JPH10324889A - Water-soluble cutting fluid for wire saw - Google Patents
Water-soluble cutting fluid for wire sawInfo
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- JPH10324889A JPH10324889A JP13696197A JP13696197A JPH10324889A JP H10324889 A JPH10324889 A JP H10324889A JP 13696197 A JP13696197 A JP 13696197A JP 13696197 A JP13696197 A JP 13696197A JP H10324889 A JPH10324889 A JP H10324889A
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- Prior art keywords
- water
- cutting fluid
- glycol
- weight
- soluble
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Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は水溶性のワイヤソ
ー用切削液に関する。The present invention relates to a water-soluble cutting fluid for wire saws.
【０００２】[0002]
【従来の技術】従来から、シリコンやＧaＡs等の硬脆材
料製の比較的大きなインゴット等の切断には、厚さの均
一な切断が可能なだけでなく、切り屑の発生量が少な
く、一回の切断で多数のウェハーを作成できるという利
点を有するワイヤソーが利用されている。ワイヤソーの
使用に際しては、鉱物油を主成分とする切削油に炭化ケ
イ素等の砥粒を１:１〜１:１．５(重量比)の割合で分散
させたスラリー状切削処理剤が切断加工面に供給され、
切り出されたウェハーはトリクロロエタンやジクロロメ
タン等のハロゲン系溶剤を用いる洗浄処理に付されてい
る。2. Description of the Related Art Conventionally, when cutting relatively large ingots made of hard and brittle materials such as silicon and GaAs, not only cutting with a uniform thickness but also a small amount of chips generated is required. Wire saws have been used which have the advantage that a large number of wafers can be made in one cut. When using a wire saw, a slurry-like cutting agent in which abrasive grains such as silicon carbide are dispersed in a cutting oil containing mineral oil as a main component at a ratio of 1: 1 to 1: 1.5 (weight ratio) is cut. Supplied to the surface,
The cut wafer is subjected to a cleaning process using a halogen-based solvent such as trichloroethane or dichloromethane.
【０００３】一方、この種のハロゲン系溶剤の使用は、
作業衛生や環境保全等の見地から実質的に禁止されるよ
うになっているために、水溶性の切削液の開発が要請さ
れ、既に種々の水溶性切削液が提案されている。このよ
うな水溶性切削液としては、(i)アルカリ水溶性または
酸水溶性を含有する切削液(特開平２−２６２９５５号
公報および特開平３−２３９５０７号公報参照)、(ii)
グリコール、水溶液増粘剤(メチルセルロースおよびポ
リアクリル酸等)および水を含有する切削液(特開平４−
２１６８９７号公報および特開平４−２１８５９４号公
報参照)、(iii)脂肪酸イミダゾール水溶液を含有する切
削液(特開平８−５７８４８号公報参照)および(iv)有機
または無機ベントナイトおよび水を含有する切削液(特
開平８−５７８４７号公報参照)が例示される。On the other hand, the use of this type of halogen-based solvent
Since it has been substantially prohibited from the viewpoint of work hygiene and environmental protection, the development of a water-soluble cutting fluid has been requested, and various water-soluble cutting fluids have already been proposed. Examples of such a water-soluble cutting fluid include (i) a cutting fluid containing an alkali-water-soluble or an acid-water-soluble (see Japanese Patent Application Laid-Open (JP-A) Nos. 2-262950 and 3-239507), and (ii)
Cutting fluid containing glycol, aqueous thickener (methylcellulose and polyacrylic acid, etc.) and water
No. 216897 and JP-A-4-218594), (iii) a cutting fluid containing an aqueous solution of a fatty acid imidazole (see JP-A-8-57848), and (iv) a cutting fluid containing an organic or inorganic bentonite and water. (See Japanese Patent Application Laid-Open No. 8-57847).
