JPH11186340A - Mechanism for determining conveying position of tab tape - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mechanism for determining conveying position, which adequately performs intermittent sending of a TAB tape described below in a device, which intermittently sends the belt-shaped TAB tape, punches the specified region with a metal mold and bonds the tape to a stiffner. SOLUTION: In a belt-shaped TAB tape 1, a hole 1a which becomes the inner shape of the TAB tape that is bonded to a stiffner after punching, is formed beforehand. At the back-stage position of a metal mold part, which performs the punching of the TAB tape and bonding to the stiffner, a fixing clamp 15 and a moving clamp 17 are provided, and a sending mechanism which holes and conveys the TAB tape 1 after punching is arranged. Furthermore, at the front stage position of the metal mold, a photoelectric sensor 23, which detects reflected light from the surrounding part of the hole 1a, is arranged. In the next step, when the photoelectric sensor 23 detects the preset amount of light, the mechanism is so constituted that the operation of the moving clamp 17 which performs the sending operation is stopped.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to a TA having a low rigidity.
In order to prevent warpage of the B tape, a TAB tape in which a predetermined area is individually cut is sequentially bonded to a metal reinforcing plate called a stiffener which is in a band shape and is intermittently fed. More particularly, the present invention relates to a mechanism capable of intermittently feeding a belt-shaped TAB tape in the apparatus and, each time, cutting and bonding a predetermined area to a processing position where the tape is to be bonded.

[0002]

2. Description of the Related Art In recent years, the terminal arrangement of electronic components such as ICs, LSIs, and liquid crystal panels has been miniaturized. These electronic components are mounted on a film carrier tape, and the film carrier tape is transferred to another circuit. Connection terminals. Then, the film carrier tape is generally called TAB (Tape Automated Bondin).
g) Called tape. As is well known, the TAB tape is very thin and easily warps, and is not easy to handle. Therefore, in order to supplement the rigidity of the electronic component at a stage before the electronic component is attached, a technique of bonding a reinforcing plate made of a metal such as a copper alloy or stainless steel and generally called a stiffener to a TAB tape is known. Have been.

[0003] As an example of the bonding apparatus in this case, a band-shaped stiffener and a band-shaped TAB tape to which an adhesive which becomes tacky when heated are preliminarily adhered to the bonding surface are intermittently fed to a bonding position. In the processing position, a part of the strip-shaped TAB tape is punched into a predetermined shape by a mold, and the cut TAB tape is pressed on a stiffener heated by a heater. is there. In such an apparatus, the TAB tape must be punched in a predetermined area and must be bonded to a predetermined position of the stiffener. Therefore, the positional accuracy of the TAB tape and the stiffener at the bonding processing position is extremely low. High accuracy is required. Among these, the present invention relates to a strip-shaped TAB.
The present invention relates to a transport positioning mechanism capable of intermittently feeding a tape and accurately positioning a predetermined area at a processing position.

In the above-described conventional apparatus, the mechanism for transporting the TAB tape is disposed at a position subsequent to the position where the die is punched, and the remaining portion after the punching is performed. When a punch (upper die) for punching a part of the TAB tape is lowered, a plurality of pilot pins descending together with the punch are used to position the TAB tape. Immediately before the operation is performed, the tape is inserted into a pilot hole formed in the TAB tape in advance, and if there is a slight displacement in the TAB tape, the TAB tape is corrected to a regular position by a tapered portion at the tip of the pilot pin. Was.

[0005]

However, in such a conventional method, the feed amount is constant depending on the distribution of the viscosity of the surface to which the adhesive is adhered and the difference in the deformation of the tape after punching. Instead, variations occur. Since the TAB tape not reinforced by the stiffener has extremely low rigidity, if such a variation occurs, it becomes impossible to correct the position by the above-mentioned pilot pin, and further, the TAB tape may be erroneously fed by a feed error. Even if a certain area of the tape was not accurately punched, there was no way to detect it,
Situations such as generating a large number of defective products have occurred.

SUMMARY OF THE INVENTION The present invention has been made to solve such a problem, and an object of the present invention is to provide a belt-like T-shaped adhesive to which an adhesive which becomes tacky by heating is adhered.
An AB tape is intermittently sent to a processing position, a predetermined area is punched out by a die at that position, and the cut TAB tape is pressed against a heated stiffener to bond the TAB tape. Well done,
Accordingly, it is an object of the present invention to provide a TAB tape transport / positioning mechanism capable of appropriately correcting the position of the predetermined area and preventing occurrence of defective products.

