JPH10278991A - Film for holding electronic parts, film for mounting electronic parts, electronic parts mounting method using them, and manufacture of circuit module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a film for keeping electronic parts capable of easily mounting the electronic parts on a substrate. SOLUTION: A film 1 is provided with a plurality of recessed parts 1a-1c capable of inserting and keeping electronic parts Pa-Pc with their connection sides in an exposed condition in the prescribed arrangement. When the electronic parts Pa-Pc are inserted and kept in the recessed parts 1a-1c, a plurality of electronic parts Pa-Pc can be mounted on the substrate in the prescribed arrangement only by releasing the packaging of the electronic parts Pa-Pc by the film 1 in a condition where the connection sides of the electronic parts Pa-Pc packaged by the film 1 are brought into contact with the substrate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a film for holding an electronic component, a film for mounting an electronic component, a method for mounting an electronic component using the film, and a method for manufacturing a circuit module.

[0002]

2. Description of the Related Art Conventionally, mounting of electronic components on a substrate is performed by:
A method is generally adopted in which electronic components are selectively taken out from a plurality of component feeders prepared according to the type of mounted components by a component transporter, mounted on a substrate, and electrically connected to the substrate. .

[0003] As the component feeder, there are used a feeder for feeding a carrier tape containing one component while peeling off a cover tape, and a feeder for feeding electronic components stored in a bulk state in a line. For the component transporter, a manipulator having two or three degrees of freedom having a suction nozzle is used.

[0004]

SUMMARY OF THE INVENTION In the above prior art,
In order to mount an electronic component on a substrate, a large-scale apparatus including a component feeder and a component transporter is required, and there is a problem that a burden in terms of cost and space increases.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a film for holding an electronic component, a film for mounting an electronic component, and a film for mounting an electronic component on a substrate, which can be easily performed. It is an object of the present invention to provide an electronic component mounting method and a circuit module manufacturing method used.

[0006]

According to one aspect of the present invention, there is provided a film for holding an electronic component, the electronic component holding film having a plurality of recesses capable of inserting and holding the electronic component with its connection surface exposed. It is characterized in that it is provided in a predetermined arrangement.

According to this electronic component holding film, a plurality of electronic components mounted on the substrate can be held in a predetermined arrangement by inserting and holding the electronic components in the respective concave portions.

According to a third aspect of the present invention, there is provided a film for mounting an electronic component, wherein the electronic component is inserted and held in each recess of the electronic component holding film according to the first or second aspect.
The feature is that.

According to this electronic component mounting film, the electronic components are held by the film while the connection surfaces of the electronic components held by the film are in contact with the substrate, so that a plurality of electronic components can be connected. It can be mounted on a substrate in a predetermined arrangement.

According to a sixth aspect of the present invention, there is provided a method for mounting an electronic component, wherein the component-exposed surface of the film according to any one of the third to fifth aspects is oriented to the component-mounted surface of the substrate, and the two components are relative to each other. And the step of bringing the connection surface of each electronic component into contact with the substrate by bringing the electronic component into contact with the substrate, removing the film by removing the electronic component from the film while the connection surface of each electronic component is in contact with the substrate, and holding the film. Transferring a plurality of electronic components to the substrate side.

According to this electronic component mounting method, a step of contacting the connection surface of each electronic component held on the film with the substrate and a step of removing the film by releasing the holding of the electronic component by the film in the same state are performed. Thus, a plurality of electronic components can be mounted on the substrate in a predetermined arrangement.

[0012] Still further, according to a method of manufacturing a circuit module, the invention according to claim 7 is configured such that the component-exposed surface of the film according to claim 4 or 5 faces the component-mounting surface of the substrate, and the two are relatively approached. Contacting the connection surface of each electronic component with the substrate by contacting the substrate, and removing the film by removing the electronic component from the film while the connection surface of each electronic component is in contact with the substrate, and removing a plurality of electronic components held by the film. It is characterized by comprising a step of transferring components to the board side and a step of electrically connecting each electronic component transferred to the board side to the board. According to an eighth aspect of the present invention, the component-exposed surface of the film according to the fourth or fifth aspect faces the component-mounting surface of the substrate, and the two are relatively approached to contact the connection surface of each electronic component with the substrate. A step of electrically connecting each electronic component to the substrate while the connection surface of each electronic component is in contact with the substrate, and releasing the film by holding the electronic components by the film after connecting the electronic components to the substrate. And a removing step.

