JPH10329145A - Optical shaping simple mold - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance mold durability and the peel strength of a metal film by covering the surface part becoming a mold surface with a metal film of a single kind and single layer or more formed by electroless plating treatment. SOLUTION: The surface part of a matrix 3 is removed by a plast device until a part of ceramic beads 5 within the matrix 3 is exposed. Subsequently, etching eluting the ceramic beads 5 exposed to the surface part is performed. A plurality of Sn substances are fixed to the surface part where the ceramic beads 5 are eluted. Next, a plurality of Pd substances composed of a metal having catalytic capacity to the metal coating 4 applied to an optical shaping simple mold 1 are fixed to the Sn substances. Further, the matrix 3 is immersed in an Ni electroless plating soln. to precipitate Ni around Pd and a metal film 4 is formed on the surface part. By this constitution, an optical straping simple mold 1 wherein the metal film 4 being a hard film with a thickness of about 10 μm is formed on the surface part of the matrix 3 composed of a photo-setting resin 2 is obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a simplified stereolithography mold manufactured by irradiating a photocurable resin with light based on shape data defined by three-dimensional CAD.

[0002]

2. Description of the Related Art Conventionally, as an optical molding simple type of this type, published by the Industrial Research Institute Co., Ltd. (November 15, 1996)
There is one described as “direct molding of a mold” on page 118, section 6.3.3 of “Lamination molding system” of the first edition, first printing. FIGS. 15 and 16 are a perspective view and a cross-sectional view for explaining “direct molding of a mold” according to the related art, and show a cross-sectional shape data group of FIG. 15B obtained from a mold model 61 of FIG. 16 (A) to FIG.
The fabrication of the optical molding simple mold 63 proceeds in the order of (C).

In FIG. 15A, a mold model 61 defined by three-dimensional CAD includes a large-diameter cylindrical portion 61a and a small-diameter cylindrical portion 61b. This model 61
As shown in FIG. 15B, the distance d1 is
Are sequentially sliced into a cross-sectional data group 62. For the sake of explanation, the section data group 62 includes “direct molding of a mold” described later.
Are given from the bottom to the cross-sectional data P1, P2 to the final cross-sectional data Pn in accordance with the operation sequence of FIG. FIG. 16A illustrates a method of forming the shape of the initial cross-sectional data P1. The bottom portion 65a of the L-shaped forming table 65 is a liquid photo-cured material mixed with glass fibers 66 as a reinforcing material. Resin 67
Is submerged at the same depth as the interval d1 obtained by slicing the mold model 61 with the liquid surface 68 as a reference. Further, in order to cure the liquid photocurable resin 67 into which the glass fibers 66 are mixed, a laser beam 69 is irradiated from above the liquid surface 68 toward the liquid surface 68.

Next, a method of "direct molding of a mold" will be described. First, in the state of FIG.
The laser beam 69 is scanned in the X direction, that is, in the left-right direction based on the range of 1. As a result, the liquid photocurable resin 67 into which the glass fibers 66 are mixed is cured to a thickness equal to the cross-sectional data P1 and to a thickness equal to the interval d1, and becomes a cured product M1. Further, as shown in FIG.
Is settled in the photocurable resin 67 by the interval d1 and the laser beam 69 is scanned in the X direction based on the range of the cross-sectional data P2. Then, similarly, the glass fiber 66
Is mixed with the liquid photocurable resin 67.
Cured product M1 in a range equal to
It cures on the above to become a cured product M2.

By repeating such an operation up to the final sectional data Pn of the sectional data group 2, a final cured product Mn as shown in FIG. 16C is formed, and as a result, the liquid A simple optical molding die 63 having the same shape as the die model 61 is formed inside the photocurable resin 67.

[0006]

However, the above-mentioned conventional stereolithography simplified type has the following problems. In normal injection molding, a high-temperature and high-viscosity thermoplastic resin is injected into a mold at a very high pressure. In addition, a reinforced thermoplastic resin mixed with glass fiber or metal powder is generally used as the thermoplastic resin. Even when a conventional stereolithography mold is applied to injection molding performed under such severe conditions, a mold using a photocurable resin as a base material is damaged early. In a study conducted by the present applicant, destruction of the stereolithography simplified mold started around 10 shots of the molded product. Further, when performing general injection molding, molding is performed in advance for about 50 shots, which is referred to as condition setting. However, such a stereolithography simple type that can perform only about 10 shots has a problem that is not practical at all.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and a first object of the present invention is to provide a simplified stereolithography mold having improved mold durability. A second object is to provide a stereolithography simplified type in which the peel strength of the metal film is increased and the mold durability is improved. Further, a third object is to provide a stereolithography simplified mold in which mold durability is remarkably improved.
A fourth object is to provide a stereolithography simplified mold having improved mold durability.

