JP2010000637A - Method and equipment for manufacturing flow channel chip - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To flexibly and promptly cope with even a change or the like in a channel pattern in a flow channel chip, in manufacturing the channel chip. <P>SOLUTION: The method for manufacturing the channel chip 1 includes: a stamper forming process of forming a stamper 4 on which a pattern transferred to a constituent substrate 2 of the chip 1 is engraved in a concavo-convex shape reverse to that after transfer; and a molding/processing process of attaching the stampers 4 formed in the stamper forming process to a pair of the molds 6 that form a cavity 7 so as to constitute at least one face of the cavity 7 that corresponds to the external shape of the substrate 2 and conducting molding and processing using the pair of the molds 6 and the stamper 4 to obtain the channel chip 1. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method of manufacturing a microchannel chip (hereinafter simply referred to as “channel chip”) and a manufacturing apparatus of the channel chip.

In recent years, for example, in the medical field and the bio field, there are increasing cases of using flow path chips.
The flow channel chip is formed by patterning a fine flow channel having a width of several to several hundreds μm on a constituent substrate made of a resin material or the like. In addition, some of the flow path chips are provided with a pump or a valve or the like on the constituent substrate for controlling the flow of fluid in the flow path by applying MEMS (Micro Electro Mechanical Systems) technology. is there.

By the way, the flow path pattern in the flow path chip has a characteristic unique to each company that manufactures and develops the flow path chip, and has a shape filled with know-how of each company.
In general, a flow path chip having such a flow path pattern is manufactured by machining a mold for forming the flow path chip based on the flow path pattern data of the flow path chip. The production is performed by using the injection molding process or the like (see, for example, Patent Document 1). In addition, it is proposed to manufacture a flow path chip by creating a mask corresponding to the flow path pattern using photolithography technology and digging the flow path pattern on the constituent substrate. (For example, see Patent Document 2).

JP 2007-285967 A JP 2008-39541 A

However, in the conventional flow path chip manufacturing method described above, it is very difficult to respond flexibly and quickly to changes in the flow path pattern in the development process of the flow path chip. Become.
For example, in a manufacturing method in which a molding process is performed using a mold, when a flow path change or the like occurs, it becomes necessary to manufacture the mold again based on the changed flow path pattern data. In other words, it is widely known that generally it takes a lot of time (for example, about 1 to 4 weeks) to manufacture the mold, but this also requires a lot of time to deal with the flow path change and the like. It will take. Therefore, it becomes very difficult to respond flexibly and quickly to changes in the flow path and the like. Furthermore, in the manufacturing method in which a molding process is performed using a mold, the channel pattern of the channel chip actually obtained using the completed mold is verified, but the verification result is reconsidered. In such a case, it may be necessary to re-manufacture the mold again through the same procedure, which may take more time.
Further, for example, in a manufacturing method performed using photolithography technology, if a flow path change or the like occurs, it takes time and cost for mask remanufacturing or etching. Therefore, it is not always possible to respond flexibly and quickly to changes in the flow path or the like.

  Accordingly, an object of the present invention is to provide a flow path chip manufacturing method and a flow path chip manufacturing apparatus that can flexibly and quickly cope with changes in flow path patterns and the like.

  The present invention provides a flow path chip manufacturing method devised to achieve the above object, wherein a stamper that forms a stamper in which a pattern to be transferred onto a constituent substrate of the flow path chip is carved with unevenness opposite to that after transfer is formed. And attaching the stamper formed in the stamper forming step to a pair of molds forming the cavity so as to constitute at least one surface of the cavity corresponding to the outer shape of the component substrate. A molding process for obtaining the flow channel chip by performing molding using the mold and the stamper.

  According to the flow path chip manufacturing method of the above procedure, a flow path chip is obtained by performing a molding process using a pair of molds and a stamper. That is, a flow path chip having a shape defined by the cavities is formed by feeding and curing the flow channel chip forming material into a cavity formed by a pair of molds. At this time, since at least one surface of the cavity is constituted by the stamper, the uneven pattern engraved in the stamper is transferred to the formed flow path chip. Therefore, for example, even when there is a change in the pattern to be transferred onto the constituent substrate of the flow path chip, it can be dealt with by remanufacturing only the stamper attached to the pair of molds. There is no need to remanufacture.

