JPH10326786A - Method and device for manufacturing semiconductor and chip carrying jig - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a stud bump bonding technology which can reduce the product cost by suppressing the capital investment. SOLUTION: A chip carrying jig comprises a base member 2b through which a plurality of base-side openings 2c having areas smaller than that of the main surface of a semiconductor chip are formed, a lid member 2d through which a plurality of lid-side openings 2e having areas smaller than that of the main surface of the chip are formed, a chip housing member 2f in which a plurality of chip housing openings 2g having areas slightly larger than that of the main surface of the chip are formed, connecting members 2h which detachably connect the lid member 2d, and a subbase member 2i to which the connecting members 2h are attached. A plurality of chip holding sections 2a is segmented by putting the chip housing member 2f between the base and the lid members 2b and 2d while the base-side openings 2c, lid-side openings 2e, and chip housing openings 2g are aligned with each other and, in addition, the lid member 2d is detachably attached by means of the connecting members 2h.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a semiconductor manufacturing technique, and more particularly to a semiconductor manufacturing method and apparatus for forming bumps on a surface electrode of a semiconductor chip by using a stud bump bonding technique, and a chip transport jig.

[0002]

2. Description of the Related Art The technology described below studies the present invention,
Upon completion, they were examined by the inventor, and the outline is as follows.

[0003] TCP (Tape Carrier Package) and CSP
In a semiconductor device such as a (Chip Size Package), a step of forming a bump on a pad (surface electrode) of a semiconductor chip is required.

[0004] As a method of forming a bump, there is a method of forming a gold (Au) bump by vapor deposition using a vapor deposition apparatus on a surface electrode of an individual semiconductor chip on a semiconductor wafer before dicing, that is, dicing. Gold is applied to individual semiconductor chips on the previous semiconductor wafer or to non-defective semiconductor chips after dicing by using stud bump bonding technology (joining technology using wire bonding, hereinafter referred to as stud bonding). Methods for forming bumps and the like are known.

When performing stud bonding, a stud bonding device dedicated to stud bonding is used, and after dicing, a non-defective semiconductor chip is transported to the stud bonding device to form bumps.

In some cases, stud bonding is performed on individual semiconductor chips of a semiconductor wafer before dicing using the stud bonding apparatus.

Here, a technique for forming a gold bump on a pad of a semiconductor chip is described in, for example, Nikkei BP, 19
Published on May 31, 1993, "Practical Course VLSI Packaging Technology (2)", Susumu Kayama and Kunihiko Naruse (supervised), 84-8
It is described on page 5.

[0008]

However, in the vapor deposition apparatus or the stud bonding apparatus of the above-mentioned technology, an apparatus corresponding to a semiconductor wafer having a large diameter (for example, 8 inches) is not prepared as equipment.

Therefore, when performing stud bonding to a large-diameter semiconductor wafer, stud bonding is performed using a stud bonding apparatus on a non-defective chip after dicing.

[0010] However, in the stud bonding apparatus, the chip transfer technology has not been established, and as a result,
It is a problem that the transport mode of the semiconductor chips is not unified.

Further, preparing a vapor deposition apparatus or a stud bonding apparatus corresponding to a large-diameter semiconductor wafer requires a large capital investment, and this capital investment is a problem.

An object of the present invention is to provide a semiconductor manufacturing method and apparatus and a chip transport jig which realize a stud bump bonding technique capable of suppressing a capital investment and reducing a product cost.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0014]

SUMMARY OF THE INVENTION Among the inventions disclosed in the present application, the outline of a representative one will be briefly described.
It is as follows.

That is, according to the semiconductor manufacturing method of the present invention, after the ball formed at the tip of the fine metal wire is pressed and bonded to the surface electrode of the semiconductor chip by a capillary on a heat block, a predetermined number of balls are formed from the fine metal wire. A step of wire bonding the semiconductor chip and the lead part of the lead frame by joining a separated part to a lead part of a lead frame; and a plurality of chip holding parts for holding the semiconductor chip, A ball formed at the tip of a thin metal wire while holding the semiconductor chip in the chip holding portion of the chip conveying jig on the heat block using a chip conveying jig formed in a shape corresponding to a frame. Is pressed against and bonded to the surface electrode of the semiconductor chip by the capillary, And cutting the fine metal wire ball near and a step of forming a bump on the surface electrode.