[0008]

In order to achieve the above object, a simplified stereolithography type according to the first invention is a simplified stereolithography type manufactured by irradiating a photocurable resin with light based on shape data. In the above, at least a surface portion serving as a molding surface is covered with one or more metal films formed by electroless plating.

[0009] Further, the stereolithography simplified type according to the second invention comprises:
In an optical molding simple mold manufactured by irradiating light to a photocurable resin based on shape data, at least a surface portion serving as a molding surface is covered with one or more metal coatings formed by a PVD method.

[0010] Further, the stereolithography simplified mold according to the third invention is a stereolithography simple mold manufactured by irradiating light to a photocurable resin based on shape data. And one or more metal films formed by a combination of the above and an electroless plating.

The simplified stereolithography die according to a fourth invention is the simplified stereolithography die according to the first or third invention, wherein the electroless plating treatment is performed until a contaminant in the mold is exposed. Removing the contaminants, washing the surface in a state where the contaminants are exposed, eluted the contaminants, fixing a reducing substance on the surface eluted the contaminants, On the other hand, the method includes a step of fixing a metal having a catalytic ability to the reducing substance, and a step of forming a metal coating on the metal.

That is, in the simplified stereolithography die according to the first invention, at least the surface portion, which is a molding surface, of the simplified stereolithography die manufactured by irradiating the photocurable resin with light based on the shape data is electroless. Cover with one or more metal films formed by plating.

[0013] Further, the stereolithography simplified type according to the second invention comprises:
At least the molding surface of the optical molding simple mold manufactured by irradiating light to the photocurable resin based on the shape data,
It is covered with one or more metal films formed by the PVD method.

Further, in the stereolithography simplified mold according to the third invention, at least the surface portion, which is a molding surface, of the stereolithography simplified mold manufactured by irradiating the photocurable resin with light based on the shape data is subjected to the PVD method. And one or more metal films formed by a combination of the above and an electroless plating process.

[0015] In the optical molding simplified mold according to the fourth invention, the surface portion is removed until the contaminants in the optical molding simplified mold manufactured by irradiating the photocurable resin with light based on the shape data are exposed. . With the contaminants exposed, the surface is washed to elute the contaminants. A reducing substance is fixed to the surface portion from which the contaminants have been eluted, and a metal having catalytic ability to the metal film is fixed to the reducing substance. Then, a metal coating is formed on the metal.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION

First Embodiment A first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a cross-sectional view showing a simplified stereolithography mold of the present embodiment, FIG. 2 is a cross-sectional view showing a simplified stereolithography mold covered with a metal film, and FIGS. FIG. 3 is an enlarged sectional view of an essential part of a stereolithography simplified type,
FIG. 4 is a flowchart, and (B) to (G) in the flowchart correspond to (B) to (G) in FIG.

As shown in FIG. 1, a simplified stereolithography mold 1 of the present embodiment is a simplified stereolithography mold (hereinafter, referred to as “hard molding”) obtained by curing a photocurable resin 2 based on shape data defined by three-dimensional CAD. A metal film 4 made of Ni was applied to a surface portion serving as a molding surface of the mother mold 3 by electroless plating.
A plurality of ceramic beads 5 having a diameter of 10 μm to 30 μm are mixed in the matrix 3 as a contaminant, and the ceramic beads 5 are surrounded by the photocurable resin 2 forming the matrix 3. I have.

Next, a process of manufacturing the stereolithography simplified mold 1 of the present embodiment will be described with reference to FIGS. In the present embodiment, a simplified stereolithography mold manufactured by a conventional technique using the photocurable resin 2 mixed with the ceramic beads 5 is used as the mother mold 3 and the stereolithography simplified mold 1 is reinforced on the surface thereof. Metal coating 4 was applied. Matrix 3 is
As shown in FIG. 2, a large-diameter cylindrical portion 3a and this cylindrical portion 3a
A so-called core composed of a cylindrical portion 3b having a smaller diameter than the tapered portion. The ceramic beads 5 having a higher specific gravity than the photocurable resin 2 sink in the manufactured matrix 3, and exist from a position lower than the surface of the matrix 3 by a depth e as shown in FIG. I have.