According to the present invention, for example, even if the flow path pattern of the flow path chip is changed, it can be dealt with by remanufacturing only the stamper. And costs can be reduced. Therefore, it is possible to respond flexibly and quickly to changes in the flow path pattern and the like.
This means that various patterns can be verified in a short period of time. That is, according to the present invention, it is possible to shorten the time for confirmation and verification of the flow path pattern of the flow path chip. Therefore, it is expected that the flow path pattern can be smoothly developed.

  Hereinafter, a flow path chip manufacturing method and a flow path chip manufacturing apparatus according to the present invention will be described with reference to the drawings.

[Configuration example of channel chip]
First, a configuration example of a channel chip will be described. FIG. 1 is a perspective view illustrating a configuration example of a channel chip.
As shown in the figure, the flow channel chip 1 includes a constituent substrate 2 made of a planar rectangular plate-like member. A fine flow path 3 having a width of about several to several hundreds μm is formed on at least one surface of the constituent substrate 2 in a pattern. The flow path 3 is formed by digging into a concave cross section so as to be a path through which a fluid flows. In addition to the flow path 3, a pump, a valve, or the like (not shown) for controlling the flow of fluid in the flow path 3 may be provided on the component substrate 2.
The flow path chip 1 having such a configuration is used for chemical operations such as analysis, mixing, reaction, and separation of a fluid such as a chemical flowing through the flow path 3 in the medical field, the bio field, and the like.

[Manufacturing method of channel chip]
Next, a method for manufacturing the flow path chip 1 having the above configuration will be described. Here, a case where the flow path chip 1 made of a resin material is manufactured using injection molding will be described as an example.
FIG. 2 is an explanatory view showing a specific example of the procedure of the flow channel chip manufacturing method according to the present invention.

  For example, as shown in FIG. 2A, consider the case of manufacturing a channel chip 1 in which channels 3 are formed on both surfaces of a component substrate 2. In manufacturing such a channel chip 1, first, three-dimensional CAD (Computer Aided Design) data for specifying the shape of the channel chip 1 is prepared. As the three-dimensional CAD data, data created at the time of development and design of the flow channel chip 1 may be used.

  When three-dimensional CAD data is prepared, three-dimensional data for specifying the shape of the formation surface of the flow channel 3 in the flow channel chip 1 is created for each formation surface based on the three-dimensional CAD data. Specifically, a shape data portion for each forming surface is extracted from the prepared three-dimensional CAD data, and the shape data portion is converted into data in a file format that can be processed by an optical modeling apparatus to be described later. Three-dimensional data about the formation surface 3 is created. In addition, as a file format which can be processed with an optical modeling apparatus, the thing by the STL (Standard Triangulated Language or STereo Lithography) file format is mentioned, for example.

Thereafter, optical modeling is performed by the optical modeling apparatus using the created three-dimensional data. Stereolithography is a method of curing and laminating a liquid photocuring resin (for example, an ultraviolet curable resin that cures in response to ultraviolet light) using laser light emitted by the stereolithography apparatus. This is a technology for creating precise three-dimensional objects that are exactly the same as the input 3D data. As an optical modeling apparatus for performing such optical modeling, a known apparatus may be used.
When this stereolithography is performed, the stereolithography apparatus forms a stamper 4 having a concavo-convex shape opposite to the flow path 3 formed on the component substrate 2 of the flow path chip 1 as shown in FIG. Will do. That is, in the stereolithography apparatus, the stamper forming process by stereolithography is executed using the input three-dimensional data, and thereby the stamper 4 necessary for manufacturing the flow path chip 1 is formed.

FIG. 3 is an explanatory view showing a specific example of a stamper formed through a stamper forming step.
The stamper 4 formed in the stamper forming step has an uneven shape opposite to the flow path 3 in the flow path chip 1.
Specifically, for example, when the concave flow path 3 is formed on the component substrate 2, the stamper 4 is formed with a convex portion 4a corresponding to the concave shape as shown in FIG. Is done. Therefore, in the case of forming the concave flow path 3, the stamper 4 functions as a so-called “male” for forming the flow path 3.
However, the stamper 4 is not limited to the one having the convex portion 4a. For example, in the case of forming a convex shape on the component substrate 2, the stamper 4 is formed with a concave portion corresponding to the convex shape, thereby functioning as a so-called “female”.
That is, the stamper 4 is formed by engraving the formation pattern of the flow path 3 to be transferred onto the constituent substrate 2 of the flow path chip 1 with concavities and convexities opposite to those after the transfer.
Note that the stamper 4 is for performing pattern formation on the flow path chip 1, and the outer diameter shape is not particularly limited. For example, the stamper 4 is formed as shown in FIG. It is conceivable to have the same planar rectangular shape as that of the flow channel chip 1. Further, as shown in FIG. 3B, for example, the stamper 4 is fixed to a predetermined position on the disk-like pedestal 4b by adhesion or the like, thereby constituting a module called a mirror stamper 4c. Good.

