JPH10321829A - Solid-state image pickup device package and image pickup device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To eliminate dead spaces from a solid-state image pickup device package and improve the positional accuracy and noise shielding effect of the package by providing a step between a position control member attaching surface on the rear surface of the package and the surface of the package electrically connected to a printed board. SOLUTION: On a chip carrier type solid-state image pickup device package 1, a step is provided between a position control member 2 attaching surface 11 on the rear surface of the package 1 and the surface 12 of the package 1 soldered to a printed board 3 so that a relation, t<=L, may be met (where L and t respectively represent the distance between the board 3 and soldered surface 12 of the package 1 and the thickness of the member 2). When the step is provided in such a way, the step between the position control member 2 attaching surface 11 of the package 1 and the surface 12 of the package 1 electrically connected to the printed board 3 can be set at a value which is close to the thickness of the member 2 and can be decided unequivocally as the package 1 with high accuracy. Therefore, dead spaces can be eliminated.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a digital camera,
The present invention relates to a structure of a solid-state imaging device package used for a video camera and the like, and an imaging device using the same.

[0002]

2. Description of the Related Art FIGS. 10 to 12 are sectional explanatory views of three examples of a conventional method of mounting a solid-state imaging device (CCD) of this type.

FIG. 10 is a schematic diagram showing an example of a method of mounting a solid-state image sensor package when a conventional discrete-type package solid-state image sensor is used. In this conventional example, a position regulating member 2 for regulating the position of the solid-state imaging device 9 with respect to the photographing lens optical system 4 is fixed to the back surface which is the reference surface of the solid-state imaging device package 1, and Electrode part 7 of element package 1
Was soldered 8 on the back side of the printed circuit board 3.

FIG. 11 is a schematic view showing an example of a method of attaching a solid-state image sensing device package when a conventional solid-state image sensing device package 1 is processed and an electrode portion 7 is bent. A position regulating member 2 for regulating the position of the solid-state imaging device 9 with respect to the photographing lens optical system 4 is fixed to the back surface, which is the reference surface of the solid-state imaging device package 1, and the electrodes of the solid-state imaging device package 1 are fixed. The part 7 is formed in an L-shape, and the front of the printed circuit board 3 (front)
8 was soldered to the surface.

FIG. 12 is a schematic view showing an example of a method for mounting a solid-state imaging device when a conventional chip carrier type solid-state imaging device package is used. When a solid-state imaging device of a chip carrier type package is used, the position regulating member 2 cannot be fixed to the back surface, which is the reference surface of the solid-state imaging device package 1, and is fixed to the front surface.

[0006]

However, FIG.
In the configuration example using the conventional discrete type solid-state image pickup device package shown in FIG. 1, the soldering portion 8 of the electrode portion 7 is 3 is protruded from the back side, and that portion becomes a dead space in reducing the size of the device, which has been a problem.

On the other hand, in the conventional configuration example using the solid-state image pickup device package shown in FIG. 11 in which the electrode portion is bent, the soldering portion 8 of the electrode portion 7 becomes the front surface of the printed circuit board 3 and the back surface. Dead space is gone.

However, it is necessary to chuck the electrode portion 7 when the electrode portion 7 is formed. However, in order to secure such a portion, the electrode portion 7 is moved from the mounting surface of the position regulating member 2 of the solid-state imaging device package 1 to the electrode portion 7. Cannot be reduced, and the space between the position regulating member 2 and the printed circuit board 3 becomes a dead space. Further, there is a large variation from the mounting surface of the position regulating member 2 to the bent portion of the electrode portion 7. If the chucking is incomplete, chip cracks will occur during molding. Furthermore, there are various problems such as chip destruction caused by an electromotive force generated during molding.

Further, in the configuration example using the conventional chip carrier type solid-state image pickup device package shown in FIG. 12, the soldered portion 8 of the electrode portion 7 is on the front surface of the printed circuit board 3 and the dead portion on the rear surface is not provided. No space left. However, since the position regulating member 2 cannot be fixed to the back surface which is the reference surface of the solid-state imaging device package 1,
The configuration is fixed to the front surface of the package, and there is a problem that positional accuracy cannot be obtained between the taking lens optical system 4 and the solid-state imaging device 9.

In recent years, the pixels of the solid-state image sensor have become finer. However, since the pixels become more susceptible to dust, the front surface of the solid-state image sensor package is provided with a rubber packing or the like for dust prevention. It is desired to attach.
However, in the case where the rubber gasket is attached by the configuration in which the position regulating member is provided on the front surface of the package, if the rubber gasket is sandwiched between the package and the position regulating member 2, the elasticity of the rubber is reduced. Therefore, there is also a problem that the position regulation of the solid-state imaging device 9 is incomplete.

The solid-state imaging device 9 is generally very susceptible to the effects of noise. If a shield case is provided as a countermeasure against this, the overall thickness becomes large. Had become a problem.

The present invention has been made in view of the above-described aspects, and uses a solid-state imaging device package of this type which has no dead space, has good positional accuracy, and has a shielding effect against noise. It is intended to provide an imaging device.

[0013]

Accordingly, the present invention achieves the above object by providing a solid-state imaging device package or an imaging device using the same according to the following items (1) to (3). What you want to do.

(1) A photographing lens optical system, a chip carrier type solid-state image sensor package containing a solid-state image sensor, a position regulating member for regulating the position of the solid-state image sensor package with respect to the optical system, and the solid-state image sensor The solid-state imaging device package used for an imaging device having a printed board having a land portion for making electrical connection with the mounting surface of the position regulating member on the back surface of the solid-state imaging device package; A solid-state imaging device package, wherein a step is provided between a printed circuit board and a surface for electrical connection.

(2) An image pickup apparatus using the solid-state image pickup device package described in the above item (1).

(3) A ground pattern that covers at least the back surface of the solid-state imaging device package is formed on a surface of the printed circuit board opposite to a surface that is electrically connected to the solid-state imaging device. The imaging device according to 2).

[0017]

According to the structure of the present invention as described above, the difference between the mounting surface of the solid-state image sensor package for position control and the surface of the solid-state image sensor package for electrical connection with the printed circuit board is adjusted. Since the thickness can be set close to the thickness of the member and can be determined uniquely and accurately with the package, dead space can be eliminated.

Further, since the electrode portion of the solid-state imaging device package is electrically connected to the front surface of the printed circuit board, dead space on the back surface of the printed circuit board, which is a problem in the conventional example, can be eliminated. .

Further, according to the above-described method of mounting the solid-state image pickup device, the ground opposite to the surface of the printed circuit board which is electrically connected to the solid-state image pickup device is formed so as to substantially cover the printed circuit board. By forming the pattern, a shielding effect against noise can be obtained.

[0020]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below.
This will be described in detail based on a plurality of embodiments.

[0021]

FIG. 1 is a schematic view showing a method of mounting a fixed image pickup device according to the present embodiment, and FIG. 2 is a view of a solid-state image pickup device package and a position regulating member as viewed from above. The same (corresponding) components as those in FIGS. 10 to 12 are denoted by the same reference numerals.

That is, 1 is a solid-state image pickup device package,
Reference numeral 2 denotes a position regulating member, 3 denotes a printed board, and 4 denotes a photographing lens optical system. Further, 5/6 indicates a hole / projection, 7 indicates an electrode, 8 indicates a soldered portion, and 9 indicates a solid-state imaging device (CCD).

The solid-state image pickup device package 1 is a chip carrier type solid-state image pickup device package. The distance between the mounting surface of the position control member 2 on the back surface and the surface to be soldered to the printed circuit board 3 is L, When the thickness of the member 2 is t, a step is provided so that t ≦ L.

Here, the solid-state imaging device package 1 is formed by laminating ceramic wafers as shown in a sectional view of FIG. Therefore, the solid-state imaging device mounting surface 10, the mounting surface 11 of the position regulating member, and the electric bonding surface 12 to be soldered to the printed board 3 are precisely and unambiguously determined.

The position regulating member 2 regulates the position of the solid state imaging device 9 in the optical axis direction by abutting against the position regulating member mounting surface 11 of the solid state imaging device package 1. In addition, the position in the plane direction perpendicular to the optical axis is regulated by bonding the solid-state imaging device package 1 to the member 2 using a jig for positioning with respect to the position regulating member 2.

At this time, as a method of regulating the position of the solid-state imaging device 9 in a plane direction perpendicular to the optical axis, as shown in FIG. 13 may be engaged with the corresponding projection 14 provided on the position regulating member 2, or as shown in FIG. The shape may be such that the position is regulated by the portion 15 and its side end surface.

In addition, as shown in FIG. 6, in order to prevent the solid-state image pickup device package 1 from being attached to the position regulating member 2 in the opposite direction, as shown in FIG.
It is desirable to form a step 16 for preventing reverse attachment, and to provide an extension 17 also for the position control member 2 for preventing reverse attachment.

As described above, the electrode portion 7 of the solid-state imaging device package 1 whose position is regulated by the position regulating member 2 is:
The printed circuit board 3 is soldered to a land formed on the same surface as the solid-state imaging device package.

The position regulating member 2 is abutted against the photographing lens optical system 4 to regulate the position of the solid-state image pickup device 9 in the optical axis direction with respect to the photographing lens optical system 4. And a hole 5 provided in the position regulating member 2;
When the corresponding projection 6 provided on the photographing lens optical system 4 is engaged, the position of the solid-state imaging device 9 in the plane direction perpendicular to the optical axis with respect to the photographing lens optical system 4 is regulated.

With the above configuration, the solid-state imaging device 9
Mounting surface 10 and mounting surface 1 of position regulating member 2
An accuracy of 1 is obtained. Also, the solid-state imaging device package 1
Since the difference between the mounting surface 11 of the position controlling member and the surface of the solid-state imaging device package 1 for electrically connecting the printed circuit board 3 can be set to a thickness close to that of the position controlling member 2, dead space is reduced. Can be eliminated. Further, since the electrode portion of the solid-state imaging device package is electrically connected to the front surface of the printed circuit board, it is necessary to eliminate dead space on the back surface of the printed circuit board which is a problem in the conventional example. It is made possible.

Further, in this configuration, as shown in FIG. 7, a ground pattern 18 almost covering the printed circuit board 3 is provided on the surface opposite to the surface on which the printed circuit board 3 is electrically connected.
In addition, by connecting the ground portion to a predetermined potential (including ground), a shielding effect can be obtained, which is effective for the solid-state imaging device 9 that is easily affected by noise. At this time, the printed circuit board 3 is
As shown in FIG. 8, a higher shielding effect can be obtained by folding the solid-state imaging device package 1 into a box shape so as to cover almost the solid-state imaging device package 1.

Further, as shown in FIG. 9, the formed ground pattern 18 is provided with a slit 19 so as to surround the back side of the land, so that the solid-state imaging device package 1 can be soldered. It is also possible to prevent the escape of heat.

The ground pattern may be at least approximately the same size as the back surface of the solid-state image sensor package, provided directly behind the package to prevent noise from entering from the back surface of the package.

[0034]

As described above, according to the present invention,
A photographing lens optical system, a chip carrier type solid-state imaging device package containing the solid-state imaging device, a position regulating member for regulating a position of the solid-state imaging device package with respect to the optical system, and an electrical connection with the solid-state imaging device. In the solid-state imaging device package used for an imaging device including a printed board having a land portion, the mounting surface of the position regulating member on the back surface of the solid-state imaging device package,
By using a solid-state imaging device package having a step on a surface of the solid-state imaging device package that electrically connects to a printed board, a mounting surface of a position regulating member of the solid-state imaging device package, and the solid-state imaging device package The difference from the surface for making an electrical connection with the printed circuit board can be set to a thickness close to that of the position regulating member and the package can be uniquely determined with high accuracy, so that dead space can be eliminated.

Further, since the electrode portion of the solid-state imaging device package is electrically connected to the front surface of the printed circuit board, the dead space on the back surface of the printed circuit board, which is a problem in the conventional example, can be eliminated. .

Further, according to the embodiment of the present invention, in addition to the above effects, a shielding effect against noise can be obtained without using a shield case.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing a method for mounting a fixed imaging device according to an embodiment.

FIG. 2 is a top view of a solid-state imaging device package and a position regulating member according to the embodiment;

FIG. 3 is a cross-sectional view of the solid-state imaging device package according to the embodiment;

FIG. 4 is a diagram illustrating an example of a method for positioning the solid-state imaging device with respect to the position regulating member according to the embodiment;

FIG. 5 is a diagram showing an example of a method for positioning the solid-state imaging device with respect to the position regulating member according to the embodiment.

FIG. 6 is a diagram illustrating an example of a method for positioning the solid-state imaging device with respect to the position regulating member according to the embodiment.

FIG. 7 is a diagram illustrating an example of a ground pattern according to the embodiment;

FIG. 8 is a view showing the shape of a substrate bent in a box shape according to the embodiment.

FIG. 9 is a diagram illustrating an example of a ground pattern according to the embodiment;

FIG. 10 is a schematic view showing a conventional example using a discrete-type solid-state imaging device package.

FIG. 11 is a diagram showing a conventional example using a solid-state imaging device package in which an electrode portion is bent into an L shape.

FIG. 12 is a diagram showing a conventional example using a chip carrier type solid-state imaging device package.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 solid-state image sensor package 2 position-regulating member 3 printed circuit board 4 photographing lens optical system 5 hole 6 protrusion 7 electrode 8 soldering portion 9 solid-state image sensor 10 solid-state image sensor mounting surface 11 position-controlling member mounting surface 12 electricity Bonding surface 13 Hole 14 Protrusion 15 Step 16 Reverse prevention step 17 Board extension 18 Ground pattern 19 Slit

Claims (3)

[Claims] An image pickup lens optical system, a chip carrier type solid-state image sensor package containing a solid-state image sensor, a position regulating member for regulating a position of the solid-state image sensor package with respect to the optical system, and the solid-state image sensor. In the solid-state imaging device package used for an imaging device having a printed board having a land portion for making electrical connection, a mounting surface of the position regulating member on a back surface of the solid-state imaging device package, and printing of the solid-state imaging device package A solid-state imaging device package, wherein a step is provided between a substrate and a surface for making electrical connection. 2. A solid-state imaging device package of a chip carrier type accommodating a photographic lens optical system, a solid-state imaging device, a position regulating member for regulating a position of the solid-state imaging device package with respect to the optical system, and the solid-state imaging device. In the solid-state imaging device package used for an imaging device having a printed board having a land portion for making electrical connection, a mounting surface of the position regulating member on a back surface of the solid-state imaging device package, and printing of the solid-state imaging device package An image pickup apparatus using a solid-state image pickup device package having a step between a substrate and a surface to be electrically connected. 3. A ground pattern that covers at least the back surface of the solid-state imaging device package is formed on a surface of the printed circuit board opposite to a surface that is electrically connected to the solid-state imaging device. An imaging device according to claim 1.