First, in FIG. 3B, the surface portion of the matrix 3 is removed by a commercially available blasting device 6 until a part of the ceramic beads 5 in the matrix 3 is exposed, that is, by a depth e ( Blast process).

As a result, the surface of the matrix 3 is in a state where a part of the ceramic beads 5 is exposed as shown in FIG. Then, with a part of the ceramic beads 5 exposed, the surface of the matrix 3 is cleaned using, for example, a commercially available ultrasonic cleaner (cleaning step).

Thereafter, so-called etching for eluting the ceramic beads 5 exposed on the surface portion is performed (etching step). As shown in FIG. Erode so complicated. Here, the etching solution for eluting the ceramic beads 5 is preferably a potassium hydroxide solution, but may be, for example, a concentrated hydrochloric acid solution or a sodium hydroxide solution as long as the ceramic beads 5 can be eluted.

As a pretreatment for fixing the metal film 4 on the etched surface, as shown in FIG. 3 (E), a plurality of reducing substances as a reducing substance are applied to the surface where the ceramic beads 5 are eluted. Fix Sn7 (first adsorption step). Here, "Sensitizer" manufactured by Okuno Pharmaceutical Co., Ltd. was used as the fixing solution.

Next, as shown in FIG. 3 (F), a plurality of Pd8 as a metal having a catalytic ability is reduced to Sn7 and fixed to the metal film 4 coated on the stereolithography simplified mold 1 (No. 2 adsorption step). Here, "Activator" (trade name) manufactured by Okuno Pharmaceutical Co., Ltd. was used as the fixing solution.

Thereafter, the matrix 3 in the above state is immersed in an electroless plating solution for Ni, and as shown in FIG.
Is deposited (coating forming step) to form a metal coating 4 on the surface. As a result, FIG.
As shown in FIG. 1, a simplified stereolithography mold 1 in which a thick hard coating of about 10 μm, that is, a metal coating 4 is formed on the surface of a matrix 3 made of a photocurable resin 2.

According to the present embodiment, the durability of the stereolithography simple mold 1 is improved by forming the metal coating 4 which is a hard coating on the surface of the matrix 3 of the photocurable resin 2. Can be.

Second Embodiment A second embodiment of the present invention will be described with reference to FIGS. 5 and 6 show a manufacturing process of the stereolithography simplified type of the present embodiment. FIG. 5 is an enlarged cross-sectional view of a main part of the surface of the matrix, and FIG. 6 is a flowchart, and FIGS. L) corresponds to (B) to (L) in FIG.

The simplified stereolithography mold of the present embodiment is similar to the first embodiment in that a matrix 3 (see FIG.
Surface) to be a molding surface of Ni-B from the surface side.
And a metal coating 4 made of Ni-P by electroless plating. In addition, a diameter of 1
A plurality of ceramic beads 5 of 0 μm to 30 μm are mixed, and the ceramic beads 5 are surrounded by the photocurable resin 2 forming the matrix 3.

Next, the steps of manufacturing the stereolithographic mold 1 of the present embodiment will be described with reference to FIGS. In the present embodiment, as in the first embodiment, a simplified stereolithography mold manufactured by a conventional method using the photocurable resin 2 mixed with the ceramic beads 5 is used as the matrix 3.
A metal coating 4 (see FIG. 1) was applied to the surface. The ceramic beads 5 having a higher specific gravity than the photocurable resin 2 sink in the manufactured matrix 3, and exist from a position lower than the surface of the matrix 3 by a depth e as shown in FIG. I have.

First, in FIG. 5B, the surface of the matrix 3 is removed by a commercially available blasting device 6 until a portion of the ceramic beads 5 in the matrix 3 is exposed, that is, the depth e. Blast process). As a result, as shown in FIG. 5C, a part of the ceramic beads 5 is exposed on the surface of the matrix 3.