【０００４】しかしながら、これらの水溶液切削液(i)
〜(iv)には下記の問題点がある。 切削液(i):切削液の粘度が低いために砥粒をほとんど保
持することができないだけでなく、水の蒸発に起因して
砥粒スラリー濃度が使用中に変化するために、均一な切
削加工ができない。 切削液(ii):水溶液増粘剤の十分な溶解性と水溶性溶剤
に対する十分な安定性を確保するために比較的多量の水
(１０〜９９重量％)を必要とするために、水の蒸発に起
因して砥粒スラリー濃度が使用中に変化して均一な切削
加工が困難となる。また、この切削液の場合には、含水
量が約３０重量％以下、特に約２０重量％以下になる
と、調製後の分散安定性が悪くなる。 切削液(iii):保水性向上剤が配合されているが、多量の
水(約３５〜４７重量％)を含有するために、水の蒸発に
起因して砥粒スラリー濃度が使用中に変化して均一な切
削加工ができない。 切削液(iv):多量の水を配合しないとベントナイトの分
散安定性が悪く、また、使用中の多量の発泡と水の蒸発
に起因して砥粒スラリー濃度が変化するために、均一な
切削加工が困難となる。However, these aqueous cutting fluids (i)
(Iv) has the following problems. Cutting fluid (i): Not only can the abrasive be hardly retained due to the low viscosity of the cutting fluid, but also because the abrasive slurry concentration changes during use due to evaporation of water, uniform cutting Cannot be processed. Cutting fluid (ii): relatively large amount of water to ensure sufficient solubility of the aqueous thickener and sufficient stability to water-soluble solvents
(10 to 99% by weight), the abrasive slurry concentration changes during use due to the evaporation of water, making uniform cutting difficult. In addition, in the case of this cutting fluid, when the water content is about 30% by weight or less, particularly about 20% by weight or less, the dispersion stability after preparation becomes poor. Cutting fluid (iii): Contains a water retention improver, but contains a large amount of water (about 35 to 47% by weight), so the abrasive slurry concentration changes during use due to water evaporation. And uniform cutting cannot be performed. Cutting fluid (iv): Unless a large amount of water is added, the dispersion stability of bentonite is poor, and the abrasive slurry concentration changes due to a large amount of foaming and evaporation of water during use, so uniform cutting Processing becomes difficult.
【０００５】出願人は先に、従来の水溶性切削液の上記
のような問題点を解決し、低含水量または無含水量の条
件下でも安定であって、砥粒を安定に分散させると共に
ワイヤソーへの砥粒の付着性を向上させることによって
被加工物の均一な切削加工を可能にするワイヤソー用水
溶性切削液として、所定量のヘクトライトと水をエチレ
ングリコール等の水溶液に配合して成る切削液を提供し
た(特願平９−６７８５２号明細書参照)。しかしなが
ら、この水溶性切削液にはチキソトロピー性が非常に高
いためゲル化をもたらすことがあるだけでなく、潤滑性
が十分でないために被加工物の切削効率が劣るという問
題があることが判明した。[0005] The applicant has previously solved the above-mentioned problems of the conventional water-soluble cutting fluid, and is stable under the condition of low water content or no water content, stably dispersing the abrasive grains, and As a water-soluble cutting fluid for wire saws, which enables uniform cutting of workpieces by improving the adhesion of abrasive grains to the wire saw, a predetermined amount of hectorite and water are mixed with an aqueous solution such as ethylene glycol. A cutting fluid was provided (see Japanese Patent Application No. 9-67852). However, it has been found that this water-soluble cutting fluid has a problem that not only the thixotropic property is extremely high and thus gelation is caused but also the cutting efficiency of a workpiece is deteriorated due to insufficient lubrication. .
【０００６】[0006]
【発明が解決しようとする課題】この発明は先の出願に
係る水溶性切削液の優れた特性を損うことなく、上記問
題点を解決するためになされたものである。SUMMARY OF THE INVENTION The present invention has been made to solve the above problems without impairing the excellent characteristics of the water-soluble cutting fluid according to the earlier application.
【０００７】[0007]
【課題を解決するための手段】即ち本発明は、ヘクトラ
イト０．２〜５重量％、ポリカルボン酸塩０．００１〜
０．２重量％非イオン界面活性剤０〜１０重量％、およ
び水２〜３０重量％を水溶性溶剤に配合して成るワイヤ
ソー用水溶性切削液に関する。That is, the present invention provides a hectorite of 0.2 to 5% by weight and a polycarboxylate of 0.001 to 0.001%.
