JPH10289920A5 - - Google Patents

Info

Publication number
JPH10289920A5
JPH10289920A5 JP1998051538A JP5153898A JPH10289920A5 JP H10289920 A5 JPH10289920 A5 JP H10289920A5 JP 1998051538 A JP1998051538 A JP 1998051538A JP 5153898 A JP5153898 A JP 5153898A JP H10289920 A5 JPH10289920 A5 JP H10289920A5
Authority
JP
Japan
Prior art keywords
semiconductor chip
semiconductor device
inner lead
inner leads
insulating tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1998051538A
Other languages
English (en)
Japanese (ja)
Other versions
JP3789633B2 (ja
JPH10289920A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP05153898A priority Critical patent/JP3789633B2/ja
Priority claimed from JP05153898A external-priority patent/JP3789633B2/ja
Publication of JPH10289920A publication Critical patent/JPH10289920A/ja
Publication of JPH10289920A5 publication Critical patent/JPH10289920A5/ja
Application granted granted Critical
Publication of JP3789633B2 publication Critical patent/JP3789633B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP05153898A 1997-02-17 1998-02-17 半導体装置 Expired - Fee Related JP3789633B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP05153898A JP3789633B2 (ja) 1997-02-17 1998-02-17 半導体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP4692097 1997-02-17
JP9-46920 1997-02-17
JP05153898A JP3789633B2 (ja) 1997-02-17 1998-02-17 半導体装置

Publications (3)

Publication Number Publication Date
JPH10289920A JPH10289920A (ja) 1998-10-27
JPH10289920A5 true JPH10289920A5 (enExample) 2005-08-25
JP3789633B2 JP3789633B2 (ja) 2006-06-28

Family

ID=26387072

Family Applications (1)

Application Number Title Priority Date Filing Date
JP05153898A Expired - Fee Related JP3789633B2 (ja) 1997-02-17 1998-02-17 半導体装置

Country Status (1)

Country Link
JP (1) JP3789633B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100585585B1 (ko) * 1999-07-05 2006-06-07 삼성테크윈 주식회사 반도체 패키지
KR100561549B1 (ko) * 1999-10-07 2006-03-17 삼성전자주식회사 패드 온 칩형 반도체 패키지

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