Incidentally, the stamper 4 is formed by optical modeling as described above, and is used for injection molding for forming the flow channel chip 1 as described later. Therefore, it is assumed that the stamper 4 is formed using a resin material that has curability for light used in stereolithography and has heat resistance against a molding temperature in injection molding.
As such a resin material, it is conceivable to select and use a cured resin having a glass transition temperature Tg higher than that of a molding resin material used in injection molding and having a high molecular weight. For example, if the molding resin material is a cyclic olefin copolymer (COC), the general glass transition temperature Tg is 70 to 145 ° C. Therefore, a material having a glass transition temperature Tg higher than that and a molecular weight somewhat higher than this is used. What is necessary is just to use as a resin material which forms 4.
More specifically, examples of the resin material for forming the stamper 4 include the following. For example, as UV curable resin used in stereolithography, it consists of photopolymerizable oligomer or monomer, reactive diluent and photopolymerization initiator, and contains photopolymerization assistant, additive, colorant, etc. as necessary To do. As a curing reaction mechanism, there is a radical polymerization reaction or a cationic polymerization reaction. In the former, an acryloyl group and a vinyl group are functional groups, and in the latter, an epoxy group and a vinyl ether group are functional groups. As the type of photopolymerizable oligomer or monomer, any of urethane acrylate, epoxy acrylate, ester acrylate, acrylate, epoxy, vinyl ether, oxetane is used. However, in any case, the glass transition temperature Tg necessary for the molding temperature (that is, a glass transition temperature Tg higher than the molding resin material used in the injection molding) is secured.

After forming the stamper 4 through the stamper forming process as described above, a metal film 5 is formed on the uneven surface of the stamper 4 as shown in FIG. That is, after the stamper forming process, before performing the injection molding using the stamper 4 formed in the stamper forming process, a surface treatment process for forming the metal film 5 is performed, thereby forming irregularities in the stamper 4. The metal film 5 is laminated on the surface.
The metal film 5 is formed to improve the peelability from the molded product after injection molding. Therefore, the metal film 5 to be formed has releasability from a molding material used for injection molding, that is, a material for forming the flow path chip 1.
Examples of the metal film 5 having such releasability include a chromium sputtered film, a nickel sputtered film, a nickel electroformed film, a chromium plated film, an electroless nickel plated film, a platinum sputtered film, a gold sputtered film, and a silicon sputtered film. Or what combined these suitably etc. are mentioned. More specifically, for example, a film obtained by performing gold sputtering after chromium plating, or a film obtained by performing electroless nickel plating to harden the surface layer and then performing nickel electroforming, etc. Take as an example.
In addition, about the process (sputtering process, plating process, electroforming process etc.) itself for forming the metal film 5, what is necessary is just to utilize a well-known technique, The description is abbreviate | omitted here.

FIG. 4 is an explanatory view showing a specific example of the surface treatment performed in the surface treatment step and the treatment result.
FIG. 4A shows a specific example of the types and thicknesses of the metal film 5 that can be formed on the uneven surface of the stamper 4.
FIG. 4B shows a specific example of the peeling characteristics of each film shown in FIG. 4A in comparison with the case where each film is not formed. In addition, the evaluation result of the peeling characteristics shown in the figure is determined visually by looking at the change in the state of the male channel after transfer.

After the formation of the metal film 5 by the surface treatment process as described above, as shown in FIG. 2 (e), the stamper 4 on which the metal film 5 is formed is injected to produce the flow channel chip 1. It is attached to a molding part in an injection molding apparatus that performs molding. More specifically, the stamper 4 is attached to the pair of molds 6 mounted on the molding portion of the injection molding apparatus.
The pair of molds 6 generally includes a fixed mold and a movable mold. And the cavity 7 which is a cavity part which demarcates the external shape of a molded article is formed in the state where each has a predetermined positional relationship.
The stamper 4 is attached to the pair of molds 6 so that the film-forming surface of the metal film 5 in the stamper 4, that is, the concavo-convex forming surface forms at least one surface of the cavity 7. “At least one surface” corresponds to the formation surface of the flow channel 3 in the flow channel chip 1. Therefore, if the flow path 3 is formed on both surfaces of the component substrate 2, the stamper 4 is attached so as to configure two surfaces of the cavity 7 correspondingly.
When the attachment of the stamper 4 is completed, the material for forming the flow path chip 1 is sent into the cavity 7 and cured. That is, in the injection molding apparatus in which the stamper 4 is attached to the pair of molds 6, a molding process step for performing an injection molding process using the pair of molds 6 and the stamper 4 is executed.