The present invention relates to a water-soluble cutting fluid for a wire saw, comprising 0.2 to 10% by weight of a nonionic surfactant and 0 to 30% by weight of water in a water-soluble solvent.
【０００８】[0008]
【発明の実施の形態】ヘクトライトとしては、天然ヘク
トライトおよび／または天然ヘクトライトと類似の構造
と組成を有する合成ヘクトライトを適宜使用すればよい
が、増粘効果を安定的に発揮する無着色切削液を調製す
るためには合成ヘクトライトが好ましい。このような合
成ヘクトライトとしては日本シリカ工業株式会社製の
「合成ヘクトライト(粒径：０．０２μｍ)」が例示され
る。DETAILED DESCRIPTION OF THE INVENTION As hectorite, natural hectorite and / or synthetic hectorite having a structure and composition similar to that of natural hectorite may be appropriately used. In order to prepare a colored cutting fluid, synthetic hectorite is preferred. As such a synthetic hectorite, “Synthetic hectorite (particle size: 0.02 μm)” manufactured by Nippon Silica Industry Co., Ltd. is exemplified.
【０００９】ヘクトライトの粒径は特に限定的ではない
が、通常は１０〜２００ｎｍ、好ましくは２０〜１００
ｎｍであり、２００ｎｍよりも大きくなると、ヘクトラ
イトの分散安定性が悪くなり、また、１０ｎｍよりも小
さくなると砥粒の沈降抑制が困難となる。The particle size of hectorite is not particularly limited, but is usually 10 to 200 nm, preferably 20 to 100 nm.
When it is larger than 200 nm, the dispersion stability of hectorite is deteriorated, and when it is smaller than 10 nm, it is difficult to suppress sedimentation of abrasive grains.
【００１０】ヘクトライトの配合量は０．２〜５重量
％、好ましくは０．５〜２重量％であり、０．２重量％
よりも少ないと砥粒の沈降を効果的に抑制できず、ま
た、５重量％よりも多くなると、切削液に対して砥粒を
多量に(例えば、重量比１:１になる量)配合することが
困難となる。The amount of hectorite is 0.2 to 5% by weight, preferably 0.5 to 2% by weight, and 0.2% by weight.
If it is less than this, the sedimentation of the abrasive grains cannot be suppressed effectively. If it exceeds 5% by weight, the abrasive grains are blended in a large amount (for example, in an amount of 1: 1 by weight) to the cutting fluid. It becomes difficult.
【００１１】また、本発明においては、ヘクトライトの
高いチキソトロピー性に起因するゲル化を遅延または防
止するためにポリカルボン酸塩を配合する。ポリカルボ
ン酸塩としては、アクリル酸塩や、メタクリル酸塩のホ
モポリマーまたはこれらとエチレン、プロピレンもしく
はスチレン等とのコポリマー、(無水)マレイン酸塩とエ
チレン、スチレン、プロピレンもしくはアミレン等との
コポリマーおよびアルギン酸塩等が例示されるが、特に
好適なポリカルボン酸塩は次式(Ｉ)で表される化合物で
ある：[0011] In the present invention, a polycarboxylate is blended in order to delay or prevent gelation caused by high thixotropic property of hectorite. Examples of the polycarboxylate include acrylates, methacrylate homopolymers and copolymers thereof with ethylene, propylene or styrene, etc., (anhydrous) maleate and ethylene, styrene, propylene or amylene copolymers and the like. Alginates and the like are exemplified. Particularly preferred polycarboxylates are compounds represented by the following formula (I):
【化２】 式(Ｉ)において、Ｍはアルカリ金属原子(好ましくはＮ
ａまたはＫ)またはＮＨ 4を示し、ｎは２〜１０、好まし
くは３〜６の数を示し、ｍは１０〜１０００、好ましく
は２０〜２００の数を示す。Embedded imageIn the formula (I), M is an alkali metal atom (preferably N
a or K) or NH FourAnd n is 2 to 10, preferably
Or 3 to 6 and m is 10 to 1000, preferably
Indicates a number of 20 to 200.