Further, the semiconductor manufacturing apparatus according to the present invention is formed on a lead frame on which a semiconductor chip is mounted or a heat block supporting the semiconductor chip and capable of heating the lead frame or the semiconductor chip, and a tip of the thin metal wire. And a capillary for pressing and bonding the ball to the surface electrode of the semiconductor chip supported by the heat block, and assembling the semiconductor device using the lead frame. After the capillary is pressed against and bonded to the surface electrode of the semiconductor chip by the capillary, a portion of the fine metal wire separated from the ball by a predetermined distance is bonded to the lead portion of the lead frame, and the surface of the semiconductor chip When forming bumps on the electrodes, In a state where the semiconductor chip is held in the chip holding portion of the chip transfer jig formed in a shape corresponding to the lead frame, the ball of the thin metal wire is pressed against the surface electrode of the semiconductor chip by the capillary. After bonding, the thin metal wire is cut near the ball to form the bump on the surface electrode.

Further, the chip transport jig of the present invention is provided with a plurality of chip holders for holding a semiconductor chip and is formed in a shape corresponding to a lead frame used when assembling a semiconductor device. When the semiconductor chip is transported into and out of the heat block when the semiconductor chip is carried in and out, and when the ball formed at the tip of the fine metal wire is pressed against the surface electrode of the semiconductor chip and bonded, after bonding,
When the thin metal wire is cut near the ball to form a bump on the surface electrode, the semiconductor chip can be held by the chip holding portion.

Thus, the chip transfer jig can also be used in a transfer system of a semiconductor manufacturing apparatus (wire bonding apparatus) for performing wire bonding using a lead frame.

As a result, in the semiconductor manufacturing apparatus,
A chip transfer technique for performing stud bonding for forming a bump on a surface electrode of a semiconductor chip can be established.

Thus, the semiconductor manufacturing apparatus can perform stud bonding using the chip transport jig.

Therefore, dicing is performed on a large-diameter semiconductor wafer to obtain a good semiconductor chip.
By holding and transporting this good semiconductor chip by the chip transport jig, stud bonding can be performed by the semiconductor manufacturing apparatus without making new capital investment.

As a result, it is not necessary to purchase a vapor deposition apparatus or a stud bonding apparatus for a large-diameter semiconductor wafer, or to improve an existing apparatus. Semiconductor chip).

[0023]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is a perspective view showing one embodiment of the structure of the semiconductor manufacturing apparatus of the present invention, and FIG. 2 is a diagram showing one embodiment of the structure of the chip transport jig according to the present invention.
(A) is a plan view, (b) is a cross-sectional view showing the XX section of (a), and FIG. 3 is a partly broken example of an embodiment of a state of holding a semiconductor chip by a chip conveying jig of the present invention. FIG. 4 is a view showing an example of an embodiment of a structure of a lead frame in which wire bonding is performed by the semiconductor manufacturing apparatus of the present invention, and FIG.
FIG. 5B is a partially enlarged plan view showing details of a portion A of FIG. 5A, and FIG. 5 is a partial cross section showing an example of an embodiment of a stud bonding method performed by a semiconductor manufacturing apparatus of the present invention using a chip carrying jig. FIG. 6 and FIG. 6 are partial sectional views showing an example of an embodiment of a wire bonding method by the semiconductor manufacturing apparatus of the present invention.

Although the structure of the semiconductor manufacturing apparatus according to the present embodiment shown in FIG. 1 is the same as that of the wire bonding apparatus, stud bump bonding (wire bonding) is performed by using the chip transport jig 2 shown in FIG. (A technique of forming a bump by applying the above method).

That is, the semiconductor manufacturing apparatus according to the present embodiment is an ultrasonic thermocompression-type wire bonding apparatus capable of performing both wire bonding and stud bump bonding.

The basic structure of the semiconductor manufacturing apparatus (wire bonding apparatus) of the present embodiment shown in FIG. 1 will be described with reference to FIGS. 1 to 6. The bonding head unit 4 for bonding and the semiconductor chip 1 are mounted. A loader unit 5 for supplying a chip transport jig 2 holding the lead frame 3 (see FIG. 4) or the semiconductor chip 1, a feeder unit 6 for transporting the lead frame 3 or the chip transport jig 2, and the lead An unloader section 7 for accommodating the frame 3 or the chip transfer jig 2 and an XY table 8 on which a bonding head section 4 is mounted.

To explain the detailed structure, the feeder 6 supports the lead frame 3 on which the semiconductor chip 1 is mounted or the semiconductor chip 1 at the time of bonding and can heat the lead frame 3 or the semiconductor chip 1 at the time of bonding. A block 6a (also referred to as a heat stage) and a heater 6b serving as a heating unit for heating the heat block 6a are provided.

As shown in FIG. 5, the stage 6d of the heat block 6a is provided with a vacuum suction system 6c for sucking and fixing the semiconductor chip 1 when performing stud bonding.

In the bonding head 4, a ball 4b formed at the tip of a bonding wire 4a (fine metal wire) made of gold or the like is applied to a pad 1b (surface electrode) of the semiconductor chip 1 supported by a heat block 6a. Capillary 4c to be pressed and bonded, and clamper 4d to hold bonding wire 4a and pull out by a predetermined length
And a camera 4e for detecting the position of the pad 1b of the semiconductor chip 1 and the like.

