JPH10319424A - Liquid crystal display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a liquid crystal display device in which reliability in connections is high by adhering a liquid crystal display element and semiconductor elements. SOLUTION: A liquid crystal display element 1 in which liquid crystal is sealed between a central transparent insulating substrate 2 and a peripheral transparent insulating substrate 4 which are overlapped with each other and semiconductor element 3 driving the liquid crystal display element 1 are constituted so that the ridgelines of at least two sides or more of adhesive surfaces are chamfered, adhered and connected. By the above described constitution, when the semiconductor elements 3 are heat-pressed with an anisotropic conductive adhesive 5, the enlarging of the contact areas of the adhesive and the enlarging of the adhesive strength are attained and then the liquid crystal display device in which reliability in connections is high is obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display device, and more particularly to a semiconductor device which is a driving IC constituting a liquid crystal display device.

[0002]

2. Description of the Related Art Generally, in a liquid crystal display device, a Tape Automated Bond is used as a means for mounting a bare IC for driving a liquid crystal around the liquid crystal display panel.
ing method (hereinafter referred to as TAB method), Chip On G
A lass method (hereinafter referred to as a COG method) is known.

In the TAB method, there is a connection step of connecting and mounting an IC on a tape carrier and then connecting the tape carrier to a peripheral portion of a liquid crystal display panel.

On the other hand, the COG method, particularly the COG method by the face-down bonding method, is a method of directly connecting an IC and an electrode on a liquid crystal display panel, and does not require a tape carrier as a member. IC can be mounted by connection,
The feature is that the process can be shortened and the cost can be reduced, and the number of products manufactured by the COG method in the industry is increasing.

In this COG method, as shown in FIGS. 3 and 4, generally, a semiconductor element 3 is attached to one long side and one short side of a peripheral portion of a central transparent insulating substrate 2 of a liquid crystal display element 1. Is directly connected to the peripheral transparent insulating substrate 4 via a conductive adhesive or an anisotropic conductive adhesive 5. Then, input F
A liquid crystal display device is configured by connecting the PC 6. 7 denotes a sealing resin, and 8 denotes a semiconductor element without chamfer.

[0006] On the glass surface, ITO which is a transparent electrode or aluminum which is a low-resistance electrode is patterned, and the ITO or aluminum electrode and the electrode of the semiconductor element 3 are aligned to form an anisotropic conductive material. The electrical connection is made with the conductive adhesive 5.

As the semiconductor element 3, a semiconductor element having an electrode in which a gold projection is formed on an aluminum pad via a barrier metal, which is an alloy of chromium and copper, is used.

The semiconductor element 3 is cut off from the wafer by a dicing apparatus. At this time, since each blade is kept fully cut by a blade, each ridge line of the semiconductor element is left standing because the edge is sharp. There was a problem that chipping easily occurred.

[0009]

In the conventional structure as described above, the side surface of the liquid crystal display element 1 of the semiconductor element 3 is completely cut by a dicing device or the like. While the corners remain sharp, a conductive adhesive or
They are directly connected via the anisotropic conductive adhesive 5. Therefore, there is a problem that the anisotropic conductive adhesive 5 does not flow smoothly to the bonding surface of the semiconductor element 3 and the adhesive property around the semiconductor element 3 becomes unstable.

Further, there is a problem that each ridge line of the semiconductor element 3 is liable to be chipped due to the state where the semiconductor device 3 is fully cut.

An object of the present invention is to solve such a conventional problem and to provide a liquid crystal display device having high bonding reliability.

[0012]

SUMMARY OF THE INVENTION In order to solve the above-mentioned conventional problems, the present invention provides a semiconductor device having an aluminum electrode and a passivation film formed on one surface thereof on an electrode formed on a transparent insulating substrate. In a liquid crystal display device electrically connected via a conductive adhesive containing conductive particles,
The bonding surface of the semiconductor element has a chamfered ridge line. By this means, it is possible to realize a liquid crystal display device in which a conductive adhesive flows around the bonding surface of the semiconductor element and is firmly bonded.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention provides a semiconductor device having an aluminum electrode and a passivation film formed on one surface on a transparent insulating substrate as described in the claims. In a liquid crystal display device electrically connected through an adhesive, at least two or more ridges of the bonding surface of the semiconductor element can be set as chamfered ridges. The bonding surface of the semiconductor element has a chamfered ridge line. In particular, if the semiconductor element is square, at least two or more of the four ridge lines may be chamfered ridge lines.

According to this configuration, the flow of the conductive adhesive becomes more natural, and the periphery of the semiconductor element bonding surface can be held more firmly than in the conventional example in which the edge is formed without chamfering, so that the bonding reliability can be increased. .

[0015]

An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a plan view of an essential part showing an embodiment of a mounting means of a driving semiconductor element constituting a liquid crystal display device according to the present invention, and FIG. 2 is a sectional view taken along line AA of FIG. is there.

In the drawings, the same parts as those shown in the above-described conventional example are denoted by the same reference numerals, and detailed description is omitted.

First, a semiconductor element in which at least two ridges are chamfered with an anisotropic conductive adhesive 5 on the external connection terminals formed on the peripheral transparent insulating substrate 4 with an anisotropic conductive adhesive 5 with a C of 100 μm or more. 3 is thermocompression-bonded. The chamfering can be easily performed by performing the cutting and chamfering at the same time if a dicing saw requires two or more axes in a dicing step of cutting the chamfered semiconductor element 3 into chips from a wafer state.

In general, dicing is performed by full cutting with a 25 μm thick aluminum sintered diamond blade. The chamfering is performed with a resin blade having a thickness of 300 μm or more and an angle of 90 °.

As described above, according to this embodiment, C100 is applied to two or more ridges of the adhesive surface of the chamfered semiconductor element 3.
By providing a chamfer of at least μm, the fluidity of the anisotropic conductive adhesive 5 at the time of thermocompression bonding is made smooth, and the anisotropic conductive adhesive 5
The bonding reliability can be improved by improving the wetting area for the semiconductor element 3 having the chamfer.

Further, there is an effect of reducing chipping during handling of the semiconductor element 3 chamfered in the mounting process.

[0022]

As described above, according to the liquid crystal display device of the present invention, by chamfering the ridge line on the bonding surface side of the semiconductor element around the liquid crystal display element, the flow of the adhesive becomes smoother and the periphery of the semiconductor element becomes smoother. Therefore, it is possible to realize an excellent liquid crystal display device in which the bonding reliability can be enhanced because the liquid crystal display device can be held firmly.

[Brief description of the drawings]

FIG. 1 is a plan view of a main part of a liquid crystal display device according to an embodiment of the present invention.

FIG. 2 is a sectional view taken along line AA of FIG. 1;

FIG. 3 is a plan view of a main part of a liquid crystal display device in a conventional example.

FIG. 4 is a sectional view taken along line BB of FIG. 3;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Liquid crystal display element 2 Central transparent insulating substrate 3 Semiconductor element 4 Peripheral transparent insulating substrate 5 Anisotropic conductive adhesive 6 FPC 7 Seal resin 8 Semiconductor element without chamfer

Claims (2)

[Claims] 1. A liquid crystal display device in which a semiconductor element having an aluminum electrode and a passivation film formed on one surface is electrically connected to an electrode formed on a transparent insulating substrate via a conductive adhesive containing conductive particles. 3. The liquid crystal display device according to claim 1, wherein the bonding surface of the semiconductor element has a chamfered ridge line. 2. The liquid crystal display device according to claim 1, wherein the semiconductor element has a quadrangular shape, and has a chamfered ridge line of at least two sides on a bonding surface with the electrode.