According to these circuit module manufacturing methods, a step of bringing the connection surface of each electronic component held on the film into contact with the substrate, and a step of removing the film by releasing the holding of the electronic component by the film in the same state. Electronically connecting the electronic component to the substrate in the same state as through the step of electrically connecting the electronic component to the substrate, or by contacting the connection surface of each electronic component held on the film with the substrate. A circuit module constituting a predetermined electric circuit can be manufactured through a connecting step and a step of removing the film by releasing the holding of the electronic component by the film.

[0014]

FIG. 1 shows a film for holding an electronic component. This film 1 has a predetermined outer dimension and the electronic component P shown in FIGS. 2 (a) to 2 (c).
a to Pc have a plurality of recesses 1a to 1c in a predetermined arrangement which can be inserted and held in a state where their connection surfaces are exposed, and the rear surface side has a depth corresponding to the depth dimension of each of the recesses 1a to 1c. There are bulges (see FIG. 5). Film 1 is PET, PBT
It is created by resin molding using a synthetic resin such as a material, or by hot pressing a film material. Further, the thickness of the film 1 is appropriately set within a range in which appropriate flexibility and elasticity can be obtained according to the dimensions of the electronic component to be held.

The recess 1a is provided with the electronic component P shown in FIG.
a, the concave portion 1b corresponds to the electronic component Pb shown in FIG.
The concave portions 1c respectively correspond to the electronic components Pc shown in FIG. The opening shape of each of the recesses 1a to 1c is as follows.
Slightly smaller than the connection surface shape of the electronic components Pa to Pc,
The electronic components Pa to Pc inserted into the recesses 1a to 1c are elastically held by the elasticity of the film itself.

Incidentally, the electronic component Pa is a chip component such as a prismatic chip resistor, a chip capacitor, a chip inductor and the like having external electrodes at both ends in the longitudinal direction. Used as a surface. The electronic components Pb and Pc are semiconductor chips such as ICs and LSIs having a plurality of bumps (protruding electrodes) on the back surface, and the back surface is used as a connection surface. Of course, the same component holding can be performed for an electronic component having a shape other than that shown by adjusting the concave shape to this.

The depths of the recesses 1a to 1c are set in accordance with the dimensions of the electronic components Pa to Pc inserted and held in the recesses 1a to 1c so that the projections of the electronic components Pa to Pc match. That is, as shown in FIG. 4, when three types of electronic components P1 to P3 having different heights (thicknesses) are inserted and held in the film 1, the corresponding concave portions H1 to H3 are provided.
Of the electronic component P1 by changing the depth dimensions Dm1 to Dm3 of the
ＰP3 are made equal to each other. Incidentally, the above-mentioned protrusion dimension is set to a value obtained by subtracting a depth dimension sufficient for insertion and holding from the height (thickness) dimension of the electronic component having the smallest height (thickness). If it is not possible to secure the projection size, the protrusion dimension may be zero or a value close to zero.

Further, the number and arrangement of the concave portions 1a to 1c correspond to the number and arrangement of electronic components Pa to Pc mounted on the substrate 2, which will be described later. In other words, the film 1 includes a plurality of electronic components Pa to P to be mounted on the substrate 2.
c are held in an array corresponding to the mounting position.

FIG. 3 shows a film for mounting electronic components. This film 1 has the electronic components Pa to Pc shown in FIG. 2 inserted and held in the respective concave portions 1a to 1c of the film 1 shown in FIG. The number and arrangement correspond to the number and arrangement of electronic components Pa to Pc mounted on the substrate 2 described later.

When mounting components, the film 1 after holding the components shown in FIG. 3 is prepared in advance. In this preparation method, the film 1 before holding the parts shown in FIG. 1 is prepared or purchased, and the concave portions 1a to 1c of the film 1 are prepared in the preparation step.
2 may be inserted into and held by the electronic components Pa to Pc shown in FIG. 2, or the film 1 after holding the components shown in FIG.

