JPH10256280A - Semiconductor chip attaching device and manufacture of semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve productivity of LOC-structured semiconductor devices. SOLUTION: A chip thrust hole 14 is formed at the bottom of a wafer fixing tool 13. A stage 11 thrusts up a chip 4 formed on the wafer fixing tool 13, via the chip thrust hole 14. The chip 4 thrusted by the stage 11 and a lead frame 7 are press-bonded to each other by a press-bonding head 9 and the heated stage 11.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor chip bonding apparatus and a method for manufacturing a semiconductor device, and more particularly to a semiconductor chip bonding apparatus for bonding a semiconductor chip used in a semiconductor device having a LOC structure to a lead frame and a method for manufacturing the semiconductor device. About.

[0002]

2. Description of the Related Art A semiconductor device having a LOC structure (hereinafter, referred to as a LOC structure)
Simply called LOC. 3) has a structure in which a lead frame and a semiconductor chip are bonded. Conventionally, this lead frame is bonded to the semiconductor chip by attaching an adhesive tape to the lead frame in advance, heating the semiconductor chip, and then bonding the lead frame with the adhesive tape to the surface of the semiconductor chip by thermocompression bonding. Mounting method is used.

FIG. 3 shows a conventional LOC manufacturing process.
This figure shows the LOC dicing process to the mounting process. First, (a) shows a step of attaching the wafer 1 on the sheet 3 attached to the ring 2. (B)
Shows a process in which the wafer 1 stuck on the sheet 3 is divided into chips 4 by a dicing device.

[0004] (c) shows the ring 2 after completion of the dicing step.
Is set in a mounting device (not shown), and then the chip 4 is picked up by the collet 5. (D) and (e) show the chip 4 by the mounting device.
To the lead frame 7. First (d)
The chip 4 picked up by the collet 5 is moved onto a stage 6 whose surface is usually heated to a temperature in the range of 150 to 350 ° C. as shown in FIG.
Then, the position is recognized, and the position of the chip 4 on the stage 6 is corrected. Next, as shown in (e), the stage 6 is moved below the lead frame 7 and the chip 4 is thermocompression-bonded to the lead frame 7 by lowering the pressure bonding head 9 and raising the stage 6. By these steps, LOC
Then, the chip 4 is bonded to the lead frame 7.

FIG. 4 shows a "break-expanding device" disclosed in Japanese Utility Model Laid-Open No. 21535/1987.
This invention mounts a half-cut wafer while breaking it. FIG. 4A is a diagram showing a state in which the chip 4 is pushed up by the push-up stage 6 after setting the half-cut wafer on the sheet 3 and setting the mount device. FIG. 4B shows a state of the wafer before pushing up. Before pushing up, each chip is not completely separated, but the chip 4 pushed up by the pushing up stage 6 is separated from peripheral chips and picked up by the collet 5.

[0006]

However, the mounting time of the above-described conventional LOC mounting method is as follows.
While the time required for bonding the chip and the lead frame in the LOC is about 1.0 second in a semiconductor device having a general structure, the chip surface is bonded to the lead frame due to the structure of the LOC package. Since the chip is moved to the stage once, the position is corrected, and then the stage is moved under the lead frame, it takes about 3.5 seconds or more including the crimping time of 1.0 second. Needs time. Therefore, there is a problem that a decrease in productivity is inevitable.

[0007] In the "break expander" disclosed in Japanese Utility Model Laid-Open Publication No. 62-21535, the seat 3
The half-cut wafer formed above is pushed up by a push-up stage 6, and the chips 4 separated by the push-up are picked up by a collet 5. A lead frame is attached to the picked-up chips 4. In order to bond the chips, a step of mounting the picked-up chips on a stage is required. Therefore, the manufacturing time cannot be reduced, and the productivity of LOC cannot be improved.

[0008] The present invention has been made in view of the above circumstances,
It is an object of the present invention to provide a semiconductor chip bonding apparatus and a method for manufacturing a semiconductor device, which can improve LOC productivity.

[0009]

According to the first aspect of the present invention,
A wafer fixing jig having an opening at the bottom, a stage for pushing up a semiconductor chip formed on the wafer fixing jig through the opening, a semiconductor chip and a lead frame pushed up by the stage; And crimping means for crimping.