Further, as shown in FIG. 1, a monitor 9 as an output device is connected to the camera 4e.

As a result, the semiconductor manufacturing apparatus (wire bonding apparatus) of the present embodiment uses the lead frame 3 to assemble the semiconductor device 10 such as a QFP (Quad Flat Package) as shown in FIG. After the ball 4b of the bonding wire 4a is pressed and bonded to the pad 1b of the semiconductor chip 1 by the capillary 4c on the heat block 6a, a portion separated by a predetermined distance from the ball 4b of the bonding wire 4a is connected to the lead portion 3a of the lead frame 3. After bonding, the bonding wire 4a is cut at a predetermined position.

Further, TCP (Tape Carrier Package)
When assembling or CSP (Chip Size Package)
When the bumps 1c are formed on the pads 1b of the semiconductor chip 1, the semiconductor chip 1 is held on the chip holder 2a of the chip transport jig 2 formed on the heat block 6a in a shape corresponding to the lead frame 3. In this state, after bonding the ball 4b of the bonding wire 4a to the pad 1b of the semiconductor chip 1 by pressing it with the capillary 4c, the bonding wire 4a is cut near the ball 4b to form a bump 1c on the pad 1b.

That is, when manufacturing the semiconductor device 10 using the lead frame 3, the semiconductor manufacturing apparatus
When wire bonding is performed and TCP or CSP is manufactured, stud bonding is performed using the chip transfer jig 2.

The material of the bonding wire 4a is not limited to gold, but may be copper or the like. However, it is preferable to use the gold bonding wire 4a.

Further, in the semiconductor chip 1 of the present embodiment, about 30 pads 1b are arranged in a row near the center in the longitudinal direction of the main surface 1a (see FIG. 5).

Next, the chip transport jig 2 of the present embodiment
The structure of FIG. 2 will be described.

The chip transport jig 2 includes a semiconductor chip 1
Is held and transported, and is used when performing stud bonding by a wire bonding apparatus when manufacturing TCP or CSP.

The basic structure of the chip transfer jig 2 is as follows.
A plurality of chip holders 2a for holding the semiconductor chip 1 are provided, and are formed in a shape corresponding to the lead frame 3 used when assembling the semiconductor device 10.

Thus, the chip transfer jig 2 is used for transferring the semiconductor chip 1 to the stage 6d of the heat block 6a of the semiconductor manufacturing apparatus (wire bonding apparatus) shown in FIG. When the ball 4b formed at the tip of the wire 4a is pressed against the pad 1b of the semiconductor chip 1 to join the ball 4b,
When the bonding wire 4a is cut in the vicinity to form the bump 1c on the pad 1b, the semiconductor chip 1 is held on the chip holding portion 2a.

The chip transfer jig 2 is formed in a shape corresponding to the lead frame 3. In the present embodiment, the outer shape of the lead frame 3 is rectangular, and accordingly, the chip conveying jig 2 is also formed in the same rectangular shape, and as shown in FIGS. The outer dimensions of the fixture 2 are formed to be exactly the same as the outer dimensions of the lead frame 3 (in the present embodiment, both are 44 mm × 140 mm).

However, in the rectangular chip carrying jig 2, at least only its width is required to be the same size as the width of the rectangular lead frame 3, and the length may be different.

As shown in FIG. 4, the lead frame 3 has a die pad 3b on which the semiconductor chip 1 is mounted,
A lead portion 3a provided therearound and a die pad portion 3
A plurality of (five in the case shown in FIG. 4) unit frame portions 3c each including a frame portion b and a frame portion 3d supporting the lead portion 3a are provided.

Here, the chip transport jig 2 of the present embodiment
A detailed description will be given of a base member 2b provided with a plurality of base side openings 2c having an area smaller than the main surface 1a of the semiconductor chip 1, and a plurality of lid side openings having an area smaller than the main surface 1a of the semiconductor chip 1. A connection for detachably connecting the lid member 2d having the portion 2e formed thereon, a chip housing member 2f having a plurality of chip housing openings 2g having an area slightly larger than the main surface 1a of the semiconductor chip 1, and a lid member 2d. Member 2h and sub-base member 2 for attaching connection member 2h
i, and in a state where the positions of the plurality of base-side openings 2c, the lid-side openings 2e, and the chip-accommodating openings 2g are aligned, the chip-accommodating member 2f is
b and the lid member 2d, a plurality of chip holders 2a are defined and defined.
Is detachably attached by a connection member 2h.

The chip housing member 2f and the sub base member 2i are fixed to the base member 2b by spot welding.

Further, the connection member 2h is fixed to the lid member 2d by an adhesive sheet or the like.

