JPH1117314A - Molded circuit body and its manufacture - Google Patents
Molded circuit body and its manufactureInfo
- Publication number
- JPH1117314A JPH1117314A JP18038997A JP18038997A JPH1117314A JP H1117314 A JPH1117314 A JP H1117314A JP 18038997 A JP18038997 A JP 18038997A JP 18038997 A JP18038997 A JP 18038997A JP H1117314 A JPH1117314 A JP H1117314A
- Authority
- JP
- Japan
- Prior art keywords
- conductor wiring
- wiring pattern
- insulating
- mask
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
Landscapes
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、絶縁基板上に導体
配線パターンを形成させた成形回路体及びその製造方法
に関し、さらに詳しくは、配線ボックス、コネクタ等、
立体的形状を有する絶縁基板の凹部に高精度かつ高密度
な導体配線パターンを形成させた成形回路体及びその製
造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a molded circuit having a conductor wiring pattern formed on an insulating substrate and a method of manufacturing the same.
The present invention relates to a molded circuit having a highly accurate and high-density conductor wiring pattern formed in a concave portion of an insulating substrate having a three-dimensional shape, and a method of manufacturing the same.
【0002】[0002]
【従来の技術】従来、プリント配線基板は、平板状の絶
縁基板上に導体配線パターンを形成したものが主流であ
った。しかしながら、近年、回路部品の実装効率を高め
たり、アセンブリ工程の簡略化等の必要性から、箱形成
型品の内側に配線回路を形成した配線ボックスや、コネ
クタの接続部等、立体的形状を有する絶縁基板の凹部に
導体配線パターンを形成させた成形回路体が用いられる
ようになっている。2. Description of the Related Art Heretofore, printed wiring boards have generally been formed by forming a conductor wiring pattern on a flat insulating substrate. However, in recent years, three-dimensional shapes such as a wiring box having a wiring circuit formed inside a box-formed product and a connector connecting portion have been required due to a need for increasing the mounting efficiency of circuit components and simplifying an assembly process. A molded circuit having a conductor wiring pattern formed in a concave portion of an insulating substrate is used.
【0003】このような立体的形状を有する絶縁基板の
凹部に導体配線パターンを形成させる成形回路体の製造
方法としては、既に種々の方法が開示されている。例え
ば、特開昭64−86590号公報には、金属製仮基材
に反転パターンのマスクを形成し、電解メッキ法により
マスクのすき間に導体配線パターンを形成し、次いで、
その仮基材を金型内に配置して、マスク及び導体配線パ
ターンを形成させた仮基板面上にさらに絶縁基板を射出
成形等により成形した後、絶縁基板から仮基材及びマス
クを除去することにより、立体的形状を有する絶縁基板
の凹部に導体配線パターンを転写して成形回路体とする
方法が開示されている。Various methods have already been disclosed as a method of manufacturing a molded circuit body for forming a conductor wiring pattern in a concave portion of an insulating substrate having such a three-dimensional shape. For example, Japanese Patent Application Laid-Open No. 64-86590 discloses that a mask of an inverted pattern is formed on a metal temporary base material, a conductor wiring pattern is formed in a gap of the mask by electrolytic plating, and then,
After disposing the temporary base in a mold and forming an insulating substrate by injection molding or the like on the temporary substrate surface on which the mask and the conductor wiring pattern are formed, the temporary base and the mask are removed from the insulating substrate. Thus, a method is disclosed in which a conductor wiring pattern is transferred to a concave portion of an insulating substrate having a three-dimensional shape to form a molded circuit body.
【0004】また、特開昭63−299295号公報に
は、樹脂成型用金型の全面に金型との接着性が小さく、
かつ導体配線パターンと同質の下地メッキ皮膜を設け、
その上にレジストを印刷して反転パターンのマスクを形
成し、さらにメッキ法によりマスクのすき間に導体配線
パターンを形成し、その後にレジストを除去し、次い
で、このような金型を用いて絶縁基板を射出成形等によ
り成形することにより、金型表面上に形成した導体配線
パターンを絶縁基板の凹部に転写する方法が開示されて
いる。この方法では、導体配線パターン間の絶縁を確保
するために、成形後にソフトエッチングにより下地メッ
キ皮膜を溶解除去して導体配線パターンを露出させるこ
とが行われている。Japanese Patent Application Laid-Open No. Sho 63-299295 discloses that the adhesiveness with the mold is small over the entire surface of the mold for resin molding.
And a base plating film of the same quality as the conductor wiring pattern is provided,
A resist is printed thereon to form a mask of an inverted pattern, a conductor wiring pattern is formed in a gap of the mask by a plating method, and then the resist is removed, and then the insulating substrate is formed using such a mold. A method of transferring a conductor wiring pattern formed on the surface of a mold to a concave portion of an insulating substrate by molding the same by injection molding or the like. In this method, in order to secure insulation between the conductor wiring patterns, the underlying plating film is dissolved and removed by soft etching after molding to expose the conductor wiring patterns.
【0005】さらに、特開平2−67114号公報に
は、フィルム上に導体箔を張り付け、化学的エッチング
を繰り返すことにより矩形の導体配線パターン素形体と
し、さらにこの導体配線パターン素形体をエッチングし
て段付き状のアンダーカット部を有する導体配線パター
ンとした後、フィルムの張り付け位置を逆転させて配線
回路形成フィルムとし、これを所定の金型に納めて射出
成形等によりフィルム上に絶縁性基材を形成させること
により、絶縁性基材の凹部に導体配線パターンを転写す
るという方法が開示されている。この方法は、導体配線
にアンダーカット部を設けることにより、成型時に樹脂
をアンダーカット部に回り込ませ、導体配線の脱落防止
を図ったものである。Further, Japanese Patent Application Laid-Open No. 2-67114 discloses that a conductor foil is stuck on a film, and a chemical conductor is repeatedly formed into a rectangular conductor wiring pattern body, and the conductor wiring pattern body is further etched. After forming a conductive wiring pattern having a stepped undercut portion, the bonding position of the film is reversed to form a wiring circuit forming film, which is placed in a predetermined mold, and an insulating base material is formed on the film by injection molding or the like. Is disclosed, whereby a conductor wiring pattern is transferred to a concave portion of an insulating base material. In this method, by providing an undercut portion in the conductor wiring, the resin flows around the undercut portion during molding, thereby preventing the conductor wiring from falling off.
