JPH10294328A - Gold-alloy thin wire for bonding - Google Patents

Gold-alloy thin wire for bonding

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Publication number
JPH10294328A
JPH10294328A JP9984997A JP9984997A JPH10294328A JP H10294328 A JPH10294328 A JP H10294328A JP 9984997 A JP9984997 A JP 9984997A JP 9984997 A JP9984997 A JP 9984997A JP H10294328 A JPH10294328 A JP H10294328A
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JP
Japan
Prior art keywords
gold
germanium
palladium
weight
thin wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9984997A
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Japanese (ja)
Other versions
JP3729302B2 (en
Inventor
Masao Naito
雅夫 内藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Metal Mining Co Ltd
Original Assignee
Sumitomo Metal Mining Co Ltd
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Application filed by Sumitomo Metal Mining Co Ltd filed Critical Sumitomo Metal Mining Co Ltd
Priority to JP9984997A priority Critical patent/JP3729302B2/en
Publication of JPH10294328A publication Critical patent/JPH10294328A/en
Application granted granted Critical
Publication of JP3729302B2 publication Critical patent/JP3729302B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide the gold-alloy thin wire for bonding the sufficient mechanical characteristics without decreasing the junction strength with chip electrodes even when the space between the chip electrodes and the external width of a lead frame are narrowed furthermore. SOLUTION: Adjustment is performed so than palladium has 0.02-2.0 wt.%, germanium has 0.01-1.5 wt.% and the remaining part becomes gold and the unavoidable impurities of these materials. In addition, one or more kinds of materials selected from the group comprising beryllium, magnesium, calcium, strontium, barium, gallium, indium, thallium, tin, lead, yttrium and other rare- earth elements are added so that the total amount becomes 1-20 ppm. Then the mechanical characteristics of the alloy thin wire are further improved. Furthermore, it is recommendable that the weight ratio of palladium and germanium is set at 1:0.2-1:0.8.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は半導体素子上のチッ
プ電極と外部リードとを電気的に接続するために用いら
れるボンディング用金合金細線に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding gold alloy thin wire used for electrically connecting a chip electrode on a semiconductor element to an external lead.

【０００２】[0002]

【従来の技術】トランジスタ、ＩＣ、ＬＳＩなどの半導
体素子をリードフレームを用いて実装する際、これら半
導体素子上のチップ電極とリードフレームの外部リード
とを線径１０〜１００ミクロンの金合金線や金線を用いて電
気的に接続している。これは、金合金線や金線が耐食
性、 接合性の上で優れているためである。2. Description of the Related Art When mounting semiconductor elements such as transistors, ICs and LSIs using lead frames, chip electrodes on these semiconductor elements and external leads of the lead frame are connected with gold alloy wires having a wire diameter of 10 to 100 microns. They are electrically connected using gold wires. This is because gold alloy wires and gold wires are excellent in corrosion resistance and bonding properties.

【０００３】一方、電子機器の低コスト化の要求は厳し
く、これに答えるべくより細い金合金線や金線の使用が
検討されている。また近年の半導体素子のチップ電極数
の増加に伴い、チップ電極間隔やリードフレームの外部
リード幅が狭化してきており、この点からも金合金線や
金線の大幅な細線化が必要となってきている。[0003] On the other hand, the demand for lowering the cost of electronic equipment is severe, and the use of finer gold alloy wires and gold wires is being studied to respond to this demand. Also, with the recent increase in the number of chip electrodes of semiconductor elements, the spacing between chip electrodes and the width of external leads of lead frames have been narrowing, and from this point it is necessary to make gold alloy wires and gold wires significantly thinner. Is coming.

【０００４】従来の金合金線や金線をそのまま細線化し
ようとすると、得られる細線が柔らかすぎる等により使
用できないものとなる。そのため、原料となる高純度金
中に他の元素を微量添加して得られる細線の機械的特性
を改良することがよく知られている。例えば特公昭57-3
4659号公報には高純度金にカルシウムを添加して機械的
特性を改良する方法が、また、特公昭62-23455号公報に
高純度金にパラジウムを添加して機械的特性を改良する
方法が、特公平7-62186号公報には高純度金にゲルマニ
ウムを添加して機械的特性を改良する方法が開示されて
いる。If a conventional gold alloy wire or gold wire is to be thinned as it is, the obtained thin wire becomes too soft and cannot be used. Therefore, it is well known that the mechanical properties of fine wires obtained by adding trace amounts of other elements to high-purity gold as a raw material are improved. For example, Japanese Patent Publication No. 57-3
No. 4659 discloses a method for improving mechanical properties by adding calcium to high purity gold, and Japanese Patent Publication No. 62-23455 discloses a method for improving mechanical properties by adding palladium to high purity gold. Japanese Patent Publication No. 7-62186 discloses a method for improving mechanical properties by adding germanium to high-purity gold.

【０００５】しかしながら金中に他の元素を単に添加す
る方法では、大幅な細線化を可能とすべく機械的強度を
飛躍的に向上させようと添加量を多くすると、例えば、
ボンディング時に正常なボールが形成出来ない、また例
えば、ボール表面に添加物が析出するために、チップ電
極との接合力が低下してしまうといった現象が生ずる。
そのため、金中に他の元素を添加するという従来の方法
では、大幅な細線化を可能とするほど機械的性質を飛躍
的に向上させるのは困難である。However, in the method of simply adding another element to gold, if the amount of addition is increased in order to dramatically improve the mechanical strength in order to enable a great thinning, for example,
A normal ball cannot be formed at the time of bonding, and a phenomenon occurs, for example, in which the additive is precipitated on the ball surface, and the bonding strength with the chip electrode is reduced.
Therefore, in the conventional method of adding another element to gold, it is difficult to dramatically improve the mechanical properties so as to enable a great thinning.

【０００６】このため、より一層狭化されたチップ電極
間隔やリードフレームの外部リード幅に充分対応できる
金合金細線が提供されているとは未だいえない。[0006] For this reason, it has not yet been said that a gold alloy thin wire which can sufficiently cope with a further narrowed chip electrode interval or an external lead width of a lead frame has been provided.

【０００７】[0007]

【発明が解決しようとする課題】本発明は上記状況を解
決すべくなされたものであり、チップ電極との接合力を
低下させることなく、かつ十分な機械的特性を備えたボ
ンディング用金合金細線の提供を課題とするものであ
る。DISCLOSURE OF THE INVENTION The present invention has been made to solve the above-mentioned situation, and has a thin gold alloy wire for bonding having sufficient mechanical characteristics without lowering the bonding strength with a chip electrode. The purpose is to provide

【０００８】[0008]

【課題を解決するための手段】本発明者は上記課題を解
決するために鋭意検討した結果、パラジウムとゲルマニ
ウムと金とで主として構成した金合金において、パラジ
ウムとゲルマニウムとの添加量を調整すれば上記課題を
解決できることを見出し本発明にいたった。Means for Solving the Problems The inventors of the present invention have conducted intensive studies to solve the above-mentioned problems, and as a result, it has been found that in a gold alloy mainly composed of palladium, germanium and gold, the amount of palladium and germanium added is adjusted. The present inventors have found that the above problems can be solved, and have reached the present invention.

【０００９】すなわち、上記課題を解決する本発明の金
合金細線は、パラジウムが０．０２〜２．０重量%、ゲ
ルマニウムが０．０１〜１．５重量%、残部が金及びこ
れらの不可避不純物となるように調整されたものであ
る。In other words, the gold alloy thin wire of the present invention which solves the above-mentioned problems has a palladium content of 0.02 to 2.0% by weight, a germanium content of 0.01 to 1.5% by weight, a balance of gold and inevitable impurities thereof. It has been adjusted so that

【００１０】また上記組成に加え、ベリリウム、マグネ
シウム、カルシウム、ストロンチウム、バリウム、ガリ
ウム、インジウム、タリウム、錫、鉛、イットリウム、
その他の希土類元素からなる群より選ばれた１種以上
を合量で１〜２０ｐｐｍとなるように添加した合金細線
もより機械的特性が向上したものとなり上記課題を解決
するものである。In addition to the above composition, beryllium, magnesium, calcium, strontium, barium, gallium, indium, thallium, tin, lead, yttrium,
An alloy fine wire in which one or more selected from the group consisting of other rare earth elements are added in a total amount of 1 to 20 ppm also has improved mechanical properties, and solves the above problem.

【００１１】なお、パラジウムとゲルマニウムとの重量
比は１：０．２〜１：０．８とすることが望ましい。The weight ratio of palladium to germanium is desirably 1: 0.2 to 1: 0.8.

【００１２】[0012]

【発明の実施の形態】パラジウムもゲルマニウムも共に
金合金の強度を高める。本発明では両者を添加する。そ
うすることによりそれぞれを単独で添加した場合より著
しく金合金の強度を向上させることができる。この効果
はＰｄ2Ｇｅ、ＰｄＧｅ等の金属間化合物が微細に金中
に析出するためと考えられる。なお、これらの金属間化
合物はワイヤーボンディング時のボール形成時には母相
である金中に再溶融するために、チップ電極との接合性
を阻害することはない。DETAILED DESCRIPTION OF THE INVENTION Both palladium and germanium increase the strength of gold alloys. In the present invention, both are added. By doing so, the strength of the gold alloy can be remarkably improved as compared with the case where each is added alone. This effect is considered to be due to the fine precipitation of intermetallic compounds such as Pd2Ge and PdGe in gold. In addition, since these intermetallic compounds are re-melted in the gold which is a parent phase at the time of ball formation at the time of wire bonding, they do not hinder the bondability with the chip electrode.

【００１３】パラジウムの添加量が０．０２重量%未
満、及びゲルマニウムの添加量が０．０１重量%未満で
は、母相に固溶しているそれぞれの濃度が低いために金
属間化合物を形成して析出するということが困難であ
り、金合金の強度が高くなることは期待できにくい。When the added amount of palladium is less than 0.02% by weight and the added amount of germanium is less than 0.01% by weight, the concentration of each of the solid solutions in the matrix is low, so that an intermetallic compound is formed. Therefore, it is difficult to expect that the strength of the gold alloy is increased.

【００１４】一方、パラジウムの添加量が２．０重量
%、ゲルマニウムの添加量が１．５重量%を超えると、十
分な強度上昇効果は認められるが、析出した金属間化合
物が伸線加工中の破断の起点となり、著しく生産性を悪
化させてしまう。またパラジウムとゲルマニウムとの比
は、金属間化合物の組成から重量比で１：０．２〜１：
０．８がとすることが好ましい。On the other hand, when the amount of palladium added is 2.0 weight
%, When the addition amount of germanium exceeds 1.5% by weight, a sufficient strength increasing effect is recognized, but the precipitated intermetallic compound becomes a starting point of breakage during wire drawing, and significantly lowers productivity. . The ratio of palladium to germanium is from 1: 0.2 to 1: weight ratio based on the composition of the intermetallic compound.
0.8 is preferable.

【００１５】金属間化合物の析出による強度上昇効果を
十分に発揮させるためには伸線加工途中で時効熱処理を
施すのが好ましい。時効熱処理条件としては温度を２０
０〜４５０℃とし、処理時間を１０〜１２０分とするの
が望ましい。また時効熱処理は伸線加工中、もしくは半
導体素子への損傷がない範囲内の条件でワイヤーボンデ
ィング後に行ってもよい。伸線加工中に時効熱処理を行
う場合には、金属間化合物の析出強化効果を十分に発揮
させるために、線径２．０ｍｍ以下でできるだけ最終線
径に近い時点で行うのが望ましい。In order to sufficiently exert the effect of increasing the strength due to the precipitation of the intermetallic compound, it is preferable to perform aging heat treatment during the wire drawing. The aging heat treatment condition is a temperature of 20.
It is preferable that the temperature is 0 to 450 ° C. and the processing time is 10 to 120 minutes. Further, the aging heat treatment may be performed during wire drawing or after wire bonding under conditions within a range that does not damage the semiconductor element. When performing the aging heat treatment during the wire drawing, it is desirable that the heat treatment be performed at a wire diameter of 2.0 mm or less and as close to the final wire diameter as possible in order to sufficiently exert the effect of strengthening the precipitation of the intermetallic compound.

【００１６】上記組成の金合金にベリリウム、マグネシ
ウム、カルシウム、ストロンチウム、バリウム、ガリウ
ム、インジウム、タリウム、錫、鉛、イットリウム、そ
の他の希土類元素からなる群より選ばれた少なくとも１
種以上を微量添加すると、さらなる強度の向上が見られ
る。しかしながらこれらの元素の添加合量が１ｐｐｍ未
満では機械的性質は向上せず、また添加量合量が２０ｐ
ｐｍを超えるとボンディング時に形成されるボールの表
面に添加元素の酸化物が析出し、ボール表面を覆ってし
まうことがありチップ電極との接合性が悪化することが
ある。The gold alloy having the above composition has at least one selected from the group consisting of beryllium, magnesium, calcium, strontium, barium, gallium, indium, thallium, tin, lead, yttrium, and other rare earth elements.
When a trace amount of a seed or more is added, a further improvement in strength is observed. However, if the added amount of these elements is less than 1 ppm, the mechanical properties are not improved, and the added amount is less than 20 ppm.
If it exceeds pm, an oxide of the additional element precipitates on the surface of the ball formed at the time of bonding, and may cover the surface of the ball, thereby deteriorating the bondability with the chip electrode.

【００１７】本発明の金合金細線は例えば、以下のよう
にして製造できる。まず純度９９．９９９重量%以上の
高純度金とパラジウム、ゲルマニウム、ベリリウム、マ
グネシウム、カルシウムなどの添加元素とを用いて母合
金を作製し、添加元素の含有量を分析する。次に計算量
の母合金を高純度金とともに不活性雰囲気中で溶解混合
し、鋳造し、水冷することにより鋳塊を得、得た鋳塊を
溝ロール圧延を施して所定の線径にした後、順次口径の
小さいダイスを通して伸線加工し、その途中の適当な個
所で時効熱処理を行う。また時効熱処理の前に加工歪み
を取り除くために焼き鈍し処理を入れても良い。最終線
径まで伸線後、伸び率が所定の範囲に入るように熱処理
を施す。The fine gold alloy wire of the present invention can be produced, for example, as follows. First, a mother alloy is prepared using high-purity gold having a purity of 99.999% by weight or more and an additional element such as palladium, germanium, beryllium, magnesium, and calcium, and the content of the additional element is analyzed. Next, a calculated amount of the mother alloy was melt-mixed in an inert atmosphere together with high-purity gold, cast, and cooled by water to obtain an ingot, and the obtained ingot was subjected to groove roll rolling to a predetermined wire diameter. Thereafter, wire drawing is performed sequentially through a die having a smaller diameter, and an aging heat treatment is performed at an appropriate location in the middle. Before the aging heat treatment, an annealing treatment may be performed in order to remove processing strain. After drawing to the final wire diameter, heat treatment is performed so that the elongation rate falls within a predetermined range.

【００１８】[0018]

【実施例】次に実施例を用いて本発明をさらに説明す
る。Next, the present invention will be further described with reference to examples.

【００１９】［実施例１〜２３、比較例１〜９］５Ｎの
高純度金とパラジウム、ゲルマニウム、ベリリウム、カ
ルシウム、錫、鉛、希土類元素とを用いてそれぞれの母
合金を作製した。そして、これらの母合金と高純度金と
を適宜秤量採取し、不活性雰囲気中で溶解混合し、鋳造
し、水冷して表１に示す組成の金合金鋳塊を得た。得た
鋳塊を溝ロール圧延し、ダイス線引きを順次行い最終線
径を３０ミクロンとし、最後に伸び率5.0%となるように熱処
理を施した。また、一部のものは線径が１．０ｍｍとな
った段階で４００℃で３０分間保持する時効熱処理を施
した。Examples 1 to 23 and Comparative Examples 1 to 9 Each mother alloy was produced using 5N high-purity gold and palladium, germanium, beryllium, calcium, tin, lead and rare earth elements. Then, these master alloys and high-purity gold were appropriately weighed and collected, melted and mixed in an inert atmosphere, cast, and cooled with water to obtain a gold alloy ingot having the composition shown in Table 1. The obtained ingot was subjected to groove roll rolling and die drawing was performed sequentially to make the final wire diameter 30 μm, and finally heat-treated so as to have an elongation of 5.0%. Some of them were subjected to an aging heat treatment at a stage where the wire diameter became 1.0 mm and kept at 400 ° C. for 30 minutes.

【００２０】 これらの試料を用いて常温強度, 高温強度, ホ゛ール形状,
伸線加工性について試験した。結果を表２に示した。[0020] Using these samples, room temperature strength, high temperature strength, ball shape,
The drawability was tested. The results are shown in Table 2.

【００２１】 なお、各試験項目の測定方法は以下の通りである。 (常温強度, 高温強度)引張試験機を用いて各試料の最大
荷重を測定した。高温強度については250℃の雰囲気中
に２０秒保持し、引き続き引張試験を行っている。[0021] In addition, the measuring method of each test item is as follows. (Normal temperature strength, high temperature strength) The maximum load of each sample was measured using a tensile tester. Regarding the high-temperature strength, the steel sheet was kept in an atmosphere at 250 ° C. for 20 seconds, and a tensile test was subsequently performed.

【００２２】(ボール形状)高速自動ボンダーに付随して
いる電気トーチを用いてボールの大きさが７０ミクロンとな
るようにボールを形成し、その真球度及び表面状態を走
査型顕微鏡にて観察した。各試料２０個ボールを観察し
て１個でも不良があるときには不良と判定した。(Ball shape) A ball is formed using an electric torch attached to a high-speed automatic bonder so that the size of the ball is 70 microns, and the sphericity and surface state are observed with a scanning microscope. did. Observation was made on 20 balls of each sample, and if even one was defective, it was determined to be defective.

【００２３】(伸線加工性)鋳塊１Ｋｇを最終線径である
３０ミクロンまで伸線した際に5回以上断線した試料を伸線
加工性不良と判定した。(Drawability) A sample that was broken 5 times or more when 1 kg of the ingot was drawn to a final wire diameter of 30 μm was judged to have poor drawability.

【００２４】表２から明らかなように、パラジウムが
０．０２〜２．０重量%、ゲルマニウムが０．０１〜
１．５重量%となるようにした実施例１〜１１は、常温
強度が１９ｇｆ以上と比較例７として示された従来組成
のものの機械的性質より向上していることが分かる。ま
たボール形状にも問題がなく、伸線加工性も損なわれて
いない。またパラジウムを０．０２〜２．０重量%、ゲ
ルマニウムを０．０１〜１．５重量%添加し、さらにベ
リリウム、カルシウム、錫、鉛、ランタン、セリウム、
ユウロピウムの内の１種または２種以上を合量で１〜２
０ｐｐｍ添加した実施例１２〜２３は、ボール形状、
伸線加工性の良好さを維持しつつ、さらなる高強度化が
図れている。As is apparent from Table 2, palladium is contained in an amount of 0.02 to 2.0% by weight and germanium in an amount of 0.01 to 2.0% by weight.
It can be seen that in Examples 1 to 11 in which the content was 1.5% by weight, the room-temperature strength was 19 gf or more, which was higher than the mechanical properties of the conventional composition shown as Comparative Example 7. Also, there is no problem in the ball shape, and the wire drawing workability is not impaired. Further, 0.02 to 2.0% by weight of palladium and 0.01 to 1.5% by weight of germanium are added, and beryllium, calcium, tin, lead, lanthanum, cerium,
One or two or more of europium are combined in a total amount of 1 to 2
Examples 12 to 23, in which 0 ppm was added, had a ball shape,
Further strength enhancement is achieved while maintaining good wire drawing workability.

【００２５】一方パラジウムの添加量が０．０２重量%
未満もしくはゲルマニウムの添加量が０．０１重量%未
満の比較例１では十分な機械的性質が得られていない。
パラジウムの添加量が２．０重量%もしくはゲルマニウ
ムの添加量が１．５重量%を超える比較例２〜４は十分
な機械的性質は得られているものの、伸線加工性が悪化
している。さらに比較例４ではボール形状も不良である
ことが分かる。On the other hand, the addition amount of palladium is 0.02% by weight.
Comparative Example 1 containing less than 0.01% by weight or containing less than 0.01% by weight does not have sufficient mechanical properties.
Comparative Examples 2 to 4 in which the amount of palladium added was 2.0% by weight or the amount of germanium exceeded 1.5% by weight, although sufficient mechanical properties were obtained, the wire drawing workability was deteriorated. . Further, in Comparative Example 4, the ball shape was also found to be defective.

【００２６】パラジウムもしくはゲルマニウムを単独で
添加した比較例５〜７では機械的性質の向上効果が十分
ではない。ベリリウム、カルシウムなどに替えてアルミ
ニウムを添加した比較例８では満足できる機械的性質は
得られているが、ボール形状が不良であることが分か
る。In Comparative Examples 5 to 7, in which palladium or germanium was added alone, the effect of improving the mechanical properties was not sufficient. In Comparative Example 8 in which aluminum was added instead of beryllium, calcium, etc., satisfactory mechanical properties were obtained, but it was found that the ball shape was poor.

【００２７】[0027]

【発明の効果】以上のことから明らかなように、本発明
により良好な伸線加工性、ボール形状を損なわずに機械
的性質を著しく向上させることが達成された。従ってワ
イヤー強度を維持しつつ金合金細線の線径を大幅に小さ
くすることが可能となり、半導体の部材コストの低減
や、半導体素子のチップ電極数増加に対応しうるボンデ
ィング用金合金細線を提供することができた。As is evident from the above, according to the present invention, good drawability and mechanical properties were significantly improved without impairing the ball shape. Therefore, it is possible to significantly reduce the wire diameter of the gold alloy thin wire while maintaining the wire strength, and to provide a gold alloy thin wire for bonding that can cope with a reduction in semiconductor member cost and an increase in the number of chip electrodes of a semiconductor element. I was able to.

Claims (3)

【特許請求の範囲】[Claims] 【請求項１】 パラジウムが０．０２〜２．０重量
%、ゲルマニウムが０．０１〜１．５重量%、残部が金及
びこれらの不可避不純物であることを特徴とするボンデ
ィング用金合金細線。1. A palladium content of 0.02 to 2.0 weight
%, Germanium is 0.01 to 1.5% by weight, and the balance is gold and their unavoidable impurities. 【請求項２】 パラジウムが０．０２〜２．０重量
%、ゲルマニウムが０．０１〜１．５重量%であり、ベリ
リウム、マグネシウム、カルシウム、ストロンチウム、
バリウム、ガリウム、インジウム、タリウム、錫、鉛、
イットリウム、 その他の希土類元素からなる群より選
ばれた１種以上が合量で１〜２０ｐｐｍ、残部が金及び
これらの不可避不純物であることを特徴とするボンディ
ング用金合金細線。2. The weight of palladium is 0.02 to 2.0.
%, Germanium is 0.01 to 1.5% by weight, beryllium, magnesium, calcium, strontium,
Barium, gallium, indium, thallium, tin, lead,
A gold alloy thin wire for bonding, characterized in that at least one selected from the group consisting of yttrium and other rare earth elements is 1 to 20 ppm in total, and the balance is gold and their unavoidable impurities. 【請求項３】 パラジウムとゲルマニウムとの重量比
が１：０．２〜１：０．８である請求項１または２記載
の金合金細線。3. The gold alloy thin wire according to claim 1, wherein the weight ratio of palladium to germanium is 1: 0.2 to 1: 0.8.
JP9984997A 1997-04-17 1997-04-17 Gold alloy wire for bonding Expired - Fee Related JP3729302B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9984997A JP3729302B2 (en) 1997-04-17 1997-04-17 Gold alloy wire for bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9984997A JP3729302B2 (en) 1997-04-17 1997-04-17 Gold alloy wire for bonding

Publications (2)

Publication Number Publication Date
JPH10294328A true JPH10294328A (en) 1998-11-04
JP3729302B2 JP3729302B2 (en) 2005-12-21

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ID=14258257

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006035803A1 (en) * 2004-09-30 2006-04-06 Tanaka Denshi Kogyo K.K. Au ALLOY BONDING WIRE

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006035803A1 (en) * 2004-09-30 2006-04-06 Tanaka Denshi Kogyo K.K. Au ALLOY BONDING WIRE
EP1811555A1 (en) * 2004-09-30 2007-07-25 Tanaka Denshi Kogyo Kabushiki Kaisha Au ALLOY BONDING WIRE
KR100899322B1 (en) * 2004-09-30 2009-05-27 타나카 덴시 코오교오 카부시키가이샤 Au ALLOY BONDING WIRE
EP1811555A4 (en) * 2004-09-30 2012-06-20 Tanaka Electronics Ind Au ALLOY BONDING WIRE

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