JPH10294024A - Electric and electronic parts and manufacture thereof - Google Patents

Electric and electronic parts and manufacture thereof

Info

Publication number
JPH10294024A
JPH10294024A JP9116182A JP11618297A JPH10294024A JP H10294024 A JPH10294024 A JP H10294024A JP 9116182 A JP9116182 A JP 9116182A JP 11618297 A JP11618297 A JP 11618297A JP H10294024 A JPH10294024 A JP H10294024A
Authority
JP
Japan
Prior art keywords
coil
metal
laser
resin
laser beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9116182A
Other languages
Japanese (ja)
Inventor
Yoshihiro Komata
芳弘 小俣
Kazuyoshi Umeya
一芳 梅屋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Enomoto Co Ltd
Original Assignee
Enomoto Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enomoto Co Ltd filed Critical Enomoto Co Ltd
Priority to JP9116182A priority Critical patent/JPH10294024A/en
Publication of JPH10294024A publication Critical patent/JPH10294024A/en
Pending legal-status Critical Current

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  • Laser Beam Processing (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide electric and electronic parts in which a coated resin or plating is hardly peeled by irradiating laser beam on a metal surface to form irregularities, then election-molding a resin, a rubber or the like at the irregular site and coating it. SOLUTION: A metal lengthwise coil 1 is plate through a laser printing mechanism 34 from a winding coil 11 and supplied to an injection molding machine 4. The laser printing mechanism 34 has a laser shooting part 341 upwardly and is connected by a high-frequency oscillation power supply and a high-frequency cable 342, and laser beam is continuously or intermittently irradiated from the laser shooting part 341 to the metal lengthwise coil 1. The laser beam reaches a given position on the surface of the metal lengthwise coil 1, the surface of the metal lengthwise coil 1 is roughened in stripe shape, dotted shaped, broken-line shape, roulette-shape, or pear foundation shape. Then, the metal lengthwise coil 1 is supplied to the injection molding machine 4, a molten resin under a high temperature and high pressure is coated with insert-molding, cooled, and cured.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は半導体装置用リードフレ
ーム、コネクター、リレー、水晶振動子、レーザーなど
の電気電子部品に関する。また、本発明はその電気電子
部品の製造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to electrical and electronic parts such as lead frames for semiconductor devices, connectors, relays, crystal oscillators and lasers. The present invention also relates to a method for manufacturing the electric / electronic component.

【0002】[0002]

【従来の技術及び発明が解決しようとする課題】半導体
装置用リードフレーム、コネクター、リレー、水晶振動
子用ベース、キャップ、CD−ROM読み取り用ベー
ス、キャップなどの電気電子部品は、金属長尺コイルを
打抜き加工、曲げ加工、つぶし加工やめっき被覆加工や
各種樹脂、ゴム被覆加工して製造されている。従来は、
めっき被覆加工や各種樹脂、ゴム被覆加工される素材の
金属長尺コイルとして、圧延材をそのまま用いることが
多かった。圧延材は、表面の性状から分類すると、光沢
材、半光沢材、ヘアライン材などがある。いずれの圧延
材もそのままの表面状態で、射出成形機を用いて、熱硬
化性樹脂、熱塑性樹脂、シリコン樹脂、ゴム等をインサ
ートモールドで被覆していた。しかしながら、従来の各
種樹脂、ゴム被覆加工では、樹脂等と金属とのくっつき
が不十分であり、金属と樹脂との界面に微細な隙間が生
じ、樹脂が剥れたり、樹脂等から金属が引き抜けてしま
うという問題がある。また、従来は、圧延材そのままを
洗浄処理した後に、メッキ被覆を行っていたが、素材の
金属とメッキ層とのくっつきが不十分で、めっきが剥れ
たり、そのために電気的導通不良が生じるという問題が
ある。
2. Description of the Related Art Electrical and electronic components such as lead frames for semiconductor devices, connectors, relays, bases for crystal oscillators, caps, CD-ROM reading bases, caps, and the like are made of metal long coils. It is manufactured by punching, bending, crushing, plating coating, and coating with various resins and rubber. conventionally,
Rolled material is often used as it is as a metal long coil made of a material to be plated or coated with various resins or rubber. Rolled materials include glossy materials, semi-glossy materials, hairline materials, and the like, when classified based on surface properties. Each of the rolled materials was coated with a thermosetting resin, a thermoplastic resin, a silicone resin, a rubber, or the like by insert molding using an injection molding machine in the surface state as it was. However, conventional resin and rubber coating processes have insufficient bonding between the resin and the metal and a minute gap at the interface between the metal and the resin, causing the resin to peel off or pulling the metal from the resin or the like. There is a problem of getting out. In the past, plating was performed after washing the rolled material as it was, but the adhesion between the metal and the plating layer of the material was insufficient, and the plating was peeled off, resulting in poor electrical conduction. There is a problem.