【0006】[0006]
【発明が解決しようとする課題】しかし、最初の特開昭
64−86590号公報に開示された方法は、射出成形
後に成型品から仮基材とともにマスクをも除去する方法
であるので、樹脂成型品表面と導体配線表面とは同一平
面とはならず、除去されたマスクの厚さの分だけ樹脂と
導体配線との間に段差が生ずる。そのため、この方法に
より、例えばコネクタを作製した場合、コネクタの挿抜
時にコネクタピンとの間に引っかかりが生じ、コンタク
ト部分が損傷するという問題があった。However, the method disclosed in the first Japanese Patent Application Laid-Open No. 64-86590 is a method of removing a mask together with a temporary base from a molded product after injection molding. The surface of the product and the surface of the conductor wiring are not flush with each other, and a step is generated between the resin and the conductor wiring by the thickness of the removed mask. Therefore, when a connector is manufactured by this method, for example, there is a problem in that the connector is caught between the connector pins when the connector is inserted and withdrawn, and the contact portion is damaged.
【0007】一方、導体配線パターンを形成した仮基材
からマスクのみを除去し、次いで樹脂を成形すれば、成
型品表面と導体配線表面とは同一平面になり、上述の問
題は回避できる。しかし、樹脂が金型と導体配線との間
に微量回り込むため、導体配線パターン表面の清浄度が
低下し、電気的接続に対する信頼性が低下するという問
題があった。On the other hand, if only the mask is removed from the temporary base material on which the conductor wiring pattern is formed, and then the resin is molded, the surface of the molded product and the surface of the conductor wiring become the same plane, and the above-mentioned problem can be avoided. However, there is a problem that since a small amount of resin flows between the mold and the conductor wiring, the cleanliness of the surface of the conductor wiring pattern is reduced, and the reliability for electrical connection is reduced.
【0008】また、2番目の特開昭63−299295
号公報に開示された方法は、導体配線パターンとともに
下地メッキ皮膜をも樹脂表面に転写し、次いで下地メッ
キ皮膜をソフトエッチング等で除去する方法であるの
で、樹脂から露出する導体配線パターンの高さや粗度を
制御するのが困難である。そのため、例えば、コネクタ
を作製した場合、エッチング過剰な部分の導体配線表面
が樹脂表面より低くなり、コネクタピンとの間に接触不
良が生ずるという問題があった。Further, the second Japanese Patent Application Laid-Open No. 63-299295
The method disclosed in Japanese Patent Application Laid-Open Publication No. H11-163873 is a method in which a base plating film is transferred to a resin surface together with a conductor wiring pattern, and then the base plating film is removed by soft etching or the like. It is difficult to control the roughness. Therefore, for example, when a connector is manufactured, there is a problem that the surface of the conductor wiring in an excessively etched portion is lower than the surface of the resin, and a contact failure occurs with the connector pin.
【0009】さらに、最後の特開平2−67114号公
報に開示された方法は、アンダカット部の高さが低いた
め、樹脂の回り込みが不十分となり、脱落に対する信頼
性が低下するという問題があった。しかも、導体配線の
間隔を狭くすると、さらに樹脂の回り込みが不十分とな
るため、高密度配線が困難であるという問題があった。
また、エッチング法によりアンダーカット部を形成して
いるため、フィルム上に張り付けた導体箔の断面積が減
少し、導体配線の電流容量が小さくなるという問題があ
った。Furthermore, the method disclosed in the last Japanese Patent Application Laid-Open No. 2-67114 has a problem in that the height of the undercut portion is low, so that the resin is insufficiently wrapped around, and the reliability against falling off is reduced. Was. In addition, when the distance between the conductor wirings is reduced, the resin is not sufficiently wrapped around, so that there is a problem that high-density wiring is difficult.
Further, since the undercut portion is formed by the etching method, the cross-sectional area of the conductor foil attached on the film is reduced, and there is a problem that the current capacity of the conductor wiring is reduced.
【0010】本発明が解決しようとする課題は、立体的
形状を有する絶縁基板の凹部に高精度かつ高密度な導体
配線パターンを形成することを可能とし、別部品との接
続時に損傷を生じたり導体配線表面の導電性を損なうこ
とがなく、しかも、脱落に対する信頼性が高く、かつ大
電流容量化が可能な成形回路体及びその製造方法を提供
することにある。The problem to be solved by the present invention is to make it possible to form a high-precision and high-density conductor wiring pattern in a concave portion of an insulating substrate having a three-dimensional shape, and to cause damage when connecting to another component. It is an object of the present invention to provide a molded circuit body which does not impair the conductivity of the surface of a conductor wiring, has high reliability against falling off, and can have a large current capacity, and a method for manufacturing the same.
【0011】[0011]
【課題を解決するための手段】この課題を解決するため
に本発明に係る成形回路体は、絶縁基板の表面に導体配
線パターンが形成されてなるものであって、該絶縁基板
の表面には、前記導体配線パターンのすき間に絶縁性マ
スクが該導体配線パターンの表面と略面一に設けられて
いることを要旨とするものである。Means for Solving the Problems In order to solve this problem, a molded circuit body according to the present invention has a conductor wiring pattern formed on a surface of an insulating substrate, and the surface of the insulating substrate has The gist is that an insulating mask is provided in a gap between the conductor wiring patterns so as to be substantially flush with the surface of the conductor wiring patterns.