【００１２】ポリカルボン酸塩の配合量は、０．００１
〜０．２重量％、好ましくは０．０１〜０．１重量％で
あり、該配合量は０．００１重量％よりも少なくなると
所期の効果が得難く、また、０．２重量％よりも多くな
ると、スラリー中の砥粒の沈降が起こる。The amount of the polycarboxylate is 0.001.
When the amount is less than 0.001% by weight, the desired effect is hardly obtained, and when the amount is less than 0.2% by weight. When the amount also increases, sedimentation of the abrasive grains in the slurry occurs.
【００１３】本発明においては、水溶性切削液にさらに
十分な潤滑性を付与するために非イオン界面活性剤を配
合するのが好ましい。非イオン界面活性剤として、ポリ
オキシアルキレンアルキルアリールエーテル、ポリオキ
シエチレンポリオキシプロピレンポリオール、ポリオキ
シアルキレンアルキルエーテル、ポリオキシアルキレン
多価アルコール脂肪酸エステル、ポリオキシアルキレン
スチレン化アリールエーテル、ポリオキシアルキレン脂
肪酸エステル、ポリオキシアルキレンアルキルアミン、
ポリオキシアルキルメルカプタンのおよび多価アルコー
ル脂肪酸エステル等が適宜選定して使用すればよいが、
特に好適な非イオン界面活性剤はヒドロキシカルボン酸
(好ましくはリシノール酸およびヒドロキシステアリン
酸等)とジグリセリンまたはトリグリセリンとのエステ
ルのエチレンオキシド付加物、例えば、ひまし油エチレ
ンオキシド付加物および水添ひまし油エチレンオキシド
付加物等である。In the present invention, it is preferable to add a nonionic surfactant in order to impart sufficient lubricity to the water-soluble cutting fluid. As nonionic surfactants, polyoxyalkylene alkyl aryl ether, polyoxyethylene polyoxypropylene polyol, polyoxyalkylene alkyl ether, polyoxyalkylene polyhydric alcohol fatty acid ester, polyoxyalkylene styrenated aryl ether, polyoxyalkylene fatty acid ester , Polyoxyalkylene alkylamine,
Polyoxyalkyl mercaptan and polyhydric alcohol fatty acid esters may be appropriately selected and used,
A particularly preferred nonionic surfactant is hydroxycarboxylic acid
Ethylene oxide adducts of esters of (preferably ricinoleic acid and hydroxystearic acid) with diglycerin or triglycerin, such as castor oil ethylene oxide adducts and hydrogenated castor oil ethylene oxide adducts.
【００１４】非イオン界面活性剤の配合量は０〜１０重
量％間で、好ましくは０．０１〜５重量％であり、該配
合量が０．０１重量％よりも少ないと所期の効果は得難
く、また、１０重量％よりも多くなると、不経済なだけ
でなく、発泡や液の不安定化という問題がもたらされ
る。The compounding amount of the nonionic surfactant is between 0 and 10% by weight, preferably 0.01 to 5% by weight. If the compounding amount is less than 0.01% by weight, the desired effect is not obtained. If it is difficult to obtain, and if it exceeds 10% by weight, not only is it uneconomical, but also there are problems of foaming and instability of the liquid.
【００１５】水の配合量は２〜３０重量％、好ましくは
１０〜２０重量％であり、２重量％よりも少なくなると
ヘクトライトを水溶性溶剤中に安定に分散させることが
困難となり、また、３０重量％よりも多くなると、従来
技術の場合のように、水の蒸発による砥粒スラリー濃度
の変化に起因する不均一な切削加工の問題が顕在化す
る。なお、水はイオン交換水または純水が好ましい。The amount of water is 2 to 30% by weight, preferably 10 to 20% by weight. If the amount is less than 2% by weight, it becomes difficult to stably disperse hectorite in a water-soluble solvent. If it exceeds 30% by weight, the problem of non-uniform cutting due to a change in the abrasive slurry concentration due to evaporation of water becomes apparent as in the case of the prior art. The water is preferably ion-exchanged water or pure water.
