JPH10325951A - Liquid crystal display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent light leakage on the periphery of a display window and the peeling of a substrate at a sealing part and to make the device excellent in display quality and reliability by constituting a black matrix so that it may cover over an area between a display area and sealing material, it may be partially overlapped on the outside of the sealing material and it may cover over an area between the sealing material and the end of a 2nd substrate. SOLUTION: The black matrix BM is partially overlapped on the inside of the sealing material SL and covers over the area between the display area AR and the material SL. Then, it is partially overlapped on the outside of the material SL and y covers over the area between the material SL and the end of an upper transparent glass substrate SUB2. By arranging the black matrix BM at the end of the color filter substrate SUB2 on the outside of the material SL, light from a backlight BL is absorbed by the black matrix BM provided at the end of the substratae SUB2 and trouble that the light is seen on the periphery of the display window WD is eliminated, so that the liquid crystal display device excellent in the display quality is obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a method for manufacturing a semiconductor device, comprising the steps of: stacking two insulating substrates with a predetermined gap therebetween so that the surfaces on which thin films are provided face each other; A liquid crystal display element in which liquid crystal is sealed between the two substrates inside the sealing material while the two substrates are adhered to each other with a sealing material, and a black matrix (light shielding film) is provided on one of the substrates.
More particularly, the present invention relates to a technique for reducing light leakage in a peripheral frame portion outside a display area.

[0002]

2. Description of the Related Art An active matrix type liquid crystal display device is provided with a non-linear element (switching element) corresponding to each of a plurality of pixel electrodes arranged in a matrix. Since the liquid crystal in each pixel is theoretically always driven (duty ratio 1.0), the active method has better contrast than the so-called simple matrix method that employs the time-division driving method. Then it is becoming an indispensable technology. A typical switching element is a thin film transistor (TFT).

An active matrix type liquid crystal display device using thin film transistors is known, for example, from Japanese Patent Application Laid-Open No. 5-257142. A configuration in which the periphery of a pixel electrode is covered with a light-shielding film made of resin is disclosed in
-342229 and JP-A-5-72540.

In a liquid crystal display device, for example, two transparent insulating substrates made of glass or the like are overlapped with a predetermined gap so that the surfaces on which a transparent pixel electrode for display and an alignment film are laminated face each other. The two substrates are bonded together with a frame-shaped sealing material provided on the peripheral edge between the two substrates, and liquid crystal is sealed and sealed inside the sealing material between the two substrates from the liquid crystal filling port provided in a part of the sealing material. Further, a liquid crystal display element (ie, a liquid crystal display panel, a liquid crystal display section, an LCD: a liquid crystal display) in which a polarizing plate is provided outside the two substrates, and a liquid crystal display element disposed below the liquid crystal display element, And a circuit board for driving the liquid crystal display element disposed outside the outer periphery of the liquid crystal display element,
It is composed of a frame-shaped body which is a molded product holding these members, a metal shield case (frame) which accommodates these members and has a liquid crystal display window opened.

In a conventional liquid crystal display device, a substrate on which a color filter is provided (hereinafter, referred to as a color filter substrate).
A black matrix is formed on the surface of the counter substrate (the substrate on which the thin film transistor is provided; hereinafter, referred to as a TFT substrate). The black matrix is formed in a grid around each pixel composed of transparent pixel electrodes provided on both the upper and lower substrates, and the grid partitions an effective display area of one pixel. The contour can be made clear and the contrast can be improved.

Conventionally, a metal film such as chromium (Cr) has been used as a material of the black matrix. When the substrate side provided with the black matrix formed over a large area is the display screen side (observation side),
If the black matrix is formed of a reflective metal material such as Cr, external light on the display screen side (hereinafter referred to as
External light) is reflected outward (observation side) by the black matrix, making the screen difficult to see (like a mirror), reducing the contrast, and deteriorating the display quality.
To solve this problem, it has been proposed to form the black matrix with a low-reflection organic resin colored black or the like. In this case, since the adhesive strength between the organic resin and the substrate is low, stress is applied to a portion provided with a sealing material (hereinafter referred to as a sealing portion) due to a substrate cutting process in a liquid crystal display element manufacturing process, and the like. Separation easily occurs at the interface between the black matrix and the substrate in the portion.
Therefore, it is desirable to minimize the overlap width between the black organic resin film and the sealing material.

[0007] If the black matrix is not arranged in the seal portion, light leakage occurs in the seal portion, and there is a problem that display quality is degraded. In order to solve this problem, it has been proposed to use a resin to which a black pigment is added as a sealing material and make the sealing material have a light-shielding property (see Japanese Patent Application No. 7-267129 filed by the present applicant).

[0008]

Further, in the conventional liquid crystal display device, the light from the backlight is irregularly reflected on the glass surface at the end of the color filter substrate outside the sealing material, and the peripheral frame of the display area is formed. Part, that is, visible around the display window, or if the gap between the shield case and the liquid crystal display element is wide, light leakage is visible when viewed from an angle,
There is a problem that display quality is deteriorated.

An object of the present invention is to solve this problem and to provide a liquid crystal display device which is excellent in display quality and reliability by preventing light leakage around a display window and peeling of a substrate in a seal portion. .