Next, as shown in FIG. 5 (D), an appropriate amount of a commercially available surfactant is added to a degreasing agent (trade name: BG-20, manufactured by Kizai Co., Ltd.) to prepare a weak alkaline solution 11 of ph10. The mother die 3 in which a part of the ceramic beads 5 is exposed is immersed in an ultrasonic cleaner filled with the solution. In this state, the ultrasonic cleaning machine is started, and the resin powder 12 in which the photocurable resin 2 becomes powdery and scatters in the above-mentioned blasting step and is clogged in any gaps of the matrix 3 is removed together with other fats and oils components (degreasing). Washing step).

Thereafter, so-called etching for eluting the ceramic beads 5 exposed on the surface is performed (etching step), and as shown in FIG. Erode so complicated. Here, a potassium hydroxide solution 13 is preferable as an etchant for eluting the ceramic beads 5, but a concentrated hydrochloric acid solution or a sodium hydroxide solution may be used as long as the ceramic beads 5 can be eluted.

Next, as shown in FIG. 5F, the residue 14 of the ceramic beads 5 eluted in the etching step and the resin powder 12 are reliably removed by ultrasonic cleaning using a cleaning liquid 15 (ultrasonic wave). Washing step). Here, cleaning liquid 1
As 5, pure water having an electric resistance of 50 × 10 ⁴ Ω / m is desirable, and more specifically, it is preferably used at a temperature of 30 ° C. or more, preferably 60 ° C. or more and 80 ° C. or less.

Depending on the components of the contaminants eluted in the etching step, one or more etching solutions are selected. Therefore, depending on the type and quantity of the etching solution selected,
It is desirable to repeat the etching step and the ultrasonic cleaning step a plurality of times. In the present embodiment, the etching step and the ultrasonic cleaning step were repeated twice.

Then, in order to adjust the surface of the ultrasonically cleaned surface to a state suitable for sensitizing, which will be described later,
As shown in FIG. 5 (G), it is immersed in a 5% hydrochloric acid aqueous solution 16 (surface adjustment step).

After that, as a pretreatment for fixing a metal film 4 described later on the surface portion whose surface has been adjusted, FIG.
As shown in (1), a plurality of Sn7 as a reducing substance is fixed on the surface portion from which the ceramic beads 5 are eluted (sensitizing step). Here, "Sensitizer" manufactured by Okuno Pharmaceutical Co., Ltd. was used as the fixing solution.

Next, as shown in FIG. 5 (I), a plurality of Pd8 as a metal having catalytic ability is reduced to Sn7 and fixed to the metal film 4 described later (activating step). Here, Okuno Pharmaceutical Co., Ltd.
“Product name: Activator” was used.

Thereafter, the matrix 3 in the above-described state is usually replaced with Ni-
Although immersed in a P plating solution to precipitate Ni around Pd8, the deposition reaction is too fast with the Ni-P plating solution, and as shown in FIG. The coating 4 a is formed, and the cavity 17 is generated inside the matrix 3.

Therefore, before immersing the matrix 3 in the Ni-P plating solution, as shown in FIG. 5 (J), it is immersed in the solution 18 obtained by diluting the Ni-B plating solution three times. As a result, a Ni-B coating 19 is formed in a narrow portion of the matrix 3 eroded by the etching process (first Ni-B plating solution immersion process).

Next, as shown in FIG.
The plating solution is immersed in a solution 20 that is diluted twice. As a result, it is accelerated more slowly than the formation of the Ni-B film 19 in the first Ni-B plating solution immersion step (the second Ni-B plating solution).
Plating solution immersion step), the surface of the Ni-B coating 19 is formed smoothly.

After that, as shown in FIG. 5 (L), the matrix 3 is immersed in the Ni-P plating solution 21 to be precipitated (Ni-P plating solution immersion step). Here, the Ni-P plating solution 21 has a fast precipitation reaction, but has already been subjected to the previous process (second N
Since the dense Ni-B coating 19 is formed on the surface of the matrix 3 in the i-B plating solution immersion step), the Ni-P plating solution 21 in this step needs to further accelerate the film formation. Can be used.

Then, the photocurable resin 2 as shown in FIG.
A simplified stereolithography mold 1 (see FIG. 1) in which a thick hard coating of about 10 μm, that is, a desired metal coating 4 composed of a Ni—P coating 19 and a Ni—P coating is formed on the surface of a matrix 3 made of Can be.

According to the present embodiment, it is possible to obtain a simplified stereolithography mold 1 in which a metal layer 4 denser than that of the first embodiment is formed on the surface of the master block 3 of the simplified stereolithography mold. The durability of the simple mold can be further improved.