【００１６】上記のヘクトライト微粉末等を分散させる
水溶性溶剤としては、エチレングリコール、ジエチレン
グリコール、トリエチレングリコール、テトラエチレン
グリコール、プロピレングリコール、ヘキシレングリコ
ール、グリセリン、１,３−プロパンジオール、１,４−
ブタンジオール、１,６−ヘキサンジオール、ポリエチ
レングリコール、ポリプロピレングリコール、ポリエチ
レングリコール−ポリプロピレングリコール共重合体お
よびこれらの任意の混合物等が例示されるが、グリコー
ル系溶剤が好ましい。ポリエチレングリコール、ポリプ
ロピレングリコールおよびポリエチレングリコール−ポ
リプロピレングリコール共重合体は分子量が１０００を
越えないものが好ましい。Examples of the water-soluble solvent for dispersing the above hectorite fine powder include ethylene glycol, diethylene glycol, triethylene glycol, tetraethylene glycol, propylene glycol, hexylene glycol, glycerin, 1,3-propanediol, 4-
Examples thereof include butanediol, 1,6-hexanediol, polyethylene glycol, polypropylene glycol, a polyethylene glycol-polypropylene glycol copolymer, and an arbitrary mixture thereof. A glycol solvent is preferred. Polyethylene glycol, polypropylene glycol and polyethylene glycol-polypropylene glycol copolymer preferably have a molecular weight of not more than 1,000.
【００１７】本発明による水溶性切削液には、所望によ
り、粘度調整のために水溶性増粘剤を適宜配合してもよ
い。水溶性増粘剤としてはポリビニルピロリドン(好ま
しくは、分子量が１００００〜２００００００、特に１
００００００〜２００００００のポリビニルピロリド
ン)が特に好ましい。水溶性増粘剤の配合量は通常は
０．１〜５重量％、好ましくは０．２〜３重量％であ
り、５重量％よりも多くなると、粘度が上がりすぎ、作
業性を低下させる。The water-soluble cutting fluid according to the present invention may optionally contain a water-soluble thickener for adjusting viscosity. As the water-soluble thickener, polyvinylpyrrolidone (preferably having a molecular weight of 10,000 to 2,000,000, particularly 1
(00000 to 2,000,000 polyvinylpyrrolidone) are particularly preferred. The amount of the water-soluble thickener is usually from 0.1 to 5% by weight, preferably from 0.2 to 3% by weight, and if it exceeds 5% by weight, the viscosity becomes too high and the workability is reduced.
【００１８】本発明による水溶性切削液には、該切削液
の前記の特性を損なわない範囲内において、所望により
さらに各種の添加剤、例えば、消泡剤(例えば、シリコ
ン系消泡剤)および防錆剤(例えば、モノエタノールアミ
ン、ジエタノールアミン等)等を適宜配合してもよい。The water-soluble cutting fluid according to the present invention may further contain various additives such as an antifoaming agent (for example, a silicon-based antifoaming agent) as long as the above-mentioned properties of the cutting fluid are not impaired. A rust inhibitor (for example, monoethanolamine, diethanolamine, etc.) may be appropriately blended.
【００１９】本発明によるワイヤソー用水溶性切削液は
上記配合成分を高速撹拌により均一な分散液とすること
によって調製されるが、水溶性増粘剤を配合する場合に
は上記水溶性溶剤にヘクトライト、非イオン界面活性
剤、ポリカルボン酸塩および水等を高速撹拌により均一
に分散させた後、これに水溶性増粘剤を添加して溶解さ
せるかまたは水溶性増粘剤の水溶性溶剤溶液を添加して
調製してもよい。The water-soluble cutting fluid for a wire saw according to the present invention is prepared by mixing the above-mentioned components into a uniform dispersion by high-speed stirring. When a water-soluble thickener is added, hectorite is added to the above-mentioned water-soluble solvent. , A nonionic surfactant, a polycarboxylate, water and the like are uniformly dispersed by high-speed stirring, and then a water-soluble thickener is added thereto and dissolved, or a water-soluble solvent solution of the water-soluble thickener is added. May be added.