In this embodiment, the base member 2
b, in the lid member 2d and the chip housing member 2f, the respective openings, that is, the base side opening 2c, the lid side opening 2e, and the chip housing opening 2g are arranged in two rows in a total of thirteen in each row, a total of 26 pieces. It is provided so that the position of each opening may be matched.

Therefore, the base member 2b and the lid member 2d
Also, when assembling with the chip accommodating member 2f, the chip holding parts 2a formed on the chip transport jig 2 are also formed in a two-row arrangement, and a total of 26 chip holding parts are formed, 13 in each row.

In the base member 2b, the lid member 2d, and the chip accommodating member 2f, the openings are not necessarily arranged in two rows, but may be arranged in one row if they are arranged in a unified form. May be an array,
Also, an arrangement of three or more rows may be used.

Accordingly, the chip holding portions 2a formed on the chip conveying jig 2 at that time may be arranged in one row, three or more rows. The form and the number of installations are not particularly limited.

The chip housing opening 2g formed in the chip housing member 2f is formed on the main surface 1a of the semiconductor chip 1.
It has a slightly larger area and a shape corresponding to the outer peripheral shape of the semiconductor chip 1, that is, a rectangle (if the semiconductor chip 1 is a square, the chip receiving opening 2g is also formed in a square).

Accordingly, the chip holding portion 2a formed by the chip housing opening 2g is also a rectangular one slightly larger than the semiconductor chip 1.

Thus, when the semiconductor chip 1 is accommodated in the chip holder 2a, the semiconductor chip 1 is held by the chip holder 2a with a small gap around the semiconductor chip 1.

The base side opening 2c and the lid side opening 2
e is smaller than the area of the main surface 1a of the semiconductor chip 1 in both cases. Therefore, the semiconductor chip 1 does not jump out of these openings during transportation of the semiconductor chip 1 or the like.

The base side opening 2c is used for vacuum suction of the semiconductor chip 1 at the time of stud bonding, so that the back surface (the surface opposite to the main surface 1a) of the semiconductor chip 1 is heat-blocked. It can be directly supported by the stage 6d of 6a.

Further, the lid-side opening 2e is connected to the pad 1b of the capillary 4c (see FIG. 1) at the time of stud bonding.
It is used at the time of joining.

Thus, the lid member 2d is formed in a shape (opened) avoiding the bonding point.

The chip accommodating member 2f is not necessarily
It is not necessary to be provided as a separate piece (not integral) with the base member 2b, and it may be formed integrally with the base member 2b. In that case, the base side opening 2c and the chip housing opening 2g are provided in a connected manner.

In this embodiment, the connecting member 2h is a thin plate-shaped magnet. However, the connecting member 2h is
If the lid member 2d can be detachably attached,
For example, a fitting-type pin member or a screw member may be used.

Further, the base member 2b, the lid member 2d, the chip accommodating member 2f, and the sub-base member 2i are made of, for example, stainless steel. In the present embodiment, the connecting member 2h made of only the sub-base member 2i is made of a magnet. Therefore, it is magnetically treated so as to have magnetism, and the other members are formed non-magnetic.

A semiconductor manufacturing method according to the present embodiment will be described with reference to FIGS.

In the semiconductor manufacturing method, wire bonding and stud bonding are performed using the semiconductor manufacturing apparatus (wire bonding apparatus) of the present embodiment shown in FIG.

Here, the stud bonding state shown in FIG.
Are arranged in one row, and the method of stud bonding itself is exactly the same whether the chip holding portion 2a is a jig arranged in one row or a jig arranged in multiple rows. The chip conveying jig 2 shown in FIG. 2 is arranged in two rows).

First, the case of performing wire bonding will be described.

That is, when assembling the semiconductor device 10 such as a QFP using the lead frame 3 shown in FIG.
Wire bonding is performed by the semiconductor manufacturing apparatus.

First, the lead frame 3 having the semiconductor chip 1 mounted on the die pad 3b is transferred from the loader 5 to the stage 6d of the heat block 6a.

Thereafter, images of the semiconductor chip 1 and the lead frame 3 are captured by the camera 4e, and the positions of the pads 1b of the semiconductor chip 1 and the positions of the lead portions 3a of the lead frame 3 are detected.

Further, the stage 6 d of the heat block 6 a is heated to a desired temperature by the heater 6 b, whereby the semiconductor chip 1 is also heated to the desired temperature via the lead frame 3.

Subsequently, the bonding wire 4a made of gold is pulled out by a predetermined length by the clamper 4d, and the XY table 8 is moved based on the detection result of the position of the pad 1b of the semiconductor chip 1 to locate the capillary 4c. Do.

Thereafter, as shown in FIG. 6, the ball 4b formed at the tip of the bonding wire 4a is pressed onto the pad 1b of the semiconductor chip 1 by means of the capillary 4c on the heat block 6a to be joined.

At this time, since the semiconductor manufacturing apparatus (wire bonding apparatus) of the present embodiment is of an ultrasonic thermocompression bonding type, it performs thermocompression bonding with the capillary 4c and the heat block 6a, and performs bonding bonding 4a with the capillary 4c. Is applied to the vicinity of the ball 4b.

Thus, the first bonding is completed.

Then, again, by the capillary 4c,
A portion of the bonding wire 4a away from the ball 4b by a predetermined distance is bonded to the lead portion 3a of the lead frame 3 by thermocompression.

Then, the side of the clamper 4d near the lead portion 3a of the bonding wire 4a is cut, thereby completing the second bonding.

The other pads 1b of the semiconductor chip 1
And other lead portions 3 corresponding to the lead frame 3
This wire bonding operation is repeatedly performed for a, and the wire bonding for electrically connecting the semiconductor chip 1 and the lead portion 3a of the lead frame 3 with the bonding wires 4a is completed.

Thereafter, the lead frame 3 on which the wire bonding has been completed is transported to the unloader section 7, and is sequentially accommodated in the unloader section 7.

Next, a case where stud bonding is performed by the semiconductor manufacturing apparatus when assembling the TCP or CSP, that is, a case where bumps 1c are formed on the pads 1b of the semiconductor chip 1 shown in FIG. 5B will be described. .

First, a chip transfer jig shown in FIG. 2 provided with a plurality of (26 in this embodiment) chip holding portions 2 a for holding the semiconductor chip 1 and formed to have the same outer dimensions as the lead frame 3. Prepare 2

Further, the lid member 2d of the chip transfer jig 2 is removed. Thereafter, the semiconductor chip 1 that has been diced and determined to be non-defective by inspection is housed in the chip holding portion 2a of the chip transport jig 2.

After the housing, the connecting member 2h attached to the lid member 2d is connected to the sub base member 2i, so that the chip holding portion 2a is covered by the lid member 2d.

At this time, since a bonding material such as an adhesive is not used in the chip holding portion 2a, the semiconductor chip 1 is held with a degree of freedom as shown in FIG.

Thereafter, the chip transport jig 2 holding the semiconductor chip 1 is set on the loader unit 5.

Subsequently, the chip transfer jig 2 is transferred from the loader section 5 to the stage section 6d of the heat block 6a.

Thereafter, the vacuum suction system 6c provided on the heat block 6a is operated. That is, in a state where the semiconductor chip 1 is held in the chip holding portion 2a of the chip transfer jig 2, the semiconductor chip 1 is vacuum-sucked through the base side opening 2c provided in the base member 2b of the chip transfer jig 2. Thus, the semiconductor chip 1 is suction-supported (fixed) on the stage section 6d of the heat block 6a.

Further, the image of the semiconductor chip 1 is captured by the camera 4e, and the position of the pad 1b of the semiconductor chip 1 is detected.

Subsequently, the stage 6d of the heat block 6a is heated to a desired temperature by the heater 6b, thereby heating the semiconductor chip 1 directly to the desired temperature from the back side.

Thereafter, the bonding wire 4a made of gold is pulled out by a predetermined length by the clamper 4d, and the XY table 8 is moved based on the detection result of the position of the pad 1b of the semiconductor chip 1 to locate the capillary 4c. .

Further, as shown in FIG. 5, the semiconductor chip 1 is held on the chip holder 2a of the chip transport jig 2 on the stage 6d of the heat block 6a.
Ball 4b formed at the tip of bonding wire 4a
To the pad 1b of the semiconductor chip 1 by the capillary 4c.
Press to join.

At this time, the ball 4b formed at the tip of the bonding wire 4a is pressed against the pad 1b of the semiconductor chip 1 by the capillary 4c through the lid side opening 2e provided in the lid member 2d of the chip transport jig 2. To join.

Here, since the semiconductor manufacturing apparatus (wire bonding apparatus) of the present embodiment is of an ultrasonic thermocompression bonding type, thermocompression bonding is performed by the capillary 4c and the heat block 6a, and the bonding wire 4a is formed by the capillary 4c. Is applied to the vicinity of the ball 4b.

Thereafter, the bonding wires 4a are cut in the vicinity of the balls 4b, whereby the bumps 1c shown in FIG. 5B can be formed on the pads 1b of the semiconductor chip 1.

After the formation of the bump 1c, the heat block 6a
Of the semiconductor chip 1 is stopped.

Subsequently, by repeating the same procedure, the other pads 1 in the semiconductor chip 1 are successively arranged.
b, and further, a bump 1c is formed on a pad 1b of another semiconductor chip 1.

For a given number of semiconductor chips 1, bumps 1
After the formation of the bumps 1c, the semiconductor chip 1 on which the formation of the bumps 1c has been held is held in the chip holding section 2a, and the entire chip transfer jig 2 is transferred to the unloader section 7. 7

According to the semiconductor manufacturing method and apparatus and the chip transport jig of the present embodiment, the following operational effects can be obtained.

That is, since the chip transporting jig 2 has a plurality of chip holding portions 2a and is formed in a shape corresponding to the lead frame 3, a semiconductor manufacturing apparatus for performing wire bonding using the lead frame 3 ( The chip transfer jig 2 can also be used in a transfer system of a wire bonding apparatus).

Thus, in the semiconductor manufacturing apparatus, a chip transfer technique for performing stud bonding for forming bumps 1c on pads 1b of the semiconductor chip 1 can be established.

As a result, with the semiconductor manufacturing apparatus,
Stud bonding can be performed using the chip transport jig 2.

That is, by using the chip transfer jig 2, the semiconductor manufacturing apparatus (wire bonding apparatus)
However, both wire bonding and stud bonding can be performed.

Further, when performing the stud bonding, the chip transport jig 2 is used, so that the semiconductor manufacturing apparatus can easily use the wire bonding and the stud bonding properly.

Therefore, a good semiconductor chip 1 is obtained by dicing even a large-diameter semiconductor wafer, and the good semiconductor chip 1 is held and transferred by the chip transfer jig 2 so that a new semiconductor chip 1 is obtained. Stud bonding can be performed by the semiconductor manufacturing apparatus without capital investment.

As a result, it is not necessary to purchase a vapor deposition apparatus or a stud bonding apparatus for a large-diameter semiconductor wafer, or to improve an existing apparatus, so that capital investment can be greatly suppressed, and as a result, the product ( The cost of the semiconductor chip 1) can be reduced.

The chip conveying jig 2 has a lid member 2d for covering the chip holding portion 2a, a base side opening 2c formed in the base member 2b, and a lid member 2d.
Since the size of the lid-side opening 2e formed in the semiconductor chip 1 is smaller than the area of the main surface 1a of the semiconductor chip 1, it is possible to prevent the semiconductor chip 1 during transportation from jumping out of the chip holding portion 2a. it can.

As a result, the transportability of the semiconductor chip 1 in performing the stud bonding can be improved, and the yield of the semiconductor chip 1 can be improved.

Further, since the lid member 2d is provided with a plurality of lid side openings 2e, the semiconductor chip 1 is supported by the capillary 4c while being held by the chip holding portion 2a of the chip transfer jig 2. The ball 4b at the tip of the bonding wire 4a can be bonded to the pad 1b of the semiconductor chip 1 via the lid-side opening 2e.

Thus, stud bonding can be performed with the lid member 2d attached.

Further, the base member 2b of the chip transfer jig 2
Is provided with a plurality of base-side openings 2c, so that the semiconductor chip 1 is held by the chip holding portion 2a of the chip transfer jig 2 while being heated by the heat block 6a of the semiconductor manufacturing apparatus (wire bonding apparatus). The semiconductor chip 1 can be vacuum-sucked through the base-side opening 2c.

As a result, the semiconductor chip 1 can be vacuum-adsorbed and supported by the heat block 6a while the semiconductor chip 1 is held in the chip holding portion 2a of the chip transfer jig 2.

As a result, stud bonding can be performed while holding the semiconductor chip 1 in the chip holding portion 2a of the chip transfer jig 2.

Further, when the stud bonding is performed, the semiconductor chip 1 can be efficiently heated by directly supporting the semiconductor chip 1 by the heat block 6a, and the base member 2b of the chip carrying jig 2 can be directly heated. Since the base member 2b is not heated, thermal deformation of the base member 2b can be reduced.

As a result, the chip holding property of the chip transfer jig 2 can be improved.

Further, since the lid member 2d is detachably attached by the magnet, the lid member 2d can be easily attached and detached.

As a result, the semiconductor chip 1 can be quickly and easily taken out of and stored in the chip holding portion 2a.

Further, when the semiconductor chip 1 is accommodated and held in the chip holding portion 2a of the chip transfer jig 2, no bonding material such as an adhesive is used. Extraction and accommodation from 2a can be performed quickly and easily, and formation of scratches on semiconductor chip 1 can be reduced.

Further, since the chip holding portions 2a are provided in a plurality of rows (two rows in the present embodiment) in the chip transport jig 2, a large number (one in the present embodiment) can be provided at one time by one chip transport jig 2. Semiconductor chip 1)
Can be transported.

As a result, the stud bonding process can be performed efficiently.