Third Embodiment A third embodiment of the present invention will be described with reference to FIGS. FIG. 8 is a cross-sectional view showing a simplified optical molding type of the present embodiment, and FIG. 9 is a schematic sectional view showing an apparatus for applying a metal coating to the simplified optical molding type of the present embodiment.

The simplified stereolithography mold 25 of the present embodiment is shown in FIG.
As shown in (1), a metal coating 26 made of Ni was applied by vacuum evaporation to a surface portion serving as a molding surface of an optical molding simple mold 3 formed by curing the photocurable resin 2. The same components as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

The stereolithography simplified mold 25 of the present embodiment is similar to that shown in FIG.
Was fabricated by coating a metal film 26 on a surface portion of the master mold 3 by a vacuum deposition process which is also a representative of the PVD method. As shown in FIG. 9, the vacuum vapor deposition apparatus is provided with a chamber 27 for performing vacuum vapor deposition inside. In the upper part of the chamber 27, the matrix 3 has a holder 28 with its surface facing downward. It is fixed to. In the vicinity of the matrix 3, a quartz oscillator 29 is installed at the same height as the matrix 3, and a commercially available quartz oscillator film thickness monitor 30 is connected to the quartz oscillator 29.

On the other hand, a metal sample 31 made of Ni is accommodated in a container 32 below the chamber 27, and a high voltage power supply device 33 is connected to the metal sample 31 via the container 32. A filament 35 for generating thermoelectrons 34 is provided near the container 32.
A power supply device 36 is connected to the filament 35.
At the intermediate portion between the metal sample 31 and the filament 35, the thermoelectrons 34 from the filament 35 are deflected to
A deflecting electromagnet 37 is provided to collide with.
The bending electromagnet 37 is connected to a power supply device 38.
The crystal resonator film thickness monitor 30, the high-voltage power supply device 33, and the power supply devices 36 and 38 are connected to a control device 39. The control device 39 includes a quartz crystal film thickness monitor 30.
, The high-voltage power supply 33 and the power supplies 36 and 38 can be controlled. Further, a pressure reducing device 40 for evacuating the inside of the chamber 27 is connected thereto. Note that, as the metal sample 31, N
i is used, but is not limited thereto. For example, TiN or C
A wide variety of metals, such as rN, can be used.

Next, a method for depositing the metal film 26 on the surface of the matrix 3 will be described. The mold 3, the metal sample 31, and the like are set in the chamber 27, and the pressure in the chamber 27 is first reduced to about 1 × 10 ⁻⁵ Pa by the pressure reducing device 40. Then, when the pressure in the chamber 27 is reduced to a predetermined pressure, the high-voltage power supply device 33 and the power supply devices 36 and 38 are activated almost simultaneously. As a result, the metal sample 31 made of Ni is applied by the high voltage power supply device 33 to about 6 kv, and the filament 35 is heated by the power supply device 36 to emit thermoelectrons 34. The emitted thermoelectrons 34 are deflected by the deflecting electromagnet 37, and are rapidly attracted to the metal sample 31 in a high potential state of 6 kv and collide at an accelerated rate. As a result, the metal sample 31 struck by the thermoelectrons 34 is heated and starts to evaporate.

The metal atoms 41 evaporated from the metal sample 31
Penetrates all over the narrow part of the surface of the matrix 3 and rapidly cools and stops when it collides with the matrix of the matrix 3. Then, by continuously performing the collision of the metal atoms 41, the metal film 26 is formed on the surface of the matrix 3.

At this time, the evaporated metal atoms 41 form the metal film 26 on the surface of the matrix 3 and also form the metal film 43 on the surface of the crystal unit 29. Since the matrix 3 and the quartz oscillator 29 are installed at the same height, the metal coatings 26 and 4 formed on the surfaces of both members are provided.
3 will be of equal thickness. Therefore, the thickness of the metal film 43 formed on the crystal unit 29 is
The metal film 26 having a desired thickness can be formed on the surface of the matrix 3, that is, the stereolithography simplified mold 25. In this embodiment, a film thickness of about 5000 ° is formed, and as a result, a film thickness of 5
It is possible to obtain a good stereolithography simple mold 25 on which a hard coating of about 000 °, that is, a metal coating 26 is formed.