[0010]

In order to solve the above-mentioned problems, the present invention comprises a first substrate in which a plurality of pixel electrodes are arranged in a matrix on an insulating substrate to form a display area, and an insulating substrate. A second substrate superimposed on the first substrate via a liquid crystal layer, and a peripheral portion of the first and second substrates, wherein the second substrate surrounds a region where the liquid crystal layer exists outside the display region; A sealing member provided between the first and second substrates to fix them, and the first and second substrates
A shield case that covers the periphery of the substrate and has an opening that exposes the display area and is made of a light-shielding frame; A black matrix comprising a light-shielding film covering the periphery of the pixel electrode on the surface of the second substrate on the first substrate side, wherein the black matrix is partially and partially inside the sealing material. Overlapping, covering an area between the display area and the seal material, and the black matrix partially overlapping the outside of the seal material, and covering an area between the seal material and an end of the second substrate. It is characterized by.

A plurality of scanning signal lines made of a metal layer and a plurality of video signal lines are arranged in a matrix on an insulating substrate so as to intersect with each other with an insulating layer interposed therebetween. A pixel composed of a pixel electrode and a thin film transistor is provided corresponding to each intersection of the lines, a first substrate having a display region formed thereon, and an insulating substrate, the first substrate being overlapped with the first substrate via a liquid crystal layer. Two substrates and a peripheral portion of the first and second substrates, which surrounds a region where the liquid crystal layer exists outside the display region, is provided between the first and second substrates, and fixes them. And a shielding case that covers the periphery of the first and second substrates, has an opening that exposes the display area, and is made of a light-shielding frame. Lines and multiple video signals Is provided outside the region surrounded by the sealing material and connected to an external circuit, and a black matrix comprising a light-shielding film covering the thin film transistor is provided on the second substrate, and the black matrix is in contact with the inside of the sealing material. The black matrix partially overlaps and covers an area between the display area and the seal material, and the black matrix partially overlaps the outside of the seal material and covers an area between the seal material and an end of the second substrate. It is characterized by the following.

Further, the sealing material is made of a resin to which a black pigment is added.

Further, the black matrix is made of a resin to which a black pigment is added.

[0014] Further, it is provided on a part of the sealing material,
The black matrix is also arranged at a liquid crystal filling opening for injecting liquid crystal between the two substrates inside the sealing material.

According to the present invention, since the black matrix is disposed at the end of the second substrate outside the sealing material, light from the backlight is absorbed by the black matrix provided at the end of the substrate, and the display window is closed. The problem that light can be seen in the periphery can be solved, and a liquid crystal display device with excellent display quality can be provided.

When viewed from a direction perpendicular to the substrate surface, a black matrix made of an organic resin having low adhesive strength to the substrate or the sealing material is not provided in the sealing portion over substantially the entire circumference of the sealing material. Since a portion where the black matrix and the sealing material overlap and a portion where the sealing material does not overlap are provided, in the non-overlapping portion, for example, a combination of high bonding strength of the substrate / protective film / sealing material is provided, and the bonding strength of the sealing portion is improved. be able to.

[0017]

Embodiments of the present invention will be described below in detail with reference to the drawings.

<< Active matrix liquid crystal display device >>
An embodiment in which the present invention is applied to a vertical electric field type / active matrix type color liquid crystal display device will be described below. In the drawings described below, those having the same functions are denoted by the same reference numerals, and the repeated description thereof will be omitted.

<< Overall Configuration of Liquid Crystal Display Module MDL >>
FIG. 5 is an exploded perspective view of the liquid crystal display module MDL.

SHD is a shield case (also called a metal frame) made of a metal plate, WD is a display window, SPC1
4 are insulating spacers, FPC1 and 2 are multilayer flexible circuit boards (FPC1 is a gate-side circuit board, FPC2 is a drain-side circuit board), HS is a drain-side circuit board FPC
2, a frame ground made of metal foil provided for establishing electrical connection between the ground and the shield case SHD, PCB is an interface circuit board, ASB is an assembled liquid crystal display element with a drive circuit board, PNL
Is a liquid crystal display element (also referred to as a liquid crystal display panel) in which a driving IC is mounted on one of two superposed transparent insulating substrates, GC1 and GC2 are rubber cushions, and PRS is a prism sheet (in this example, two sheets of liquid crystal display panel). SPS is a diffusion sheet, GLB is a light guide plate, R
FS is a reflection sheet, SLV is a sleeve for fixing the diffusion sheet SPS and the prism sheet PRS, MCA is a lower case (mold case) formed by integral molding,
LP is a fluorescent tube, LS is a reflector that reflects the light of the fluorescent tube LP to the light guide plate GLB side, LPCs 1 and 2 are lamp cables, L
CT is the connector for the inverter, GB is the fluorescent tube LP
It is a rubber bush that supports.

BL denotes a fluorescent tube LP, a reflector LS, and a light guide plate G.
LB, a reflection sheet RFS, and a diffusion sheet SPS. A backlight composed of a prism sheet PRS. The backlight supplies uniform light to the back surface of the liquid crystal display panel PNL.
It is provided so that an observer viewed from the surface of the NL can recognize a change in the light transmittance of the liquid crystal as an image display.