【００２０】本発明によるワイヤソー用水溶性切削液の
粘度はヘクトライト、非イオン界面活性剤およびポリカ
ルボン酸塩の種類および配合量並びに水溶性溶剤の種類
および配合量等によって左右され、特に限定的ではな
い。一般的には１０〜１０００cp、好ましくは５０〜５
００cpである。一般に、粘度が１０cpよりも低くなる
と、砥粒の分散性が低下し、また、粘度が１０００cpよ
りも高くなると、作業性が低下する。The viscosity of the water-soluble cutting fluid for a wire saw according to the present invention depends on the types and amounts of hectorite, nonionic surfactants and polycarboxylates, and the types and amounts of water-soluble solvents. Absent. Generally, 10 to 1000 cp, preferably 50 to 5 cp
00cp. In general, when the viscosity is lower than 10 cp, the dispersibility of the abrasive grains decreases, and when the viscosity is higher than 1000 cp, the workability decreases.
【００２１】被加工物、例えばシリコンやＧaＡs等の硬
脆材料製のインゴットやフェライトヘッド等をワイヤソ
ーを用いて切断するに際しては、上記の水溶性切削液に
砥粒、例えばＳiＣ製砥粒等を１:１〜１:１．５(重量
比)で添加した切削加工液を調製し、該切削加工液を加
工部に供給し、ワイヤソー切断をおこなう。砥粒の粒径
は被加工物の種類や寸法等によって左右され、特に限定
的ではないが、通常は５〜３０μm、好ましくは１０〜
２０μmである。When cutting a workpiece such as an ingot or a ferrite head made of a hard and brittle material such as silicon or GaAs using a wire saw, abrasive grains such as SiC abrasive grains are added to the above water-soluble cutting fluid. A cutting fluid added at a ratio of 1: 1 to 1: 1.5 (weight ratio) is prepared, and the cutting fluid is supplied to a processing portion to perform wire saw cutting. The particle size of the abrasive grains depends on the type and size of the workpiece and is not particularly limited, but is usually 5 to 30 μm, preferably 10 to 10 μm.
20 μm.
【００２２】[0022]
【実施例】以下、本発明を実施例によって説明する。実施例１〜９ 表１に示す配合処方により、ホモミキサー(回転数：５
０００ｒｐｍ)を用いてワイヤソー用水溶性切削液１〜
９を調製した。The present invention will be described below with reference to examples. Examples 1 to 9 According to the formulation shown in Table 1, a homomixer (rotation speed: 5
000 rpm) using a water-soluble cutting fluid 1 for wire saws.
9 was prepared.
【００２３】[0023]
【表１】 [Table 1]
【００２４】得られた水溶性切削液１〜９の表面張力を
測定し、また、調製から２４時間静置後の分散安定性お
よびゲル形成性を調べた。さらに、水溶性切削液１〜９
に関する炭化ケイ素砥粒(ＧＣ＃８００)の分散性および
ワイヤソーへの該砥粒の付着性を以下の方法によって調
べた。炭化ケイ素砥粒の分散性 被験液に等重量のＧＣ＃８００を添加し、この分散液を
メスシリンダーに入れ、４８時間静置後、ケイ素砥粒の
沈降状態を透明液部分の容量％で評価する。ワイヤソーへの炭化ケイ素砥粒の付着性 上記分散液中にワイヤを１分間浸漬した後、引きあげ、
ワイヤソーへの砥粒の付着性を目視によって評価する。
上記の評価結果を切削液の表面張力、分散安定性および
ゲル形成性と共に以下の表２に示す。The surface tensions of the obtained water-soluble cutting fluids 1 to 9 were measured, and the dispersion stability and the gel-forming property after standing for 24 hours from the preparation were examined. Furthermore, water-soluble cutting fluids 1 to 9
The dispersibility of the silicon carbide abrasive grains (GC # 800) and the adhesion of the abrasive grains to the wire saw were determined by the following methods. Dispersibility of silicon carbide abrasive grains An equivalent weight of GC # 800 was added to the test liquid, and this dispersion liquid was placed in a measuring cylinder, and allowed to stand for 48 hours. I do. Adhesion of silicon carbide abrasive grains to wire saw After immersing the wire in the above dispersion for 1 minute, pull up,
The adhesion of the abrasive grains to the wire saw is visually evaluated.
The above evaluation results are shown in Table 2 below together with the surface tension, dispersion stability, and gel forming properties of the cutting fluid.
