JPH10239352A - Probe apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a probe apparatus in which the abrasion of a film through sliding touch with a pressing film is restricted to a minimum and which makes constant a press force (press amount) exerted from the pressing film to a contact pin via the film. SOLUTION: The probe apparatus is provided with a pressing film 410 which is arranged arm a film 201a and presses a contact pin 3a via the film 201a when the contact pin 3a is in pressed touch with an object 90 to be measured. The pressing film 410 is set to be projected from the film 201a so that a corner part 411 at a leading end of the film is not in touch with the film 201a when the pressing film 410 presses the contact pin 3a. Moreover, the pressing film 410 is designed to project from the film 201a by an amount not to exceed the contact pin 3a to keep tone noncontact state to the contact pin 3a.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe device (probe) which is used as a probe pin or a socket pin and has a contact probe for performing an electrical test by contacting each terminal of a semiconductor IC chip or a liquid crystal device. Card).

[0002]

2. Description of the Related Art In general, a contact pin is used to conduct an electrical test by contacting a semiconductor chip such as an IC chip or an LSI chip or each terminal of an LCD (liquid crystal display). In recent years, as the integration and miniaturization of IC chips and the like have increased, the pitch of contact pads, which are electrodes, has been reduced, and the pitch of contact pins has been required to be narrower. However, with a tungsten needle contact probe used as a contact pin, it has been difficult to cope with a multi-pin narrow pitch due to the limitation of the diameter of the tungsten needle.

On the other hand, as shown in FIGS. 9 and 10, a plurality of pattern wirings 3 are formed on a resin film 201, and the tips of these pattern wirings 3 are arranged so as to protrude from the resin film 201. Contact pin 3
The technology of the contact probe 200 referred to as “a” has been proposed. In this technology example, the tip of the plurality of pattern wirings 3 is used as a contact pin 3a, thereby achieving a narrow pitch of the multi-pin.

The contact probe 200 is used, for example, in an LCD probe device 100 as shown in FIG. The LCD probe device 100 includes a contact probe holding body 110 that holds the contact probe 200 and a contact probe holding body 11 that holds the contact probe 200.
0 is fixed to the frame frame 120 (actually, a plurality of contact probe holding bodies 11
0 is attached, but only one is shown here),
The tip of the contact pin 3a protruding from the contact probe holding body 110 comes into contact with a terminal (not shown) of the LCD 90.

As shown in FIG. 12, the contact pin 3a of the contact probe 200 may have an upwardly curved distal end S1 or a downwardly curved distal end S2 in addition to a normal distal end S. In this case, as shown in FIG.
Even when pressed against the terminal 90, the normal tip S1 and the downwardly curved tip S2 contact the terminal of the LCD 90, but the upwardly curved tip S1 does not contact, and even if the tip S1 makes contact, it has a sufficient contact pressure. And electrical tests could not be performed accurately due to poor contact. In addition, the pressing amount of the contact pin 3a is increased or decreased in order to obtain a desired contact pressure at the time of the test, but a large pressing amount is required to obtain a large contact pressure, but the amount is limited due to the shape of the needle. In some cases, a large contact pressure could not be obtained.

Therefore, as shown in FIG. 14, in order to align the tip S1 curved upward and the tip S2 curved downward on the contact pin 3a with the normal tip S, a ferroelastic film 400 is placed on top of the resin film 201. Are superimposed. This strong elastic film 400
Since the upwardly curved distal end S1 is pressed, even the upwardly curved distal end S1 reliably contacts the terminal of the LCD 90. Further, by changing the amount of protrusion of the contact pin 3a from the ferroelastic film 400, it is possible to change the timing of pressing the contact pin 3a from above when the contact pin 3a is pressed. A contact pressure can be obtained.

However, in this case, the ferroelastic film 40
When 0 directly presses and contacts the contact pin 3a, the friction between the ferroelastic film 400 and the contact pin 3a is repeated by repeated use, and when the resulting distortion is accumulated, the contact pin 3a bends right and left, and The dots sometimes shifted.

Therefore, as shown in FIG. 15, instead of the conventional resin film 201, a resin film 201a having a larger projection than the ferroelastic film 400 is employed. According to this, the resin film 201a functions as a cushioning material without directly contacting the ferroelastic film 400 and the contact pins 3a. 3a is not distorted and curved, and stable contact with the terminal can be maintained.