As shown in FIG. 5, a lower case MCA, a backlight BL, a liquid crystal display element ASB with a drive circuit board,
The liquid crystal display module MDL is assembled by stacking the shield cases SHD and the like.

<< Outline of Matrix Section >> FIG. 7 is a plan view of a pixel section of a liquid crystal display device.

FIG. 8 is a sectional view showing the vicinity of the liquid crystal display element angle and the vicinity of the video signal terminal on both sides (A) and (C) with the pixel portion at the center (B). FIG. 8B corresponds to a cross section taken along line 8-8 in FIG.

Each pixel is located within an intersection area between two adjacent scanning signal lines (gate signal lines or horizontal signal lines) GL and two adjacent video signal lines (drain signal lines or vertical signal lines) DL. (In a region surrounded by four signal lines). Each pixel includes a thin film transistor TFT, a transparent pixel electrode ITO1, and a storage capacitor Cadd. The scanning signal lines GL extend in the left-right direction, and a plurality of scanning signal lines GL are arranged in the up-down direction. The video signal lines DL extend in the up-down direction, and a plurality of video signal lines DL are arranged in the left-right direction.

As shown in FIG. 8, a thin film transistor TFT and a transparent pixel electrode ITO1 are formed on the lower transparent glass substrate SUB1 side with respect to the liquid crystal layer LC, and a color filter FIL and a light-shielding element are formed on the upper transparent glass substrate SUB2 side. A black matrix pattern BM is formed. A silicon oxide film SIO formed by dipping or the like is provided on both surfaces of the transparent glass substrates SUB1 and SUB2.

On the inner (liquid crystal LC side) surface of the upper transparent glass substrate SUB2, a black matrix BM, a color filter FIL, a protective film PSV2, and a common transparent pixel electrode I are provided.
TO2 (COM) and an upper alignment film ORI2 are sequentially laminated.

<< Outline of Matrix Peripheral >> FIG. 4 is an exaggerated plan view of a matrix (AR) peripheral portion of a liquid crystal display element (liquid crystal display panel) PNL including upper and lower glass substrates SUB1 and SUB2, and FIG. It is a figure showing the enlarged plane near seal part SL corresponding to the upper left corner. FIG.
FIG. 3 is a diagram showing a cross section taken along the line 8a-8a in FIG. 3 with the cross section in the pixel portion at the center as described above, and a cross section near the external connection terminal DTM to which the video signal drive circuit is to be connected on the right. is there.

In the manufacture of this panel, in order to improve the throughput if the size is small, a plurality of devices are simultaneously processed on one glass substrate and then divided, and if the size is large, the manufacturing equipment is shared. For each type, a glass substrate of a standardized size is processed and then reduced to a size suitable for each type. In each case, the glass is cut after passing through a single process. FIGS. 3 and 4 show the latter example. FIG. 4 shows the upper and lower substrates SUB1 and SUB2 after cutting, and FIG. 3 shows the state before cutting. CT2 is the substrate SUB1, SU
Indicates the position of B2 to be cut. In any case, in the completed state, the size of the upper substrate SUB2 is reduced so that the external connection terminal groups Tg and Td (subscripts are omitted) (the upper and lower sides and the left side in the drawing) are exposed. More restricted inside. The terminal groups Tg and Td respectively include a scanning circuit connection terminal GTM and a video signal circuit connection terminal DTM, which will be described later, and their leading wiring portions are integrated circuit chips CHI.
Are collectively named for the unit of the tape carrier package TCP on which is mounted. The lead wiring from the matrix section of each group to the external connection terminal section is inclined as approaching both ends. This is the package TCP
This is for adjusting the terminals DTM and GTM of the display panel PNL to the arrangement pitch of the display panel PNL and the connection terminal pitch of each package TCP.

As shown in FIG. 3, before cutting the glass and separating the substrate SUB1, the terminals in the terminal groups Tg and Td are short-circuited by short lines SHg and SHd, respectively, in order to prevent electrostatic breakdown of the thin film transistor. The short lines SHg and SHd are also electrically connected to each other at the connection part PRT.

Between the transparent glass substrates SUB1 and SUB2, along the edge thereof, except for the liquid crystal filling port INJ, the liquid crystal LC
Is formed to seal the sealing pattern SL. The sealing material is made of, for example, an epoxy resin. The common transparent pixel electrode ITO2 on the upper transparent glass substrate SUB2 side is connected to the lead-out wiring INT formed on the lower transparent glass substrate SUB1 side by a silver paste material AGP at four corners of the panel in this example at least at one position. I have. The lead wiring INT is formed in the same manufacturing process as the later-described gate terminal GTM and drain terminal DTM.

The alignment films ORI1 and ORI2, the transparent pixel electrode ITO1, and the common transparent pixel electrode ITO2 are formed inside the seal pattern SL. Polarizing plate P
OL1 and POL2 are each a lower transparent glass substrate SUB
1. Formed on the outer surface of the upper transparent glass substrate SUB2. The liquid crystal LC is sealed in a region partitioned by the seal pattern SL between the lower alignment film ORI1 and the upper alignment film ORI2 for setting the direction of the liquid crystal molecules. The lower alignment film ORI1 is a protective film P on the lower transparent glass substrate SUB1 side.
It is formed above the SV1.