【００２５】[0025]
【表２】 [Table 2]
【００２６】比較例１〜４ 前記実施例の手順に準拠し、表１に示す配合処方により
切削液１'〜４'を調製し、これらに関する炭化ケイ素砥
粒の分散性およびワイヤソーへの該砥粒の付着性並びに
切削液の表面張力、粘度、分散安定性およびゲル形成性
を調べた。結果を表２に示す。 Comparative Examples 1 to 4 Cutting fluids 1 'to 4' were prepared according to the formulation shown in Table 1 in accordance with the procedures of the above Examples, and the dispersibility of silicon carbide abrasive grains in these cutting fluids and the polishing The adhesiveness of the grains and the surface tension, viscosity, dispersion stability and gel forming properties of the cutting fluid were examined. Table 2 shows the results.
【００２７】[0027]
【発明の効果】本発明によるワイヤソー用水溶性切削液
を使用することにより、砥粒を安定に分散させてワイヤ
ソーへの付着性を向上させることができ、さらに該切削
液のゲル化が防止されると共に該切削液が十分な潤滑性
を発揮するので、ワイヤソーによる被加工物(例えば、
シリコンやＧaＡs等の硬脆材料製のインゴットやフェラ
イトヘッド、水晶、セラミックス、光学ガラス、ネオジ
ム磁石、サファイヤ、リチウムタンタレート等)の均一
で効率的な切削加工が可能となる。By using the water-soluble cutting fluid for a wire saw according to the present invention, the abrasive grains can be stably dispersed to improve the adhesion to the wire saw, and the cutting fluid is prevented from gelling. In addition, the cutting fluid exhibits sufficient lubricity, so that the workpiece (e.g.,
Uniform and efficient cutting of ingots and ferrite heads made of hard and brittle materials such as silicon and GaAs, quartz, ceramics, optical glass, neodymium magnets, sapphire, lithium tantalate, etc. can be performed.
─────────────────────────────────────────────────────
────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成９年６月２３日[Submission date] June 23, 1997
【手続補正１】[Procedure amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】請求項２[Correction target item name] Claim 2
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【化１】 (式中、Ｍはアルカリ金属原子またはＮＨ4を示し、ｎは
２〜１０の数を示し、ｍは１０〜１０００の数を示す)
で表される化合物である請求項１記載の切削液。Embedded image (Wherein, M represents an alkali metal atom or NH 4 , n represents a number of 2 to 10, and m represents a number of 10 to 1000)
The cutting fluid according to claim 1, which is a compound represented by the formula:
【手続補正２】[Procedure amendment 2]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００１１[Correction target item name] 0011
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【００１１】また、本発明においては、ヘクトライトの
高いチキソトロピー性に起因するゲル化を遅延または防
止するためにポリカルボン酸塩を配合する。ポリカルボ
ン酸塩としては、アクリル酸塩や、メタクリル酸塩のホ
モポリマーまたはこれらとエチレン、プロピレンもしく
はスチレン等とのコポリマー、(無水)マレイン酸塩とエ
チレン、スチレン、プロピレンもしくはアミレン等との
コポリマーおよびアルギン酸塩等が例示されるが、特に
好適なポリカルボン酸塩は次式(Ｉ)で表される化合物で
ある：[0011] In the present invention, a polycarboxylate is blended in order to delay or prevent gelation caused by high thixotropic property of hectorite. Examples of the polycarboxylate include acrylates, methacrylate homopolymers and copolymers thereof with ethylene, propylene or styrene, etc., (anhydrous) maleate and ethylene, styrene, propylene or amylene copolymers and the like. Alginates and the like are exemplified. Particularly preferred polycarboxylates are compounds represented by the following formula (I):
【化２】 式(Ｉ)において、Ｍはアルカリ金属原子(好ましくはＮ
ａまたはＫ)またはＮＨ4を示し、ｎは２〜１０、好まし
くは３〜６の数を示し、ｍは１０〜１０００、好ましく
は２０〜２００の数を示す。Embedded image In the formula (I), M is an alkali metal atom (preferably N
It indicates a or K) or NH 4, n is 2 to 10, preferably represents a number of 3 to 6, m is 10 to 1000, preferably is a number of 20 to 200.
