JPH10322096A - Method of mounting electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable an electronic part to be efficiently mounted by a method wherein a mis-mounted electronic part and the electronic part paired with the former are mounted together with a following electronic part after another electronic part is mounted when a mounting failure occurs. SOLUTION: A part scrapping flag is put up in the data storage region of the nozzle number of a nozzle which sucks an electronic part when it is judged that the electronic part is abnormally sucked (#7), and the nozzle number is inputted in a temporary storage region (#8). It is judged whether a suction nozzle keeps an electronic part or not (#9), and when the nozzle number is stored in the temporary storage region, an electronic part sucked by a nozzle, whose nozzle number is stored in the nozzle number data storage region where a part scrapping flag is put up in a step #7, is scrapped (#12). Thereafter, the nozzle number stored in the temporary storage region is registered in the storage region of a control (#13). Furthermore, the scrapped electronic part is sucked again, and the temporary storage region is cleared (#14).

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting an electronic component on a circuit board.

[0002]

2. Description of the Related Art There are various dimensions and shapes of electronic components mounted on a circuit board. When a short electronic component is mounted near a tall electronic component, a suction nozzle or the like that holds the electronic component is mounted. The component holding means contacts the tall electronic component and damages or repels it. In order to solve such a problem, in the conventional mounting method, when the mounting order is restricted due to the interference between the shape and the mounting position of the electronic component and the shape of the component holding means due to the interference between the two, the mounting of the mounted electronic component is performed. The mounting program is set in a mounting order such that the electronic component does not interfere with the component holding means. In accordance with this mounting program, a plurality of electronic components are held by a plurality of component holding means, and if a mounting error or the like occurs during the mounting operation, the electronic component having the mounting error or the like is recovered and then held. The mounting operation of all the electronic components being performed is terminated, and then the process proceeds to the next mounting operation.

An example of an electronic component mounting machine will be described specifically. FIG. 2 is a perspective view showing an example of the electronic component mounter. The mounting head 5 is movable on an XY plane and has four suction nozzles (component holding means) mounted as shown in FIG.
1, 2, 3, and 4 can be individually raised and lowered and rotated. The mounting head 5 includes a component supply unit 7
Then, the electronic components are sucked by the suction nozzles 1 to 4, and the suction position of each electronic component is recognized by the component recognition unit 6.
After the posture is corrected based on the recognition result, the electronic components adsorbed to the predetermined mounting position of the printed circuit board carried in from the transfer device 8 and positioned at the predetermined position are sequentially mounted.

As described above, when mounting is performed using the mounting head 5 on which a plurality of suction nozzles 1 to 4 are mounted, for example,
If the electronic component to be mounted first cannot be mounted due to a suction error or a recognition error in the electronic component to be mounted first, and then the electronic component to be mounted second is mounted, the electronic component to be mounted first is mounted later. At this time, since the mounted electronic components may interfere with the suction nozzles 1 to 4, subsequent mounting of the second and subsequent electronic components is not performed. The electronic components are sucked again, all the electronic components are re-recognized by the component recognizing unit 4, the electronic components to be mounted are mounted first, and then the second and subsequent electronic components are mounted.

[0005]

As described above, in the prior art, when the mounting of the electronic component to be mounted first cannot be performed due to a suction error or the like, the electronic component to be mounted second is mounted. If the electronic components to be mounted later interfere with the mounted electronic components and the suction nozzles 1 to 4, when the electronic components to be mounted later interfere with each other, the electronic components to be mounted third and fourth are mounted on the first electronic component. Not near the position,
Even when there is no interference with the first electronic component or the component holding means, mounting cannot be performed, and the recovery operation of the first mounted electronic component has to be waited.

As described above, in the conventional electronic component mounting method, in order to avoid interference between the mounted electronic component and the component holding means, the mounting order set even when the mounting order is changed occurs. And there is a problem that flexibility is low and productivity is reduced.

The present invention has been made in view of the problems of the conventional electronic component mounting method, and efficiently mounts the electronic components held in the component holding means even if the mounting order changes. It is an object of the present invention to provide an electronic component mounting method capable of performing the above.

[0008]

SUMMARY OF THE INVENTION According to the present invention, there is provided an electronic component which has been mounted first, based on the relationship between the shape and mounting position of the electronic component and the shape of the component holding means for holding and mounting the electronic component. An electronic component mounting method for mounting a plurality of electronic components held by a plurality of component holding units in accordance with the mounting order based on a mounting program set in a mounting order such that the component holding units do not interfere with each other. Extraction of a pair to keep the mounting order among the plurality of electronic components held by the means, when a mounting error occurs,
After mounting other electronic components except for the electronic component that is the mounting error and the electronic component that is the pairing target, the electronic component that has caused the mounting error and the electronic component to be paired are subsequently mounted. The electronic component is mounted while being held by the plurality of component holding means together with the electronic component.

According to the electronic component mounting method described above, the electronic component is set based on the relationship between the shape of the electronic component and the shape of the holding unit so that the previously mounted electronic component does not interfere with the holding unit of the electronic component. Based on the mounting program set in the mounting order, when mounting is performed by holding a plurality of electronic components by a plurality of component holding means, if a mounting error or the like occurs, the electronic component having the mounting error or the like has occurred. And after giving priority to the mounting of the electronic components irrespective of the mounting order based on the interference relationship, the electronic component in which the mounting error has occurred and the electronic component to be paired together with the electronic components of the subsequent mounting to the plurality of component holding means. Hold and implement. Therefore, since the mounting order can be changed based on the interference relationship, mounting can be performed with flexibility and mounting efficiency can be improved.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the accompanying drawings to provide an understanding of the present invention.
The embodiment described below is an example embodying the present invention, and does not limit the technical scope of the present invention.

FIG. 1 is a flowchart showing a procedure of an electronic component mounting method according to an embodiment of the present invention. Hereinafter, the electronic component mounting method according to the present embodiment will be described with reference to FIG. Note that the present embodiment is an electronic component mounting method using the electronic component mounter shown in FIGS. 2 and 3, and the reference numerals of each component accompanying the description of the processing procedure correspond to those shown in FIG. I do. Also, # 1, # 2,... Shown in FIG. 1 are step numbers indicating the processing procedure, and correspond to the numbers described in the main text.

First, a mounting program representing a mounting order and a mounting method of electronic components to be mounted on a circuit board is input to the control unit (# 1). This mounting program is a program such that the mounted electronic components do not interfere with the suction nozzles (component holding means) 1 to 4 if the mounting operation is performed in the specified mounting order.

Next, component suction is performed using an empty suction nozzle from which the electronic components are not suctioned among the suction nozzles 1 to 4, and the component recognition unit 6 performs component recognition (６).
2). However, when the mounting operation is proceeding at the beginning of mounting or in the mounting order instructed by the mounting program, all of the suction nozzles 1 to 4 are empty.

Next, the suction nozzle 1 derived from the relationship between the shape of the electronic component and the shape of the suction nozzles 1 to 4 is applied to the electronic components sucked by the suction nozzles 1 to 4 respectively.
Extraction of a pair of electronic components that will cause interference between the suction nozzles 1-4 and the mounted electronic components if the mounting order is not observed, from the relationship of the allowable distances between the electronic components and the mounted electronic components. (# 3). The state in which the suction nozzles 1 to 4 interfere with the mounted electronic components will be described with reference to FIG.

FIG. 4 shows a state in which a large electronic component 11 as a tall electronic component is already mounted on a circuit board 10 and a small electronic component 12 as a short electronic component sucked by suction nozzles 1 to 4 is mounted. The interference state at the time of performing is described. FIG.
Denotes one of the suction nozzles 1 to 4 and is configured to be able to be individually driven up and down by the mounting head 5, and a nozzle b is provided at the center of the nozzle base a. The distance from the tip of the nozzle portion b to the base a is L, the distance from the center of the base a to the farthest part on the XY plane is R, the height of the large electronic component 11 from the circuit board 10 is h, Assuming that the distance from the center of the electronic component 11 to the farthest part on the XY plane is r and the height of the small electronic component 12 is H, the distance between the mounting positions of the large electronic component 11 and the small electronic component 12 is If it is larger than r + R, there is no interference whichever is mounted first. The distance between the mounting positions is r
In the case where L + H is smaller than h, there is no danger of interference. However, when L + H is smaller than h, there is no danger of interference. Small electronic components 12
If not mounted first, the nozzle base a and the large electronic component 11
And interfere. From the above conditions, the suction nozzles 1 to
It is possible to extract a pair of electronic components that interfere with the electronic component 4 and the mounted electronic component.

Therefore, in the extracted electronic component pair,
First, the nozzle numbers of the suction nozzles 1 to 4 that need to be mounted are input to the information storage areas of the suction nozzles 1 to 4.
For example, when the electronic components sucked by the suction nozzle 1 must be mounted earlier than the electronic components sucked by the suction nozzle 3, the storage area of the suction nozzle 3 is stored in the storage area of the suction nozzle 3.
Is input.

Returning to the description of FIG. 1, the suction state of the electronic component recognized in step # 2 is checked based on the recognition result (# 4), and when it is determined that the suction state is abnormal, , The suction nozzles 1 that are sucking this
The electronic component discard flag is set in the information storage area of the nozzle number 4 (# 7). This nozzle number is input to the temporary storage area of the control unit of the electronic component mounting machine as suction nozzles 1 to 4 that could not be mounted (♯
8). In step # 4, when it is determined that the suction state is normal, the nozzle numbers that need to be mounted first in the information storage areas of the suction nozzles 1 to 4 and the nozzles that are input in the temporary storage area The head number is compared with the number (# 5), and if the same nozzle number exists, it means that the electronic component that needs to be mounted first has not been mounted, so the head number is input to the temporary storage area. Implementation is not performed (# 8).
If the same nozzle number does not exist in the information storage area and the temporary storage area of the suction nozzles 1 to 4, component mounting is performed because mounting is possible (# 6).

In step # 9, it is determined whether or not the electronic components to be mounted remain in the suction nozzles 1 to 4. If any, the process returns to step # 4, and the process returns to step # 4 to step # 9. Repeat the process. Suction nozzle 1
If there are no electronic components remaining in 4, it is determined whether there are any electronic components that could not be mounted (# 10). The determination of the presence or absence of the electronic component that could not be mounted can be made based on whether or not the nozzle number has been input to the temporary storage area. If the nozzle number has been input, there is an electronic component that could not be mounted.
The electronic components sucked by the suction nozzles 1 to 4 input to the information storage area are discarded (# 12). After this process, the nozzle number input to the temporary storage area is registered as a component-sucked nozzle in the storage area of the control unit (# 13). Further, after re-adsorbing the discarded electronic components and clearing the temporary storage area (# 14), the process returns to step # 2, and returns to the empty suction heads 1 to 4 which are not registered in the component-sucked nozzle information. Then, the electronic components of the next process of the mounting program are sucked, and step # 3
Implementation is performed according to the following processing procedure.

With the above processing operations, if the mounting operations are performed in the mounting order specified by the mounting program,
Even if a change occurs in the mounting order in a mounting program in which the mounted electronic components do not interfere with the suction nozzles 1 to 4, the grouping of the mounting programs is changed and efficient execution is performed. Can be divided into groups.

In step # 10, when there is no electronic component that could not be mounted, it is determined whether or not all programs for mounting have been completed (# 11).
If the mounting has been completed, the mounting operation ends. If the mounting has not been completed, the process returns to step # 2 and the above processing is repeated.

[0021]

As described above, according to the present invention, the shape of the electronic component and the shape of the holding means are adjusted so that the previously mounted electronic component does not interfere with the holding means of the electronic component. When mounting and holding a plurality of electronic components by a plurality of component holding means based on a mounting program set in a mounting order set from the relationship, if a mounting error or the like occurs, a mounting error or the like is performed. After giving priority to mounting of the generated electronic component and the electronic component irrespective of the mounting order based on the interference relationship, the electronic component in which the mounting error has occurred and the electronic component to be paired together with the electronic component of the subsequent mounting are included in the plurality of electronic components. It is held by the component holding means and mounted. Therefore, the mounting order can be changed based on the interference relationship, so that mounting can be performed with flexibility and mounting efficiency can be improved.

[Brief description of the drawings]

FIG. 1 is a flowchart showing a processing procedure of an electronic component mounting method according to an embodiment of the present invention.

FIG. 2 is a perspective view illustrating a configuration of an electronic component mounter.

FIG. 3 is a front view showing a configuration of a suction nozzle portion of the above device.

FIG. 4 is an explanatory diagram illustrating an interference relationship between a suction nozzle and an electronic component.

[Explanation of symbols]

 1, 2, 3, 4 suction nozzles (part holding means)

Claims (1)

[Claims] A relationship between a shape and a mounting position of an electronic component and a shape of a component holding unit that holds the electronic component and performs a mounting operation, such that the component holding unit does not interfere with the previously mounted electronic component. An electronic component mounting method for mounting a plurality of electronic components held by a plurality of component holding units in accordance with the mounting order based on a mounting program set in a mounting order, the plurality of electronic components held by the plurality of component holding units In the above, a pair is extracted to observe the mounting order, and when a mounting error occurs, mounting of other electronic components except for the electronic component that is the mounting target and the paired electronic component is performed. After performing the mounting, the electronic component in which the mounting error has occurred and the electronic component to be paired are held together with the subsequently mounted electronic component by the plurality of component holding units and mounted. Instrumentation method.