[0007]

In order to achieve the above object, the present invention intermittently feeds a belt-shaped TAB tape to which an adhesive which becomes tacky by heating is applied to a processing position, and the position of the tape is changed. In a device for punching a predetermined area with a mold in a die and pressing and bonding the cut TAB tape to a heated stiffener, the TAB tape is provided with a hole for forming an inner shape of the predetermined area in advance, and A feed mechanism for intermittently feeding the TAB tape is disposed at a position subsequent to the processing position, and a TA mechanism is disposed at a position preceding the processing position.
A photoelectric sensor whose optical path is restricted by the inner moving position of the B tape is arranged, and the conveyance by the feed mechanism is stopped by a predetermined output signal of the photoelectric sensor.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to an embodiment shown in FIGS. FIG. 1 is a front view showing an apparatus for cutting a predetermined area of a strip-shaped TAB tape and bonding the strip to a predetermined position of a strip-shaped stiffener.
Part is shown in cross section. FIG. 2 is a plan view of FIG. FIG. 3 is an explanatory view of a belt-shaped TAB tape, and FIG. 4 is a plan view showing a state where the cut TAB tape is adhered to a belt-shaped stiffener.

First, a strip-shaped TAB tape and a stiffener to be supplied to and processed by the apparatus of this embodiment will be described with reference to FIGS. As shown in FIG. 3, the belt-like TAB tape 1 supplied to the apparatus of the present embodiment has, in advance, an adhesive which becomes tacky when heated, attached to an adhesive surface with a stiffener described later. A rectangular hole 1 to regulate the inside shape of a predetermined area to be punched
a is formed. Also, between each predetermined area,
Two pilot holes 1b are formed. Furthermore,
A well-known perforation 1c is formed on both sides of the belt-shaped TAB tape 1 in the longitudinal direction.
Then, a predetermined area is punched out by a mold provided in the apparatus of the present embodiment, and a cut TAB tape 1A is obtained.

As shown in FIG. 4, a strip-shaped stiffener 2 supplied to the apparatus of the present embodiment has, on both sides in the longitudinal direction,
A total of twelve circular pilot holes 2a are formed. Further, five rectangular holes 2b smaller than the rectangular holes 1a of the TAB tape 1 are formed at positions surrounded by the four pilot holes 2a, respectively. Although a plurality of holes are formed in the stiffener 2 in addition to this, in the present embodiment, these holes are all formed in advance by etching. Then, the cut TAB tape 1A and the stiffener 2 are
According to the apparatus of this embodiment, the centers of the rectangular holes 1a and 2b are aligned and bonded. It is up to this state that processing is performed by the apparatus of the present embodiment, but thereafter, an IC package or the like is joined on the TAB tape 1A and cut into individual pieces to obtain a finished product as an electronic component. .

Next, the overall configuration of the apparatus according to the present embodiment will be described with reference to FIGS. However, FIGS. 1 and 2 show only the minimum configuration necessary for understanding the present invention. For a configuration that is not directly related to the present invention, such as a feed mechanism of the stiffener 2, for example. Omitted.
Therefore, first, a die hole 3a is formed in the base 3 constituting the die of the mold. This base 3 has four pillars 4
And a cylinder 6 is mounted on a platform 5 supported by them. The piston 6a operated by the cylinder 6 extends through the base 5 and extends below the base 5.

The slide plate 7 is attached to the column 4 so as to be vertically movable, and is attached to the tip of the piston 6a at the center of the upper surface. Therefore, the slide plate 7 moves up and down in conjunction with the up and down movement of the piston 6a. A die punch 8 is attached to the slide plate 7, and the tip of the die 8 moves up and down by being guided by a guide hole of a guide block 9 fixed to the base 3. . Although the detailed configuration of the punch 8 is not shown but schematically shown, the tip of the punch 8 is a blade for cutting a predetermined area from the strip-shaped TAB tape 1, and the cut TAB tape 1A is air-sealed. A hole for punching and adsorbing, a pressing portion for pressing the cut TAB tape 1A against the stiffener 1, and the like are formed.

The slide plate 7 has a slide plate 7
In addition, four pilot pins 10 (only one is shown in FIG. 1) fitted to each guide hole provided in the guide block 9 and the base 3 are attached. The pilot pin 10 is fitted in a guide hole provided in the guide block 9 and the base 3 so that the pilot pin 10 can move up and down together with the slide plate 7.
0a comes into contact with the guide block 9, and then the spring 10b
Is compressed so that only the slide plate 7 can be lowered. And these four pilot pins 10
A tapered portion is formed at the tip of the stiffener 2 so as to fit into the pilot hole 2a of the stiffener 2 described with reference to FIG.

Further, four (only one is shown in FIG. 1) pilot pins 11 are attached to the slide plate 7. The pilot pin 11 is also fitted in a guide hole provided in the guide block 9 and the base 3 in the same manner as the pilot pin 10 described above, and can move up and down together with the slide plate 7. At this time, after the flange 11a contacts the guide block 9, the spring 11
By compressing b, only the slide plate 7 can be lowered. A tapered portion is formed at the tip of each of the four pilot pins 11, and the strip-shaped TAB tape 1 sent from right to left through a gap formed between the base 3 and the guide block 9. Pilot hole 1a
Can be fitted. The TA shown in FIG.
The B tape 1 does not show a perforation 1c and a pattern of a predetermined area to be punched.

In FIG. 1, a guide rail 12 of the stiffener 2 is disposed below the base 3. The guide rail 12 has a U-shaped cross section with a shallow bottom, and a relief hole (not shown) is formed at the bottom in accordance with the pitch of the pilot holes 2 a of the stiffener 2. In the bottom of the guide rail 12, a predetermined area below the die hole 3a formed in the base 3 is missing, and the heater 13 faces there, and the stiffener 2 facing the heater 13 faces there. The area can be heated. And this stiffener 2
In FIG. 1, the paper is intermittently fed by a feed mechanism (not shown) in a direction perpendicular to the paper surface.

A feed mechanism and a detection mechanism are provided on both sides of the above-mentioned mold part. First, the feed mechanism provided on the left side of the mold section will be described. This feed mechanism
This is a feed mechanism that performs index feed, and performs a feed method generally called a gripper feed. This feed mechanism has a fixed clamp 15 attached to the base portion 14 and a movable clamp 17 that can be moved in the left and right direction by two shaft portions 16. Have been. Also, cylinder 1
Heads 20, 21 for grasping the TAB tape 1 are attached to the tips of the pistons 18a, 19a which move up and down by 8, 8 respectively. The illustration of the actuator for operating the moving clamp 17 is omitted.

The detection mechanism provided on the right side of the mold part includes a slide table 22 and a photoelectric sensor 23. The photoelectric sensor 23 is movable in the left and right directions by rotating the adjustment shaft 22a. Attached to the tip of a possible movable arm 22b. The photoelectric sensor 23 is a reflection-type fiber sensor. The tip of the fiber is opposed to a substantially central portion in the width direction of the strip-shaped TAB tape 1, and the other end is provided with a light emitting unit and a light receiving unit (not shown). Provided so that the reflected light from the TAB tape 1 can be detected. In the drawings, for convenience, only the head portion at the tip of the fiber is shown, and reference numeral 23 is attached thereto. However, in the present embodiment, the photoelectric sensor actually refers to all of those components. .

The initial positioning of the head of the photoelectric sensor 23 will now be described. First, a strip-shaped TAB
The tape 1 is inserted through the mold as shown in FIG. Then, the slide plate 7 is gently lowered, and the tip of the pilot pin 11 is inserted into the pilot hole 1b of the TAB tape 1 while visually adjusting the positional deviation of the TAB tape 1. Next, the adjustment shaft 22 of the slide table 22
The movable arm 22b is moved by rotating a, and the head of the photoelectric sensor 23 is set at a position facing the inner edge of the TAB tape 1 as shown in FIG. Then, the amount of reflected light at this time is measured, and a detection light amount range is set.

Next, the operation at the time of machining will be described. When a start switch of an operation panel (not shown) is pressed, a cylinder 1 provided in a feeding mechanism of the belt-like TAB tape 1 is provided.
9 operates, the piston 9a descends, and the head 21
Grab AB tape 1. The moving clamp 17 initially moves to the left in the high-speed mode to feed the TAB tape 1, but sends less than one pitch (a length corresponding to the interval between two longitudinally adjacent pilot holes 1b). The mode switches to the low-speed mode and moves slowly. Then, when the sensitivity of the photoelectric sensor 23 reaches the initially set numerical value, the moving clamp 17 is stopped by the output signal.

As described above, when the moving clamp 17 is stopped, the mold portion operates to start a punching and bonding process. Before describing the process, however, the operation of one cycle of the feed mechanism must be performed first. Let me explain. When the moving clamp 17 stops as described above, the cylinder 18 of the fixed clamp 15 operates, the piston 9a descends, and the head 20 grips the TAB tape 1. Thereafter, the moving clamp 17
The head 21 moves rightward after the TAB tape 1 is released, and the head 21 grips a portion behind by one pitch from the previous position. At that stage, the head 20 of the fixed clamp 15 releases the TAB tape 1 and is ready for the next feeding operation. During the operation of the feed mechanism in one cycle, punching and bonding by the die are performed.

Next, the operation of the mold will be described with reference to FIG. As described above, TAB tape 1
Stops, the cylinder 6 starts operating, and the slider plate 7 descends. In this downward movement, first, four pilot pins 11 for the TAB tape are fitted into pilot holes 1b formed on both sides of the belt-like TAB tape 1. At this time, TA
Even if the B tape 1 is slightly displaced from the normal position, the position is corrected to the normal position by the tapered portion formed at the tip of the pilot pin 11. Next, the four stiffener pilot pins 10 are fitted into the pilot holes 2a of the stiffener 2, and the stiffener 2 is positioned at a regular position.

After the strip-shaped TAB tape 1 and the strip-shaped stiffener 2 are accurately positioned in this manner, a punch 8 punches a predetermined area from the strip-shaped TAB tape 1. Then, the cut TAB tape 1A (see FIG. 3)
With the air removed by a vacuum pump and in the adsorption state,
The stiffener 2 is pressed through the die hole 3a.
Therefore, the adhesive previously attached to the TAB tape 1A becomes tacky by being heated through the stiffener 2, and the TAB tape 1A is adhered to the stiffener 2. Thereafter, the slide plate 7 is raised by the cylinder 6, and all the constituent members return to the state shown in FIG. 1, whereby the operation of one cycle in the mold portion is completed. Therefore, thereafter, the moving clamp 17 of the feed mechanism starts to operate leftward again while holding the TAB tape 1 in the form of a belt.

In the above embodiment, the belt-shaped TA
As the feed mechanism of the B tape 1, an index feed mechanism that performs gripper feed is employed, but the feed mechanism in the present invention is not limited to such a feed mechanism. For example, a mechanism that feeds by rotation of a sprocket that meshes with the perforation 1c of the belt-shaped TAB tape 1 may be used. Further, in the above embodiments, a reflection type fiber sensor is used as the photoelectric sensor, but the present invention is not limited to a fiber type sensor, and a transmission type photoelectric sensor may be used. .

[0024]

As described above, the present invention intermittently feeds a belt-shaped TAB tape to which an adhesive which becomes tacky by heating is applied to a processing position, and punches a predetermined area with a die at that position. In a device in which a cut TAB tape is pressed against and bonded to a heated stiffener, intermittent feeding of a band-shaped TAB tape can be performed accurately, and as a result, an appropriate position of a punched area can be corrected. Can be prevented.

[Brief description of the drawings]

FIG. 1 is a front view showing an apparatus according to an embodiment of the present invention for cutting a predetermined area of a strip-shaped TAB tape and bonding the cut area to a predetermined position of a strip-shaped stiffener; is there.

FIG. 2 is a plan view of the device shown in FIG.

FIG. 3 is an explanatory diagram of the strip-shaped TAB tape shown in FIG. 2;

FIG. 4 is a plan view showing a state in which the TAB tape cut by the embodiment device is adhered to a belt-shaped stiffener.

[Explanation of symbols]

REFERENCE SIGNS LIST 1 strip-shaped TAB tape 1a, 2b hole 1b, 2a pilot hole 1c perforation 1A cut TAB tape 2 stiffener 3 base 3a die hole 3b guide hole 4 pillars 5 units 6, 18, 19 cylinders 6a, 18a, 19a Piston 7 Slide plate 8 Punch 9 Guide block 10, 11 Pilot pin 10a, 11a Flange part 10b, 11b Spring 12 Guide rail 13 Heater 14 Base part 15 Fixed clamp 16 Shaft 17 Moving clamp 20, 21 Head 22 Slide table 22a Adjusting shaft 22b movable arm 23 photoelectric sensor

Claims (1)

[Claims] 1. A belt-shaped TAB tape to which an adhesive which becomes tacky due to heating is attached intermittently sent to a processing position, a predetermined area is punched out by a die at that position, and the cut TAB tape is heated. In the device for pressing and adhering to the stiffener, the TAB tape is provided with a hole for forming the inner shape of the predetermined area in advance, and a feed mechanism for intermittently feeding the TAB tape is disposed at a position subsequent to the processing position. In addition, a TAB
A photoelectric sensor whose optical path is restricted by the inner moving position of the tape is arranged, and the transport by the feed mechanism is stopped by a predetermined output signal of the photoelectric sensor, and the transport positioning of the TAB tape is performed. mechanism.