In this liquid crystal display device, various layers are separately stacked on the lower transparent glass substrate SUB1 side and the upper transparent glass substrate SUB2 side, and a seal pattern SL is formed on the substrate SUB2.
The lower transparent glass substrate SUB1 and the upper transparent glass substrate SUB2 are overlapped, liquid crystal LC is injected from the opening INJ of the sealing material SL, the injection port INJ is sealed with epoxy resin or the like, and the upper and lower substrates are Assembled by cutting.

<< Thin Film Transistor TFT >> Next, FIG.
Returning to, the configuration on the TFT substrate SUB1 side will be described in detail.

The thin film transistor TFT has a gate electrode G
When a positive bias is applied to T, the channel resistance between the source and the drain decreases, and when the bias is set to zero, the channel resistance increases.

Each pixel is provided with a plurality (two) of thin film transistors TFT1 and TFT2 redundantly. Each of the thin film transistors TFT1 and TFT2 has substantially the same size (channel length and channel width are the same), and includes a gate electrode GT, a gate insulating film GI, and an i-type (intrinsic,
intrinsic, not doped with conductivity determining impurities)
It has an i-type semiconductor layer AS made of amorphous silicon (Si), a pair of source electrode SD1, and a drain electrode SD2. It should be understood that the source and the drain are originally determined by the bias polarity between them, and in the circuit of this liquid crystal display device, the polarity is inverted during the operation, so that the source and the drain are interchanged during the operation. However, in the following description, one is fixed and the other is fixed as a drain for convenience.

<< Gate Electrode GT >> The gate electrode GT is configured to protrude vertically from the scanning signal line GL (branched into a T-shape). The gate electrode GT protrudes beyond the respective active areas of the thin film transistors TFT1 and TFT2. Thin film transistor TFT
1. The respective gate electrodes GT of the TFT 2 are integrally formed (as a common gate electrode) and are formed continuously with the scanning signal line GL. In this example, the gate electrode GT is formed of a single-layer second conductive film g2. As the second conductive film g2, for example, an aluminum (Al) film formed by sputtering is used, and an anodic oxide film AOF of Al is provided thereon.

The gate electrode GT is formed to be larger than it (as viewed from below) so as to completely cover the i-type semiconductor layer AS, and is designed so that external light or backlight does not hit the i-type semiconductor layer AS. .

<< Scanning Signal Line GL >> The scanning signal line GL is
It is composed of a conductive film g2. The second conductive film g2 of the scanning signal line GL is formed in the same manufacturing process as the second conductive film g2 of the gate electrode GT, and is integrally formed. An anodic oxide film AOF of Al is also provided on the scanning signal line GL.

<< Insulating Film GI >> The insulating film GI is used as a gate insulating film for applying an electric field to the semiconductor layer AS together with the gate electrode GT in the thin film transistors TFT1 and TFT2. The insulating film GI is formed above the gate electrode GT and the scanning signal line GL. As the insulating film GI, for example, a silicon nitride film formed by plasma CVD is selected and has a thickness of 1200 to 2700 ° (in this example,
(About 2000 °). FIG. 3 shows the gate insulating film GI.
As shown in (1), it is formed so as to surround the whole of the matrix part AR, and the peripheral part is removed so as to expose the external connection terminals DTM and GTM. The insulating film GI also contributes to electrical insulation between the scanning signal lines GL and the video signal lines DL.

<< i-type semiconductor layer AS >> i-type semiconductor layer AS
Is formed to be an independent island for each of the thin film transistors TFT1 and TFT2 in this example, and is made of amorphous silicon to a thickness of 200 to 2200 ° (in this example, 200 mm).
(A film thickness of about 0 °). The layer d0 is an N ⁺ -type amorphous silicon semiconductor layer doped with phosphorus (P) for ohmic contact, where the i-type semiconductor layer AS is present below and the conductive layer d2 (d3) is present above. Only left.

The i-type semiconductor layer AS is also provided between both intersections (crossover portions) between the scanning signal lines GL and the video signal lines DL. The i-type semiconductor layer AS at the intersection reduces a short circuit between the scanning signal line GL and the video signal line DL at the intersection.

<< Transparent Pixel Electrode ITO1 >> Transparent Pixel Electrode I
TO1 constitutes one of the pixel electrodes of the liquid crystal display section.

The transparent pixel electrode ITO1 is connected to the source electrode SD1 of the thin film transistor TFT1 and the thin film transistor T1.
It is connected to both source electrodes SD1 of FT2. Therefore, even if a defect occurs in one of the thin film transistors TFT1 and TFT2, if the defect causes a side effect, an appropriate portion is cut off by a laser beam or the like, and if not, the other thin film transistor operates normally. You can leave it. The transparent pixel electrode ITO1 is composed of a first conductive film d1.
Is a transparent conductive film (Indium-Tin) formed by sputtering.
-Oxide ITO: Nesa film), 1000-200
It is formed to a thickness of 0 ° (about 1400 ° in this example).

<< Source electrode SD1, Drain electrode SD
2 >> Each of the source electrode SD1 and the drain electrode SD2 is composed of a second conductive film d2 in contact with the N ⁺ type semiconductor layer d0 and a third conductive film d3 formed thereon.

The second conductive film d2 is formed of a chromium (Cr) film formed by sputtering and has a thickness of about 500 to 1000 ° (about 600 ° in this example). Since the stress increases when the Cr film is formed with a large film thickness, the thickness of the
It is formed in a range that does not exceed a certain thickness. Cr film was good adhesion between the N ⁺ -type semiconductor layer d0, is used in the 3 Al of the conductive film d3 is prevented from diffusing into the N ⁺ -type semiconductor layer d0 (so-called barrier layer) purposes. As the second conductive film d2, in addition to the Cr film, a high melting point metal (Mo, Ti, T
a, W) film, refractory metal silicide (MoSi ₂ , Ti)
Si ₂ , TaSi ₂ , WSi ₂ ) film may be used.

The third conductive film d3 is formed to a thickness of 3000 to 5000 ° by sputtering of Al (4000 ° in this example).
Degree) is formed. The Al film has a smaller stress than the Cr film and can be formed to have a large thickness, and can reduce the resistance values of the source electrode SD1, the drain electrode SD2 and the video signal line DL, and can reduce the gate electrode GT and the i-type semiconductor. Layer AS
Has the function of ensuring that the vehicle gets over a step (improves step coverage).

After patterning the second conductive film d2 and the third conductive film d3 with the same mask pattern, using the same mask or using the second conductive film d2 and the third conductive film d3 as masks, an N ⁺ type semiconductor layer is formed. d0 is removed. That is, i
In the N ⁺ type semiconductor layer d0 remaining on the type semiconductor layer AS, portions other than the second conductive film d2 and the third conductive film d3 are removed by self-alignment. At this time, since the N ⁺ type semiconductor layer d0 is etched so as to remove the entire thickness thereof,
The surface of the i-type semiconductor layer AS is also slightly etched, but the extent may be controlled by the etching time.

<< Video Signal Line DL >> The video signal line DL is composed of the second conductive film d2 and the third conductive film d3 in the same layer as the source electrode SD1 and the drain electrode SD2.

<< Protective Film PSV1 >> Thin Film Transistor TF
A protective film PSV1 is provided on T and the transparent pixel electrode ITO1. The protective film PSV1 is mainly formed to protect the thin film transistor TFT from moisture and the like.
Use a material with high transparency and good moisture resistance. The protective film PSV1 is formed of, for example, a silicon oxide film or a silicon nitride film formed by a plasma CVD device, and has a thickness of 1 μm.
It is formed with a film thickness of about.

As shown in FIG. 3, the protective film PSV1 is formed so as to surround the entire matrix portion AR, the peripheral portion is removed so as to expose the external connection terminals DTM and GTM, and the common electrode of the upper substrate side SUB2 is formed. COM is the lower substrate SUB
Silver paste A on the lead-out wiring INT for connecting the external connection terminal 1
Portions connected by GP are also removed. Protective film PSV1
And the thickness of the gate insulating film GI, the former is made thicker in consideration of the protective effect, and the latter is made thinner in the transconductance gm of the transistor. Therefore, as shown in FIG. 3, the protective film PSV1 having a high protective effect is formed larger than the gate insulating film GI so as to protect the peripheral portion as much as possible.

<< Black Matrix BM >> On the upper transparent glass substrate SUB2 side, a black matrix BM is provided as a light shielding film so that external light or backlight light does not enter the i-type semiconductor layer AS. A closed polygonal outline of the black matrix BM indicates an opening in which the black matrix BM is not formed. The black matrix BM is made of an organic resin such as acryl, epoxy, or polyimide resin to which carbon black, a black organic pigment or the like is added, and has a thickness of 0.5 to 2.5 μm (about 1.6 μm in this example). It is formed.

Therefore, the thin film transistors TFT1,
The i-type semiconductor layer AS of the TFT 2 is sandwiched between the upper and lower black matrices BM and the large gate electrode GT, so that external natural light or backlight does not shine. The black matrix BM is formed in a grid around each pixel, and an effective display area of one pixel is partitioned by the grid. Therefore, the outline of each pixel is made clear by the black matrix BM, and the contrast is improved. That is, the black matrix BM has two functions of light shielding for the i-type semiconductor layer AS and black matrix.

The edge of the transparent pixel electrode ITO1 on the root side in the rubbing direction is also shielded from light by the black matrix BM. Therefore, even if a domain is generated in the above-mentioned portion, the domain is not seen, so that the display characteristics are not deteriorated. Absent.

As shown by hatching in FIG. 4, the black matrix BM is also formed in a frame shape around the display area AR, and its pattern is a pattern of a matrix section provided with a plurality of openings in a dot shape. Is formed continuously.
Further, the black matrix BM in the region is formed of a sealing material S
It overlaps with the inside of L, that is, a part of the liquid crystal side. Further, as described later in detail, the black matrix BM
Overlaps with a part of the outside of the sealing material SL and is also formed in an end region of the transparent glass substrate SUB2. In the peripheral seal portion, the seal material SL has a light-shielding property, and prevents leakage light such as reflected light due to a mounting machine such as a personal computer from entering the matrix portion together with the black matrix BM.

<< Color Filter FIL >> The color filter FIL is formed in a stripe shape by repeating red, green and blue at a position facing the pixel. The color filter FIL is formed to be large so as to cover all of the transparent pixel electrode ITO1, and the black matrix BM is formed inside the periphery of the transparent pixel electrode ITO1 so as to overlap with the color filter FIL and the edge of the transparent pixel electrode ITO1. I have.

The color filter FIL can be formed as follows. First, the upper transparent glass substrate SUB2
A dye base material such as an acrylic resin is formed on the surface of the substrate, and the dye base material other than the red filter formation region is removed by photolithography. Thereafter, the dyed substrate is dyed with a red dye and subjected to a fixing treatment to form a red filter R. Next, a green filter G and a blue filter B are sequentially formed by performing a similar process.

<< Protective Film PSV2 >> The protective film PSV2 is provided to prevent the colorant of the color filter FIL from leaking into the liquid crystal LC. The protective film PSV2 is formed of, for example, a transparent resin material such as an acrylic resin or an epoxy resin.

<< Common Transparent Pixel Electrode ITO2 >> The common transparent pixel electrode ITO2 is opposed to the transparent pixel electrode ITO1 provided for each pixel on the lower transparent glass substrate SUB1 side, and the optical state of the liquid crystal LC is determined by each pixel electrode ITO1. In response to a potential difference (electric field) between the pixel electrode and the common transparent pixel electrode ITO2. The common transparent pixel electrode ITO2 is configured to apply a common voltage Vcom. In this example,
The common voltage Vcom has a minimum level driving voltage Vdmin and a maximum level driving voltage Vdmax applied to the video signal line DL.
However, if it is desired to reduce the power supply voltage of the integrated circuit used in the video signal drive circuit to about half, an AC voltage may be applied. Note that the plan shape of the common transparent pixel electrode ITO2 should be referred to FIGS.

<< Black Matrix BM and Sealing Material S
L >> FIG. 1A shows a liquid crystal charging port I of a color filter substrate SUB2 of a liquid crystal display element PNL according to an embodiment of the present invention.
FIG. 1B is a schematic plan view of a main portion near the NJ, and FIG.
FIG. 3 is a schematic cross-sectional view of the liquid crystal display element PNL corresponding to a section line A.

SUB2 is an upper transparent glass substrate (color filter substrate), BM is a black matrix (light shielding film) made of an organic resin colored black or the like, FIL (R),
(G) and (B) are red, green, and blue color filters, respectively, SL is a sealing material having a light-shielding property, INJ is a liquid crystal sealing opening, CP is a sealing material for the liquid crystal sealing opening INJ, and in FIG. , SUB1 is a lower transparent glass substrate (TFT substrate), and LC is a liquid crystal layer. In FIG. 1, a protective film of the color filter FIL, a thin film transistor, a spacer for defining a gap between both substrates, a transparent pixel electrode provided on both substrates, an alignment film, a polarizing plate, and the like are omitted.
FIG. 8 shows details of the sectional structure of the liquid crystal display element PNL. In addition, the black matrix BM is indicated by an oblique line that rises to the right in FIG. 1A (downward in FIG. 3), and the sealing material SL is indicated by an oblique line that descends to the right.

FIG. 6 is a plan view and a side view as viewed from the shield case SHD side.

FIG. 2 shows an end of the liquid crystal display module MDL,
That is, it is a schematic cross-sectional view of an end near a seal portion where a pair of upper and lower transparent glass substrates SUB1 and SUB2 constituting the liquid crystal display element PNL are adhered and a liquid crystal is sealed between the two substrates. FIG. 2 corresponds to a cross section taken along line 2-2 of the plan view shown in FIG.

PSV2 is a protective film, GTM and DTM are wiring (external connection terminals), POL1 and POL2 are polarizing plates, A
R is a display area (matrix section), SHD is a metal shield case, WD is a display window formed by an opening of the shield case SHD, and BLL is backlight light.

In this embodiment, the black matrix B
M is formed of an organic resin film such as an acrylic, epoxy, or polyimide resin to which carbon black, a black organic pigment, or the like is added. Further, the light-shielding sealing material SL is formed of a thermosetting epoxy resin film in which a phenol resin having three or more nuclei is used as a curing agent and a black coloring agent is added. Note that the optical characteristics of the black matrix BM and the sealing material SL, that is, the light shielding properties, the color tone, and the like are the same. That is, the absorbance (OD value) of the black matrix BM and the light-blocking sealing material SL in the visible light range is in the range of 1.5 to 3.5, and the color tone converted by the C light source is such that both x and y are 0.2 to 0.2. 0.
5 range.

In this embodiment, the black matrix B
M partially overlaps with the inside of the sealing material SL, covers an area between the display area AR and the sealing material SL, and partially overlaps with the outside of the sealing material SL, and the sealing material SL and the edge of the upper transparent glass substrate SUB2. Covering the area between the parts. By arranging the black matrix BM at the end of the color filter substrate SUB2 outside the sealing material SL in this manner, light from the backlight BL is absorbed by the black matrix BM provided at the end of the substrate SUB2, and display is performed. Window WD
Can solve the problem that light can be seen in the periphery of the liquid crystal display, and can provide a liquid crystal display device with excellent display quality.

Further, a black matrix BM made of an organic resin having a low adhesive strength to the glass substrate or the sealing material is not provided partially over almost the entire circumference of the sealing material SL.
Since a portion where the black matrix BM and the sealing material SL do not overlap with each other is provided, in the portion where the black matrix BM does not overlap, for example, the glass substrate SUB2 / protective film PSV2
/ The combination of the sealing material SL and the adhesive strength is high, and the adhesive strength of the seal portion can be improved.

Further, if there is any overlap between the sealing material SL and the black matrix BM over the entire circumference of the sealing material SL, both substrates SUB1 and SU of the liquid crystal display element are determined.
B2 gap unevenness occurs, and display unevenness occurs. From these, the black matrix BM and the sealing material SL
Means that an overlap portion is formed substantially all around except for the liquid crystal sealing port (INJ in FIG. 4).

Further, since the masking of the seal portion by the shield case SHD covering the outer peripheral portion of the liquid crystal display element becomes unnecessary, a liquid crystal display element having a large display area, a small size and a large screen can be obtained.

In this embodiment, the transparent glass substrate SUB
2, a black matrix BM made of an organic resin such as acrylic, epoxy, polyimide resin or the like to which carbon black, a black organic pigment or the like is added is formed in a predetermined pattern, and a color filter FIL (R) is formed thereon. ,
(G) and (B) were each formed in a predetermined pattern.
That is, the black matrix BM of the display area AR is
As shown in FIG. 1, each pixel is partitioned into a grid, and color filters FIL (R), (G),
(B) is formed. Further, when the liquid crystal display element PNL is incorporated in the module MDL, a peripheral portion of the display area AR is formed in a frame shape with an appropriate width and a liquid crystal sealing opening INJ portion in order to prevent light leakage from the backlight BL. Are formed in a pattern that shields the light. Also, as described above, the pattern of the black matrix BM is also formed in the substrate SUB2 region outside the sealing material SL. Further, as shown in FIG. 1A, the pattern of the black matrix BM is also formed integrally with the frame-shaped pattern at the portion of the liquid crystal filling opening INJ, and the liquid crystal filling opening IJ is formed.
Light leakage in the NJ section is also prevented.

The color filters FIL were formed by photolithography using a photocurable negative resist to which an organic pigment added to each color tone was added. After that, in order to prevent the elution of impurities from the colored resin, and to ensure surface flatness, acrylic, epoxy resin, etc. are applied by spin coating, roll coating, transfer printing, etc., heat-treated, cured, and blackened. Protective film PS on matrix BM and color filter FIL
V1 was formed.

Next, a transparent conductive film containing indium oxide as a main component was formed thereon by sputtering to form a transparent pixel electrode ITO2.

Next, the transparent pixel electrode ITO2 on this substrate
After the transfer of the alignment film ORI2 by transfer printing, a heat treatment was performed at 180 to 220 ° C.

Further, a thin film transistor T as an opposite substrate
After forming the orientation film ORI1 on the substrate on which the FT is formed,
The same heat treatment was performed.

Then, after subjecting both substrates to an orientation treatment, one of the substrates is mainly composed of a thermosetting epoxy resin containing a trinuclear or higher phenol resin as a curing agent, and carbon black is used as a light shielding material. A light-shielding sealing material SL internally containing a colored, for example, black organic pigment or inorganic pigment was formed by a screen printing method, a dispenser coating method, or the like. Since the sealing material SL comes into contact with the terminal of the transparent pixel electrode (see FIG. 8), it is required to have an insulating property. In this case, the electric resistance after curing is set to 10 ⁸ Ω · cm or more. The optical characteristics were adjusted so as to have a predetermined value.

After that, solvent drying is performed, and a large number of spacers SP for controlling the gap between the upper and lower substrates are dispersed over the entire surface of one of the substrates.
A load of 0 kg / cm ² is applied,
The thermosetting treatment was performed for 4 hours. The absorbance (OD value) in the visible light range of the sealing material SL of the cured substrate.
Was in the range of 1.5 to 3.5, and the color tone converted with the C light source was such that both x and y were in the range of 0.2 to 0.5, which was equivalent to that of the black matrix BM.

Next, the bonded substrates are cut to a predetermined size, and the liquid crystal L is inserted into the gap between the substrates through the liquid crystal filling opening INJ.
C is injected, and the liquid crystal sealing opening INJ is sealed with a sealing material CP made of a photocurable resin or the like.

Thereafter, the polarizers POL1, POL1,
POL2 was attached to complete the liquid crystal display device.

As a result of turning on the liquid crystal display element, light radiated from the backlight in a portion outside the display area is
The portion of the sealing material SL is shielded from light as much as the black matrix BM, and the portion of the liquid crystal sealing opening INJ is also shielded from light by the black matrix BM, thereby minimizing light leakage from the peripheral frame of the liquid crystal display element. As a result, a color liquid crystal display device having good display quality was obtained.

In FIG. 2, for example, the sealing material S
L has a width of 1.0 mm, the overlap width on both sides of the black matrix BM and the sealing material SL is 0.3 mm, and therefore, the width of the black matrix BM and the sealing material SL that does not overlap is 0.4 mm, and the edge of the substrate SUB2. Is 0.3 mm, and therefore the black matrix BM provided at the end of the substrate SUB2
Is 0.6 mm in width.