【0012】上記構成を有する成形回路体によれば、導
体配線の露出面が平坦となっているので、得られた成形
回路体を別部品と接続した場合に、コンタクト部分が損
傷することはなく、アセンブリ工程も簡略化することが
可能となる。According to the molded circuit having the above structure, the exposed surface of the conductor wiring is flat, so that when the obtained molded circuit is connected to another component, the contact portion is not damaged. Also, the assembly process can be simplified.
【0013】また、本発明に係る成形回路体の製造方法
は、導電性を有する仮基板の表面の導体配線パターン領
域以外の領域を絶縁性マスクにより被覆する工程と、該
絶縁性マスクにより被覆されない導体配線パターン領域
に電気メッキ法により導体配線パターンを形成する工程
と、該導体配線パターンの形成面に絶縁性基板を成形す
る工程と、該絶縁性基板上に導体配線パターンと絶縁性
マスクを残し前記仮基板のみを除去する工程と、からな
ることを要旨とするものである。In the method of manufacturing a molded circuit body according to the present invention, a step of covering a region other than the conductor wiring pattern region on the surface of the conductive temporary substrate with an insulating mask, and a step of not covering the region with the insulating mask. Forming a conductive wiring pattern on the conductive wiring pattern area by electroplating, forming an insulating substrate on the surface on which the conductive wiring pattern is formed, and leaving the conductive wiring pattern and the insulating mask on the insulating substrate. Removing only the temporary substrate.
【0014】上記構成を有する成形回路体の製造方法に
よれば、まず、仮基板表面の内、導体配線パターン領域
以外の領域が絶縁性マスクにより被覆される。次に、仮
基板を陰極として、その絶縁性マスクにより被覆されな
い導体配線パターン領域に電気メッキ法により導体配線
パターンが形成される。そして、絶縁性マスク及び導体
配線パターンを形成した仮基板の面に樹脂が成型される
よう、金型上に仮基板を配置して、射出成形等の手段に
より導体配線パターンの形成面に絶縁基板が成型され
る。成型後、金型から成型品を取り出し、前記仮基板の
みを機械的に剥離することにより、絶縁基板の凹部に導
体配線パターンとともに絶縁性マスクが転写された成形
回路体が得られる。According to the method of manufacturing a molded circuit having the above-described structure, first, a region other than the conductor wiring pattern region in the surface of the temporary substrate is covered with the insulating mask. Next, using the temporary substrate as a cathode, a conductor wiring pattern is formed by electroplating in a conductor wiring pattern area not covered by the insulating mask. Then, the temporary substrate is arranged on a mold so that the resin is molded on the surface of the temporary substrate on which the insulating mask and the conductor wiring pattern are formed, and the insulating substrate is formed on the surface on which the conductor wiring pattern is formed by means such as injection molding. Is molded. After the molding, the molded product is taken out from the mold and only the temporary substrate is mechanically peeled off, whereby a molded circuit body having the conductive mask and the insulating mask transferred to the concave portion of the insulating substrate is obtained.
【0015】これにより、絶縁基板上に導体配線パター
ンとともに絶縁性マスクが一体となって転写されるの
で、絶縁基板と導体配線の間に生ずる段差が導体配線間
に配置された絶縁性マスクにより解消され、導体配線と
絶縁性マスクの表面が平坦に保たれた成形回路体を得る
ことが可能となる。Thus, the insulating mask is transferred integrally with the conductive wiring pattern onto the insulating substrate, so that the step generated between the insulating substrate and the conductive wiring is eliminated by the insulating mask disposed between the conductive wirings. As a result, it is possible to obtain a molded circuit body in which the surfaces of the conductor wiring and the insulating mask are kept flat.
【0016】また、導体配線パターンとともに絶縁性マ
スクをも絶縁基板上に転写するので、絶縁基板を成形す
る際、マスクが導体配線表面への樹脂の回り込みを遮
り、導体配線表面が清浄に保たれる。その結果、成形後
に導体配線の一部が絶縁されることもなく、電気的接続
に対する信頼性の高い成形回路体を得ることができる。In addition, since the insulating mask is transferred onto the insulating substrate together with the conductive wiring pattern, when the insulating substrate is formed, the mask blocks the resin from wrapping around the conductive wiring surface and keeps the conductive wiring surface clean. It is. As a result, a part of the conductor wiring is not insulated after molding, and a molded circuit having high reliability for electrical connection can be obtained.
【0017】ここで、前記絶縁性マスクは、光硬化性樹
脂材料からなることが特に好ましい。絶縁性マスクとし
て光硬化性樹脂材料を用いると、パターン形成工程にフ
ォト法を採用できるので、高精度、高密度な配線パター
ンが形成可能であると同時に、パターン形成工程が簡略
化できるからである。また、光硬化性樹脂は、硬化後は
十分な硬度を有し、硬化した樹脂により導体配線パター
ンが保護されるので、別部品と接続する際に導体配線に
力がかかっても、その変形を低減できるからである。光
硬化性樹脂材料としては、例えば、感光性ポリイミド、
感光性エポキシ、感光性アクリル系樹脂等が好適である
が、これらに限定されるものではない。Here, it is particularly preferable that the insulating mask is made of a photocurable resin material. If a photocurable resin material is used as the insulating mask, a photolithography method can be employed in the pattern forming step, so that a high-precision, high-density wiring pattern can be formed, and the pattern forming step can be simplified. . In addition, the photocurable resin has sufficient hardness after curing, and the cured resin protects the conductor wiring pattern. This is because it can be reduced. As the photocurable resin material, for example, photosensitive polyimide,
A photosensitive epoxy, a photosensitive acrylic resin or the like is suitable, but not limited thereto.