【0003】そこで、上記問題点を解決することが、本
発明の目的である。
Therefore, it is an object of the present invention to solve the above problems.

【0004】[0004]

【課題を解決するための手段】上記問題点は、請求項1
に記載の電気電子部品、すなわち、樹脂、ゴム等を射出
成形して被覆しようとする部位の金属表面に予めレーザ
ー光を照射して凹凸を形成してある電気電子部品によっ
て、解決される。
SUMMARY OF THE INVENTION The above problem is solved by claim 1.
In other words, the problem is solved by the electric / electronic component described in (1), that is, the resin / rubber or the like, which is formed by injecting a laser beam into a metal surface of a portion to be covered by injection molding in advance.

【0005】また、上記問題点は、請求項2に記載の電
気電子部品の製造方法、すなわち、金属表面にレーザー
光を照射して凹凸を形成し、その後に、当該凹凸形成部
位に樹脂、ゴム等を射出成形して被覆することを特徴と
する電気電子部品の製造方法によって、解決される。
[0005] Further, the above-mentioned problem is caused by the method of manufacturing an electric / electronic part according to claim 2, that is, forming irregularities by irradiating a metal surface with a laser beam, and then forming resin and rubber on the irregularity-formed portions. This is solved by a method for manufacturing an electric / electronic component, which is characterized by injection-molding and coating the like.

【0006】さらに、上記問題点は、請求項3に記載の
電気電子部品、すなわち、部分メッキを行おうとする部
位の金属表面に予めレーザー光を照射して凹凸を形成し
てある電気電子部品によって、解決される。
Further, the above problem is caused by the electric / electronic component according to the third aspect, that is, the electric / electronic component in which irregularities are formed by previously irradiating a laser beam to a metal surface of a portion to be subjected to partial plating. Will be solved.

【0007】さらにまた、上記問題点は、請求項4に記
載の電気電子部品の製造方法、すなわち、金属表面にレ
ーザー光を照射して凹凸を形成し、その後に、金属表面
の全範囲に下地メッキを行い、さらに、当該凹凸形成部
位の直上の下地メッキの表面に部分メッキ層を形成する
ことを特徴とする電気電子部品の製造方法によって、解
決される。
Further, the above-mentioned problem is caused by a method of manufacturing an electric / electronic component according to claim 4, that is, forming irregularities by irradiating a metal surface with a laser beam, and then forming a base on the entire surface of the metal surface. The problem is solved by a method for manufacturing an electric / electronic component, wherein plating is performed, and a partial plating layer is formed on a surface of a base plating immediately above the concave / convex portion.

【0008】[0008]

【発明の実施の形態】以下、本発明の実施形態の電気電
子部品及びその製造方法について、添付図面を参照し
て、詳細に説明する。
BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, an electric and electronic component according to an embodiment of the present invention and a method for manufacturing the same will be described in detail with reference to the accompanying drawings.