According to the present embodiment, the stereolithography in which the metal atoms 41 penetrate all over the narrow portion of the surface of the matrix 3 to form the dense metal film 26 with high peel strength and the durability is remarkably improved. A simple mold 25 can be obtained.

Fourth Embodiment A third embodiment of the present invention will be described with reference to FIGS. FIG. 10 is a cross-sectional view showing a simplified optical molding type of the present embodiment, and FIG. 11 is a schematic sectional view showing an apparatus for applying a metal coating to the simplified optical molding type of the present embodiment.

The stereolithography simplified type 45 of the present embodiment is similar to that of FIG.
0, as shown in FIG.
A metal coating 46 made of Ni is applied on the metal coating 26 of the above by ion plating.

The stereolithography simplified type 45 of the present embodiment is similar to that of FIG.
Using the apparatus shown in FIG. 1, the surface of the stereolithography
It was manufactured from ion plating which is the D method. At the upper part in the chamber 27 of the apparatus, a stereolithography simple mold 25 is fixed to a holder 28 with the metal coating 26 facing downward.
A power supply device 47 for applying the stereolithography simple type 25 to a negative voltage from the ground potential is connected to the stereolithography simple type 25. Other configurations are the same as those of the vapor deposition apparatus of the third embodiment, and the same portions are denoted by the same reference numerals and description thereof will be omitted.

Next, a method of forming the metal film 46 on the surface of the stereolithographic mold 25 will be described. First, stereolithography simple mold 2
5 and the metal sample 31 are set in the chamber 27, and the inside of the chamber 27 is filled with an argon gas 48,
The internal pressure is maintained at about 1.0 to 0.1 Pa. Then, the power supply device 47 is activated, and a negative voltage of about −2 kv is applied to the stereolithography simple mold 25. At this time, a glow discharge 49 is generated around the stereolithography simplified mold 25. Next, Embodiment 3
As described above, when the metal sample 31 is evaporated, the evaporated metal atom 41 is ionized in the plasma of the glow discharge on the way to the stereolithography simple mold 25 to become the metal ion 50, and at the same time, the metal ion 50 becomes negative. Is accelerated and sucked by the stereolithography simplified mold 25 applied with the voltage of, and is incident in a shocking manner. The incident metal ions 50 are fixed on the metal film 26 to form a strong metal film 46. As a result, as shown in FIG.
It is possible to obtain a simplified stereolithography mold 45 in which the metal film 46 is firmly fixed through the metal film 26 of about Å. Although Ni is used as the metal sample 31, a variety of metals such as TiN and CrN can be used without being limited thereto.

According to this embodiment, the stereolithography simple mold 45 is used.
In addition to the effect of the third embodiment, the surface portion of is formed by forming the metal film 46 on the dense metal film 26 having a high peeling strength formed on the surface portion of the mother die 3, so that The mold durability can be further improved.

[Embodiment 5] FIG.
This will be described with reference to FIG. FIG. 12 is a cross-sectional view showing a stereolithography simplified type of the present embodiment, FIG. 13 is an enlarged cross-sectional view of a main part showing a surface portion of the stereolithography simplified type, and FIG. 14 is a cross-section showing a stereolithography simplified type forming a metal film. FIG.

In this embodiment, the metal coating 2 of the stereolithography simple mold 25 in which the metal coating 26 is formed on the surface of the third embodiment is used.
6, a metal film 4 was formed by the film forming step exemplified in the first embodiment.

Next, a method of manufacturing the stereolithography simple mold 55 of the present embodiment will be described. First, a stereolithography simple mold 25 having a metal film 26 formed on the surface in the same manner as in the third embodiment.
Is manufactured as shown in FIG. Next, the coating forming step (G) of the first embodiment is applied to the stereolithography simplified mold 25, and the metal coating 4 is formed on the metal coating 26 by the action of the coating forming step.

In the stereolithography simplified type of the present embodiment,
As shown in FIG. 13, the metal film 26 formed by the method of the third embodiment penetrates from the surface of the matrix 3 to the tip of a narrow portion 56 having a depth of several μm and formed in the depth direction. Further, the metal film 26 is thin and covers the surface of the matrix 3 without unevenness. On the surface of the metal film 26, the thick metal film 4 formed by the film forming process of the first embodiment is in contact with the metal film 26. Completely integrated and coated.

According to the present embodiment, it is possible to obtain a simplified stereolithography mold 55 in which the good operations and effects of the first and third embodiments are synergistically exhibited. That is, the thin metal film 26 formed according to the third embodiment is simply subjected to the film forming step (G), which is the final step of the first embodiment, on the surface of the stereolithography simplified mold 55, and the thick metal film 4 is formed. Can be formed. Therefore, it is possible to obtain the stereolithography simplified mold 55 having higher mold durability than the stereolithography simplified mold of each of the above embodiments.

In each of the above embodiments, the metal film is not limited to Ni, but may be Cr, A
A wide variety of metals such as u, Cu, Ag, etc. can be used.
The contaminants are not limited to ceramic beads, such as glass and metal.
Fibers and beads of various materials can also be used.

The technical idea having the following configuration is derived from the above specific embodiment. (Supplementary note) (1) In a stereolithography simple mold manufactured by irradiating light to a photocurable resin based on shape data defined by three-dimensional CAD, at least a surface portion serving as a molding surface is formed by electroless plating. A stereolithography simple type characterized by being covered with one or more types of metal coatings.

(2) In a stereolithography simple mold manufactured by irradiating light to a photocurable resin based on shape data defined by three-dimensional CAD, at least a surface portion serving as a molding surface is formed by a PVD method. A simplified stereolithography type characterized by being covered with one or more types of metal coatings.

(3) In a stereolithography simple mold manufactured by irradiating a photocurable resin with light based on shape data defined by three-dimensional CAD, at least a surface portion serving as a molding surface is subjected to a PVD method and electroless plating. A stereolithography simple type characterized by being covered with at least one kind of metal film formed by a combination of the treatment and the treatment.

(4) In the electroless plating treatment, the step of removing the surface portion until the contaminant in the mold is exposed, the step of cleaning the surface portion with the contaminant exposed, and the step of eluting the contaminant A step of cleaning a surface portion eluted with contaminants, a step of surface conditioning the cleaned surface portion, a step of fixing a reducing substance on the surface portion, and having a catalytic ability for a metal film. The stereolithography simple type according to Supplementary note (1) or (3), further comprising: fixing a metal to the reducing substance; and forming a metal coating on the metal.

(5) The stereolithography simple type according to supplementary note (4), wherein the step of eluting the contaminant and the step of cleaning the surface part from which the contaminant is eluted are repeated a plurality of times.

(6) In a method of manufacturing an optical molding simple type in which a photocurable resin is manufactured by irradiating light based on shape data defined by three-dimensional CAD, a surface portion is exposed until contaminants in the mold are exposed. Removing, cleaning the surface in a state where the contaminant is exposed, eluted the contaminant, fixing a reducing substance to the surface, and having a catalytic ability for the metal film. A simple stereolithography manufacturing method, comprising: fixing a metal to the substance; and forming a metal coating on the metal.

(7) In a stereolithography simple manufacturing method of irradiating a photocurable resin with light based on shape data defined by three-dimensional CAD, at least a surface portion to be a molding surface is made of metal by a PVD method. A method of manufacturing a stereolithography simple type, comprising forming a film and thereafter forming a metal film on the metal film by electroless plating.

According to the simplified stereolithography type of the supplementary note (1), it is possible to obtain a simplified stereolithography type in which a relatively thick metal film is easily formed on the surface and the mold durability is improved.

Further, according to the stereolithography simplified type of the supplementary note (2), a metal film firmly fixed to the surface portion can be formed in a narrow portion to improve the mold durability. In addition, it is possible to obtain a simplified stereolithography type in which a multilayer metal film is easily formed.

Further, according to the simplified stereolithography mold of the supplementary note (3), a simplified stereolithography mold with improved mold durability is obtained by quickly forming a metal film on a surface portion over a narrow portion and at a desired thickness. be able to.

Further, according to the simplified stereolithography type (4), it is possible to obtain a simplified stereolithography type in which a relatively thick metal film is easily formed on the surface portion to improve mold durability.

Further, according to the stereolithography simplified type described in Appendix (5), contaminants and residues adhering to the surface portion are reliably removed from the surface portion on which the metal film is formed, and a good metal film is formed. It is possible to obtain a stereolithography simplified mold having improved mold durability.

In addition, according to the manufacturing method of the stereolithography simplified type described in the appendix (6), a relatively thick metal film can be easily formed on the surface portion to improve the mold durability.

According to the simplified stereolithography manufacturing method of Appendix (7), a thick metal film integrated with the metal film can be formed on the metal film firmly fixed to a narrow portion of the surface. In addition, it is possible to obtain an optical molding simplified mold having good mold durability without film peeling.

[0076]

As described above, according to the stereolithography simplified type of the present invention according to the first aspect, a stereolithography simplified type in which a relatively thick metal film is easily formed on the surface to improve the mold durability is provided. Obtainable.

Further, according to the simplified stereolithography die of the present invention according to the second aspect, a simplified stereolithography die improved in mold durability by forming a metal film firmly adhered to the surface to a small part of the surface is obtained. be able to. In addition, it is possible to obtain a simplified stereolithography type in which a multilayer metal film is easily formed.

Further, according to the simplified stereolithography die of the present invention according to the third aspect, a simplified stereolithography die in which a metal coating is quickly formed on a surface portion over a narrow portion and in a desired thickness to improve mold durability. Can be obtained.

According to the simplified stereolithography die of the present invention, a relatively thick metal film is easily formed on the surface portion, and a simplified stereolithography die having improved mold durability can be obtained. .

[Brief description of the drawings]

FIG. 1 is a sectional view showing Embodiment 1 of the present invention.

FIG. 2 is a cross-sectional view showing a matrix used in the first embodiment of the present invention.

FIG. 3 is an enlarged cross-sectional view of a main portion of a surface portion showing a manufacturing process according to the first embodiment of the present invention.

FIG. 4 is a flowchart showing a manufacturing process according to the first embodiment of the present invention.

FIG. 5 is an enlarged cross-sectional view of a main part of a surface portion showing a manufacturing process according to a second embodiment of the present invention.

FIG. 6 is a flowchart showing a manufacturing process according to the second embodiment of the present invention.

FIG. 7 is an enlarged cross-sectional view of a main part of a surface portion showing a defect in a manufacturing process according to the second embodiment of the present invention.

FIG. 8 is a sectional view showing a third embodiment of the present invention.

FIG. 9 is a schematic sectional view showing an apparatus for manufacturing the third embodiment of the present invention.

FIG. 10 is a sectional view showing a fourth embodiment of the present invention.

FIG. 11 is a schematic sectional view showing an apparatus for manufacturing a fourth embodiment of the present invention.

FIG. 12 is a sectional view showing a fifth embodiment of the present invention.

FIG. 13 is an enlarged sectional view of a main part of a surface part according to a fifth embodiment of the present invention.

FIG. 14 is a cross-sectional view showing a matrix used in a fifth embodiment of the present invention.

15A and 15B show a conventional mold model, FIG. 15A is a perspective view, and FIG. 15B is cross-sectional data.

FIG. 16 is a cross-sectional view showing a step of manufacturing a conventional die model.

[Explanation of symbols]

 1,25,45,55 Stereolithography simplified type 2 Photocurable resin 4,26,46 Metal coating 5 Ceramic beads 6 Blasting device 7 Sn 8 Pd 13 Etching solution 15 Cleaning solution 18,20 Ni-B solution 19 Ni-B coating 21 Ni-P plating solution

Claims (4)

[Claims] In a simplified stereolithography mold manufactured by irradiating a photocurable resin with light based on shape data, at least one surface of a molding surface is formed by electroless plating. A stereolithography simple type characterized by being covered with. 2. A simplified stereolithography mold manufactured by irradiating a photocurable resin with light based on shape data, wherein at least a surface portion to be a molding surface is covered with one or more metal coatings formed by a PVD method. A stereolithography simple type characterized by the following. 3. An optical molding simple mold manufactured by irradiating a photocurable resin with light based on shape data, wherein at least a surface portion to be a molding surface is formed by a process combining PVD and electroless plating. A stereolithography simple type characterized by being covered with one or more types of metal coatings. 4. The electroless plating process includes: a step of removing a surface portion until a contaminant in a mold is exposed; a step of cleaning the surface portion with the contaminant being exposed; and a step of eluting the contaminant Fixing a reducing substance on the surface portion eluted with contaminants, fixing a metal having catalytic ability to the metal film to the reducing substance, and forming a metal film on the metal. 4. The stereolithography simple type according to claim 1 or 3, further comprising: