JPH10255223A - Manufacture of magnetic head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To form a recess to form a coil not including level-different area to control breaking of coil by previously forming a resist layer thinner than the resist to become a mask on a conductive material in the etching region at the time of etching. SOLUTION: A recess to form a coil 29 is formed, by the etching process, to the area between the area filled with the low melting point glass 26 the terminal groove 27 filled with a conductive material 28 on the joining surface of the nonmagnetic substrates 20, 21. Since the etching rate of the low melting point glass 26 is higher than that of the conductive material 28, a resist layer 31 in the predetermined thickness is previously formed on the conductive material 28. Therefore, difference in amount of etching is alleviated and the recess 29 to form a coil. not including level-different area can be formed. Accordingly, the thin film coil formed in the recess 29 to form the coil can be well connected to the conductive material 28 to control the generation of breaking of the coil and improve the manufacturing yield.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for manufacturing a magnetic head in which a pair of magnetic core halves having at least one thin-film coil formed thereon are joined and integrated, and a magnetic gap is formed on a joining surface. The present invention relates to a method of manufacturing a magnetic head in which no step is formed in a concave portion for forming a coil.

[0002]

2. Description of the Related Art Conventionally, a video cassette recorder (V
As a magnetic head for CR), a metal magnetic film is formed on each magnetic gap forming surface of a pair of magnetic core halves made of single crystal ferrite or the like, and this pair of magnetic core halves is joined to the magnetic gap forming surface. A so-called metal-in-gap (MIG) type magnetic head which is integrally joined as a surface and a so-called laminated type magnetic head in which a metal magnetic film is sandwiched between nonmagnetic ceramic substrates have been proposed and put into practical use.

In a magnetic recording / reproducing apparatus such as a VCR, digital recording for digitizing and recording a signal has been promoted in order to improve image quality. In response to this, recording density has been increased and recording frequency has been increased. Higher frequencies are being used. Also, a magnetic head mounted on a VCR is desired to exhibit good electromagnetic conversion characteristics in a higher frequency band. Further, it is desired to reduce the size of a magnetic head for a VCR so that a plurality of magnetic heads can be mounted on a small drum.

However, the above-mentioned MIG type magnetic head has a large impedance and is not suitable for use in a high frequency band. In addition, in the stacked magnetic head, it is necessary to reduce the thickness of the metal magnetic film constituting the magnetic path in accordance with the reduction of the track width due to the high density recording, so that the reproduction efficiency is reduced and the size of the head is reduced. There are some limits to the conversion.

[0005] Therefore, as a magnetic head capable of exhibiting good electromagnetic conversion characteristics in a high frequency band, the above-mentioned MIG is used.
A magnetic head (hereinafter, referred to as a bulk thin-film magnetic head) in which a magnetic path formed of a metal magnetic film is made smaller than that of a conventional magnetic head or a stacked magnetic head and a coil is formed by a thin film forming process is proposed. ing.

In this bulk thin-film magnetic head, a pair of magnetic core halves each having a metal magnetic film formed as a magnetic core on a non-magnetic substrate are joined and integrated, and a magnetic gap is formed between joining surfaces. In this bulk thin-film magnetic head, a thin-film coil is formed on a joining surface of at least one of the pair of magnetic core halves.

In forming this thin-film coil, first,
A concave portion for coil formation having a shape corresponding to the coil shape is formed on the joint surface of the magnetic core half filled with the low melting point glass by a method such as ion etching. Then, a thin film coil made of Cu or the like is formed in the concave portion by a method such as an electrolytic plating method.

[0008]

In this bulk thin-film magnetic head, a terminal groove is formed on the joining surface of the magnetic core halves for leading out the terminals of the coil to the outside. Is filled with the conductive material. The thin-film coil is formed such that one end thereof is connected to the conductive material in the terminal groove.

Therefore, the concave portion for forming the coil is formed from the portion of the magnetic core half filled with the low melting point glass to the terminal groove filled with the conductive material in order to connect one end of the coil to the conductive material. .

However, since the etching rate is different between the conductive material and the low-melting glass, if the concave portion for forming the coil is to be formed as it is, there is a difference between the etching amount of the conductive material and the etching amount of the low-melting glass. Arises
As shown in FIG. 15, a step 101 is formed in the coil forming recess 100. For example, when Cu is used for the conductive material 102, the etching rate of the conductive material 102 is 0.0232 μm / min, while the etching rate of the low-melting glass 103 is 0.0196 μm / mi.
n. Therefore, 306 is obtained by ion etching.
When etching is performed for one minute, the etching amount of the conductive material 102 is about 7 μm, and the etching amount of the low melting point glass 103 is about 6 μm, so that a step 101 of about 1 μm is formed.

As described above, when the step 101 is formed in the coil forming recess 100, the wall portion 1 of the step 101
It is difficult to grow Cu or the like, which is the material of the coil, by plating on 01a, which causes disconnection of the coil and lowers the production yield.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a method of manufacturing a magnetic head in which a coil-forming concave portion having no step is formed and the disconnection of the coil is suppressed to improve the manufacturing yield.

[0013]

In a method of manufacturing a magnetic head according to the present invention, a coil forming region on a joining surface of a magnetic core half is filled with glass, and a conductive material is embedded corresponding to a terminal position of the coil. Thereafter, the glass and the conductive material are etched using a resist as a mask to form a concave portion corresponding to the coil shape, and in a method of manufacturing a magnetic head in which a thin film coil is formed in the concave portion, it becomes a mask at the time of etching. It is characterized in that a resist layer thinner than the resist is formed in advance on the conductive material in the etching region.

According to this method of manufacturing a magnetic head, the resist layer formed in advance on the conductive material reduces the difference in the etching amount due to the difference in the etching rate between the glass and the conductive material. It is formed.

That is, the difference in the amount of etching is calculated from the difference in the etching rate between the glass and the conductive material and the etching time, and a resist layer having a thickness corresponding to the difference in the amount of etching is previously formed on the conductive material. By performing the etching, the amount of etching of the conductive material can be made substantially the same as the amount of etching of the glass, and a concave portion having no step is formed.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, specific embodiments of the present invention will be described in detail with reference to the drawings.

The bulk thin-film magnetic head 1 is shown in FIG.
1B, a pair of magnetic core halves 4 each having a metal magnetic film 3 serving as a magnetic core formed on a non-magnetic substrate 2 by a sputtering method or the like, as shown in an enlarged perspective view of a main part in FIG. , 5 are bonded and integrated by low-temperature metal diffusion bonding, and a magnetic gap G is formed between the bonding surfaces. The bulk thin-film magnetic head 1 has a coil-forming recess (not shown) formed on a joining surface of at least one of the pair of magnetic core halves 4 and 5. A thin film coil 6 for exciting or detecting an induced electromotive voltage is formed therein.

The bulk thin-film magnetic head 1 has the following features.
A winding groove 7 is formed in the joining surface of the pair of magnetic core halves 4 and 5 on which the metal magnetic film 3 is formed so as to separate a part of the joining surface side of the metal magnetic film 3. Therefore, in the bulk thin film magnetic head 1, the magnetic gap G
Are separated into a front gap 8 and a back gap 9 which are operating gaps by the winding grooves 7.

The bulk thin-film magnetic head 1 has the following features.
As shown in FIG. 2, a terminal groove 10 for leading a coil terminal to the outside is formed on a joint surface of the pair of magnetic core halves 4 and 5, and the terminal groove 10 is filled with a conductive material 11. . The bulk thin-film magnetic head 1 is formed such that one end of the thin-film coil 6 is connected to the conductive material 11 in the terminal groove 10, and the coil terminal is drawn out.

The bulk thin-film magnetic head 1
Is mounted on, for example, a VCR or the like, and records a signal on the magnetic recording medium or reproduces a signal magnetic field by sliding the magnetic recording medium on the medium sliding surface on the front gap 8 side.

The bulk thin-film magnetic head 1 configured as described above has a plurality of magnetic core halves formed on the same substrate. The bulk thin-film magnetic head 1 is formed by bonding a pair of the substrates and separating the individual substrates.

Hereinafter, a method of manufacturing the bulk thin-film magnetic head 1 will be described in detail.

First, as shown in FIG. 3, a pair of substantially flat non-magnetic substrate members 20 and 21 are prepared. The non-magnetic substrate members 20 and 21 are finally cut to become the non-magnetic substrate 2 of the bulk thin-film magnetic head 1 described above.
Materials having good sliding characteristics and wear characteristics and excellent mechanized composition are used. For example, calcium titanate, potassium titanate, barium titanate, zirconium oxide (zirconia), alumina, alumina titanium carbide, SI
O ₂ , MnO—NiO mixed sintered material, Zn ferrite, crystallized glass, high hardness glass and the like are used. In this example, Mn having a thickness of about 2 mm, a length and a width of about 30 mm
An O—NiO mixed sintered material is used.

Then, as shown in FIG. 4, the main surfaces 20a and 21a of the pair of non-magnetic substrate members 20 and 21 respectively.
A magnetic core forming groove 22 having an inclined surface 22a inclined at a predetermined angle with respect to the main surfaces 20a, 21a.
Are formed in a plurality of rows. The angle of the inclined surface 22a of the magnetic core forming groove 22 is set within the range of 25 degrees to 60 degrees. However, in consideration of the pseudo gap and the track width accuracy, the angle of the inclined surface 22a is 35 degrees to 50 degrees. It is desirable that the degree is about the degree. In this example, the non-magnetic substrate material 20,
21 has an inclined surface 22a inclined at an angle of 45 degrees with respect to the main surfaces 20a, 21a, and has a depth of about 130 μm.
Then, a magnetic core forming groove 22 having a width of about 150 μm is formed. The magnetic core forming groove 22 is formed using a grindstone having one surface formed obliquely.

Next, as shown in FIG. 5, a metal magnetic film 23 is formed on the inclined surface 22a of the magnetic core forming groove 22 by a PVD method such as a magnetron sputtering method or a thin film forming method such as a CVD method. It is formed to have a thickness. The metal magnetic film 23 finally becomes the metal magnetic film 3 constituting the magnetic core of the bulk thin-film magnetic head 1 described above. The metal magnetic film 23 has a high saturation magnetization and a high magnetic permeability, and is a material that can be easily thinned. Is used, for example, Sendust (Fe
-Al-Si alloy), Fe-Al alloy, Fe-Si
-Co alloy, Fe-Ga-Si alloy, Fe-Ga-
Si-Ru alloy, Fe-Al-Ge alloy, Fe-G
a-Ge alloy, Fe-Si-Ge alloy, Fe-Co
Crystalline alloys such as -Si-Al alloys and Fe-Ni alloys are used. Alternatively, the metal magnetic film 23 is made of Fe,
Alloy composed of one or more elements of Co, Ni and one or more elements of P, C, B, Si, or an alloy containing Al, Ge, Be, Sn, In, Mo, W, T
metal-metalloid amorphous alloys typified by alloys containing i, Mn, Cr, Zr, Hf, Nb, etc .;
It may be made of an amorphous alloy such as a metal-metal-based amorphous alloy mainly containing a transition metal such as Co, Hf, or Zr and a rare earth element.

The metal magnetic film 23 may be a single-layer film of the above-described metal magnetic material. However, in order to provide high sensitivity in a higher frequency region, the metal magnetic material 23 is formed of a non-magnetic layer by a plurality of layers. It is preferable to have a laminated structure in which the structure is divided. As described above, by forming the metal magnetic film 23 to have a laminated structure of the metal magnetic layer and the nonmagnetic layer, eddy current loss can be reduced. In this case, the thickness of the non-magnetic layer is required to be at least a thickness at which an insulating effect can be obtained, but is set to a thickness that does not act as a pseudo gap. In this example, a metal magnetic layer made of sendust having a thickness of about 5 μm and a nonmagnetic layer made of alumina having a thickness of about 0.15 μm are alternately laminated to have three magnetic layers.

Next, as shown in FIG. 6, the separation grooves 24 and the winding grooves are formed on the main surfaces 20a and 21a of the non-magnetic substrate members 20 and 21 in a direction orthogonal to the magnetic core forming grooves 22. 25 are alternately formed in a plurality of rows.

The separation groove 24 is used to magnetically separate the metal magnetic film 23 to form a magnetic core and to form a closed magnetic path when the bulk thin-film magnetic head 1 is finally formed. Therefore, the separation groove 24 needs to have a depth enough to surely divide the metal magnetic film 23, but the shape is not limited. In this example, the groove is formed to have a depth of about 150 μm, that is, a depth of about 280 μm from the bottom of the magnetic core forming groove 22, and has a substantially U-shaped cross section.

Although two separation grooves 24 are formed in the example of FIG. 6, it is necessary to provide as many as the number of rows of magnetic core halves to be formed.

The winding groove 25 is used for winding the thin film coil 6 formed in a step described later, and when the bulk thin film magnetic head 1 is finally formed, the front gap 8 and the back gap 9 are formed. The metal magnetic film 23 must be formed to have such a depth that the metal magnetic film 23 is not cut. The shape of the winding groove 25 is determined according to the length of the front gap 8 and the back gap 9. Here, the width is about 140 μm, and the length of the front gap 8 is about 300 μm,
The back gap 9 is formed to have a length of about 85 μm. The winding groove 25 may have such a depth that the metal magnetic film 23 is not cut. However, if the winding groove 25 is too deep, there is a possibility that the magnetic path length increases and the efficiency of magnetic flux transmission decreases.

The winding groove 25 is formed in the front gap 8 when the bulk thin-film magnetic head 1 is finally formed.
If the end on the side is narrowed down to an acute angle,
The magnetic flux can be concentrated, and the recording sensitivity of the head can be improved. Therefore, it is desirable that the winding groove 25 be formed in a shape in which the front gap 8 side is inclined. In this example, the winding groove 25 is formed such that the wall surface on the front gap 8 side has a 45-degree inclined surface.

Next, as shown in FIG. 7, the magnetic core forming groove 22, the separation groove 24 and the winding groove 25 are melted on the main surfaces 20a and 21a of the non-magnetic substrate members 20 and 21, respectively. The low melting point glass 26 is filled. Then, the main surfaces 20 of the nonmagnetic substrate materials 20 and 21 filled with the low melting point glass 26 are formed.
The surfaces of a and 21a are flattened by polishing or the like.

Next, as shown in FIG. 8, terminal grooves 27 are formed on the main surfaces 20a, 21a of the flattened non-magnetic substrate members 20, 21 by grinding using a grindstone or the like. This terminal groove 27 is located immediately above the above-described separation groove 24,
It is formed so that its width and depth are about 100 μm. Then, a conductive material 2 such as Cu is
8 is filled by an electrolytic plating method or the like, and the surface is flattened.

Next, as shown in FIGS. 9A and 9B, the main surfaces 20 of the planarized non-magnetic substrate members 20 and 21 are formed.
A coil-forming recess 29 having a shape corresponding to the coil shape is formed on a and 21a. Then, the thin-film coil 6 is formed in the coil forming recess 29 by a method such as an electrolytic plating method.
Is formed.

In this embodiment, a coil forming recess 29 having a depth of about 6 μm is formed by ion etching, and a Cu plating of about 4 μm is grown in the coil forming recess 29 by Cu electroplating. Thin film coil 6
To form

The thin-film coil 6 is provided with a conductive material 28 in the above-described terminal groove 27 in order to extract the terminal to the outside.
It needs to be formed to be connected to Therefore, the coil forming recess 29 is also formed from the portion where the low melting point glass 26 is filled on the main surfaces 20 a and 21 a of the nonmagnetic substrate materials 20 and 21 to the terminal groove 27.

When forming the coil forming recess 29, first, as shown in FIG. 10, the main surfaces 20a, 21a of the nonmagnetic substrate materials 20, 21 filled with the low melting point glass 26 are formed.
In a place where the coil forming recess 29 is not formed,
The resist 30 is patterned.

If the thickness of the resist 30 is not sufficient, the resist 30 is completely removed before the end of the etching, so that the low-melting glass 26 on which the resist 30 is coated is etched. If the low-melting glass 26 on the application surface of the resist 30 is etched, the depth of the coil-forming concave portion 29 changes relatively, and the depth of the coil-forming concave portion 29 is set to an accurate value. Can not. Therefore, the resist 30 is formed in the concave portion 2 for coil formation.
During the etching of No. 9, it is desirable that the film remains while maintaining an appropriate film thickness. Therefore, the resist 30 to be patterned has an appropriate film thickness calculated from the etching rate of the low-melting glass 26 serving as an etching surface, the etching rate of the resist 30 to be used, and the intended depth of the coil forming recess 29. It is desirable to apply.

The etching rate of the low-melting glass 26 used in this example is 0.0196 μm / min, and the etching rate of the resist 30 is 0.0165.
μm / min. Therefore, when forming the coil forming recess 29 having a depth of about 6 μm, about 306
Minute etching is required, and the amount of etching of the resist 30 in the case of etching for 306 minutes is 5 μm.
m. Therefore, it is desirable that the thickness of the resist 30 be 5 μm or more, and a value of about 7 to 8 μm.

The terminal groove 2 filled with the conductive material 28
A resist layer 31 that is thinner than the above-described resist 30 is previously formed on 7. This is for reducing the difference in the etching amount due to the difference in the etching rate between the low melting point glass 26 and the conductive material 28 so that no step is formed in the coil forming recess 29.

The thickness of the resist layer 31 can be calculated from the etching rate of the low-melting glass 26, the etching rate of the conductive material 28, the etching rate of the resist 31, and the depth of the coil-forming concave portion 29 to be formed. . That is, the thickness D of the resist layer 31 is such that the etching rate of the low-melting glass 26 is R ₁ , the etching rate of the conductive material 28 is R ₂ , the etching rate of the resist 31 is R ₃ , and the depth of the coil forming recess 29 is When L, it can be represented by D = R ₃ · (L / R ₁ -L / R ₂ ).

This value is the optimum thickness of the resist layer 31, and a slight error is allowed within a range in which a step that causes disconnection of the thin film coil 6 is not formed in the coil forming recess 29. It has been confirmed that this step does not cause disconnection in the thin film coil 6 if the conductive material 28 is suppressed to within 0.5 μm in a concave state. Therefore, the thickness D of the resist layer 31 is R ₃ · ｛L / R _1- (L + 0.
5) If it is within the range represented by / R ₂ ｝ ≦ D ≦ R ₃ · (L / R ₁ -L / R ₂ ), the thin film coil 6 may be disconnected in the coil forming recess 29. Since no step is formed, the step may be formed within this range.

In this example, the etching rate R ₁ of the low melting point glass is 0.0196 μm / min, and the conductive material 2
The etching rate R _{2 of} Cu, which is 8, is 0.0232 μm.
m / min, the etching rate R ₃ of the resist 31 is 0.0165 μm / min, and the depth L of the coil-forming recess 29 to be formed is 6 μm. Therefore, the resist layer 31 has a thickness D of about 0.43 μm to 0.8 μm.
It is formed within a range of 4 μm.

Then, as shown in FIG. 11A to FIG. 11C, the patterned resist 30
Is used as a mask to form the coil forming recess 29 by a method such as ion etching. At this time, the etching rate of the conductive material 28 is higher than the etching rate of the low-melting glass 26, but since the resist layer 31 having a predetermined thickness is formed on the conductive material 28, the etching rate is lower. Thus, the difference in the etching amount due to the difference is alleviated, and the coil forming recess 29 having no step is formed. Therefore, in the thin film coil 6 formed in the coil forming recess 29, the occurrence of disconnection is suppressed, and the production yield is improved.

