JPH10296159A - Coating device of adhesive - Google Patents

Coating device of adhesive

Info

Publication number
JPH10296159A
JPH10296159A JP9112287A JP11228797A JPH10296159A JP H10296159 A JPH10296159 A JP H10296159A JP 9112287 A JP9112287 A JP 9112287A JP 11228797 A JP11228797 A JP 11228797A JP H10296159 A JPH10296159 A JP H10296159A
Authority
JP
Japan
Prior art keywords
discharge port
adhesive
coating
temp
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9112287A
Other languages
Japanese (ja)
Inventor
Koji Okawa
浩二 大川
Hachirou Nakatsuji
八郎 中逵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP9112287A priority Critical patent/JPH10296159A/en
Publication of JPH10296159A publication Critical patent/JPH10296159A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To make a coating position and a coating shape definite and to enable a coating device to stably apply by providing a temp. controller for keeping an adhesive at a specified viscosity at an injection time and making tearing-off from a discharge port stable, in the coating device in which the inside of a housing container having a discharge port at the bottom is pressurized and the adhesive is pushed out from the discharge port. SOLUTION: An adhesive coating part mounted to a head of an XY robot has a coating unit 1 forming a discharge port 2 at the tip and an adhesive 3 is pushed out from the discharge port 2 by pressure of a plunger 4 working in the coating unit 1. At this time, a discharge port heater 5 is provided at the outer periphery of the discharge port 2, also a housing 6 is provided on the outer periphery of the coating unit 1 and a hot wind is fed into the housing 6 and adjusts the temp. in the housing 6 so as to become a fixed temp. That is, a temp. sensor 7 for temp. adjustment is provided in the vicinity of the tip of the discharge port at the inside of an opening part for the discharge port 2 of the housing 6 and the temp. of the hot wind is adjusted so as to become always the fixed temp. in accordance with the output of the temp. sensor 7.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【発明の属する技術分野】本発明は、電子回路部品を接
着剤で基板に仮固定し、実装するための接着剤塗布装置
に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive applying device for temporarily fixing an electronic circuit component to a substrate with an adhesive and mounting the same.

【従来の技術】従来、電子部品の電極部を基板上にはん
だ付けする工程は、基板上の電子部品実装位置に塗布さ
れた接着剤の上に、電子部品を装着して仮固定した後、
はんだが溶融しているはんだ槽に浸漬することにより行
われていた。従来の接着剤塗布方法を使用する接着剤塗
布装置について、図3及び図4を参照して説明する。図
3及び図4において、1は先端に吐出口2を形成した塗
布ユニット、3は塗布ユニット1に充填した接着剤であ
り、塗布ユニット1内で動作するプランジャー4の圧力
により吐出口2から押し出される。5は吐出口2の外周
に設けられた吐出口ヒータ、8は基板、9は上記基板8
の部品実装表面に対して平行なXY平面において、XY
方向に移動する位置決め手段を有するXYロボットで、
X方向移動手段11と上記X方向移動手段11に設けら
れたY方向移動手段12a、12bとを有し、上記X方
向移動手段7には、上記塗布ユニット1を装着したヘッ
ド10が移動自在に取り付けられている。尚、塗布ユニ
ット1内のプランジャー4の動作はばねの反発力と圧縮
空気の組み合わせで制御される。このように構成される
従来の接着剤塗布装置における動作を説明する。前工程
から移送されてきた基板8をXYロボット9の所定位置
に固定し、X方向移動手段11とY方向移動手段12
a、12bでヘッド10を移動させることにより吐出口
2を基板8における電子部品実装位置の上まで移動させ
る。次いで、開閉バルブを開き、圧縮空気を塗布ユニッ
ト1内に送り込んで、プランジャー4を上昇させる。次
に、上昇しきったプランジャー4はバネの反発力を利用
して元の位置に戻される。このときに発生する圧力で塗
布ユニット1内の接着剤3を吐出口2から噴射し、電子
部品実装位置に塗布が行われる。この際、基板8に塗布
する接着剤3の量は、プランジャー4のストローク、上
記圧縮空気の開閉バルブの開放時間、吐出口2の吐出口
ヒータ5の温度などの条件によって調整する。その後、
吐出口2を次の電子部品実装位置へ移動し、接着剤3の
噴射塗布の各動作を繰り返して行い、全ての電子部品実
装位置への接着剤3の塗布を完了する。そして、基板5
を次の電子部品実装工程に移送して、電子部品を接着剤
3上に装着する。そして、電子部品が装着された基板5
を更に接着剤硬化工程に移送して、電子部品を基板8に
実装する。
2. Description of the Related Art Conventionally, in a process of soldering an electrode portion of an electronic component on a substrate, the electronic component is mounted and temporarily fixed on an adhesive applied to a mounting position of the electronic component on the substrate.
This has been done by immersing in a solder bath in which the solder is molten. An adhesive applying apparatus using a conventional adhesive applying method will be described with reference to FIGS. 3 and 4, reference numeral 1 denotes a coating unit having a discharge port 2 formed at the tip, and 3 denotes an adhesive filled in the coating unit 1, and the adhesive is discharged from the discharge port 2 by the pressure of a plunger 4 operating in the coating unit 1. Extruded. 5 is a discharge port heater provided on the outer periphery of the discharge port 2, 8 is a substrate, 9 is the substrate 8
XY plane parallel to the component mounting surface
An XY robot having positioning means that moves in the direction,
It has an X-direction moving unit 11 and Y-direction moving units 12a and 12b provided on the X-direction moving unit 11, and the X-direction moving unit 7 can move the head 10 on which the coating unit 1 is mounted so as to be movable. Installed. The operation of the plunger 4 in the application unit 1 is controlled by a combination of a spring repulsion and compressed air. The operation of the conventional adhesive coating apparatus configured as described above will be described. The substrate 8 transferred from the previous process is fixed at a predetermined position of the XY robot 9, and the X direction moving means 11 and the Y direction moving means 12 are fixed.
The ejection port 2 is moved to a position above the electronic component mounting position on the substrate 8 by moving the head 10 at a and 12b. Next, the open / close valve is opened, and compressed air is sent into the application unit 1 to raise the plunger 4. Next, the plunger 4 that has risen completely is returned to the original position by using the repulsive force of the spring. The adhesive 3 in the application unit 1 is jetted from the discharge port 2 by the pressure generated at this time, and the application is performed at the electronic component mounting position. At this time, the amount of the adhesive 3 applied to the substrate 8 is adjusted depending on conditions such as the stroke of the plunger 4, the opening time of the compressed air opening / closing valve, the temperature of the discharge port heater 5 of the discharge port 2, and the like. afterwards,
The discharge port 2 is moved to the next electronic component mounting position, and each operation of spraying and applying the adhesive 3 is repeated to complete the application of the adhesive 3 to all the electronic component mounting positions. And the substrate 5
Is transferred to the next electronic component mounting step, and the electronic component is mounted on the adhesive 3. Then, the substrate 5 on which the electronic components are mounted
Is further transferred to an adhesive curing step, and the electronic component is mounted on the substrate 8.

【発明が解決しようとする課題】上述した接着剤塗布装
置においては、使用する接着剤や使用環境温度によって
噴射状態が安定しないという問題がある。これらに使わ
れる接着剤は温度に対する粘度の変化が敏感であり、温
度変化は粘度変化を意味する。接着剤は吐出口のヒータ
で加熱され一定粘度に保たれ、噴射塗布を繰り返すが、
噴射後には噴射引きちぎれの一部が吐出口側に残り、吐
出口先端部には一定量の接着剤が溜まりを形成する。こ
の溜まりは噴射待機中に外気にさらされ、その時間によ
って温度(粘度)が変化し、噴射時の引きちぎれ方にば
らつきが生じ、噴射位置・塗布形状に影響を与えるとい
う問題があった。この問題は吐出口ヒータ温度と外気温
度の差が大きい時に起きやすい。本発明は、このような
問題点を解決するためになされたもので、吐出口先端部
を覆い、その中を温調することにより、吐出口先端部の
接着剤溜まりを一定の温度(粘度)に保ち、噴射時の引
きちぎれ方を一定にし、噴射ばらつきを解消することに
よって、常に安定した塗布位置・塗布形状にて塗布を行
うことができる接着剤塗布装置を提供することを目的と
する。
The above-mentioned adhesive coating apparatus has a problem that the jetting state is not stable depending on the adhesive used and the temperature of the use environment. Adhesives used in these are sensitive to a change in viscosity with temperature, and a change in temperature means a change in viscosity. The adhesive is heated by the heater at the discharge port and maintained at a constant viscosity, and spray coating is repeated,
After the ejection, a part of the ejection tear remains on the ejection port side, and a fixed amount of adhesive is formed at the tip of the ejection port. This pool is exposed to the outside air during standby for injection, and the temperature (viscosity) changes depending on the time, causing a variation in tearing during injection, which has a problem of affecting the injection position and coating shape. This problem tends to occur when the difference between the discharge port heater temperature and the outside air temperature is large. The present invention has been made in order to solve such a problem, and covers the tip of the discharge port and regulates the temperature in the tip so that the adhesive pool at the tip of the discharge port has a constant temperature (viscosity). It is an object of the present invention to provide an adhesive coating apparatus capable of constantly performing coating at a stable coating position and coating shape by keeping the tearing method at the time of spraying constant and eliminating jetting variations.

【課題を解決するための手段】本発明における接着剤塗
布装置は、吐出口を底面に有する接着剤の収納容器と、
収納容器内を加圧し、加圧力によって吐出口から接着剤
を押し出し、回路基板に噴射塗布する接着剤塗布装置に
おいて、噴射時に接着剤を常に一定粘度に保ち、吐出口
からの引きちぎれを安定にする温調装置を具備したこと
を特徴とした接着剤の塗布装置としたものであり、この
本発明によれば、噴射ばらつきのない安定した接着剤塗
布が得られる。
According to the present invention, there is provided an adhesive applying apparatus, comprising: an adhesive container having a discharge port on a bottom surface;
In an adhesive application device that pressurizes the inside of the storage container, extrudes the adhesive from the discharge port by applying pressure, and spray-applies it to the circuit board, the adhesive always keeps a constant viscosity at the time of spraying and stabilizes tearing from the discharge port. According to the present invention, it is possible to obtain a stable adhesive application without jetting variation.

【発明の実施の形態】本発明の請求項1に記載の発明
は、吐出口を底面に有する接着剤の収納容器と、収納容
器内を加圧し、加圧力によって吐出口から接着剤を押し
出し、回路基板に噴射塗布する接着剤塗布装置におい
て、吐出口先端部雰囲気を一定温度に保つ温調装置を設
けたことを特徴とする接着剤の塗布装置であり、吐出口
先端部を温調することにより、噴射時に接着剤を常に一
定粘度に保ち、吐出口からの引きちぎれを安定にし、塗
布位置・塗布形状を一定化する作用を有する。請求項2
に記載の発明は、接着剤収納容器の吐出口を除いて全体
を覆い、熱風供給手段を備えたハウジングと、ハウジン
グの吐出口先端近傍に設けた温度センサーを備えた温調
装置により、吐出口先端部雰囲気を一定温度に保つこと
を特徴とする請求項1記載の接着剤の塗布装置であり、
吐出口先端部はハウジングで覆われているので、外気の
影響を受けず、安定した状態で接着剤を噴射できる作用
を有する。さらに、吐出部先端部の温度は吐出部先端近
傍に設けた温度センサーにより調整されるので、常時一
定温度に保つことができる作用を有する。 (実施の形態)このように構成される接着剤塗布部は、
図3に示すような接着剤塗布装置を構成するXYロボッ
ト9に備わるヘッド10に装着される。図1は本発明の
塗布部構成を示す断面図であり、図1において、1は先
端に吐出口2を形成した塗布ユニット、3は塗布ユニッ
ト1に充填した接着剤であり、塗布ユニット1内で動作
するプランジャー4の圧力により吐出口2から押し出さ
れる。5は吐出口2の外周に設けられた吐出口ヒータ
で、塗布ユニット1の外周には吐出口2を残して全体を
覆うハウジング6が設けられ、ハウジング6内には熱風
が送り込まれて、ハウジング6内を一定温度になるよう
に調整している。7はハウジング6の吐出口2用の開口
部内側の吐出口先端近傍に設けられた温度調整用の温度
センサーである。次に本発明の具体例を図2に基づいて
説明する。図2は塗布動作の工程を示す図である。ハウ
ジング内は、熱風により加温され、吐出口先端部の雰囲
気は吐出口先端近傍に設けた温度センサーにより、常時
一定温度になるように設定されている。図において、
(a)は原点状態であり、吐出口先端部の接着剤溜まり
は、常時一定温度(粘度)に保たれている。(b)では
プランジャーが上昇し、次に、(c−1)でプランジャ
ーが下降しきったときに圧力が発生し、瞬時に接着剤は
噴射塗布され、(c−2)で原点位置に戻る。尚、ハウ
ジング内の温度は、ノズル先端近傍の温度センサー7に
よって常に一定温度になるように制御され、温度として
は、接着剤の種類や環境条件で異なるが30〜50℃が
好ましい。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention provides a container for storing an adhesive having a discharge port on the bottom surface, pressurizing the inside of the storage container, and extruding the adhesive from the discharge port by pressing force. An adhesive coating device for spray-coating a circuit board, wherein a temperature control device for maintaining an atmosphere at the tip of the discharge port at a constant temperature is provided, and the temperature of the tip of the discharge port is controlled. Accordingly, the adhesive has an effect of always maintaining a constant viscosity at the time of spraying, stabilizing tearing from the discharge port, and stabilizing an application position and an application shape. Claim 2
The invention described in (1) is characterized in that the outlet is covered by a housing provided with hot air supply means and a temperature control device provided with a temperature sensor provided near the tip of the outlet of the housing, except for the outlet of the adhesive storage container. The adhesive coating apparatus according to claim 1, wherein the tip end atmosphere is maintained at a constant temperature,
Since the front end of the discharge port is covered with the housing, the discharge port has an effect of being able to jet the adhesive in a stable state without being affected by the outside air. Further, since the temperature at the tip of the discharge unit is adjusted by a temperature sensor provided near the tip of the discharge unit, it has the effect of always being able to maintain a constant temperature. (Embodiment) The adhesive application section configured as described above is
It is mounted on a head 10 provided on an XY robot 9 constituting an adhesive application device as shown in FIG. FIG. 1 is a cross-sectional view showing the configuration of a coating unit according to the present invention. In FIG. 1, reference numeral 1 denotes a coating unit having a discharge port 2 formed at the tip, and 3 denotes an adhesive filled in the coating unit 1. And is pushed out from the discharge port 2 by the pressure of the plunger 4 operating at the time. Reference numeral 5 denotes a discharge port heater provided on the outer circumference of the discharge port 2. A housing 6 is provided on the outer circumference of the coating unit 1 so as to cover the entirety except for the discharge port 2. Hot air is fed into the housing 6, and 6 is adjusted to a constant temperature. Reference numeral 7 denotes a temperature sensor for temperature adjustment provided near the tip of the discharge port inside the opening for the discharge port 2 of the housing 6. Next, a specific example of the present invention will be described with reference to FIG. FIG. 2 is a diagram showing the steps of the coating operation. The interior of the housing is heated by hot air, and the atmosphere at the tip of the discharge port is set to be always at a constant temperature by a temperature sensor provided near the tip of the discharge port. In the figure,
(A) is the origin state, and the adhesive pool at the tip of the discharge port is always maintained at a constant temperature (viscosity). In (b), the plunger is raised, and then, when the plunger is completely lowered in (c-1), pressure is generated, and the adhesive is instantaneously spray-applied. Return. The temperature in the housing is controlled by the temperature sensor 7 near the nozzle tip so as to be always constant. The temperature is preferably 30 to 50 ° C., although it varies depending on the type of adhesive and environmental conditions.

【発明の効果】本発明の接着剤塗布装置は、吐出口を底
面に有する接着剤の収納容器と、収納容器内を加圧し、
加圧力によって吐出口から接着剤を押し出し、回路基板
に噴射塗布する接着剤塗布装置において、噴射時に接着
剤を常に一定粘度に保ち、吐出口からの引きちぎれを安
定にする温調装置を具備したことを特徴とした接着剤の
塗布装置であり、吐出口先端部を温調するこよにより、
噴射時における接着剤を常に一定粘度に保ち、吐出口か
らの引きちぎれを安定にし、塗布位置・塗布形状を一定
化し、安定塗布が可能であるという効果を奏する。
According to the present invention, there is provided an adhesive applying apparatus comprising: an adhesive container having a discharge port on a bottom surface;
An adhesive application device that extrudes adhesive from a discharge port by applying pressure and spray-coats the circuit board with a temperature control device that constantly maintains the adhesive at a constant viscosity during spraying and stabilizes tearing from the discharge port. This is an adhesive coating device characterized by the following features:
The adhesive has a constant viscosity at the time of spraying, stabilizes tearing from the discharge port, stabilizes the application position and application shape, and achieves an effect of enabling stable application.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の実施形態における塗布部の構造を示す
断面図である。
FIG. 1 is a cross-sectional view illustrating a structure of a coating unit according to an embodiment of the present invention.

【図2】本発明の実施形態における塗布動作の工程を示
す断面図である。
FIG. 2 is a cross-sectional view showing a step of a coating operation in the embodiment of the present invention.

【図3】塗布装置を示す斜視図である。FIG. 3 is a perspective view showing a coating apparatus.

【図4】従来方式における塗布部を示す断面図である。FIG. 4 is a cross-sectional view showing a coating unit in a conventional method.

【符号の説明】[Explanation of symbols]

1 塗布ユニット 2 吐出口 3 接着剤 4 プランジャー 5 吐出口ヒータ 6 ハウジング 7 温度センサー 8 基板 9 XYロボット 10 ヘッド 11 X方向移動手段 12 Y方向移動手段 DESCRIPTION OF SYMBOLS 1 Application unit 2 Discharge port 3 Adhesive 4 Plunger 5 Discharge port heater 6 Housing 7 Temperature sensor 8 Substrate 9 XY robot 10 Head 11 X direction moving means 12 Y direction moving means

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 吐出口を底面に有する接着剤の収納容器
と、収納容器内を加圧し、加圧力によって吐出口から接
着剤を押し出し、回路基板に噴射塗布する接着剤塗布装
置において、吐出口先端部雰囲気を一定温度に保つ温調
装置を設けたことを特徴とする接着剤の塗布装置。
1. An adhesive container having a discharge port on the bottom surface of an adhesive, and an adhesive coating apparatus for pressurizing the inside of the storage container, extruding the adhesive from the discharge port by pressurizing force, and spray-coating the circuit board. An adhesive coating device, comprising a temperature control device for maintaining the atmosphere at the tip at a constant temperature.
【請求項2】 接着剤収納容器の吐出口を除いて全体を
覆い、熱風供給手段を備えたハウジングと、ハウジング
の吐出口先端近傍に設けた温度センサーを備えた温調装
置により、吐出口先端部雰囲気を一定温度に保つことを
特徴とする請求項1記載の接着剤の塗布装置。
2. A tip end of a discharge port formed by a housing provided with hot air supply means and entirely covered with a hot air supply means, and a temperature control device provided near a tip end of the discharge port of the housing. 2. The apparatus for applying an adhesive according to claim 1, wherein the atmosphere of the section is maintained at a constant temperature.
JP9112287A 1997-04-30 1997-04-30 Coating device of adhesive Pending JPH10296159A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9112287A JPH10296159A (en) 1997-04-30 1997-04-30 Coating device of adhesive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9112287A JPH10296159A (en) 1997-04-30 1997-04-30 Coating device of adhesive

Publications (1)

Publication Number Publication Date
JPH10296159A true JPH10296159A (en) 1998-11-10

Family

ID=14582924

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9112287A Pending JPH10296159A (en) 1997-04-30 1997-04-30 Coating device of adhesive

Country Status (1)

Country Link
JP (1) JPH10296159A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006035057A (en) * 2004-07-26 2006-02-09 Matsushita Electric Ind Co Ltd Adhesive applicator and its application method
CN109413874A (en) * 2018-09-06 2019-03-01 芜湖职业技术学院 A kind of printed circuit board automatic drier

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006035057A (en) * 2004-07-26 2006-02-09 Matsushita Electric Ind Co Ltd Adhesive applicator and its application method
CN109413874A (en) * 2018-09-06 2019-03-01 芜湖职业技术学院 A kind of printed circuit board automatic drier

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