CN117261089A - Manufacturing method of micro-fluidic chip based on dual-mode injection molding - Google Patents
Manufacturing method of micro-fluidic chip based on dual-mode injection molding Download PDFInfo
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- CN117261089A CN117261089A CN202311561324.8A CN202311561324A CN117261089A CN 117261089 A CN117261089 A CN 117261089A CN 202311561324 A CN202311561324 A CN 202311561324A CN 117261089 A CN117261089 A CN 117261089A
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- 238000001746 injection moulding Methods 0.000 title claims abstract description 57
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 30
- 238000000465 moulding Methods 0.000 claims abstract description 33
- 238000000034 method Methods 0.000 claims description 22
- 238000009713 electroplating Methods 0.000 claims description 19
- 229920002120 photoresistant polymer Polymers 0.000 claims description 19
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 18
- 230000003075 superhydrophobic effect Effects 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
- 229910052759 nickel Inorganic materials 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 8
- 238000001259 photo etching Methods 0.000 claims description 6
- 239000000243 solution Substances 0.000 claims description 5
- 238000005516 engineering process Methods 0.000 claims description 4
- 230000002209 hydrophobic effect Effects 0.000 claims description 4
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 4
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 claims description 3
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 claims description 3
- 239000000155 melt Substances 0.000 claims description 3
- 239000002105 nanoparticle Substances 0.000 claims description 3
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 claims description 3
- 229910001453 nickel ion Inorganic materials 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000001035 drying Methods 0.000 claims description 2
- 239000012778 molding material Substances 0.000 claims description 2
- 229910052814 silicon oxide Inorganic materials 0.000 claims 1
- 238000002347 injection Methods 0.000 abstract description 4
- 239000007924 injection Substances 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 9
- 238000004513 sizing Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000000338 in vitro Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0046—Details relating to the filling pattern or flow paths or flow characteristics of moulding material in the mould cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14336—Coating a portion of the article, e.g. the edge of the article
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C2045/0094—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor injection moulding of small-sized articles, e.g. microarticles, ultra thin articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The invention discloses a manufacturing method of a micro-fluidic chip based on double-mode injection molding, wherein two sets of molding spaces of products are arranged in a set of mold, a bottom plate with a micro-channel is injection molded in one molding space, then a front mold is rotated, another molding space is formed above the bottom plate, and a cover plate is injection molded on the bottom plate to form the micro-fluidic chip. A die cavity surrounded by the front die core A and the rear die core A, and a die cavity surrounded by the front die core B and the rear die core B are arranged in a set of die, and the front die core A and the front die core B can rotate around the front die to form the microfluidic chip through twice injection molding. Greatly improves the production speed and is beneficial to rapidly realizing large-scale mass production.
Description
Technical Field
The application relates to the field of micro-electromechanical systems, in particular to a manufacturing method of a micro-fluidic chip based on dual-mode injection molding.
Background
Microfluidic chips play a key role in the exquisite scaling of large laboratory systems to micron-scale substrates as an outstanding representation of microelectromechanical systems (MEMS). It perfectly mimics and replicates the complex biological and chemical reaction processes, achieves efficient, rapid and automated experimental procedures, and is an integral component of achieving In Vitro Diagnostics (IVD).
Although conventional laboratory microfluidic chip fabrication methods have made some progress, such as photolithography, LIGA, molding, etc., they have been successful in small-lot manufacturing. However, they are still limited by the problems of high manufacturing costs and unstable quality, which makes them mainly suitable for scientific experiments, but difficult to use on a large scale in commercial applications.
When meeting the industrial requirements of the microfluidic chip, the injection molding method is used for forming the brand-new corner. This method has excellent manufacturing accuracy and reproducibility, and a relatively short production cycle. However, the current injection molding technology has challenges in forming a micro-channel structure, because for the micro-fluidic chip, the micro-channel in the middle of the micro-channel structure is irregular in shape and cannot be molded in one step by using a traditional injection molding mode, and generally, a mode of joining a bottom plate and a cover plate after respectively injection molding the bottom plate and the cover plate twice is adopted, so that the efficiency is low and the time is consumed. In another U.S. patent application, publication No. US2010201028A1, entitled "injection molding method for closed channel products", a molded floor with microchannel grooves is first placed into a mold, and then plastic is injection molded over the microchannel grooves as a cover plate, which by lowering the temperature while increasing the plastic flow rate ensures that the glue does not enter the microchannels. But this approach has the following problems: (1) The bottom plate is required to be processed and then placed in a die, so that the efficiency is low; (2) The difficulty that the sizing material does not enter the micro-channel is high by controlling the temperature of the die and the flow rate of the sizing material, because the temperature of the sizing material is very high in the injection molding process, if the temperature of the die is controlled in a lower value, the cooling requirement on the die is very high, and the cooling requirement is difficult to reach.
Disclosure of Invention
The method for manufacturing the micro-fluidic chip aims at the problems of low speed and low efficiency in the manufacturing process of the current micro-fluidic chip, can be used for injection molding the micro-fluidic chip in two steps in one set of die, greatly improves the efficiency, has stable quality and is favorable for industrial mass production.
The technical means adopted by the application for solving the problems are as follows: a method for manufacturing a micro-fluidic chip based on dual-mode injection molding includes setting two sets of molding spaces of products in a set of mold, injecting a bottom plate with a micro-channel in one molding space, rotating a front mold, forming another molding space above the bottom plate, and injecting a cover plate on the bottom plate to form the micro-fluidic chip.
Specifically, the front mold core A and the rear mold core A form a mold cavity A, the front mold core B and the rear mold core B form a mold cavity B, the rear mold core A and the rear mold core B form the same structure, the front mold core A is the mold core shape of the bottom plate, the front mold core B is the mold core shape of the cover plate, and after one injection molding is finished, the front mold rotates 180 degrees, forming spaces are respectively formed between the front mold core A and the rear mold core B and between the front mold core B and the rear mold core A, and the injection molding is performed again, so that the one injection molding of the microfluidic chip is finished. When the production is started, a bottom plate is injected in the die cavity A, the die cavity B is not injected (or the die cavity B is also injected, and defective products in the die cavity B which is injected for the first time are taken out and scrapped), the front die rotates 180 degrees to enable the positions of the front die core A and the front die core B to be exchanged, then injection molding is carried out simultaneously in two molding spaces, a complete microfluidic chip is injected in the molding space surrounded by the front die core B and the rear die core A, the bottom plate is injected in the molding space surrounded by the front die core A and the rear die core B, products in the rear die core A are ejected out of the die after the die is opened, and meanwhile the front die core A and the front die core B continue to rotate 180 degrees; and (3) continuously and simultaneously injecting the two molding spaces after mold closing, at the moment, injecting the finished microfluidic chip in the mold cavity B, injecting the bottom plate in the mold cavity A, ejecting the product in the mold core after mold opening B, simultaneously continuously rotating the front mold core A and the front mold core B for 180 degrees, and closing the mold for the next injection.
Further, the rear mold core A of the mold cavity A and the rear mold core B of the mold cavity B are in central symmetry along the axis at the center of the mold, and the front mold core A of the mold cavity A and the front mold core B of the mold cavity B can move rotationally along the axis at the center of the mold. The front mold core A and the front mold core B can respectively form a molding space with the rear mold core A or the rear mold core B.
Further, the micro-channel die core structure corresponding to the front die core A is made of nickel materials.
Further, the micro-channel die core structure corresponding to the front die core A is a super-hydrophobic nickel film plated on the surface of the front die core A by adopting an electroplating method. The surface energy in the micro-channel after injection molding can be reduced, so that the surface of the micro-channel after injection molding has super-hydrophobic performance.
Further, the specific forming process of the micro-channel die core structure corresponding to the front die core A comprises the following steps: coating a layer of positive photoresist on the surface of the position outside the micro-channel die core structure corresponding to the front die core A by adopting a photoetching technology, drying, exposing the photoresist through a mask plate by utilizing an ultraviolet photoetching machine, and developing the exposed photoresist to obtain the front die core A with the micro-channel structure; cleaning a front mold core A and then taking the front mold core A as an electroplating cathode, selecting pure nickel as an anode to be connected with a power supply, and passing nickel chloride electroplating solution which is dispersed and distributed with non-conductive hard silica balls between the anode and the cathode to form an electroplating system, wherein the hard micro-nano particle balls and nickel ions in the electroplating solution are co-deposited in a micro-channel structure corresponding to the front mold core A by electrifying to form a super-hydrophobic micro-nano electroplating layer; and then removing the photoresist on the surface of the front mold core A to obtain the front mold core A with the hydrophobic electroplated layer micro-channel mold core structure. And photoresist is used as a protective layer to prevent the nickel film layer from being electroplated on the part outside the micro-channel core structure of the front mould core A.
Further, the photoresist thickness is 20-80 μm.
Further, the diameter of the silica spheres is 10-100nm.