フロントページの続き (51)Int.Cl.6 識別記号 ＦＩ (Ｃ１０Ｍ 173/02 145:16 125:30 129:06 129:16） Ｃ１０Ｎ 10:02 20:02 30:02 40:22 40:32 Continued on the front page (51) Int.Cl. 6 Identification symbol FI (C10M 173/02 145: 16 125: 30 129: 06 129: 16) C10N 10:02 20:02 30:02 40:22 40:32
Claims (4)
ルボン酸塩０．００１〜０．２重量％、非イオン界面活
性剤０〜１０重量％および水２〜３０重量％を水溶性溶
剤に配合して成るワイヤソー用水溶性切削液。1. An aqueous solvent comprising 0.2 to 5% by weight of hectorite, 0.001 to 0.2% by weight of a polycarboxylate, 0 to 10% by weight of a nonionic surfactant and 2 to 30% by weight of water. Water-soluble cutting fluid for wire saws
２〜１０の数を示し、ｍは１０〜１０００の数を示す)
で表される化合物である請求項１記載の切削液。2. A polycarboxylate having the following formula (I): (Wherein, M represents an alkali metal atom or NH 4 , n represents a number of 2 to 10, and m represents a number of 10 to 1000)
The cutting fluid according to claim 1, which is a compound represented by the formula:
ン酸とジグリセリンまたはトリグリセンとのエステルの
エチレンオキシド付加物である請求項１記載の切削液。3. The cutting fluid according to claim 1, wherein the nonionic surfactant is an ethylene oxide adduct of an ester of hydroxycarboxylic acid and diglycerin or triglycene.
チレングリコール、トリエチレングリコール、テトラエ
チレングリコール、プロピレングリコール、ヘキシレン
グリコール、グリセリン、１,３−プロパンジオール、
１,４−ブタンジオール、１,６−ヘキサンジオール、ポ
リエチレングリコール、ポリプロピレングリコールおよ
びポリエチレングリコール／ポリプロピレングリコール
共重合体から成る群から選択される１種または２種以上
の溶剤である請求項１記載の切削液。4. The water-soluble solvent is ethylene glycol, diethylene glycol, triethylene glycol, tetraethylene glycol, propylene glycol, hexylene glycol, glycerin, 1,3-propanediol,
2. The solvent according to claim 1, which is one or more solvents selected from the group consisting of 1,4-butanediol, 1,6-hexanediol, polyethylene glycol, polypropylene glycol and a polyethylene glycol / polypropylene glycol copolymer. Cutting fluid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13696197A JP3933748B2 (en) | 1997-05-27 | 1997-05-27 | Water-soluble cutting fluid for wire saw |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13696197A JP3933748B2 (en) | 1997-05-27 | 1997-05-27 | Water-soluble cutting fluid for wire saw |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10324889A true JPH10324889A (en) | 1998-12-08 |
| JP3933748B2 JP3933748B2 (en) | 2007-06-20 |
Family
ID=15187547
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13696197A Expired - Fee Related JP3933748B2 (en) | 1997-05-27 | 1997-05-27 | Water-soluble cutting fluid for wire saw |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3933748B2 (en) |
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|---|---|---|---|---|
| JP2002036113A (en) * | 2000-07-25 | 2002-02-05 | Sumitomo Special Metals Co Ltd | Method of cutting rare-earth alloy and method of manufacturing rare-earth alloy magnet |
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| US6381830B1 (en) | 1998-09-01 | 2002-05-07 | Sumitomo Special Metals Co., Ltd. | Method for cutting rare earth alloy, method for manufacturing rare earth alloy plates and method for manufacturing rare earth alloy magnets using wire saw, and voice coil motor |
| US6408840B2 (en) | 1999-12-14 | 2002-06-25 | Sumitomo Special Metals Co., Ltd. | Method and apparatus for cutting a rare earth alloy |
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| JP2008103690A (en) * | 2007-08-24 | 2008-05-01 | Mitsubishi Electric Corp | Slurry used for cutting silicon ingot |
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- 1997-05-27 JP JP13696197A patent/JP3933748B2/en not_active Expired - Fee Related
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