Although the present invention has been specifically described based on the embodiments, the present invention is not limited to the above-described embodiments, and may be variously modified without departing from the gist thereof. Of course. For example, the present invention
It goes without saying that the present invention can be applied to an active matrix type liquid crystal display device of a vertical electric field type or a horizontal electric field type, a COG (chip-on-glass) type liquid crystal display device, or a simple matrix type liquid crystal display device.

[0082]

As described above, according to the present invention,
By arranging the black matrix at the end of the color filter substrate outside the sealing material, light from the backlight is absorbed by the black matrix provided at the end of the substrate, solving the problem that light can be seen around the display window And a liquid crystal display device having excellent display quality can be provided.

[Brief description of the drawings]

FIG. 1 (a) shows an active power supply according to an embodiment of the present invention.
FIG. 2B is a schematic plan view of a main part of a color filter substrate of a matrix type color liquid crystal display element in the vicinity of a liquid crystal filling port, and FIG.
FIG. 3 is a schematic cross-sectional view of the liquid crystal display element corresponding to a section line AA of FIG.

FIG. 2 is a schematic sectional view of an end near a seal portion of the liquid crystal display element according to the embodiment of the present invention.

FIG. 3 is an enlarged plan view of a corner portion of a display panel including an electrical connection portion between upper and lower transparent glass substrates of a liquid crystal display element.

FIG. 4 is a plan view of a panel for explaining the configuration of the matrix peripheral portion of the liquid crystal display element in a slightly exaggerated manner, and for explaining it more specifically;

FIG. 5 is an exploded perspective view of the liquid crystal display module.

FIG. 6 is a plan view and a side view of the liquid crystal display device as viewed from a shield case side.

FIG. 7 is a plan view of a pixel portion of the liquid crystal display element.

8A is a cross-sectional view of a liquid crystal display element near a panel angle, FIG. 8B is a cross-sectional view of a pixel portion of the liquid crystal display element, and FIG. 8C is a cross-sectional view of a liquid crystal display element near a video signal terminal; is there.

[Explanation of symbols]

SUB1: lower transparent glass substrate, SUB2: upper transparent glass substrate, BM: black matrix, PSV2: protective film, SL: sealing material, LC: liquid crystal layer, AR: display area (matrix section), SHD: metal shield case, W
D: display window, BLL: backlight light.

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁶ Identification code FI H01L 29/786 H01L 29/78 612D 21/336 (72) Inventor Junichi Owada 3300 Hayano, Mobara-shi, Chiba Pref. Hitachi, Ltd. Electronic Devices, Ltd. Within the business division

Claims (5)

[Claims] A first substrate having a display area formed by arranging a plurality of pixel electrodes in a matrix on an insulating substrate; and a second substrate comprising an insulating substrate and being superposed on the first substrate via a liquid crystal layer. A substrate, which is provided at a peripheral portion of the first and second substrates, surrounds a region where the liquid crystal layer exists outside the display region, is provided between the first and second substrates, and fixes them. A sealing material, a shield case which covers the periphery of the first and second substrates, has an opening exposing the display area, and is made of a light-shielding frame; and a counter substrate of the first or second substrate; An illumination light means for irradiating light to an opposite surface; and a black matrix comprising a light-shielding film covering the periphery of the pixel electrode on the surface of the second substrate on the first substrate side; The matrix is The black matrix partially overlaps the outside of the seal material, and covers the area between the seal material and the end of the second substrate. A liquid crystal display device covering an area. 2. A plurality of scanning signal lines and a plurality of video signal lines made of a metal layer are arranged in a matrix on an insulating substrate so as to intersect via an insulating layer, and the plurality of scanning signal lines and the plurality of video signals are arranged. A pixel composed of a pixel electrode and a thin film transistor is provided corresponding to each intersection of the lines, a first substrate having a display area formed thereon, and an insulating substrate, the first substrate being overlapped with the first substrate via a liquid crystal layer. Two substrates, provided on the periphery of the first and second substrates, surrounding the region where the liquid crystal layer exists outside the display region, provided between the first and second substrates, and fixing them. And a shield case that covers the first and second substrates, has an opening that exposes the display area, and is made of a light-shielding frame. Line and multiple video signal lines A black matrix formed of a light-shielding film that extends outside the region surrounded by the sealing material and is connected to an external circuit; and that covers the thin film transistor on the second substrate; Overlapping, covering an area between the display area and the sealing material, and the black matrix partially overlapping the outside of the sealing material, and covering an area between the sealing material and an end of the second substrate. A liquid crystal display device characterized by the above-mentioned. 3. The liquid crystal display device according to claim 2, wherein said sealing material is made of a resin to which a black pigment is added. 4. The black matrix according to claim 1, wherein the black matrix is made of a resin to which a black pigment is added.
The liquid crystal display device as described in the above. 5. The liquid crystal display device according to claim 1, wherein said black matrix is also provided at a liquid crystal filling opening for injecting liquid crystal between said two substrates inside said seal material. 3. The liquid crystal display device according to 1 or 2.