Further, the injection molding material is polymethyl methacrylate (PMMA).
Further, the technological parameters of the molding space corresponding to the front mold core A are as follows: melt temperature 280 ℃ and mold temperature 100 ℃; the molding space technological parameters corresponding to the front mold core B are as follows: the melt temperature was 200℃and the mold temperature was 60 ℃.
Further, the depth of the micro-channel of the micro-fluidic chip is consistent with the thickness of the photoresist, and the width is 20-100 mu m.
The beneficial effects of this application are:
1. according to the injection molding die, the two sets of front dies and the two sets of rear dies are arranged in the die, and the two sets of front dies and the two sets of rear dies can be matched to form independent molding spaces, so that the cover plate and the bottom plate of the microfluidic chip can be simultaneously and independently molded in the two molding spaces, and a product after demolding is a complete microfluidic chip, so that the production speed is greatly improved, and the injection molding die is favorable for rapidly realizing large-scale mass production.
2. According to the micro-channel die core structure, the micro-channel die core structure on the front die core A is formed in an electroplating mode, so that the surface of the die core has super-hydrophobic performance, the surface of the micro-channel of the bottom plate after injection molding also has super-hydrophobic performance, the glue stock is guaranteed not to flow into the micro-channel in the process of injection molding the cover plate, and the quality of the micro-fluidic chip is guaranteed.
Drawings
Fig. 1 is a schematic diagram of a front mold structure for fabricating a microfluidic chip according to a first embodiment;
fig. 2 is a schematic diagram of a back mold structure for manufacturing a microfluidic chip according to an embodiment;
FIG. 3 is a schematic view of an embodiment of an exposed and developed A front mold core;
FIG. 4 is a schematic diagram of a micro-nano electroplated layer formed by a front mold core according to an embodiment A;
FIG. 5 is a schematic diagram of a front mold core with a micro-channel cavity structure according to an embodiment;
in the figure: front mold core of 11.A, front mold core of 12.B, back mold core of 21.A, back mold core of 22.B, 3 photoresist, 4 micro-channel structure, 5 micro-channel mold core structure.
Detailed Description
The present application is further described below with reference to the accompanying drawings. Wherein the drawings are for illustrative purposes only and are shown in schematic, non-physical, and not intended to be limiting of the present patent; for the purpose of better illustrating embodiments of the present application, certain elements of the drawings may be omitted, enlarged or reduced and do not represent the size of the actual product; it will be appreciated by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted.
Embodiment one: a method for manufacturing a microfluidic chip based on dual-mode injection molding is characterized in that a set of one-mode two-hole mold is used for two-time injection molding. As shown in fig. 1 and 2, two different molding spaces are provided in a set of mold, a front mold core 11 and a front mold core 12 are provided in a front mold of the mold, and a rear mold core 21 and a rear mold core 22 are provided in a rear mold. The rear mold core 21 and the rear mold core 22 have the same structure, but are different in arrangement position of the rear mold, so that the rear mold core 21 and the rear mold core 22 are in central symmetry along an axis at the center of the rear mold. The front mold core 11 is in the shape of a die of a micro-fluidic chip bottom plate, the front mold core 12 is in the shape of a die of a cover plate, and the front mold core 11 and the front mold core 12 can rotate along an axis at the center of the front mold, so that the front mold core 11 and the front mold core 12 can be respectively combined with the rear mold core 21 and the rear mold core 22 to form independent forming spaces. Thus, during the injection molding of the mold, in one case, the a front mold core 11 and the a rear mold core 21 enclose the a mold cavity, and the B front mold core 12 and the B rear mold core 22 enclose the B mold cavity; in another case, the front mold core 11 and the rear mold core 22 enclose one mold cavity, and the front mold core 12 and the rear mold core 12 enclose the other mold cavity. In both cases there are two separate sets of forming spaces. The molding space formed by the matching of the front mold core 11A and the rear mold core 21A or the rear mold core 22B is the molding space of the bottom plate with the micro channel, and the molding space formed by the matching of the front mold core 12B and the rear mold core 21A or the rear mold core 22B is the molding space of the cover plate.
When in primary injection molding, firstly, the front mold core 11 and the rear mold core 21 after mold assembly enclose a molding space A mold cavity of the bottom plate, the front mold core 12 and the rear mold core 22 enclose a molding space B mold cavity of the cover plate, the A mold cavity is used for injection molding to produce the bottom plate, the B mold cavity is not used for injection molding or is used for primary injection molding production, but the primary injection molding product needs to be scrapped.