【0009】実施形態1 図1は、本発明の実施形態1のレーザー捺印機及びプレ
ス機の概略図である。
Embodiment 1 FIG. 1 is a schematic view of a laser marking machine and a press according to Embodiment 1 of the present invention.

【0010】材料の金属長尺コイル1は、巻き出しコイ
ル11から第1のレーザー捺印機31、プレス機2、第
2のレーザー捺印機32、第3のレーザー捺印機33の
順に通板されて、巻き取りコイル12に巻き取られる。
各レーザー捺印機31、32、33の上部には、レーザ
ー発射部311、321、331があり、照射するレー
ザー光を通板方向に直角方向に移動させることができ
る。また、各レーザー発射部311、321、331
は、それぞれ、不図示の高周波発振電源と、高周波ケー
ブル312、322、332によって、接続されてい
る。そして、42アロイやステンレス鋼などの鉄系合金
またはりん青銅やベリリウム銅や黄銅や無酸素銅などの
銅系合金の金属長尺コイルには、連続的にあるいは断続
的にレーザー光が照射され、金属長尺コイルの表面はス
トライプ状や梨地状に荒らされる。
The long metal coil 1 of the material is passed through the unwinding coil 11 in the order of a first laser stamping machine 31, a press machine 2, a second laser stamping machine 32, and a third laser stamping machine 33. , And wound up by the winding coil 12.
Laser emitting units 311, 321 and 331 are provided above each of the laser stamping machines 31, 32 and 33, and can irradiate a laser beam to be irradiated in a direction perpendicular to the plate direction. In addition, each of the laser emitting units 311, 321, 331
Are connected to a high-frequency oscillation power supply (not shown) by high-frequency cables 312, 322, and 332, respectively. Then, laser light is continuously or intermittently applied to a long metal coil of an iron-based alloy such as 42 alloy or stainless steel or a copper-based alloy such as phosphor bronze, beryllium copper, brass, or oxygen-free copper, The surface of the long metal coil is roughened in a stripe shape or a satin shape.

【0011】実施形態1においては、レーザー発射部を
すべて金属長尺コイルの上方に配置しているので、金属
長尺コイルの上面だけ、片面だけにレーザー光が照射さ
れ、荒らされる。一方、他の実施形態として、複数のレ
ーザー発射部のうち、一部を金属長尺コイルの上方に配
置し、残りを金属長尺コイルの下方に配置してもよい。
この不図示の実施形態によれば、金属長尺コイルの上面
及び下面にレーザー光を照射し、両面を荒らすことがで
きる。
In the first embodiment, since all the laser emitting portions are disposed above the long metal coil, only the upper surface or only one surface of the long metal coil is irradiated with the laser beam to be roughened. On the other hand, as another embodiment, a part of the plurality of laser emitting units may be arranged above the long metal coil, and the rest may be arranged below the long metal coil.
According to the embodiment (not shown), the upper and lower surfaces of the long metal coil can be irradiated with laser light to roughen both surfaces.

【0012】また、実施形態1においては、レーザー捺
印機を、プレス機の上流に1台、下流に2台配置してい
るが、別の実施形態として、下流にのみ1台設置するよ
うに変更しても良いし、上流にのみ1台設置するように
変更しても良い。
In the first embodiment, one laser marking machine is arranged upstream of the press machine and two laser marking machines are arranged downstream. However, in another embodiment, one laser marking machine is arranged only downstream. Alternatively, it may be changed so that only one device is installed upstream.

【0013】実施形態2 図2は、本発明の実施形態2のレーザー捺印機及び射出
成形機の概略図である。
Embodiment 2 FIG. 2 is a schematic view of a laser marking machine and an injection molding machine according to Embodiment 2 of the present invention.

【0014】材料の金属長尺コイル1は、巻き出しコイ
ル11から第4のレーザー捺印機34に通板されて、射
出成形機4へと供給される。実施形態2で用いる材料の
金属長尺コイルは、プレス品であっても良いし、プレス
メッキ品であっても良い。第4のレーザー捺印機34は
上方に、レーザー発射部341を有し、不図示の高周波
発振電源と、高周波ケーブル342によって、接続され
ている。レーザー発射部341から金属長尺コイル1へ
とレーザー光が、連続的に、あるいは、断続的に、照射
され、また、レーザー光を金属長尺コイルの走行方向の
直角方向に走査させ振らすことができる。そして、レー
ザー光は金属長尺コイルの表面の所定位置に当たり、金
属長尺コイルの表面はストライプ状、点線状、波線状、
ローレット状あるいは梨地状に荒らされる。その後に、
金属長尺コイル1は、射出成形機4に供給されて、高温
高圧で溶融状態の樹脂をインサートモールドによって被
覆され、冷却固化されるのである。
The metal long coil 1 of the material is passed from the unwinding coil 11 to a fourth laser marking machine 34 and supplied to the injection molding machine 4. The metal long coil made of the material used in the second embodiment may be a pressed product or a press-plated product. The fourth laser marking machine 34 has a laser emitting unit 341 above, and is connected to a high-frequency oscillation power supply (not shown) by a high-frequency cable 342. Laser light is continuously or intermittently irradiated from the laser emitting section 341 to the metal long coil 1, and the laser light is scanned and shaken in a direction perpendicular to the running direction of the metal long coil. Can be. The laser beam hits a predetermined position on the surface of the long metal coil, and the surface of the long metal coil has a stripe shape, a dotted line shape, a wavy line,
Knurled or satin-like. Then,
The long metal coil 1 is supplied to the injection molding machine 4, coated with a resin in a molten state at a high temperature and a high pressure by insert molding, and cooled and solidified.

【0015】この樹脂被覆される部位を予めレーザー光
で荒らしておくので、樹脂被覆された金属長尺コイルの
断面は図4及び図5に示すようになる。図4において
は、金属長尺コイル1の表面にストライプ状あるいは縞
状にレーザー光を照射してストライプ状の凹部101、
102、103、104、105、106を形成し、こ
の凹凸形成部に樹脂41を被覆してある。また、図5に
おいては、金属長尺コイル1の表面100、110に分
散的にレーザー光を照射して、梨地状凹凸111、11
2を形成し、その凹凸形成部に樹脂を被覆してある。
Since the resin-coated portion is previously roughened with a laser beam, the cross section of the resin-coated metal long coil is as shown in FIGS. 4 and 5. In FIG. 4, the surface of the long metal coil 1 is irradiated with laser light in the form of stripes or stripes to form a stripe-shaped concave portion 101,
102, 103, 104, 105, and 106 are formed, and the resin 41 is coated on the uneven portions. In FIG. 5, laser light is scattered onto the surfaces 100 and 110 of the long metal coil 1 so that
2 is formed, and a resin is coated on the uneven portion.

【0016】比較例 比較例として、ロール表面に凹凸を設けた溝付きロール
を用いて圧延し、金属長尺コイルの表面に凹凸を形成し
た。その後に、本実施形態と同様に、射出成形機を用い
て、凹凸形成部に樹脂を被覆した。しかし、いわゆる機
械的に刻印を行うと、凹凸形成とともに金属長尺コイル
や打抜き微細部分が伸び寸法精度が悪化するという欠点
がある。また、凹凸形成部がきれいすぎて、荒れが不十
分であるため、樹脂の剥離が生じるという欠点がある。
COMPARATIVE EXAMPLE As a comparative example, rolling was performed using a grooved roll having irregularities on the roll surface to form irregularities on the surface of the long metal coil. Then, similarly to the present embodiment, the resin was coated on the concave / convex portion using an injection molding machine. However, when so-called mechanical engraving is performed, there is a drawback that the metal long coil and the minute punched portion are stretched and the dimensional accuracy is deteriorated in addition to the formation of unevenness. In addition, there is a disadvantage that the resin is peeled off because the uneven portion is too clean and the roughness is insufficient.

【0017】一方、本実施形態においては、表面の凹凸
が微細範囲で不規則であるため、樹脂と金属とのくっつ
きがよく、剥離が生じない。また、凹凸のために、樹脂
と金属との接触界面の面積が大きく、外界と内部とを結
ぶ経路の長さが長くなるので、ハンダやフラックスや水
分がこの界面に沿って外界から封止した内部へ侵入しに
くいという効果が得られた。
On the other hand, in the present embodiment, since the irregularities on the surface are irregular in a fine range, the resin and the metal are well adhered to each other, and no peeling occurs. Also, because of the unevenness, the area of the contact interface between the resin and the metal is large, and the length of the path connecting the outside and the inside becomes long, so that solder, flux and moisture are sealed from the outside along this interface. The effect of hardly getting into the inside was obtained.

【0018】実施形態3 図3は、本発明の実施形態3のレーザー捺印機、メッキ
洗浄機及びメッキ機の概略図である。
Third Embodiment FIG. 3 is a schematic diagram of a laser marking machine, a plating cleaning machine, and a plating machine according to a third embodiment of the present invention.

【0019】材料の金属長尺コイル1は、巻き出しコイ
ル11から第5のレーザー捺印機35、メッキ洗浄機5
及びメッキ機6の順に通板される。第5のレーザー捺印
機35は上方に、レーザー発射部351を有し、不図示
の高周波発振電源と、高周波ケーブル352によって、
接続されている。レーザー発射部351から金属長尺コ
イル1へとレーザー光が、連続的に、あるいは、断続的
に、照射され、また、レーザー光を金属長尺コイルの走
行方向の直角方向に走査させ振らすことができる。そし
て、レーザー光は金属長尺コイルの表面の所定位置に当
たり、金属長尺コイルの表面はストライプ状、点線状、
波線状、ローレット状あるいは梨地状に荒らされる。そ
の後に、金属長尺コイル1は、メッキ洗浄機5に供給さ
れる。そして、金属長尺コイル1の表面に付着している
汚れや油が除去され、必要であれば表面酸化層が酸洗い
され除去される。
The long metal coil 1 of the material is fed from the unwinding coil 11 to the fifth laser marking machine 35,
And the plating machine 6. The fifth laser stamping machine 35 has a laser emitting unit 351 above, and is connected to a high-frequency oscillation power supply (not shown) and a high-frequency cable 352.
It is connected. Laser light is continuously or intermittently irradiated from the laser emitting unit 351 to the long metal coil 1, and the laser beam is scanned and shaken in a direction perpendicular to the running direction of the long metal coil. Can be. The laser beam hits a predetermined position on the surface of the metal long coil, and the surface of the metal long coil has a stripe shape, a dotted line shape,
Wavy, knurled or pear-skinned. Thereafter, the long metal coil 1 is supplied to the plating washing machine 5. Then, dirt and oil adhering to the surface of the long metal coil 1 are removed, and if necessary, the surface oxide layer is pickled and removed.

【0020】図6は、実施形態3のメッキ被覆したコネ
クター端子の断面図である。金属1の表面の一部分にレ
ーザー光を照射して梨地状凹凸部113を予め形成す
る。次に、金属の平滑な表面100及び凹凸部113を
含むすべての表面に下地Niメッキ層61を形成する。
下地Niメッキ層61と金属1との界面610、611
は、金属1の表面に隙間なく形成され、特に凹凸部11
3の微細で不規則な凹凸に下地Niめっき層61が入り
込んでいる。下地Niメッキ層61の厚さを所定値以上
にすると、金属1の表面の凹凸にかかわりなく、下地N
iメッキ層の表面612、620は平滑な平面状とな
る。続いて、金属1の凹凸部113の直上の範囲の下地
Niメッキ層61の表面612、620の上に部分Au
メッキ層62が形成される。部分Auメッキ層62の界
面は下地Niメッキ層61の表面620に密着してい
る。通常の繰返し摺動試験や実用の結果、部分Auメッ
キ層は、従来例に比べて剥離しにくく、電気的導通が確
保されており、電気抵抗の劣化もほとんどない。また、
部分Auメッキ層62の表面621は極めて平滑となっ
ている。
FIG. 6 is a sectional view of a plated connector terminal of the third embodiment. A part of the surface of the metal 1 is irradiated with a laser beam to form the satin-like irregularities 113 in advance. Next, a base Ni plating layer 61 is formed on all surfaces including the metal smooth surface 100 and the uneven portions 113.
Interfaces 610 and 611 between base Ni plating layer 61 and metal 1
Are formed on the surface of the metal 1 without gaps, and particularly, the uneven portions 11
3, the underlying Ni plating layer 61 enters the fine and irregular irregularities. When the thickness of the base Ni plating layer 61 is equal to or larger than a predetermined value, the base N
The surfaces 612 and 620 of the i-plated layer have a smooth planar shape. Subsequently, a portion Au is formed on the surfaces 612 and 620 of the base Ni plating layer 61 in a range immediately above the uneven portion 113 of the metal 1.
A plating layer 62 is formed. The interface of the partial Au plating layer 62 is in close contact with the surface 620 of the base Ni plating layer 61. As a result of a normal repeated sliding test and practical use, the partial Au plating layer is harder to peel off than in the conventional example, electrical continuity is secured, and there is almost no deterioration in electric resistance. Also,
The surface 621 of the partial Au plating layer 62 is extremely smooth.

【0021】[0021]

【発明の効果】本発明に係る電気電子部品は、金属表面
に予めレーザー光を照射して凹凸を形成し、その後に、
当該凹凸形成部位に樹脂等を射出成形して被覆している
ので、金属表面に微細で不規則な凹凸が形成され、その
凹凸に樹脂等が微細に入り込み、アンカー効果が生じ
て、樹脂等被覆層が剥離しにくいという効果が得られ
る。
According to the electric / electronic component of the present invention, the metal surface is irradiated with a laser beam in advance to form irregularities.
Because the resin or the like is injection-molded and coated on the irregularity-formed portion, fine irregular irregularities are formed on the metal surface, and the resin or the like penetrates finely into the irregularity, causing an anchor effect and coating the resin or the like. The effect that the layer is hard to peel off is obtained.

【0022】本発明に係る電気電子部品は、金属表面に
予めレーザー光を照射して凹凸を形成し、その後に、当
該凹凸形成部位に樹脂等を射出成形して被覆しているの
で、金属表面に微細で不規則な凹凸が形成され、その凹
凸に樹脂等が微細に入り込み、界面が複雑に屈曲し、ハ
ンダやフラックスや水分がこの界面に沿って通過しにく
いという効果がある。
In the electric / electronic component according to the present invention, the metal surface is irradiated with a laser beam in advance to form irregularities, and thereafter, the irregularities are coated by injection molding resin or the like. Fine irregular irregularities are formed, and the resin and the like penetrate minutely into the irregularities, and the interface is bent in a complicated manner, so that there is an effect that it is difficult for solder, flux and moisture to pass along the interface.

【0023】本発明に係る電気電子部品は、金属表面に
予めレーザー光を照射して凹凸を形成し、その後に、当
該凹凸形成部位にメッキ層を、直接に、あるいは下地メ
ッキ層を介して、形成しているので、金属表面に微細で
不規則な凹凸が形成され、その凹凸にメッキ層が微細に
入り込み、アンカー効果が生じて、めっき層が剥離しに
くいという効果がある。
In the electric / electronic component according to the present invention, the metal surface is irradiated with a laser beam in advance to form irregularities, and thereafter, a plating layer is formed on the irregularity-forming portion, directly or via a base plating layer. Since it is formed, fine and irregular irregularities are formed on the metal surface, and the plating layer penetrates finely into the irregularities, and has an effect that an anchor effect is generated and the plating layer is difficult to peel.

【0024】本発明に係る電気電子部品は、金属表面に
予めレーザー光を照射して凹凸を形成し、その後に、当
該凹凸形成部位にメッキ層を、直接に、あるいは下地メ
ッキ層を介して、形成しているので、汚れや酸化膜が金
属表面からはじき飛ばされ除去されて、金属表面が活性
化されて、下地Niメッキ層が強固に付着され、剥離さ
れにくいという効果がある。
In the electric / electronic component according to the present invention, the metal surface is irradiated with a laser beam in advance to form irregularities, and thereafter, a plating layer is formed on the irregularity-forming portion directly or via a base plating layer. Since it is formed, dirt and oxide films are repelled and removed from the metal surface, the metal surface is activated, and the base Ni plating layer is firmly adhered and has an effect of being hardly peeled off.

【0025】本発明に係る電気電子部品は、金属表面に
予めレーザー光を照射して凹凸を形成し、その後に、当
該凹凸形成部位にメッキ層を、直接に、あるいは下地メ
ッキ層を介して、形成しているので、メッキ層が強固に
付着され、界面に隙間が生じにくく、電気的導通が確保
されるという効果がある。
In the electric / electronic component according to the present invention, the metal surface is irradiated with a laser beam in advance to form irregularities, and thereafter, a plating layer is formed on the irregularity-forming portion directly or via a base plating layer. Since it is formed, there is an effect that the plating layer is firmly attached, a gap is hardly generated at the interface, and electrical conduction is ensured.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明に係る実施形態1のレーザー捺印機及び
プレス機の概略図である。
FIG. 1 is a schematic view of a laser stamping machine and a press according to a first embodiment of the present invention.

【図2】本発明に係る実施形態2のレーザー捺印機及び
射出成形機の概略図である。
FIG. 2 is a schematic view of a laser marking machine and an injection molding machine according to a second embodiment of the present invention.

【図3】本発明に係る実施形態3のレーザー捺印機、メ
ッキ洗浄機及びメッキ機の概略図である。
FIG. 3 is a schematic diagram of a laser stamping machine, a plating cleaning machine, and a plating machine according to a third embodiment of the present invention.

【図4】本発明に係る実施形態2によって、樹脂被覆さ
れた金属長尺コイルの断面図である。
FIG. 4 is a cross-sectional view of a long metal coil coated with a resin according to a second embodiment of the present invention.

【図5】本発明に係る実施形態2によって、樹脂被覆さ
れた金属長尺コイルの断面図である。
FIG. 5 is a cross-sectional view of a long metal coil coated with a resin according to a second embodiment of the present invention.

【図6】本発明に係る実施形態3のメッキ被覆したコネ
クター端子の断面図である。
FIG. 6 is a sectional view of a plated connector terminal according to a third embodiment of the present invention.

【符号の説明】[Explanation of symbols]

1 金属長尺コイル 100 表面 101 ストライプ状の凹部 102 ストライプ状の凹部 103 ストライプ状の凹部 104 ストライプ状の凹部 105 ストライプ状の凹部 106 ストライプ状の凹部 110 表面 111 梨地状凹凸 112 梨地状凹凸 113 凹凸部 2 プレス機 31 第1のレーザー捺印機 311 レーザー発射部 312 高周波ケーブル 32 第2のレーザー捺印機 321 レーザー発射部 322 高周波ケーブル 33 第3のレーザー捺印機 331 レーザー発射部 332 高周波ケーブル 34 第4のレーザー捺印機 341 レーザー発射部 342 高周波ケーブル 35 第5のレーザー捺印機 351 レーザー発射部 352 高周波ケーブル 36 第6のレーザー捺印機 361 レーザー発射部 362 高周波ケーブル 4 射出成形機 41 樹脂 5 メッキ洗浄機 6 メッキ機 61 下地Niメッキ層 610 界面 611 界面 612 表面 620 表面 62 部分Auメッキ層 621 表面 11 巻き出しコイル 12 巻き取りコイル DESCRIPTION OF SYMBOLS 1 Metal long coil 100 Surface 101 Stripe recess 102 Stripe recess 103 Stripe recess 104 Stripe recess 105 Stripe recess 106 Stripe recess 110 Surface 111 Satin texture 112 Satin texture 113 Uneven texture 2 Press machine 31 First laser stamping machine 311 Laser emitting unit 312 High frequency cable 32 Second laser stamping unit 321 Laser emitting unit 322 High frequency cable 33 Third laser marking machine 331 Laser emitting unit 332 High frequency cable 34 Fourth laser Marking machine 341 Laser emitting unit 342 High frequency cable 35 Fifth laser marking machine 351 Laser emitting unit 352 High frequency cable 36 Sixth laser marking machine 361 Laser emitting unit 362 High frequency cable 4 Injection Forms machine 41 resin 5 plated washer 6 plating machine 61 underlying Ni plating layer 610 interface 611 interface 612 surface 620 surface 62 partially Au plating layer 621 surface 11 unwinding coil 12 winding coils

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 FI H01R 13/03 H01R 13/03 D H03H 9/05 H03H 9/05 ──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. 6 Identification code FI H01R 13/03 H01R 13/03 D H03H 9/05 H03H 9/05

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 樹脂、ゴム等を射出成形して被覆しよう
とする部位の金属表面に予めレーザー光を照射して凹凸
を形成してある電気電子部品。
1. An electric / electronic component in which a metal surface of a portion to be covered by injection molding of resin, rubber, or the like is previously irradiated with laser light to form irregularities.
【請求項2】 金属表面にレーザー光を照射して凹凸を
形成し、その後に、当該凹凸形成部位に樹脂、ゴム等を
射出成形して被覆することを特徴とする電気電子部品の
製造方法。
2. A method for producing an electric / electronic component, comprising: irradiating a laser beam on a metal surface to form irregularities; and thereafter, injecting and coating a resin, rubber, or the like on the irregularity-formed portion.
【請求項3】 部分メッキを行おうとする部位の金属表
面に予めレーザー光を照射して凹凸を形成してある電気
電子部品。
3. An electric / electronic component in which a metal surface at a portion where partial plating is to be performed is previously irradiated with laser light to form irregularities.
【請求項4】 金属表面にレーザー光を照射して凹凸を
形成し、その後に、金属表面の全範囲に下地メッキを行
い、さらに、当該凹凸形成部位の直上の下地メッキの表
面に部分メッキ層を形成することを特徴とする電気電子
部品の製造方法。
4. Irradiation of a laser beam on the metal surface to form irregularities, thereafter, undercoating is performed on the entire area of the metal surface, and further, a partial plating layer is formed on the surface of the undercoat immediately above the irregularity forming portion. A method for producing an electric / electronic component, comprising:
JP9116182A 1997-04-18 1997-04-18 Electric and electronic parts and manufacture thereof Pending JPH10294024A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9116182A JPH10294024A (en) 1997-04-18 1997-04-18 Electric and electronic parts and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9116182A JPH10294024A (en) 1997-04-18 1997-04-18 Electric and electronic parts and manufacture thereof

Publications (1)

Publication Number Publication Date
JPH10294024A true JPH10294024A (en) 1998-11-04

Family

ID=14680843

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9116182A Pending JPH10294024A (en) 1997-04-18 1997-04-18 Electric and electronic parts and manufacture thereof

Country Status (1)

Country Link
JP (1) JPH10294024A (en)

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