【0018】また、絶縁性マスクの厚さは、5μm以上
であることが望ましい。絶縁性マスクの厚さが5μm以
上であると、絶縁性マスクの機械的強度が確保されるの
で、成形回路体の製造工程における導体配線パターンの
変形等の不具合を回避できるからである。さらに、絶縁
基板を成形する前に、絶縁性マスクの表面を過マンガン
酸カリウムによるエッチング等、適当な手段を用いて粗
面化するとよい。粗面化した絶縁性マスクの凹凸部分に
樹脂が入り込むことによって、樹脂/絶縁性マスク間に
アンカー効果が作用し、接着剤を用いなくても高い接着
強度を得ることができるからである。The thickness of the insulating mask is preferably at least 5 μm. If the thickness of the insulating mask is 5 μm or more, the mechanical strength of the insulating mask is ensured, so that problems such as deformation of the conductor wiring pattern in the manufacturing process of the molded circuit body can be avoided. Further, before forming the insulating substrate, the surface of the insulating mask may be roughened by using an appropriate means such as etching with potassium permanganate. This is because, when the resin enters the uneven portion of the roughened insulating mask, an anchor effect acts between the resin and the insulating mask, and high adhesive strength can be obtained without using an adhesive.
【0019】前記導体配線は、その基部が前記絶縁基板
に埋設しているものであることが特に望ましい。すなわ
ち、導体配線の基部が絶縁性マスクから絶縁基板に向か
って突出し、その先端が絶縁基板に埋設されていれば、
その埋設された部分とそれを取り囲む絶縁基板との間に
摩擦力が発生し、導体配線が脱落する方向に作用する力
に対して抵抗となるからである。It is particularly desirable that the base of the conductor wiring is buried in the insulating substrate. That is, if the base of the conductor wiring protrudes from the insulating mask toward the insulating substrate, and the tip is buried in the insulating substrate,
This is because a frictional force is generated between the buried portion and the insulating substrate surrounding the buried portion, and it becomes a resistance against a force acting in a direction in which the conductor wiring drops.
【0020】また、絶縁基板に埋設されている導体配線
部分の外径は、絶縁性マスクに囲まれている部分の外径
より大きいこと、すなわち導体配線の断面がキノコ型を
呈していることが特に望ましい。導体配線の断面がキノ
コ型を呈していると、導体配線脱落に対する抵抗がいっ
そう大きくなるとともに、溶融した樹脂が表面に達する
までの経路が狭くかつ長くなるので、成型時に樹脂の滲
み出しが一層生じにくくなり、導体表面が清浄に保たれ
るからである。また、導体配線の断面積が大きくなるた
め、導体配線の電気抵抗が小さくなり、大電流容量化が
可能となるからである。The outer diameter of the conductor wiring portion embedded in the insulating substrate is larger than the outer diameter of the portion surrounded by the insulating mask, that is, the cross section of the conductor wiring has a mushroom shape. Especially desirable. If the cross section of the conductor wiring has a mushroom shape, the resistance to the conductor wiring falling off will be even greater, and the route for the molten resin to reach the surface will be narrower and longer, so that the resin will exude more during molding. This is because it becomes difficult to keep the conductor surface clean. Further, since the cross-sectional area of the conductor wiring is increased, the electric resistance of the conductor wiring is reduced, and a large current capacity can be achieved.
【0021】さらに、前記導体配線は、電気メッキ法に
より形成された金属層からなることが特に望ましい。電
気メッキ法によれば、高精度かつ高密度の導体配線パタ
ーンを形成することが可能だからである。また、蒸着法
や導電性ペースト法等の他の方法に比して、得られた導
体配線の抵抗値が格段に低く、大電流容量化が可能であ
り、かつ高い信頼性を有しているからである。ここで、
導体配線に使用するメッキ金属としては、銅、ニッケ
ル、金、銀等の導電性の高い金属が好適であるが、価格
及び電気伝導率の点において、銅が特に好ましい。電気
銅メッキに用いられるメッキ浴としては、硫酸銅メッキ
浴、ホウフッ化銅メッキ浴、シアン化銅メッキ浴、ピロ
リン酸銅メッキ浴等、各種のメッキ浴があるが、特にこ
れらに限定されるものではない。Furthermore, it is particularly desirable that the conductor wiring is formed of a metal layer formed by an electroplating method. This is because, according to the electroplating method, a highly accurate and high-density conductor wiring pattern can be formed. Also, compared to other methods such as a vapor deposition method and a conductive paste method, the resistance value of the obtained conductor wiring is remarkably low, large current capacity can be achieved, and high reliability is obtained. Because. here,
As a plating metal used for the conductor wiring, a metal having high conductivity such as copper, nickel, gold, and silver is preferable, but copper is particularly preferable in terms of price and electric conductivity. Examples of the plating bath used for the electrolytic copper plating include various plating baths such as a copper sulfate plating bath, a copper borofluoride plating bath, a copper cyanide plating bath, and a copper pyrophosphate plating bath. is not.
【0022】また、前記絶縁基板は、熱可塑性樹脂材料
からなることが特に望ましい。射出成形法等の高効率な
成型法を採用でき、成形回路体を安価に大量生産できる
からである。熱可塑性樹脂材料としては、ポリフェニレ
ンサルファイド(PPS)、ポリブチレンテレフタレー
ト(PBT)、ポリカーボネート(PC)、ポリアミド
66(PA66)、液晶高分子(LCP)等が好適であ
るが、特にこれらに限定されるものではない。It is particularly desirable that the insulating substrate is made of a thermoplastic resin material. This is because a highly efficient molding method such as an injection molding method can be adopted, and a molded circuit body can be mass-produced at low cost. As the thermoplastic resin material, polyphenylene sulfide (PPS), polybutylene terephthalate (PBT), polycarbonate (PC), polyamide 66 (PA66), liquid crystal polymer (LCP), and the like are preferable, but particularly limited to these. Not something.
【0023】[0023]
【発明の実施の形態】以下、本発明の一実施の形態を図
面に基づき詳細に説明する。図1は、本発明に係る成形
回路体の製造方法の一実施の形態を、工程順に示したも
のである。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below in detail with reference to the drawings. FIG. 1 shows one embodiment of a method for manufacturing a molded circuit body according to the present invention in the order of steps.
【0024】図1(a)は、配線パターンを形成するた
めの仮基板(1)を示す。仮基板(1)は、その表面に
導体配線パターンを形成する基材となるものである他、
電気メッキ法により導体配線を形成する際に、陰極とな
るものである。従って、仮基板は、導電性を有する材料
かならることが必要である。通常は、ステンレス鋼板、
アルミニウム板等の金属板が用いられる。FIG. 1A shows a temporary substrate (1) for forming a wiring pattern. The temporary substrate (1) serves as a substrate on which a conductor wiring pattern is formed,
It serves as a cathode when forming conductor wiring by electroplating. Therefore, the temporary substrate needs to be made of a conductive material. Usually stainless steel plate,
A metal plate such as an aluminum plate is used.
【0025】まず、仮基板(1)の表面を平坦に研磨
し、その片側全面に光硬化性樹脂からなる絶縁性マスク
(2)を所定の厚さに塗布する。仮基板(1)に絶縁性
マスク(2)を塗布した状態を図2(b)に示す。絶縁
性マスク(2)の厚さは、機械的強度を確保するため、
5μm以上であることを要するが、成形回路体の用途や
使用する光硬化性樹脂の性質に合わせて、適宜選択すれ
ばよい。First, the surface of the temporary substrate (1) is polished flat, and an insulating mask (2) made of a photocurable resin is applied to the entire surface of one side to a predetermined thickness. FIG. 2B shows a state where the insulating mask (2) is applied to the temporary substrate (1). The thickness of the insulating mask (2) is to ensure mechanical strength.
The thickness is required to be 5 μm or more, but may be appropriately selected according to the use of the molded circuit body and the properties of the photocurable resin to be used.
【0026】次いで、導体配線パターンとは逆の反転パ
ターンを有するフォトマスクを作製して、光硬化性樹脂
を塗布した仮基板(1)上に配置し、導体配線パターン
領域以外の領域を露光して、光硬化性樹脂を硬化させ
る。光硬化性樹脂が硬化した後、現像を行って未硬化の
光硬化性樹脂を取り除くことにより、絶縁性マスク
(2)のすき間に電路(3・・・)が形成される。仮基
板(1)上に電路(3・・・)が形成された状態を図1
(c)に示す。Next, a photomask having an inverted pattern opposite to the conductor wiring pattern is prepared and placed on the temporary substrate (1) coated with the photocurable resin, and the area other than the conductor wiring pattern area is exposed. To cure the photocurable resin. After the photo-curable resin is cured, development is performed to remove the uncured photo-curable resin, whereby electric paths (3...) Are formed in the gaps of the insulating mask (2). FIG. 1 shows a state in which electric paths (3...) Are formed on the temporary substrate (1).
It is shown in (c).
【0027】このようにして得られた仮基板を陰極とし
て、メッキ浴に浸漬し、電気メッキを行うと、電路(3
・・・)の間にメッキ浴中の金属イオンが析出し、導体
配線(4・・)が形成されていく。メッキ条件を適当に
選択すると、絶縁性マスク(2)の間に形成された電路
(3・・・)から、析出した導体配線(4・・・)が突
出するとともに、横方向に張り出し、その断面がキノコ
状を呈するようになる。電気メッキ法によりキノコ状の
導体配線を形成させた状態を図1(d)に示す。The temporary substrate thus obtained was used as a cathode, immersed in a plating bath, and electroplating was performed.
..), Metal ions in the plating bath are precipitated, and conductor wirings (4...) Are formed. If the plating conditions are appropriately selected, the conductor wirings (4...) That have been deposited project from the electric paths (3...) Formed between the insulating masks (2) and project laterally. The cross section becomes mushroom-shaped. FIG. 1D shows a state where the mushroom-shaped conductor wiring is formed by the electroplating method.
【0028】仮基板(1)上に導体配線(4・・・)が
形成されたところで、仮基板(1)を銅メッキ浴から取
り出して洗浄する。この状態で直ちに、仮基板(1)上
に樹脂を成型しても良いが、仮基板上を過マンガン酸カ
リウム(KMnO4 )水溶液等の適当なエッチング液を
用いて粗面化すると、絶縁性マスク(2)とその上に成
形する樹脂との接着強度が向上するので、好ましい。エ
ッチング液を用いて、絶縁性マスク(2)の表面を粗面
化した状態を図1(e)に示す。When the conductor wirings (4...) Are formed on the temporary substrate (1), the temporary substrate (1) is taken out of the copper plating bath and washed. In this state, the resin may be immediately molded on the temporary substrate (1). However, if the temporary substrate is roughened with an appropriate etching solution such as an aqueous solution of potassium permanganate (KMnO 4 ), the insulating property is reduced. This is preferable because the adhesive strength between the mask (2) and the resin molded thereon is improved. FIG. 1E shows a state in which the surface of the insulating mask (2) is roughened using an etching solution.
【0029】次に、このようにして調整した仮基板
(1)を用いて、立体的形状を有する絶縁基板の成形を
行う。図1(f)は、成形直後の金型の断面図を示した
ものである。下金型(5)は上に凸の断面形状を有し、
また、上金型(6)は下に凹の断面形状を有しており、
両者を重ねると、最終製品である成形回路体の形状に相
当するキャビティ(7)が形成されるようになってい
る。また、上金型(6)の中央には、溶融した樹脂をキ
ャビティ内に流し込むためのゲート(8)が設けられて
いる。Next, using the temporary substrate (1) thus adjusted, an insulating substrate having a three-dimensional shape is formed. FIG. 1F shows a cross-sectional view of the mold immediately after molding. The lower mold (5) has an upwardly convex cross-sectional shape,
Also, the upper mold (6) has a concave cross-sectional shape below,
When both are overlapped, a cavity (7) corresponding to the shape of a molded circuit body as a final product is formed. Further, a gate (8) for pouring the molten resin into the cavity is provided at the center of the upper mold (6).
【0030】樹脂の成形は、以下の手順により行う。上
述の方法によりその表面に導体配線(4・・・)からな
る導体配線パターン及び絶縁性マスク(2)を形成させ
た仮基板(1)を、導体配線パターン及び絶縁性マスク
(2)を形成させた面を上にして下金型(5)の凸部に
載せる。次に、上金型(6)を下金型(5)に重ねて成
形機内に固定し、ゲート(8)から溶融した樹脂を金型
内に圧入する。溶融した樹脂が金型内に圧入されると、
樹脂がキャビティ(7)内に充填されるとともに、下金
型(5)上に載せた仮基板(1)表面に形成した絶縁性
マスク(2)及び導体配線パターンが、溶融した樹脂と
密着する。The resin is molded according to the following procedure. A temporary wiring board (1) having a conductive wiring pattern composed of conductive wirings (4...) And an insulating mask (2) formed on the surface thereof by the above-described method is used to form a conductive wiring pattern and an insulating mask (2). It is placed on the convex part of the lower mold (5) with the made surface facing up. Next, the upper mold (6) is placed on the lower mold (5) and fixed in the molding machine, and the molten resin is pressed into the mold from the gate (8). When the molten resin is pressed into the mold,
The resin is filled in the cavity (7), and the insulating mask (2) and the conductor wiring pattern formed on the surface of the temporary substrate (1) placed on the lower mold (5) are in close contact with the molten resin. .
【0031】樹脂の圧入終了後、金型を冷却して樹脂を
固化させた後、下金型(5)と上金型(6)とを分離す
る。この時、成形品は上金型(6)に固着されたままで
ある。そこで、次に、ピン(図示せず)を用いて上金型
(6)から成形体を押し出し、成形体と上金型(6)を
分離する。分離後、成形体から仮基板(1)を機械的に
剥離させると、絶縁性マスク(2)と導体配線(4・・
・)からなる導体配線パターンが成形体の凹部底面に転
写された成形回路体が得られる。得られた成形回路体を
図1(g)に示す。After the injection of the resin is completed, the mold is cooled to solidify the resin, and then the lower mold (5) and the upper mold (6) are separated. At this time, the molded product remains fixed to the upper mold (6). Therefore, next, the molded body is extruded from the upper mold (6) using a pin (not shown), and the molded body and the upper mold (6) are separated. After the separation, when the temporary substrate (1) is mechanically peeled from the molded body, the insulating mask (2) and the conductor wiring (4.
A molded circuit body in which the conductor wiring pattern composed of ()) is transferred to the bottom surface of the concave portion of the molded body is obtained. The resulting molded circuit is shown in FIG.
【0032】(実施例1)上述の手順に従い、内部に導
体配線を有するコネクタを作製した。仮基板としてアル
ミニウム板を用い、その上に、絶縁性マスクとして、光
硬化性樹脂を30μmの厚さに塗布した。光硬化性樹脂
は、シプレイ・ファーイースト社製、商品名「マルチポ
ジットXP−9500CC」を用いた。(Example 1) According to the above-described procedure, a connector having a conductor wiring inside was manufactured. An aluminum plate was used as a temporary substrate, and a photocurable resin was applied thereon as an insulating mask to a thickness of 30 μm. As the photocurable resin, "Multiposit XP-9500CC" manufactured by Shipley Far East Co., Ltd. was used.
【0033】次に、導体配線パターンとは逆の反転パタ
ーンを有するフォトマスクを作製し、導体配線パターン
領域以外の領域を露光し、該領域部分の光硬化性樹脂を
硬化させた。露光量は、3000mJ/cm2 とした。
光硬化性樹脂が硬化した後、同社製専用現像液を35℃
の温度で90秒間、光硬化性樹脂表面にスプレーして、
未硬化部分の光硬化性樹脂を取り除き、電路を形成し
た。Next, a photomask having an inverted pattern opposite to the conductor wiring pattern was prepared, and an area other than the conductor wiring pattern area was exposed to light to cure the photocurable resin in the area. The exposure amount was 3000 mJ / cm 2 .
After the photo-curing resin is cured, the developer developed by the company is heated to 35 ° C.
Spray on the photocurable resin surface for 90 seconds at the temperature of
An uncured portion of the photocurable resin was removed to form an electric path.
【0034】このようにして得られた仮基板を陰極とし
て、電気銅メッキを行った。銅メッキ浴は、ピロリン酸
銅(Cu2P2O7・3H2O)85g/l、ピロリン酸カ
リウム(K4P2O7 )240g/l、アンモニア水3m
l/lからなるピロリン酸銅浴を用い、電流密度5A/
m2 、温度55℃の条件で電気銅メッキを行った。1.
1時間経過後、仮基板上に形成された電路内に銅が析出
し、さらに析出した銅が絶縁性マスクより突出するとと
もに、横方向に張り出し、高さ70μmで、断面がキノ
コ状の導体配線が形成された。Using the temporary substrate thus obtained as a cathode, electrolytic copper plating was performed. Copper plating bath, copper pyrophosphate (Cu 2 P 2 O 7 · 3H 2 O) 85g / l, potassium pyrophosphate (K 4 P 2 O 7) 240g / l, ammonia water 3m
1 / l copper pyrophosphate bath with a current density of 5 A /
Copper electroplating was performed under the conditions of m 2 and a temperature of 55 ° C. 1.
After one hour, copper is deposited in the electric circuit formed on the temporary substrate, and the deposited copper protrudes from the insulating mask, and extends laterally, is 70 μm in height, and has a mushroom-shaped cross section. Was formed.
【0035】電路内に導体配線が形成されたところで、
仮基板を銅メッキ浴から取り出して洗浄した。次いで、
これを過マンガン酸カリウム(KMnO4 )水溶液(シ
プレイ・ファーイースト社製、商品名「ミクロエッチ7
48」)に、20℃で1時間浸漬して、絶縁性マスクの
表面をエッチングして、粗面化した。When the conductor wiring is formed in the electric circuit,
The temporary substrate was taken out of the copper plating bath and washed. Then
This was treated with a potassium permanganate (KMnO 4 ) aqueous solution (trade name “Microetch 7” manufactured by Shipley Far East Co., Ltd.).