Then opening the die, rotating the front die by 180 degrees (if the die cavity B is used for injection molding production in the step, the product in the die cavity B needs to be ejected out of the die and scrapped), closing the die, enclosing the front die core 11A and the rear die core 22B into a forming space of the bottom plate, enclosing the front die core 12B and the rear die core 21A into a forming space of the cover plate, and forming the bottom plate in the forming space. And the two molding spaces are produced by injection molding, wherein the front mold core 12 and the rear mold core 21 enclose a molding space, the inner cover plate is directly molded above the bottom plate, and the molded microfluidic chip can be obtained by two times of injection molding.
And (3) opening the die again, wherein the micro-fluidic chip formed in the rear die core 21A is ejected, the bottom plate in the rear die core 22B is kept still, the front die rotates 180 degrees again, the front die core 11A and the rear die core 21A enclose the die cavity A again after die assembly, and the front die core 12 and the rear die core 22B enclose the die cavity B again. And (3) carrying out injection molding production on both sides, and respectively carrying out injection molding to obtain the cover plate and the bottom plate.
And (3) opening the die, ejecting the micro-fluidic chip formed in the rear die core 22, keeping the bottom plate in the rear die core 21 still, rotating the front die for 180 degrees again, and then closing the die again for injection molding, thereby circulating.
In the injection molding process, PMMA is adopted as the material, and the technological parameters of the molding space corresponding to the front mold core A are as follows: melt temperature 280 ℃ and mold temperature 100 ℃; the molding space technological parameters corresponding to the front mold core B are as follows: the melt temperature was 200℃and the mold temperature was 60 ℃. The depth of the micro-channel of the formed micro-fluidic chip is 20 mu m, and the width is 50 mu m.
In order to ensure that the sizing material can not flow into the micro-channel of the formed bottom plate in the injection molding process of the cover plate, the micro-channel core structure 5 of the front mold core 11A is subjected to hydrophobic treatment, so that the surface of the micro-channel core structure has super-hydrophobic performance, the micro-channel of the bottom plate after injection molding can also form the super-hydrophobic performance, and the sizing material can be thoroughly prevented from flowing into the micro-channel in the injection molding process by matching with proper technological parameters of an injection molding machine.
The forming process of the micro-channel die core structure 5 of the front die core 11A is as follows: firstly, a layer of positive photoresist with the thickness of 20 mu m is coated on the surface of the position outside the micro-channel die core structure 5 corresponding to the micro-channel die core 11 by adopting a photoetching technology, the photoresist is subjected to exposure treatment through a mask plate by an ultraviolet photoetching machine after being dried, and the exposed photoresist is developed to obtain the micro-channel die core 11 with the micro-channel structure 4, wherein the micro-channel structure 4 is in a shape surrounded by the photoresist 3, as shown in figure 3.
Then, the front mold core 11 is cleaned and then used as an electroplating cathode, a nickel plate is selected as an electroplating anode to be connected with a power supply, nickel chloride electroplating liquid which is dispersed and distributed with non-conductive hard silica balls (with the diameter of about 50 nm) is used between the anode and the cathode to form an electroplating system, and hard micro-nano particle balls and nickel ions in the electroplating liquid are co-deposited in the micro-channel structure 4 corresponding to the front mold core 11 to form a super-hydrophobic micro-nano electroplated layer, as shown in fig. 4.
Finally, removing the photoresist 3 on the surface of the front mould core 11A to obtain the front mould core 11A with the hydrophobic electroplated layer micro-channel mould core structure 5, as shown in figure 5.
In the electroplating process, the photoresist 3 is used as a protective layer, so that the situation that a nickel film layer is electroplated on the part outside the micro-channel die core structure 5 of the front die core 11 is avoided, and a micro-channel cannot be formed in the injection molding process.
The above embodiments are provided for illustrating the present application and not for limiting the present application, and various changes and modifications may be made by one skilled in the relevant art without departing from the spirit and scope of the present application, so that all equivalent technical solutions should be also included in the scope of the present application, which should be defined by the claims.