Therefore, according to the present invention, the semiconductor chip formed by the wafer fixed on the wafer fixing jig is pushed up by the stage through the opening provided at the bottom of the wafer fixing jig. Further, by bonding the chip on the stage and the lead frame in this pushed-up state, it is possible to eliminate the trouble of picking up the semiconductor chip and moving it on the stage, thereby shortening the manufacturing time. Performance can be improved.

According to a second aspect of the present invention, in the first aspect of the present invention, the stage has heating means for heating the stage and vacuum means for vacuum-sucking the semiconductor chip. Features.

Therefore, according to the present invention, the effect of the invention described in claim 1 can be obtained, and since the stage itself for pushing up the chip is heated, the chip can be heated easily, and the chip and the stage can be separated. Since only the necessary chips can be pushed up because of the vacuum suction, the productivity of the semiconductor device can be further improved.

According to a third aspect of the present invention, in the first or second aspect, the semiconductor chip bonding apparatus has a camera for recognizing a semiconductor chip pushed up on the stage.

Therefore, according to the present invention, the operation of the invention described in claim 1 or 2 can be obtained, and the position of the semiconductor chip pushed up on the stage can be accurately known.

According to a fourth aspect of the present invention, in the first aspect of the present invention, the semiconductor chip formed on the wafer fixing jig is fixed on the wafer fixing jig. The wafer is formed by half-cutting the wafer.

Therefore, according to the present invention, the operation of the invention according to any one of claims 1 to 3 can be obtained, and the semiconductor chip is half-cut on the wafer, so that the jig for fixing the wafer can be provided. In the semiconductor chip can be prevented.

According to a fifth aspect of the present invention, there is provided a method of fixing a wafer on a wafer fixing jig having an opening at the bottom, and forming the wafer on the wafer fixing jig via the opening. A step of pushing up the semiconductor chip by the stage; and a step of crimping the lead frame and the semiconductor chip pushed up by the stage.

Therefore, according to the present invention, a wafer is fixed on a wafer fixing jig having an opening at the bottom, and a semiconductor chip formed on the wafer fixing jig is placed on the stage through the opening. By pressing the semiconductor chip pushed up by the stage and the lead frame onto the lead frame, it is possible to reduce the time and effort required to pick up the semiconductor chip and move it on the stage, thereby shortening the manufacturing time, and thus the production of semiconductor devices. Performance can be improved.

According to a sixth aspect of the present invention, in the invention of the fifth aspect, the step of pushing up the semiconductor chip formed on the wafer fixing jig by the stage through the opening portion includes heating the stage. The method includes a step of heating by a mechanism and a step of vacuum-sucking the semiconductor chip to a stage.

Therefore, according to the present invention, the operation of the invention described in claim 5 is obtained, and the step of pushing up the semiconductor chip formed on the wafer fixing jig through the opening by the stage is performed in this step. Since it has a step of heating the stage by a heating mechanism and a step of vacuum-sucking the semiconductor chip to the stage, the chip can be easily heated, and only the necessary chip is selected and pushed up on the stage. Further, the productivity of the semiconductor device can be improved.

According to a seventh aspect of the present invention, in the invention of the fifth or sixth aspect, the step of pushing up a semiconductor chip formed on the wafer fixing jig by using a stage comprises:
A step of recognizing a semiconductor chip pushed up by the stage by a camera.

Therefore, according to the present invention, the operation of the invention described in claim 6 or 7 can be obtained, and the position of the semiconductor chip pushed up on the stage can be accurately known.

According to an eighth aspect of the present invention, in the invention according to any one of the fifth to seventh aspects, the step of fixing the wafer on the wafer fixing jig having an opening at the bottom portion comprises the step of fixing the wafer. A step of forming a semiconductor chip by half-cutting a wafer.

Therefore, according to the present invention, the operation of the invention according to any one of claims 5 to 7 can be obtained, and the semiconductor chip is half-cut on the wafer, so that the jig for fixing the wafer can be provided. In the semiconductor chip can be prevented.

[0025]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an embodiment of a semiconductor chip bonding apparatus and a method of manufacturing a semiconductor device according to the present invention will be described with reference to the drawings.

FIG. 1 shows the structure of an embodiment of a semiconductor chip bonding apparatus according to the present invention. However, in this figure, the same members as those shown in FIG. 3 are denoted by the same reference numerals. This semiconductor chip bonding apparatus includes a wafer fixing jig 13 having one or more chip pushing holes 14, a stage 11 for pushing up the chips 4 on the wafer fixing jig 13 through the chip pushing holes 14. , Stage 1
1 has a crimping head 9 for crimping the chip 4 pushed up by 1 and the lead frame 7 to which the adhesive tape 8 is attached. Further, the camera 10 is provided which recognizes a chip around the chip to be picked up and corrects the position. The stage 11 is heated by a heating mechanism (not shown), and the vacuum hole 12 is kept at a vacuum by a bacium hole (not shown).

In this semiconductor chip bonding apparatus, a wafer 1 fixed on a wafer fixing jig 13 is cut in half instead of sticking a wafer on a ring as described in the prior art and pasting the wafer. Then, a chip 4 is formed. Then, the chip 4 is pushed up from the back surface of the chip 4 by the stage 11 through the chip pushing-up hole 14. At this time, the chips around the chip 4 to be picked up are vacuum-adsorbed because the vacuum hole 12 is kept in vacuum, and only the chip 4 to be picked up is separated from the wafer 1. Then, the protruded chip 4 is attached to the lead frame 7 to which the adhesive tape 8 is attached, by the stage 11.
The LOC is manufactured by pressure bonding with the pressure bonding head 9. Further, since the stage 11 is also heated, the chip 4 pushed up by the stage 11 is also heated. Therefore, pressure bonding by the stage 11 and the pressure bonding head 9 is thermocompression bonding.

Therefore, according to the semiconductor chip bonding apparatus, the chip 4 formed on the wafer fixing jig 13 is pushed up by the stage 11 and is pressed against the lead frame as it is, thereby shortening the mounting time. As a result, LOC productivity can be improved.

Next, one embodiment of a method of manufacturing a semiconductor device according to the present invention will be described with reference to FIG. However, in this figure, the same members as those of the semiconductor chip bonding apparatus shown in FIG. FIG. 2 (a)
Is a wafer fixing jig 13 for fixing the wafer 1 having a plurality of chip push-up holes 14 at the bottom thereof.
FIG. 5 is a view showing a step of fixing the wafer 1 to the substrate. FIG. 2B shows the wafer 1 fixed to the wafer fixing jig 13.
FIG. 3 is a view showing a process of forming a chip 4 by dividing the chip 4 in a half-cut state. FIG. 2C shows that the stage 11 is pushed up through the chip pushing-up hole 14 formed in the bottom of the wafer fixing jig 13, and the chip 4 is attached to the lead frame 7 to which the adhesive tape 8 is attached. FIG. 3 is a view showing a step of pressing the pressure-bonding with a pressure bonding head 9.

The method of manufacturing the semiconductor device will be described in more detail. First, as described above, FIG. 2A shows a step of fixing the wafer 1 to the wafer fixing jig 13, and FIG. 2B shows a step of dividing the wafer 1 into chips 4 in a half-cut state. The uncut amount of this half cut is set to 150 μm or less. This is stage 11
This is because it is necessary to easily separate the chips when the chips 4 are pushed up to reduce chip breakage on the back surface. Therefore, the jig 1 for fixing the wafer 1 to the wafer 1
It is preferable that the mounting to No. 3 is performed before dicing in order to prevent cracking of the wafer.

(C) shows a step of bonding the chip 4 to the lead frame 7 by a mounter device (not shown). Wafer 1
Since the chip 4 is obtained by performing a half-cut, the position of the chip 4 on the wafer fixing jig 13 does not shift, and there is no need to directly recognize the position of the chip to be mounted. . Therefore, the camera 10
Recognize the chip around the chip to be picked up by and correct the position. After the correction of the position, the stage 11 is raised from the bottom of the wafer fixing jig 13 through the chip push-up hole 14. Chip 4 and Stage 1
1 is vacuum-adsorbed because the vacuum hole 12 is kept in a vacuum, and the chip 4 is separated from peripheral chips when pushed up. Then, at the same time when the chip 4 comes into contact with the lead frame 7, the pressure bonding head 9 presses the lead frame 7 having the adhesive tape 8 from above, and the chip 4
Adhered to. Here, the size of the chip push-up hole 14 is large enough to move the stage 11 up and down. The distance between the side of the chip push-up hole 14 and the side of the stage 11 is about 1
mm, and all the chips 4 formed on the wafer 1 are arranged so as to be pushed up.

The stage 11 has a not-shown bacium hole for vacuum-sucking the chip 4 and a heating mechanism for thermocompression bonding. Therefore, the vacuum hole 12 is evacuated by the bacium hole, the stage 11 and the chip 4 are vacuum-sucked, and the stage 4 is heated by the heating mechanism, thereby heating the chip 4 on the stage 11 and thus the lead frame 7. Thermocompression bonding between the chip 4 and the chip 4 can be easily performed. The size of the tip of the stage 11 only needs to be about 0.5 to 1.0 mm larger than the dimension of the tape material since it is sufficient that the tape material does not protrude.

[0033]

As is apparent from the above description, according to the present invention, the half-cut wafer is moved under the lead frame and the chips are directly pushed up and mounted. In addition, the chip recognition time is 0.5 seconds and the wafer movement time is 0.5 seconds. Therefore, the mounting time is about 2.0 seconds compared to about 3.5 seconds in the conventional method.
Since the time can be reduced to seconds, it is possible to provide a semiconductor chip bonding apparatus and a method for manufacturing a semiconductor device, which can improve the productivity of the semiconductor device.

Further, by heating the stage, the chip pushed up by the stage is heated, the stage and the chip are sucked by vacuum suction, and the position of the chip pushed up by the stage is recognized by the camera. It is possible to provide a semiconductor chip bonding apparatus and a method for manufacturing a semiconductor device, which can further improve the performance.

Further, since the chips are obtained by half-cutting the wafer fixed on the wafer fixing jig, the chip can be prevented from being displaced on the wafer fixing jig. A semiconductor chip bonding apparatus and a method for manufacturing a semiconductor device, which can further improve the productivity of the apparatus, can be provided.

[Brief description of the drawings]

FIG. 1 is a view showing one embodiment of a semiconductor chip bonding apparatus according to the present invention.

FIG. 2 is a diagram showing one embodiment of a method for manufacturing a semiconductor device according to the present invention.

FIG. 3 is a view showing a manufacturing process of a conventional semiconductor device.

FIG. 4 is a diagram showing a conventional method of picking up a chip.

[Explanation of symbols]

 Reference Signs List 1 wafer 2 ring 3 sheet 4 chip 5 collet 6 stage 7 lead frame 8 adhesive tape 9 pressure bonding head 10 camera 11 stage 12 vacuum hole 13 wafer fixing jig 14 chip push-up hole

Claims (8)

[Claims] 1. A wafer fixing jig having an opening at a bottom portion, a stage for pushing up a semiconductor chip formed on the wafer fixing jig through the opening, and a semiconductor pushed up by the stage. A semiconductor chip bonding apparatus, comprising: a crimping means for crimping a chip and a lead frame. 2. The semiconductor chip bonding apparatus according to claim 1, wherein the stage has a heating unit for heating the stage and a vacuum unit for vacuum-sucking the semiconductor chip. 3. The semiconductor chip bonding apparatus according to claim 1, wherein the semiconductor chip bonding apparatus has a camera for recognizing a semiconductor chip pushed up on the stage. 4. The semiconductor chip formed on the wafer fixing jig is formed by half-cutting a wafer fixed on the wafer fixing jig. 4. The semiconductor chip bonding apparatus according to any one of items 1 to 3, wherein 5. A step of fixing a wafer on a wafer fixing jig having an opening at the bottom, and pushing up a semiconductor chip formed on the wafer fixing jig by a stage via the opening. A method for manufacturing a semiconductor device, comprising: a step of bonding a semiconductor chip pushed up by the stage and a lead frame to a lead frame. 6. A step of pushing up a semiconductor chip formed on the wafer fixing jig by a stage through the opening, the step of heating the stage by a heating mechanism, and applying a vacuum to the stage by the semiconductor chip. 6. The method for manufacturing a semiconductor device according to claim 5, further comprising the step of adsorbing. 7. The step of pushing up a semiconductor chip formed on the wafer fixing jig by a stage includes a step of recognizing the semiconductor chip pushed up by the stage by a camera.
13. The method for manufacturing a semiconductor device according to item 5. 8. The step of fixing a wafer on a wafer fixing jig having an opening at the bottom thereof includes a step of half-cutting the fixed wafer to form semiconductor chips. Items 5 to 7
The method for manufacturing a semiconductor device according to any one of the above.