Although the invention made by the inventor has been specifically described based on the embodiments of the present invention, the present invention is not limited to the embodiments of the invention, and does not depart from the gist of the invention. It is needless to say that various changes can be made.

For example, in the above embodiment, the case where the chip transport jig is a jig used for stud bonding has been described, but the lead frame 3 shown in FIG. 4 is used instead of the chip transport jig. You can also.

That is, the semiconductor chip 1 is temporarily fixed to the die pad portion 3b of the lead frame 3 with a paste or the like, and is stud-bonded by the semiconductor manufacturing apparatus (wire bonding apparatus) of the present embodiment. The semiconductor chip 1 is detached from 3b, and takes the place of a chip transport jig.

Further, in the above-described embodiment, the case where the semiconductor manufacturing apparatus is an ultrasonic thermocompression bonding wire bonding apparatus has been described, but the semiconductor manufacturing apparatus may be a thermocompression bonding wire bonding apparatus. .

[0121]

Advantageous effects obtained by typical ones of the inventions disclosed by the present application will be briefly described as follows.
It is as follows.

(1). Since the chip transport jig has a plurality of chip holding portions and is formed in a shape corresponding to a lead frame, stud bonding for forming a bump on a surface electrode of a semiconductor chip in a semiconductor manufacturing apparatus (wire bonding apparatus). A chip transfer technique for performing the above can be established.

(2). According to the above (1), the semiconductor manufacturing apparatus can perform stud bonding using the chip transport jig. Therefore, the semiconductor manufacturing apparatus can perform both wire bonding and stud bonding. As a result, it is possible to perform stud bonding with a semiconductor manufacturing apparatus even on a large-diameter semiconductor wafer without making new capital investment. In other words, it is not necessary to purchase a vapor deposition device or a stud bonding device for a large-diameter semiconductor wafer, or to improve an existing device, thereby greatly reducing capital investment and, as a result, the cost of a product (semiconductor chip). Can be reduced.

(3). When the stud bonding is performed, since the chip transport jig is used, the semiconductor manufacturing apparatus can easily use the wire bonding and the stud bonding properly.

(4). The chip transport jig has a lid member that covers the chip holding portion, and the size of the base side opening formed in the base member and the size of the lid side opening formed in the lid member is the area of the main surface of the semiconductor chip. By being formed smaller, it is possible to prevent the semiconductor chip during transportation from jumping out of the chip holding portion. As a result, the transportability of the semiconductor chip in performing the stud bonding can be improved, and the yield of the semiconductor chip 1 can be improved.

(5). Since the plurality of lid-side openings are provided in the lid member of the chip transfer jig, stud bonding can be performed with the lid member attached.

(6). By providing a plurality of base-side openings in the base member of the chip transfer jig, the semiconductor chip is vacuum-suction-supported by the heat block while the semiconductor chip is held in the chip holding portion of the chip transfer jig. Can be. As a result, stud bonding can be performed while holding the semiconductor chip in the chip holding portion of the chip transport jig.

(7). When the semiconductor chip is directly supported by the heat block when performing the stud bonding, the base member of the chip transfer jig is not directly heated, so that the thermal deformation of the base member can be reduced.
As a result, it is possible to improve the chip holding property of the chip transport jig.

(8). Since the lid member is detachably attached by the magnet, the lid member can be easily attached and detached. As a result, the semiconductor chip can be quickly and easily taken out and stored in the chip holding section.

(9). Since the chip holding units are provided in a plurality of rows in the chip transfer jig, a large number of semiconductor chips can be transferred at once by one chip transfer jig. Thereby, the stud bonding process can be performed efficiently.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an example of an embodiment of the structure of a semiconductor manufacturing apparatus according to the present invention.

FIGS. 2A and 2B are diagrams showing an example of an embodiment of the structure of a chip transport jig according to the present invention, wherein FIG. 2A is a plan view and FIG. It is sectional drawing which shows X cross section.

FIG. 3 is a partially enlarged plan view showing an example of an embodiment of a state in which a semiconductor chip is held by a chip transport jig of the present invention, with a part cut away.

4A and 4B are diagrams showing an example of an embodiment of a lead frame structure in which wire bonding is performed by the semiconductor manufacturing apparatus of the present invention, wherein FIG. 4A is a plan view,
FIG. 2B is a partially enlarged plan view showing details of a portion A in FIG.

FIGS. 5A and 5B are partial cross-sectional views showing an example of an embodiment of a stud bonding method performed by a semiconductor manufacturing apparatus of the present invention using a chip transport jig.

FIG. 6 is a partial cross-sectional view showing one example of an embodiment of a wire bonding method using the semiconductor manufacturing apparatus of the present invention.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 semiconductor chip 1a main surface 1b pad (surface electrode) 1c bump 2 chip transport jig 2a chip holding portion 2b base member 2c base side opening 2d lid member 2e lid side opening 2f chip housing member 2g chip housing opening 2h connection Member 2i Sub-base member 3 Lead frame 3a Lead part 3b Die pad part 3c Unit frame part 3d Frame part 4 Bonding head part 4a Bonding wire (thin metal wire) 4b Ball 4c Capillary 4d Clamper 4e Camera 5 Loader part 6 Feeder part 6a Heat block 6b Heater 6c Vacuum suction system 6d Stage unit 7 Unloader unit 8 XY table 9 Monitor 10 Semiconductor device

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁶ Identification code FI H01L 21/92 604Z

Claims (9)

[Claims] After a ball formed at the tip of a thin metal wire is pressed against a surface electrode of a semiconductor chip by a capillary on a heat block and joined, a portion of the thin metal wire which is separated from the ball by a predetermined distance is connected to a lead frame. A step of wire bonding the semiconductor chip and the lead part of the lead frame by bonding to a lead part, and a plurality of chip holding parts for holding the semiconductor chip are provided and formed in a shape corresponding to the lead frame. With the semiconductor chip held in the chip holding portion of the chip conveying jig on the heat block using the chip conveying jig, the ball formed at the tip of the thin metal wire is moved by the capillary to the semiconductor chip. After pressing and bonding to the surface electrode, cutting the thin metal wire near the ball Semiconductor manufacturing method characterized by a step of forming bumps on the surface electrode. 2. The semiconductor manufacturing method according to claim 1, wherein when forming the bump on the front surface electrode of the semiconductor chip, the semiconductor chip is held by the chip holding portion of the chip transport jig. In the state, the semiconductor chip is supported on the heat block by vacuum-suctioning the semiconductor chip through a base-side opening provided in a base member of the chip transfer jig. Method. 3. The semiconductor manufacturing method according to claim 1, wherein when forming the bump on the front surface electrode of the semiconductor chip, the semiconductor chip is mounted on the chip holding portion of the chip transport jig. In the held state, the capillary formed by pressing the ball formed at the tip of the thin metal wire against the surface electrode of the semiconductor chip through the lid side opening provided in the lid member of the chip transport jig is joined. A semiconductor manufacturing method characterized by the above-mentioned. 4. A lead frame on which a semiconductor chip is mounted or a heat block supporting the semiconductor chip and capable of heating the lead frame or the semiconductor chip, and a ball formed at the tip of a thin metal wire is formed by the heat block. A capillary that is pressed against and bonded to a surface electrode of the semiconductor chip that is supported. After pressing and bonding to the surface electrode of the semiconductor chip, bonding a portion of the fine metal wire separated from the ball by a predetermined distance to a lead portion of the lead frame, and forming a bump on the surface electrode of the semiconductor chip. The lead frame on the heat block After holding the semiconductor chip in the chip holding portion of the chip transfer jig formed in a corresponding shape, pressing the ball of the thin metal wire against the surface electrode of the semiconductor chip by means of the capillary, and joining the ball. The semiconductor manufacturing apparatus, wherein the thin metal wire is cut in the vicinity of a ball to form the bump on the surface electrode. 5. The semiconductor manufacturing apparatus according to claim 4, wherein in the chip transport jig used when forming the bump on the surface electrode of the semiconductor chip, a plurality of the chip holding portions are formed in a partitioned manner. And a lid member for covering the chip holding portion is detachably attached. 6. A chip transport jig for holding and transporting a semiconductor chip, comprising: a plurality of chip holders for holding said semiconductor chip; and a shape corresponding to a lead frame used when assembling a semiconductor device. When the semiconductor chip is transported into and out of the heat block of the semiconductor manufacturing apparatus at the time of loading and unloading, and when the ball formed at the tip of the fine metal wire is pressed against the surface electrode of the semiconductor chip and bonded, A chip transport jig capable of holding the semiconductor chip on the chip holding portion when the metal thin wire is cut near the ball to form a bump on the surface electrode. 7. The chip transporting jig according to claim 6, wherein a plurality of said chip holding portions are defined and a lid member for covering said chip holding portions is detachably attached. Chip transport jig. 8. The chip transport jig according to claim 6, wherein said base member provided with a plurality of base-side openings having an area smaller than a main surface of said semiconductor chip; A lid member formed with a plurality of lid side openings having an area smaller than the surface, and a chip housing member formed with a plurality of chip housing openings having an area slightly larger than the main surface of the semiconductor chip, In a state where the positions of the base side opening, the lid side opening, and the chip housing opening are aligned, the chip housing member is provided between the base member and the cover member, and the plurality of chips are provided. A chip conveying jig, wherein a holding portion is formed and the lid member is detachably attached. 9. The chip conveying jig according to claim 6, wherein said lid member is detachably attached by a magnet.