Claims (7)
1.A manufacturing method of a micro-fluidic chip based on double-mode injection molding is characterized by comprising the following steps: arranging two sets of molding spaces of products in one set of mold, firstly, injection molding a bottom plate with a micro-channel in one molding space, then rotating a front mold, forming another molding space above the bottom plate, and injection molding a cover plate on the bottom plate to form a micro-fluidic chip;
the die comprises an A die cavity formed by surrounding an A front die core and an A rear die core, and a B die cavity formed by surrounding a B front die core and a B rear die core, wherein the A rear die core has the same structure as the B rear die core, the A front die core is in the shape of a die core of a bottom plate, the B front die core is in the shape of a die core of a cover plate, and after one injection molding is finished, the front die rotates 180 degrees, so that forming spaces are respectively formed between the A front die core and the B rear die core, and between the B front die core and the A rear die core, and the micro-fluidic chip is subjected to injection molding again, so that one injection molding of the micro-fluidic chip is finished;
the front mold core A and the front mold core B of the mold cavity B are in central symmetry along the axis at the center of the mold, and the front mold core A and the front mold core B of the mold cavity B can rotate along the axis at the center of the mold, so that the front mold core A and the front mold core B can respectively form a molding space with the rear mold core A or the rear mold core B;
the micro-channel die core structure corresponding to the front die core A is a super-hydrophobic nickel film plated on the surface of the front die core A by adopting an electroplating method.
2. The method for manufacturing the micro-fluidic chip based on dual-mode injection molding as claimed in claim 1, wherein: the micro-channel die core structure corresponding to the front die core A is made of nickel materials.
3. The method for manufacturing the micro-fluidic chip based on dual-mode injection molding as claimed in claim 1, wherein: the forming process of the micro-channel die core structure corresponding to the front die core A comprises the following steps: coating a layer of positive photoresist on the surface of the position outside the micro-channel die core structure corresponding to the front die core A by adopting a photoetching technology, drying, exposing the photoresist through a mask plate by utilizing an ultraviolet photoetching machine, and developing the exposed photoresist to obtain the front die core A with the micro-channel structure; cleaning a front mold core A and then taking the front mold core A as an electroplating cathode, selecting a nickel plate as an anode to be connected with a power supply, and passing nickel chloride electroplating solution which is dispersed and distributed with non-conductive hard silica balls between the anode and the cathode to form an electroplating system, wherein the hard micro-nano particle balls and nickel ions in the electroplating solution are co-deposited in a micro-channel structure corresponding to the front mold core A by electrifying to form a super-hydrophobic micro-nano electroplating layer; and then removing the photoresist on the surface of the front mold core A to obtain the front mold core A with the hydrophobic electroplated layer micro-channel mold core structure.
4. The method for manufacturing the micro-fluidic chip based on dual-mode injection molding according to claim 3, wherein the method comprises the following steps: the photoresist thickness is 20-80 μm.
5. The method for manufacturing the micro-fluidic chip based on dual-mode injection molding according to claim 3, wherein the method comprises the following steps: the diameter of the silicon oxide sphere is 10-100nm.
6. The method for manufacturing the micro-fluidic chip based on dual-mode injection molding according to claim 3, wherein the method comprises the following steps: the injection molding material is PMMA.
7. The method for manufacturing the micro-fluidic chip based on dual-mode injection molding according to claim 3, wherein the method comprises the following steps: the technological parameters of the molding space corresponding to the front mold core A are as follows: melt temperature 280 ℃ and mold temperature 100 ℃; the molding space technological parameters corresponding to the front mold core B are as follows: the melt temperature was 200℃and the mold temperature was 60 ℃.
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| JP2010000637A (en) * | 2008-06-19 | 2010-01-07 | Sony Corp | Method and equipment for manufacturing flow channel chip |
| KR20120053757A (en) * | 2010-11-18 | 2012-05-29 | 한국과학기술원 | Fabrication method of micro-fluidic chip using ultrasonic bonding |
| US20120208324A1 (en) * | 2011-02-14 | 2012-08-16 | Renesas Electronics Corporation | Manufacturing method of semiconductor device |
| US20210291170A1 (en) * | 2018-12-10 | 2021-09-23 | Shenzhen University | Micro-structured mold-core of microfluidic chip and its manufacturing method |
| CN209409168U (en) * | 2018-12-25 | 2019-09-20 | 广东力人科技有限公司 | Rotate injection molding tool altogether |
| CN113290770A (en) * | 2021-05-12 | 2021-08-24 | 泰极微(成都)技术发展有限公司 | Injection molding method of plastic microfluidic chip |
| WO2023035289A1 (en) * | 2021-09-13 | 2023-03-16 | 上海仁芯生物科技有限公司 | Microfluidic chip having flat dielectric layer surface, preparation method therefor, and manufacturing mold |
| CN114536652A (en) * | 2022-02-23 | 2022-05-27 | 中南大学 | Method for preparing microfluidic chip through injection molding of nickel composite electroforming mold core |
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