48 ”), the surface of the insulating mask was etched and roughened by immersion at 20 ° C. for 1 hour.
【0036】次いで、得られた仮基板を用いて、絶縁基
板の成形を行った。絶縁基板材料としては、液晶ポリマ
ー(商品名「ベクトラA130」、ガラスファイバー3
0%添加)を用い、成形には、射出成型法を採用した。
射出成形の条件は、金型温度100℃、成形温度290
〜320℃とした。Next, an insulating substrate was formed using the obtained temporary substrate. As an insulating substrate material, a liquid crystal polymer (trade name “VECTRA A130”, glass fiber 3
0% added), and an injection molding method was employed for molding.
The injection molding conditions were a mold temperature of 100 ° C. and a molding temperature of 290.
~ 320 ° C.
【0037】得られたコネクタは、導体配線上に樹脂が
付着するようなことはなく、正常であった。また、導体
配線の導通試験を行った結果、十分に低い抵抗値を示し
ており、導体配線自体に損傷がないことがわかった。さ
らに、コネクタを接続した状態で導通試験を行ったとこ
ろ、異常は認められず、コネクタピンとのコンタクト部
分に接触不良は認められなかった。The obtained connector was normal without any resin adhering to the conductor wiring. In addition, as a result of conducting a conduction test of the conductor wiring, it was found that the resistance was sufficiently low and the conductor wiring itself was not damaged. Further, when a continuity test was performed with the connector connected, no abnormality was found, and no poor contact was found in the contact portion with the connector pin.
【0038】また、導体配線の表面と絶縁性マスクの表
面とは、平坦であり、目視できる程度の凹凸は認められ
なかった。得られたコネクタについて、繰り返し挿抜試
験を行ったところ、コンタクト部分に損傷を生ずること
はなかった。The surface of the conductor wiring and the surface of the insulating mask were flat, and no visible irregularities were observed. When the obtained connector was subjected to a repeated insertion / extraction test, no damage was caused on the contact portion.
【0039】以上のように、本発明によれば、別部品と
の接続時に損傷を生じたり導体配線表面の導電性を損な
うことなく、立体的形状を有する絶縁基板の凹部に高精
度かつ高密度な導体配線パターンを形成した成形回路体
を容易に得ることができることがわかった。As described above, according to the present invention, a high-precision and high-density concave portion of an insulating substrate having a three-dimensional shape can be formed without damaging it at the time of connection with another component and without impairing the conductivity of the conductor wiring surface. It has been found that it is possible to easily obtain a molded circuit body on which a suitable conductor wiring pattern is formed.
【0040】なお、本発明は、上記した実施例に何ら限
定されるものではなく、本発明の要旨を逸脱しない範囲
内で種々の改変が可能である。例えば、上記実施例で
は、コネクタを作製したが、これに限定されるものでは
なく、箱形成形品の内側に配線回路を形成した配線ボッ
クス等、立体的形状を有する絶縁基板の凹部のみなら
ず、平板状の絶縁基板の片面あるいは両面に回路を形成
する場合にも応用可能である。また、仮基板として高さ
の異なる複数の仮基板を組み合わせて、より立体的な成
形回路体を製造することも可能である。さらに仮基板と
してステンレス鋼板等、他の金属板を用いたり、電気メ
ッキとして、硫酸銅浴等の銅メッキ浴や他の金属メッキ
浴を用いたり、光硬化性樹脂、絶縁基板用の熱硬化性樹
脂として他の材質を用いても、上記実施例と同様の効果
を得ることができる。The present invention is not limited to the above-described embodiment at all, and various modifications can be made without departing from the gist of the present invention. For example, in the above-described embodiment, the connector is manufactured. However, the present invention is not limited to this. Not only the concave portion of the insulating substrate having a three-dimensional shape, such as a wiring box in which a wiring circuit is formed inside a box-shaped product, but also a concave portion is provided. The present invention is also applicable to a case where a circuit is formed on one or both sides of a flat insulating substrate. Further, it is also possible to manufacture a more three-dimensional molded circuit body by combining a plurality of temporary substrates having different heights as the temporary substrate. Furthermore, other metal plates such as a stainless steel plate are used as a temporary substrate, a copper plating bath such as a copper sulfate bath or another metal plating bath is used as an electroplating, a photocurable resin, a thermosetting resin for an insulating substrate. Even when another material is used as the resin, the same effect as in the above embodiment can be obtained.
【0041】[0041]
【発明の効果】本発明の成形回路体及びその製造方法に
よれば、成形体と一体化した導体配線の一部が表面に露
出し、しかも導体配線の露出面が平坦になっているの
で、別部品と接続した時にコンタクト部の損傷を回避す
ることができるとともに、接続と同時に電気的接続が可
能となり、アセンブリ工程の簡略化が図れる。また、導
体配線パターンと絶縁性マスクを一体として絶縁性基板
上に転写するので、導体表面上への樹脂の回り込みを防
止でき、導体配線の導電性が損なわれることがないとい
う効果がある。According to the molded circuit body and the method of manufacturing the same of the present invention, a part of the conductor wiring integrated with the molded body is exposed on the surface and the exposed surface of the conductor wiring is flat. Damage to the contact portion when it is connected to another component can be avoided, and electrical connection can be made simultaneously with connection, thereby simplifying the assembly process. Further, since the conductor wiring pattern and the insulating mask are integrally transferred onto the insulating substrate, it is possible to prevent the resin from wrapping around the conductor surface, and there is an effect that the conductivity of the conductor wiring is not impaired.
【0042】また、導体を電気メッキ法により作製すれ
ば、配線の高精度化、高密度化及び大電流容量化が可能
となる。しかも、メッキ条件によっては、断面がキノコ
状を呈する導体配線を形成できるので、形状効果による
導体の脱落防止、断面積増大による大電流容量化、樹脂
の滲み出し阻止による導体表面の清浄化等、種々の効果
がある。Further, if the conductor is formed by an electroplating method, it is possible to increase the precision, density and current capacity of the wiring. Moreover, depending on the plating conditions, conductor wiring having a mushroom-shaped cross section can be formed, so that the conductor can be prevented from dropping due to the shape effect, the current capacity can be increased by increasing the cross-sectional area, and the conductor surface can be cleaned by preventing resin from seeping out. There are various effects.
【0043】さらに、絶縁性マスクとして光硬化性樹脂
を用いると、パターン形成工程にフォト法を用いること
ができ、高精度、高密度な配線パターンが形成可能とな
ると同時に、工程が簡略化されるという効果がある。Further, when a photocurable resin is used as the insulating mask, a photolithography method can be used in the pattern forming step, so that a high-precision and high-density wiring pattern can be formed, and the step is simplified. This has the effect.
【0044】以上のように、本発明によれば、立体的形
状を有する成形体の凹部に高精度かつ高密度の導体配線
パターンであって、信頼性が高くかつ大電流容量化が可
能なものを形成することは容易であり、しかもそのよう
な成形回路体を安価に製造できるので産業上その効果の
極めて大きい発明である。As described above, according to the present invention, a high-precision and high-density conductor wiring pattern in a concave portion of a molded article having a three-dimensional shape, which has high reliability and can achieve a large current capacity. Is easy to form, and since such a molded circuit body can be manufactured at a low cost, the present invention has an industrially extremely large effect.
【図1】本発明に係る成形回路体の製造工程を示す図で
ある。FIG. 1 is a view showing a manufacturing process of a molded circuit body according to the present invention.
1 仮基板 2 絶縁性マスク 3 電路 4 導体配線 5 下金型 6 上金型 7 キャビティ 8 ゲート DESCRIPTION OF SYMBOLS 1 Temporary board 2 Insulating mask 3 Electric circuit 4 Conductor wiring 5 Lower mold 6 Upper mold 7 Cavity 8 Gate
Claims (8)
成されてなるものであって、該絶縁基板の表面には、前
記導体配線パターンのすき間に絶縁性マスクが該導体配
線パターンの表面と略面一に設けられていることを特徴
とする成形回路体。1. A conductive wiring pattern formed on a surface of an insulating substrate, wherein an insulating mask is provided on a surface of the insulating substrate in a space between the conductive wiring pattern and the surface thereof. A molded circuit body provided on the same surface.
からなることを特徴とする請求項1記載の成形回路体。2. The molded circuit body according to claim 1, wherein said insulating mask is made of a photocurable resin material.
縁基板に埋設されてなることを特徴とする請求項1又は
2記載の成形回路体。3. The molded circuit body according to claim 1, wherein a base of the conductor wiring pattern is embedded in the insulating substrate.
により形成された金属層からなることを特徴とする請求
項1、2又は3記載の成形回路体。4. The molded circuit body according to claim 1, wherein the conductor wiring pattern is formed of a metal layer formed by an electroplating method.
なることを特徴とする請求項1、2、3又は4記載の成
形回路体。5. The molded circuit body according to claim 1, wherein said insulating substrate is made of a thermoplastic resin material.
パターン領域以外の領域を絶縁性マスクにより被覆する
工程と、該絶縁性マスクにより被覆されない導体配線パ
ターン領域に電気メッキ法により導体配線パターンを形
成する工程と、該導体配線パターンの形成面に絶縁基板
を成形する工程と、該絶縁基板上に導体配線パターンと
絶縁性マスクを残し前記仮基板のみを除去する工程と、
からなることを特徴とする成形回路体の製造方法。6. A step of covering an area other than the conductive wiring pattern area on the surface of the temporary substrate having conductivity with an insulating mask, and a step of electroplating a conductive wiring pattern in a conductive wiring pattern area not covered by the insulating mask. Forming, and forming an insulating substrate on the surface on which the conductive wiring pattern is formed, and removing only the temporary substrate while leaving the conductive wiring pattern and the insulating mask on the insulating substrate,
A method for manufacturing a molded circuit body, comprising:
であることとを特徴とする請求項6記載の成形回路体の
製造方法。7. The method according to claim 6, wherein the insulating mask is made of a photocurable resin material.
なることを特徴とする請求項6又は7記載の成形回路体
の製造方法。8. The method according to claim 6, wherein the insulating substrate is made of a thermoplastic resin material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18038997A JPH1117314A (en) | 1997-06-19 | 1997-06-19 | Molded circuit body and its manufacture |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18038997A JPH1117314A (en) | 1997-06-19 | 1997-06-19 | Molded circuit body and its manufacture |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH1117314A true JPH1117314A (en) | 1999-01-22 |
Family
ID=16082387
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18038997A Pending JPH1117314A (en) | 1997-06-19 | 1997-06-19 | Molded circuit body and its manufacture |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH1117314A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002004077A (en) * | 2000-06-20 | 2002-01-09 | Kyushu Hitachi Maxell Ltd | Electroforming product and method for manufacturing the same |
JP2005535138A (en) * | 2002-08-05 | 2005-11-17 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Electronic product, main body, and manufacturing method |
JP2006253228A (en) * | 2005-03-08 | 2006-09-21 | Ricoh Co Ltd | Electric structure and method of manufacturing the same |
JP2006253512A (en) * | 2005-03-11 | 2006-09-21 | Ricoh Co Ltd | Wiring board and manufacturing method |
-
1997
- 1997-06-19 JP JP18038997A patent/JPH1117314A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002004077A (en) * | 2000-06-20 | 2002-01-09 | Kyushu Hitachi Maxell Ltd | Electroforming product and method for manufacturing the same |
JP2005535138A (en) * | 2002-08-05 | 2005-11-17 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Electronic product, main body, and manufacturing method |
JP2006253228A (en) * | 2005-03-08 | 2006-09-21 | Ricoh Co Ltd | Electric structure and method of manufacturing the same |
JP2006253512A (en) * | 2005-03-11 | 2006-09-21 | Ricoh Co Ltd | Wiring board and manufacturing method |
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