FIG. 5 is an explanatory diagram showing a specific example of execution conditions for the molding process.
As shown in the figure, in the injection molding apparatus, injection molding is performed under conditions such as a mold temperature of 50 ° C., a resin temperature (nozzle) of 250 to 270 ° C., a clamping force of 12 t, and a resin type of cyclic olefin polymer (COP). It is possible. However, the condition shown here is only a specific example, and may be appropriately changed, for example, COC is used as the type of resin.

  Through the molding process as described above, a molded product of the channel chip 1 as shown in FIG. 2F is obtained.

[Channel chip manufacturing equipment]
Next, the manufacturing apparatus of the flow channel chip 1 that executes the manufacturing method of the above procedure will be described by taking an injection molding apparatus that executes a molding process as an example.

FIG. 6 is an explanatory view showing a configuration example of a main part of an injection molding apparatus which is one of the flow channel chip manufacturing apparatuses according to the present invention.
The injection molding apparatus shown in the figure includes a fixed mold 6 a and a movable mold 6 b as a pair of molds 6. And the position of the movable mold 6b can be moved as required. Each of these molds 6a, 6b forms a cavity 7 corresponding to the outer shape of the constituent substrate 2 of the flow path chip 1 to be molded by an injection molding apparatus.

  Among these, the mirror stamper 4c is attached to the fixed die 6a side so as to constitute one surface of the cavity 7. That is, by attaching the mirror stamper 4c, the stamper 4 in the mirror stamper 4c constitutes one surface of the cavity 7. The mirror stamper 4c is fixed by a fixing component (not shown). This fixed component may be configured using a known technique, but is assumed to be configured to detachably attach the mirror stamper 4c to the fixed side mold 6a.

On the other hand, the stamper 4 is attached to the movable mold 6b side so as to constitute one surface of the cavity 7 facing the mirror stamper 4c. That is, by attaching the stamper 4, the stamper 4 constitutes one surface of the cavity 7 different from the mirror stamper 4c.
The stamper 4 attached to the movable mold 6b side is assumed to be performed using a locking claw 6c that constitutes a part of the movable mold 6b. In other words, the stamper 4 is sandwiched between the mounting surface of the stamper 4 in the movable mold 6b and the locking claw portion 6c that constitutes a part of the movable mold 6b. It is fixed in place.
Furthermore, a suction hole 8 is formed on the mounting surface of the stamper 4 in the movable mold 6b in order to perform vacuum suction on the stamper 4. Then, vacuum suction using the suction holes 8 is used together when the stamper 4 is fixed.
As described above, the stamper 4 is detachably attached to the movable side mold 6b by vacuum suction using the engaging claw portion 6c and the suction hole 8 of the movable side mold 6b.

  That is, the stamper 4 or the mirror stamper 4c is detachably attached to the molds 6a and 6b.

In addition, a runner 11 and a spool 12 communicate with the cavities 7 formed by the molds 6a and 6b, the mirror stamper 4c, and the stamper 4. The material for forming the flow channel chip 1 is fed into the cavity 7 through the runner 11 and the spool 12.
Further, on the movable mold 6b side, an ejector mechanism comprising an ejector plate return pin 13, a product eject pin 14, an ejector plate 15, a spool eject pin 16, an ejector plate return spring 17 and the like provided in a general injection molding apparatus. Is provided. Then, the ejector mechanism is used to take out the channel chip 1 that is a molded product after injection molding from the cavity 7.
That is, the injection molding apparatus includes the runner 11 and the spool 12 and the ejector mechanism described above, and these function as a molding processing unit that performs molding processing using the pair of molds 6, the mirror stamper 4 c, and the stamper 4. It has become.

  In the injection molding apparatus configured as described above, after the mirror stamper 4c is attached to the fixed mold 6a side and the stamper 4 is attached to the movable mold 6b side, the molding process of the flow channel chip 1 is performed. Execute. That is, the material for forming the flow path chip 1 is fed into the cavity 7 constituted by the molds 6a and 6b, the mirror stamper 4c and the stamper 4 through the runner 11 and the spool 12, and is cured. Thereby, the flow path chip 1 having a shape defined by the cavity 7 is formed. And after shaping | molding the flow-path chip | tip 1, it takes out from the cavity 7 of the said flow-path chip | tip 1 using an ejector mechanism.

  At this time, the cavity 7 that defines the shape of the flow path chip 1 has two surfaces corresponding to the flow path forming surface of the flow path chip 1, which are constituted by the mirror stamper 4 c and the stamper 4, respectively. Therefore, in the flow path chip 1 molded in the cavity 7, the mirror stamper 4 c and the concave / convex pattern carved in the stamper 4 are transferred to each surface. That is, the outer shape of the component substrate 2 of the flow channel chip 1 is formed depending on the pair of molds 6 that form the cavity 7 corresponding to the outer shape. The formation surface is formed depending on the uneven shape formed on each of the mirror stamper 4c and the stamper 4.

[Operational effects in this embodiment]
As described above, according to the method for manufacturing the flow channel chip 1 in the present embodiment, after the stamper forming step, the flow channel chip 1 is obtained by using the stamper 4 formed in the stamper forming step. Execute the machining process. Moreover, in the manufacturing apparatus of the flow path chip 1 in the present embodiment, the flow path chip 1 is obtained by performing a molding process using the pair of molds 6 and the mirror stamper 4c and the stamper 4, and the mirror used for the molding process The stamper 4c and the stamper 4 are detachably attached.
Therefore, for example, even when the pattern to be transferred onto the constituent substrate 2 of the flow path chip 1 is changed, only the mirror stamper 4c or the stamper 4 attached to the pair of molds 6 is remanufactured. Therefore, there is no need to remanufacture the mold 6. That is, for example, even if the flow path pattern of the flow path chip 1 is changed, it can be dealt with by remanufacturing only the mirror stamper 4c or the stamper 4, so compared with the case of remanufacturing the mold, mask, etc. The time and cost required can be reduced, and the change can be responded flexibly and quickly.
This means that various pattern verifications can be performed in a short period for the flow path chip 1. That is, it is possible to shorten the time for confirmation and verification of the flow path pattern of the flow path chip 1. Therefore, it is expected that smooth development of the flow path pattern can be realized.

In the present embodiment, the stamper 4 is formed by stereolithography in the stamper forming step. That is, the stamper 4 functioning as a “male mold” or “female mold” when forming the flow path 3 in the flow path chip 1 instead of the flow path chip 1 which is the final modeling target is formed by optical modeling. Forming.
Therefore, even if the pattern of the flow path 3 is fine and complicated, the stamper 4 that is a three-dimensional object corresponding to the pattern can be easily and quickly formed by using stereolithography. Therefore, it is possible to smoothly develop the flow path pattern of the flow path chip 1.
In the present embodiment, the stamper 4 is formed by stereolithography, but the stamper 4 may be formed using a known technique other than stereolithography.

Further, in the present embodiment, in forming the stamper 4 using stereolithography, the resin has curability with respect to light used in stereolithography and has heat resistance against the injection molding temperature in the molding process. We are using materials.
Therefore, the stamper 4 formed in the stamper forming process can be used as it is in the molding process, and the flow path pattern development of the flow path chip 1 can be smoothly performed even in this respect.

Further, in the present embodiment, after the stamper 4 is formed in the stamper forming process, before the molding process using the stamper 4 is performed, the surface treatment process for forming the metal film 5 on the unevenness forming surface of the stamper 4 is performed. Is supposed to run.
Therefore, even when the stamper 4 formed in the stamper forming process is used as it is in the molding process, the stamper 4 can be peeled from the forming material of the flow channel chip 1 used for the injection molding process in the molding process. It is possible to sufficiently ensure the occurrence of problems such as defective peeling in the injection molding process.
The surface treatment process is not an essential process and may be omitted depending on circumstances.

In the present embodiment, the stamper 4 is attached in the molding process using the locking claw portion 6c that constitutes a part of the movable mold 6b. That is, the locking claw portion 6c constitutes a part of the movable die 6b, functions as the movable die 6b that defines the outer diameter shape of the flow path chip 1, and the fixing and fixing of the stamper 4. This is also used as a fixture for performing the above.
Therefore, even when the stamper 4 is detachably attached, the fixing force necessary for fixing the stamper 4 (holding force in the attached state) is secured, and the configuration for that purpose is suppressed as much as possible. can do.