When mounting electronic components on the board, first, as shown in FIG. 5, the film 1 after holding the components shown in FIG. The connection surfaces of the electronic components Pa to Pc are brought into contact with the substrate 2 by facing the surfaces and bringing them relatively close to each other. Since electrodes (lands) 2a to 2c corresponding to the electronic components Pa to Pc are formed on the substrate 2, actually, the electrodes of the electronic components Pa to Pc and the electrodes 2a to 2c of the substrate 2 are formed.
Contact each other.

Incidentally, the electrode 2a on the substrate 2 corresponds to the electronic component Pa, the electrode 2b corresponds to the electronic component Pb, and the electrode 2c corresponds to the electronic component Pc. Although not shown in the drawing, a wiring line, terminal electrodes, and the like are formed on the substrate 2.
After the electronic components are mounted, the circuit module forms a predetermined electric circuit.

Next, with the connection surfaces of the electronic components Pa to Pc in contact with the substrate 2, as shown in FIG.
Is gradually lifted from one end, and the concave portions 1a to 1c are deformed by the lifting so that the openings thereof are widened. As a result, the holding of the electronic components Pa to Pc by the film 1 is released, and the plurality of electronic components Pa to Pc held by the film 1 remain in a predetermined arrangement and are aligned with the respective electrodes 2a to 2c. Move to side 2.

As described above, the film 1 is flexible, and the electronic components Pa to Pa in each of the recesses 1a to 1c.
Since the holding force of Pc is not so strong, the component transfer to the substrate 2 due to the above-described film deformation can be performed relatively smoothly. If a bonding material such as cream solder is applied to each of the electrodes 2a to 2c of the substrate 2 in advance, or an adhesive is applied to portions other than the electrodes, the component transfer can be performed more smoothly using these adhesive forces. In this case, even if the film 1 is lifted as it is, the same component transfer can be performed.

Next, the plurality of electronic components Pa to Pc transferred to the board 2 are electrically connected to the board 2. When the component connection is performed by the soldering method, the electronic components Pa to
Heat is applied to the connection portion of Pc to melt the solder and connect the electrodes. When the components are connected by the thermocompression bonding method, heat and pressure are applied to the connected portions of the electronic components Pa to Pc after the transfer to connect the electrodes. Laser light irradiation may be used for applying the heat, and the above-described soldering and thermocompression bonding can be performed without using a reflow furnace or the like by irradiating the connection portion with laser light to apply heat. It goes without saying that various well-known component connection methods other than those described above can be used for component connection.

As described above, a substrate on which a plurality of electronic components Pa to Pc are mounted in a predetermined arrangement is manufactured as shown in FIG. If a plurality of electronic components for forming a predetermined electric circuit are held on one film 1, a circuit module forming the predetermined electric circuit can be manufactured by the above-described component mounting.

As described above, if the film 1 in which the electronic components Pa to Pc are inserted and held in the concave portions 1a to 1c is prepared, it is easy to mount the components on the substrate 2 using the film 1. Since it can be carried out, a large-scale device including a conventional component feeder and a component transporter is not required at all, and the cost and space burden can be remarkably reduced to achieve inexpensive and simple component mounting. Thus, a circuit module constituting a predetermined electric circuit can be manufactured very easily.

FIGS. 8 and 9 show a modification of the electronic component holding film. Film 1 shown in FIG.
Reference numeral 1 denotes a recess 11a in which a rod insertion hole 11b is formed in the bottom surface. As shown in FIG. 2B, in a state where the connection surface of the electronic component P is in contact with the substrate 2, the electronic component P
Is pressed against the substrate 2 by the rod R inserted into the hole 11b, the film 11 can be removed while releasing the components only by lifting the film 1 upward.

FIG. 9A shows a structure in which a film 12a having a concave portion 12b and a second film 12c which is thinner and stretchable than the film 12a are separably stacked. Electronic component P is film 12
a is inserted and held in the recess 12b of FIG. As shown in FIG. 2B, the film 12a and the second
By separating from the film 12c, the films 12a and 12c can be removed while releasing the parts.

In the above embodiment, the electronic component transferred to the substrate side is electrically connected to the substrate after the film is removed by releasing the holding of the electronic component by the film. After electrically connecting each electronic component to the board in a state where the connection surface of the component is in contact with the board, the same component mounting can be performed even if the electronic component is held by the film and the film is removed. .

For example, in the case where the connection of parts is performed by irradiating a laser beam from the back surface side of the laser light transmitting substrate toward the connection point, heat is hardly exerted on portions other than the connection point. When such a connection method is adopted, no particular problem can occur even if the film is removed after connecting the electronic component to the substrate.

[0032]

As described in detail above, according to the present invention,
If a film in which electronic components are inserted and held in each concave portion is prepared, components can be easily mounted on a substrate by using the film. This eliminates the need for a large-scale device including a machine, significantly reduces the cost and space burdens, achieves inexpensive and simple component mounting, and makes it extremely easy to manufacture a circuit module constituting a predetermined electric circuit. .

[Brief description of the drawings]

FIG. 1 is a perspective view of a film before holding a component according to the present invention.

FIG. 2 is a view showing an electronic component held by the film shown in FIG. 1;

FIG. 3 is a perspective view of a film after holding a component according to the present invention.

FIG. 4 is an explanatory view of a depth of a concave portion according to the present invention.

FIG. 5 is a diagram showing a method for mounting components according to the present invention.

FIG. 6 is a diagram showing a method for releasing component holding according to the present invention.

FIG. 7 is a perspective view of a substrate after mounting electronic components according to the present invention.

FIG. 8 is a view showing a modified example of the film according to the present invention.

FIG. 9 is a view showing a modified example of the film according to the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Film, 1a-1c ... Depression, 2 ... Substrate, 2a-2
c ... electrode, 11 ... film, 11a ... recess, 11b ...
Holes, 12a: film, 12b: recess, 12c: second film, Pa to Pc, P1 to P3, P: electronic components.

Claims (8)

[Claims] 1. A film for holding an electronic component, wherein a plurality of concave portions capable of inserting and holding an electronic component with its connection surface exposed are provided in a predetermined arrangement. 2. The electronic component holding device according to claim 1, wherein a depth dimension of each of the concave portions is set according to the component size so that a projection size of the electronic component inserted and held in each of the concave portions matches. For film. 3. A film for mounting an electronic component, wherein the electronic component is inserted and held in each recess of the film for holding an electronic component according to claim 1. 4. The electronic component mounting film according to claim 3, wherein the number and arrangement of the concave portions correspond to the number and arrangement of electronic components mounted on the substrate. 5. The electronic component mounting film according to claim 4, wherein a plurality of electronic components for forming a predetermined electric circuit are held on a single film. 6. The component-exposed surface of the film according to claim 3 is oriented to a component-mounting surface of a substrate, and the two are brought relatively close to each other to bring the connection surface of each electronic component into contact with the substrate. And releasing the electronic component by the film in a state where the connection surface of each electronic component is in contact with the substrate, removing the film, and transferring the plurality of electronic components held by the film to the substrate side. An electronic component mounting method characterized in that: 7. A step in which the component-exposed surface of the film according to claim 4 or 5 faces a component-mounting surface of the substrate, and the two are relatively approached to bring the connection surface of each electronic component into contact with the substrate. A step of releasing the electronic component held by the film in a state where the connection surface of the electronic component is in contact with the substrate, removing the film, and transferring a plurality of electronic components held on the film to the substrate side; Electrically connecting an electronic component to a substrate. A method for manufacturing a circuit module, comprising: 8. A process in which the component-exposed surface of the film according to claim 4 or 5 faces a component-mounting surface of the substrate, and the two are relatively approached to bring the connection surface of each electronic component into contact with the substrate. A step of electrically connecting each electronic component to the substrate while the connection surface of the electronic component is in contact with the substrate, and a step of removing the film by releasing the electronic component from the film after connecting the electronic component to the substrate. A method for manufacturing a circuit module, comprising: