び巻取り軸のセンターラインP−P対し
て同期して接近離反可能な幅調整可能な一対のガイド部
8a,8aが設置してあり、この一対のガイド部8a,
8aでセンターリングされた帯状材料Wは、針刺し装置
9を通してエアー抜き穴を開けた後、図示しない巻取り
装置で巻取られるようになっている。
Behind the guides 6a and 6b, a pair of width-adjustable guides 8a and 8a are provided which can be approached and separated in synchronization with the guide roller 7 and the center line PP of the take-up shaft. The pair of guide portions 8a,
The belt-shaped material W centered at 8a is wound by a winding device (not shown) after an air vent hole is opened through the needle sticking device 9.

【0014】次に、帯状材料Wの搬送工程における材料
幅変更方法について説明する。まず、搬送コンベヤ5で
搬送されている先の帯状材料Wの材料幅に対して、材料
幅を広げて変更した場合には、コンベヤ装置1上を搬送
されて来る帯状材料Waを切断装置2により所定の巾で
バイヤスに切断する。そして、該切断された帯状材料W
aをトランスファー装置3により、帯状材料Waの巾方
向のセンターラインが搬送コンベヤ5上の巻取り軸のセ
ンターラインP−Pに一致する位置まで搬送する場合、
トランスファー装置3の移動量を制御装置10で制御し
て所定位置の貼合わせ位置まで搬送すると共に落下させ
る。
Next, a description will be given of a method for changing the material width in the process of transporting the belt-shaped material W. First, in the case where the material width is changed by widening the material width of the previous band-shaped material W conveyed by the conveyor 5, the band-shaped material Wa conveyed on the conveyor device 1 is cut by the cutting device 2. Cut into pliers with a predetermined width. Then, the cut strip-shaped material W
a is transferred by the transfer device 3 to a position where the center line in the width direction of the strip-shaped material Wa coincides with the center line PP of the winding shaft on the transfer conveyor 5;
The moving amount of the transfer device 3 is controlled by the control device 10 so that the transfer device 3 is transported to a predetermined bonding position and dropped.

【0015】すると、先の帯状材料Wの材料幅に対し
て、幅変更された帯状材料Waの幅余り分Wxは、セン
ターラインP−Pに対して左右均一となり、この状態で
帯状材料W,Waの端末部同志を貼り合わせ装置4で貼
合わせる。この結果、貼り合わせ装置4の後方に設置さ
れた一対のガイド部6a,6bやガイドローラ7,更に
はプリッキング装置9の前に設置された一対のガイド部
8a,8aに幅変更された帯状材料Waの幅余り分Wx
が引っ掛かることなく変形したり、また帯状材料Waの
貼直し作業を省略することが出来る。
Then, the width Wx of the strip-shaped material Wa whose width has been changed becomes uniform left and right with respect to the center line PP with respect to the material width of the strip-shaped material W, and in this state, the strip-shaped materials W, Wa terminals are bonded together by the bonding device 4. As a result, the width of the strip is changed to a pair of guide portions 6a and 6b and a pair of guide rollers 7 installed behind the bonding device 4 and a pair of guide portions 8a and 8a installed in front of the precking device 9. Excess width Wx of material Wa
Can be deformed without being caught, and the work of reattaching the band material Wa can be omitted.

【0016】なお、上記の実施形態では、先の帯状材料
Wの材料幅に対して、材料幅を広げて変更する場合につ
いて説明したが、逆に先の帯状材料Wの材料幅に対し
て、材料幅を狭めて変更する場合にも、トランスファー
装置3の移動量を制御装置10で制御して、帯状材料W
aの巾方向のセンターラインが搬送コンベヤ5上の巻取
り軸のセンターラインP−Pに一致する位置まで搬送す
るものである。
In the above embodiment, the case where the material width is changed to be wider than the material width of the strip material W has been described. Even in the case of changing the material width by narrowing the material width, the moving amount of the transfer device 3 is controlled by the control device 10 so that the band material W
The transport is performed to a position where the center line in the width direction a coincides with the center line PP of the winding shaft on the transport conveyor 5.

【0017】以上のように、帯状材料Wの切断,貼合せ
工程において帯状材料Wの幅変更を行う場合にも、変更
後の帯状材料Waの幅方向のセンターラインを巻取り装
置の巻取り軸のセンターラインP−Pに一致させるよう
にトランスファー装置3の移動量を制御装置10により
制御して移載すると共に貼合わせるので、帯状材料Wa
のコーナー部分または幅余り分Wxがガイド部等に引っ
掛かって折れ曲がることなく、搬送することが出来、こ
の結果、貼替え作業の手間を省略して作業性及び生産性
の向上を図ることが出来る。
As described above, even when the width of the band material W is changed in the cutting and laminating process of the band material W, the center line in the width direction of the band material Wa after the change is taken up by the winding shaft of the winding device. The transfer amount of the transfer device 3 is controlled by the control device 10 so as to coincide with the center line PP of FIG.
The corner portion or excess width Wx can be transported without being caught and bent by the guide portion or the like. As a result, the work and the productivity can be improved by eliminating the labor of the re-sticking operation.

【0018】[0018]

【発明の効果】この発明は、上記のように構成したの
で、帯状材料の切断,貼合せ工程において帯状材料の幅
変更を行う場合にも、帯状材料のコーナー部分が折れ曲
がることなく搬送することが出来、この結果、貼替え作
業の手間を省略して作業性及び生産性の向上を図ること
が出来る。また従来装置を大幅に変更することなくこの
発明の材料幅変更方法に実施することが出来る。
Since the present invention is constructed as described above, even when the width of the band-shaped material is changed in the cutting and laminating process of the band-shaped material, the band-shaped material can be conveyed without being bent at the corners. As a result, it is possible to improve the workability and the productivity by eliminating the labor of the replacement work. Further, the method can be applied to the material width changing method of the present invention without largely changing the conventional apparatus.

【図面の簡単な説明】[Brief description of the drawings]

【図1】この発明の帯状材料の切断,貼合せ工程におけ
る材料幅変更方法を実施するための切断,貼合せ装置を
備えた材料幅変更装置の平面図である。
FIG. 1 is a plan view of a material width changing device provided with a cutting and laminating device for performing a material width changing method in a strip-shaped material cutting and laminating step of the present invention.

【図2】材料幅平行時における制御方法の説明図であ
る。
FIG. 2 is an explanatory diagram of a control method when the material width is parallel.

【図3】従来の帯状材料の切断,貼合せ工程における材
料幅変更方法を実施するための切断,貼合せ装置を備え
た材料幅変更装置の平面図である。
FIG. 3 is a plan view of a conventional material width changing device provided with a cutting and bonding device for performing a material width changing method in a cutting and bonding process of a strip-shaped material.

【図4】従来の材料幅変更時における制御方法の説明図
である。
FIG. 4 is an explanatory diagram of a conventional control method when changing a material width.

【符号の説明】[Explanation of symbols]

1 コンベヤ装置 2 切断装置 3 トランスファー装置 4 貼り合わせ装置
(スプライス装置) 5 搬送コンベヤ 6a,6b 一対のガイド部 7 ガイドローラ7 8a,8b 一対のガイド部 9 プリッキング装置 10 制御装置 W 変更前の帯状材料 Wa 幅変更後の帯状
材料 P−P 巻取り軸のセンターライン(搬送コンベヤのセ
ンターライン)
DESCRIPTION OF SYMBOLS 1 Conveyor apparatus 2 Cutting apparatus 3 Transfer apparatus 4 Laminating apparatus (splice apparatus) 5 Conveying conveyor 6a, 6b A pair of guide parts 7 Guide rollers 7 8a, 8b A pair of guide parts 9 Prefixing device 10 Control device W Strip before change Material Wa Strip material after width change PP Center line of take-up shaft (center line of conveyor)

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 搬送されて来る帯状材料を所定の巾でバ
イヤスに切断し、該切断された帯状材料をトランスファ
ー装置により搬送コンベヤ上に移載させて帯状材料の端
末部同志を順次貼り合わせながら巻取り工程まで搬送さ
せる方法において、帯状材料の幅が変更になった時、変
更後の切断された帯状材料を、トランスファー装置によ
り搬送コンベヤ上に移載して貼り合わせる際、該帯状材
料の幅方向のセンターラインを、巻取り軸のセンターラ
インに一致させるようにトランスファー装置の移動量を
制御する帯状材料の切断,貼合せ工程における材料幅変
更方法。
1. A conveyed strip-shaped material is cut into a bias with a predetermined width, and the cut strip-shaped material is transferred onto a conveyor by a transfer device, and the end portions of the strip-shaped material are sequentially bonded to each other. In the method of transporting to the winding step, when the width of the strip-shaped material is changed, when the changed cut strip-shaped material is transferred onto a transport conveyor by a transfer device and bonded, the width of the strip-shaped material is changed. A method of changing a material width in a cutting and laminating process of a strip-shaped material in which a moving amount of a transfer device is controlled so that a center line in a direction coincides with a center line of a winding shaft.
【請求項2】 前記搬送コンベヤの幅方向の長手方向に
沿って設置された一対のガイド部を、帯状材料のサイズ
変更部分が通過するのに伴って順次左右均等に幅変更す
る請求項1に記載の帯状材料の切断,貼合せ工程におけ
る材料幅変更方法。
2. The method according to claim 1, wherein the width of the pair of guide portions installed along the longitudinal direction of the width direction of the conveyor is sequentially changed left and right evenly as the size change portion of the band-shaped material passes. The method for changing the material width in the cutting and laminating process of the strip-shaped material described above.
【請求項3】 帯状材料を所定の巾でバイヤスに切断す
る切断装置を備えたコンベヤ装置と、このコンベヤ装置
と交差し、かつ巻取り装置と接続する貼り合わせ装置を
備えた搬送コンベヤと、コンベヤ装置と搬送コンベヤと
の間に、制御装置を介して移動量の制御可能な帯状材料
のトランスファー装置を設置して成る帯状材料の切断,
貼合せ工程における材料幅変更装置。
3. A conveyor device provided with a cutting device for cutting a band-shaped material into a predetermined width into a bias, a transport conveyor provided with a bonding device crossing the conveyor device and connected to a winding device, and a conveyor. A cutting device for a strip material, which is provided with a transfer device for the strip material whose movement amount can be controlled via a control device between the apparatus and the conveyor.
Material width changing device in laminating process.
【請求項4】 前記搬送コンベヤの幅方向の両側部に、
巻取り軸の幅方向の中心に対して同期して接近離反可能
な幅調整可能な一対のガイド部を設置した請求項3に記
載の帯状材料の切断,貼合せ工程における材料幅変更装
置。
4. On both sides in the width direction of the transport conveyor,
4. The material width changing apparatus according to claim 3, further comprising a pair of width-adjustable guide portions that can be moved toward and away from each other in synchronization with the center of the winding shaft in the width direction.
JP14659797A 1997-06-04 1997-06-04 Method and apparatus for changing material width in cutting and laminating process of band-shaped material Expired - Fee Related JP3449887B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14659797A JP3449887B2 (en) 1997-06-04 1997-06-04 Method and apparatus for changing material width in cutting and laminating process of band-shaped material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14659797A JP3449887B2 (en) 1997-06-04 1997-06-04 Method and apparatus for changing material width in cutting and laminating process of band-shaped material

Publications (2)

Publication Number Publication Date
JPH10329233A true JPH10329233A (en) 1998-12-15
JP3449887B2 JP3449887B2 (en) 2003-09-22

Family

ID=15411330

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14659797A Expired - Fee Related JP3449887B2 (en) 1997-06-04 1997-06-04 Method and apparatus for changing material width in cutting and laminating process of band-shaped material

Country Status (1)

Country Link
JP (1) JP3449887B2 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57102332A (en) * 1980-12-19 1982-06-25 Yokohama Rubber Co Ltd:The Method and apparatus for transfer of belt form article between devices shifted in phase
JPS61152439A (en) * 1984-12-27 1986-07-11 Yokohama Rubber Co Ltd:The Centering device in belt-type material supplying device
JPH03205133A (en) * 1989-12-21 1991-09-06 Sumitomo Rubber Ind Ltd Molding method for best-shaped sheet body and its molding device
JPH04113831A (en) * 1990-09-04 1992-04-15 Yokohama Rubber Co Ltd:The Method and device for automatically correcting band-like rubber seat material

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57102332A (en) * 1980-12-19 1982-06-25 Yokohama Rubber Co Ltd:The Method and apparatus for transfer of belt form article between devices shifted in phase
JPS61152439A (en) * 1984-12-27 1986-07-11 Yokohama Rubber Co Ltd:The Centering device in belt-type material supplying device
JPH03205133A (en) * 1989-12-21 1991-09-06 Sumitomo Rubber Ind Ltd Molding method for best-shaped sheet body and its molding device
JPH04113831A (en) * 1990-09-04 1992-04-15 Yokohama Rubber Co Ltd:The Method and device for automatically correcting band-like rubber seat material

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