  Furthermore, in this embodiment, in addition to the attachment and fixing of the stamper 4 using the locking claw portion 6c, vacuum suction to the stamper 4 is used in combination. Therefore, a sufficient fixing force (holding force in the attached state) necessary for fixing the stamper 4 can be ensured.

In the present embodiment, the preferred specific examples of the present invention have been described. However, the present invention is not limited to the contents, and can be appropriately changed without departing from the gist thereof.
For example, in the present embodiment, the case where the flow path 3 is formed on each of both surfaces (front and back surfaces) of the constituent substrate 2 in the flow path chip 1 is described as an example, but the flow path 3 is formed only on one of the surfaces. Even in this case, the present invention can be applied in exactly the same manner. In that case, the stamper 4 may be attached so that the stamper 4 forms at least one surface of the cavity 7 corresponding to the formation surface of the flow path 3.
Further, in the present embodiment, the case where injection molding is performed in the molding process has been described as an example, but the present invention is exactly the same even when other known molding techniques are used instead of the injection molding. It is possible to apply.
Furthermore, in this embodiment, the case where the locking claw portion 6c is used for the attachment of the stamper 4 or the vacuum suction by the suction hole 8 is used as an example is described. It is also possible to perform. Examples of attachment using other known techniques include those using a fastener such as a screw and those using an adhesive or a pressure-sensitive adhesive.

It is a perspective view which shows the structural example of a flow-path chip | tip. It is explanatory drawing which shows one specific example of the procedure of the manufacturing method of the flow-path chip | tip which concerns on this invention. It is explanatory drawing which shows one specific example of the stamper formed through the stamper formation process in the manufacturing method of the flow-path chip | tip concerning this invention. It is explanatory drawing which shows the specific example of the surface treatment performed in the surface treatment process in the manufacturing method of the flow-path chip concerning this invention, and its treatment result. It is explanatory drawing which shows the specific example of the execution conditions of the shaping | molding process in the manufacturing method of the flow-path chip concerning this invention. It is explanatory drawing which shows the principal part structural example of the injection molding apparatus which is one of the manufacturing apparatuses of the flow-path chip concerning this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Flow path chip, 2 ... Constituent board, 3 ... Flow path, 4 ... Stamper, 4c ... Mirror stamper, 5 ... Metal film, 6 ... Mold, 6a ... Fixed side mold 6ab ... Movable side mold 6bc ... Stopper, 7 ... cavity, 8 ... suction hole

Claims (7)

A stamper forming step of forming a stamper in which a pattern to be transferred onto the constituent substrate of the flow path chip is engraved with irregularities opposite to those after transfer; and
The stamper formed in the stamper forming step is attached to a pair of molds forming the cavity so as to configure at least one surface of the cavity corresponding to the outer shape of the component substrate, the pair of molds and the pair of molds A flow path chip manufacturing method including: a flow forming process by performing a forming process using a stamper to obtain the flow path chip. The flow path chip manufacturing method according to claim 1, wherein in the stamper forming step, the stamper is formed by stereolithography. The stamper is formed in the stamper forming step using a resin material that has curability to light used in the optical shaping and has heat resistance against a molding temperature in the molding process. A manufacturing method of a channel chip. After the stamper is formed in the stamper forming step, before the molding process using the stamper is performed, the flow path chip that is subjected to the molding process in the molding process on the uneven surface of the stamper. The manufacturing method of the flow-path chip | tip of any one of Claim 1 to 3 including the surface treatment process which forms the metal film which has the peelability with respect to the forming material. The flow path chip manufacturing method according to any one of claims 1 to 4, wherein the stamper is attached in the molding process by using a locking claw portion that constitutes a part of the mold. The manufacturing method of the flow-path chip according to claim 5, wherein vacuum stamping with respect to the stamper is used together with the attachment of the stamper in the molding process. A pair of molds forming a cavity corresponding to the outer shape of the substrate of the flow path chip;
A stamper that is detachably attached to the pair of molds so as to constitute at least one surface of the cavity, and a pattern to be transferred onto the component substrate is engraved with concavities and convexities opposite to those after transfer;
A flow channel chip manufacturing apparatus comprising: a molding processing unit that obtains the flow channel chip by performing a molding process using the pair of molds and the stamper.

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