In this embodiment, an example in which the thin film coil 6 is formed by the electrolytic plating method has been described. However, the thin film coil 6 may be formed by a thin film forming method such as a sputtering method or a vapor deposition method without using the electrolytic plating method. May be formed.

Even when the thin film coil 6 is formed by a sputtering method, a vapor deposition method or the like, since no step is formed in the coil forming recess 29, disconnection of the thin film coil 6 is suppressed.

Next, although not shown, a coil protection film is formed on the thin-film coil 6 to prevent leakage between the coils and disconnection of the thin-film coil 6. Then, a metal film which becomes a magnetic gap G is formed on the entire surface of the non-magnetic substrate materials 20 and 21 by a thin film forming method such as a sputtering method, and is etched using a resist or the like, whereby the non-magnetic substrate materials 20 and 21 are etched. A metal bonding film patterned into a predetermined shape is formed thereon. Since this metal bonding film bonds the pair of non-magnetic substrate materials 20 and 21 by low-temperature metal diffusion bonding, the material is Au, Ag, P
Metals such as t, Cu, and Al are preferred. In this example,
An Au film having a thickness of about 0.1 μm is formed as a metal bonding film.

Next, as shown in FIG. 12, the non-magnetic substrate members 20, 21 are cut so that the plurality of magnetic core halves formed simultaneously as described above are arranged in a line in the horizontal direction. Core half blocks 32 and 33 are created.

Then, the pair of magnetic core half-blocks 32 and 33 whose joint surfaces have been cleaned are bonded by low-temperature metal diffusion bonding as shown in FIG. in this way,
By joining and integrating the pair of magnetic core half-blocks 32 and 33 by low-temperature metal diffusion bonding, it is possible to reliably join a portion that needs to be electrically connected between the pair of magnetic core half-blocks 32 and 33. Can be.

Next, as shown in FIG. 14, the magnetic core block 34 obtained by bonding the pair of magnetic core half blocks 32 and 33 is separated into individual bulk thin film magnetic heads 1. At this time, the magnetic core block 34
Are cut along the lines indicated by A1-A2 and B1-B2 in FIG. Thus, the bulk thin-film magnetic head 1 having the magnetic gap G between the front gaps 8 is formed.

Although not shown, the medium sliding surface of the bulk thin-film magnetic head 1 is subjected to cylindrical polishing so that the medium sliding surface has a cylindrical shape. Also,
In order to improve the contact characteristics with the magnetic recording medium, a restricting groove is formed on the medium sliding surface so as to be substantially parallel to the sliding direction of the magnetic recording medium. The head 1 is completed.

In the bulk thin film magnetic head 1 manufactured as described above, since no step is formed in the coil forming concave portion 29, the occurrence of disconnection of the thin film coil 6 is suppressed. Therefore, by manufacturing the bulk thin-film magnetic head 1 by this method, the manufacturing yield can be improved.

[0053]

According to the method of manufacturing a magnetic head of the present invention,
When forming a concave portion for forming a coil by etching from a portion filled with glass on a joining surface of a magnetic core half to a portion filled with a conductive material, the conductive material is formed on the conductive material in advance by using a resist which is a mask. Since a thin resist layer is formed, a difference in etching amount due to a difference in etching rate between the glass and the conductive material can be reduced, and a recess having no step can be formed.

Therefore, according to the method of manufacturing a magnetic head, the occurrence of disconnection of the coil of the manufactured magnetic head is suppressed, so that the manufacturing yield can be improved.

[Brief description of the drawings]

FIG. 1 is a diagram showing a bulk thin film magnetic head;
FIG. 2A is an overall perspective view of the magnetic head, and FIG. 2B is an enlarged perspective view of a main part of the magnetic head in FIG.

FIG. 2 is an exploded perspective view of the magnetic head shown in FIG.

FIG. 3 is a diagram illustrating a manufacturing process of the bulk thin-film magnetic head, and is a perspective view of a pair of non-magnetic substrate materials.

FIG. 4 is a diagram for explaining a manufacturing process of the bulk thin-film magnetic head, and is a perspective view of a pair of non-magnetic substrate materials in which a magnetic core forming groove is formed.

FIG. 5 is a diagram illustrating a manufacturing process of the bulk thin-film magnetic head, and is a perspective view of a pair of non-magnetic substrate materials on which a metal magnetic film is formed.

FIG. 6 is a diagram illustrating a manufacturing process of the bulk thin-film magnetic head, and is a perspective view of a pair of non-magnetic substrate members in which a gap separation groove and a winding groove are formed.

FIG. 7 is a diagram illustrating a manufacturing process of the bulk thin-film magnetic head, and is a perspective view of a pair of non-magnetic substrate materials filled with low-melting glass.

FIG. 8 is a diagram for explaining a manufacturing process of the bulk thin-film magnetic head, and is a perspective view of a pair of non-magnetic substrate materials on which terminal grooves are formed.

9A and 9B are diagrams illustrating a manufacturing process of a bulk thin-film magnetic head, wherein FIG. 9A is an overall perspective view of a pair of non-magnetic substrate materials on which a thin-film coil is formed, and FIG. It is a principal part expansion perspective view of a board | plate material.

FIG. 10 is a diagram illustrating a manufacturing process of the bulk thin-film magnetic head, and is a plan view of a main part of a nonmagnetic substrate material showing a state in which a resist for forming a coil forming recess is patterned;

11A and 11B are diagrams showing a process of forming a coil-forming concave portion over time, wherein FIG. 11A is a cross-sectional view taken along line AA of FIG. 10 of a non-magnetic substrate material on which a resist is formed, and FIG. It is sectional drawing of the non-magnetic board | substrate material inside, (C) is sectional drawing of the non-magnetic board | substrate material in which the recessed part for coil formation was formed.

FIG. 12 is a diagram for explaining a manufacturing process of the bulk thin-film magnetic head, and is an overall perspective view of a pair of magnetic core block halves.

FIG. 13 is a diagram illustrating a manufacturing process of the bulk thin-film magnetic head, and is a perspective view illustrating a state in which a pair of magnetic core block halves are joined.

FIG. 14 is a diagram for explaining a manufacturing process of the bulk thin-film magnetic head, and is an overall perspective view of the magnetic core block.

FIG. 15 is a view for explaining a conventional method of manufacturing a magnetic head, and is a cross-sectional view of a non-magnetic substrate material showing a state in which a step is formed in a coil forming recess.

[Explanation of symbols]

1 bulk thin film magnetic head, 4,5 magnetic core halves,
6 Thin film coil, 10, 27 terminal groove, 11, 28 conductive material, 26 low melting point glass, 29 coil forming recess, 30 resist, 31 resist layer

Claims (2)

[Claims] After filling a coil forming region of a joining surface of a magnetic core half with glass and embedding a conductive material corresponding to a terminal position of the coil, the glass and the conductive material are etched using a resist as a mask. Forming a concave portion corresponding to the coil shape, and forming a thin-film coil in the concave portion. In the method of manufacturing a magnetic head, a resist layer having a thickness smaller than that of the resist serving as the mask is previously etched in the etching region. A method of manufacturing a magnetic head, comprising forming the magnetic head on a conductive material. 2. The etching rate of the glass is R ₁ ,
When the etching rate of the conductive material is R ₂ , the etching rate of the resist formed on the conductive material is R _3, and the depth of the formed recess is L, the resist formed on the conductive material is The thickness D of R ₃ · {L / R _1- (L + 0.5) / R ₂ } ≦ D ≦ R _{3
· (L / R 1 -L /} R 2) The process according to claim 1, magnetic head, wherein the represented by.