[0009]

As shown in FIG.
When overdrive is applied, the resin film 201a
Is bent upward together with the contact pins 3a, and at this time, the resin film 201a is
Relatively in contact with the lower surface of the front end (particularly, the front end corner 401). As described above, the ferroelastic film 400 has a function of pressing the tip S1 (the contact pin 3a) that is curved upward, and therefore requires a certain rigidity. For example, a ceramic material is used. On the other hand, for the resin film 201a, for example, a polyimide resin is used. Therefore, the resin film 201a and the ferroelastic film 40
Compared with the hardness of 0, the ferroelastic film 400 was harder, and when the sliding contact between the both 201a and 400 (401) was repeated, the sliding contact surface of the resin film 201a was worn as shown in FIG. (See symbol H).

If the sliding surface of the resin film 201a is roughened by abrasion and the concave portion H is formed on the surface, the slidability between the resin film 201a and the ferroelastic film 400 during overdrive is impaired, and the contact pins 3a And L
The contact property with the terminal of the CD 90 is deteriorated.

In addition, when the concave portion H is formed on the sliding contact surface of the resin film 201a, the pressing force of the ferroelastic film 400 through the resin film 201a is reduced by the concave portion H, and the contact pin In some cases, a predetermined amount of pressing did not act on 3a. As a result, the pressing amount of the contact pins 3a against the terminals of the LCD 90 is insufficient, which causes a contact failure. Further, in this case, the contact pins 3a are likely to be affected by the vibration from the peripheral device (for example, the vibration of the prober motor), and the contact pins 3a may come and go from the terminals.

For the same reason, even if the contact state of the contact pin 3a to the terminal is maintained, the amount of pressing of the contact pin 3a to the terminal is different from each other. A difference occurs in the contact pressure, and as a result, the wear state (flatness of the pin tip) of the contact pin 3a due to repeated use is different, which may cause a contact failure.

As described above, the probe device 100
Since a plurality of contact probe holding members 110 are provided, the wear amount of the resin film 201a may be different for each contact probe holding member 110. In this case, the contact state of each contact pin 3a with respect to the terminal may be changed. Also varied.

Further, since the resin film 201a generates dust due to abrasion, there is also a problem that it deteriorates the test environment.

The present invention has been made in view of the above circumstances, and minimizes abrasion of the film due to sliding contact with the pressing film, and acts on the contact pin from the pressing film via the film. It is an object of the present invention to provide a probe device having a constant pressing force (amount of pressing).

[0016]

The present invention has the following features to attain the object mentioned above. That is, in the probe device according to the first aspect, a plurality of pattern wirings are formed on a film, and each tip of the pattern wirings is arranged in a protruding state from the film to be a contact probe, and the contact probe is used as a contact pin for the pattern wirings. In a probe device which is connected to a circuit having a terminal connected to each base end, the probe device is arranged on the film, and the contact pin comes into contact with the object to be measured in a pressurized state. A pressing film that presses the contact pin toward the object to be measured through the film,
A holding member that holds the pressing film and the contact probe is provided, and the pressing film is configured to press the contact pin through the film.
The tip corner and the film are provided so as to protrude from the film so as to be in a non-contact state, and the pressing film has an amount of protrusion from the film so as to be in a non-contact state with the contact pin. A technology set smaller than the contact pins is employed.

In this probe device, the pressing film protrudes from the film so that when the contact pin is pressed through the film, the corner of the tip and the film are not in contact with each other. Since the pressing film is provided, the pressing film is in sliding contact with the film only on the lower surface other than the corner at the tip. Therefore,
The contact pressure of the pressing film against the film is reduced and wear of the film is minimized. Therefore, the sliding property between the pressing film and the film during overdrive is not impaired, and the contact property between the contact pin and the object to be measured does not deteriorate. Also, dust generation due to abrasion of the film can be minimized.

Further, since a concave portion due to abrasion is not formed on the film surface, the pressing force from the pressing film acts on the contact pin by a predetermined pressing amount via the film. Therefore, there is no shortage of the amount of pressing of the contact pin against the object to be measured, and there is no possibility of causing poor contact. In addition, for the same reason, the contact pressure of each contact pin on the object to be measured becomes uniform,
As a result, the state of wear of the contact pin (the flatness of the pin tip) due to repeated use is also made uniform.

Further, in this probe device, when the pressing film presses the contact pin through the film, the amount of protrusion from the resin film is such that the pressing film is not in contact with the contact pin. The pressing film does not directly press the contact pins because it is set to be smaller than that, and the film between them buffers the pressing force from the pressing film. Therefore, even if the contact pin is repeatedly used, the contact pin does not bend and bend due to friction with the pressing film.

In the probe device according to the second aspect, in the probe device according to the first aspect, the film comes into contact with the pressing film when the pressing film presses the contact pin through the film. A technique in which a process of reducing the friction coefficient is applied to the contact portion is adopted.

In this probe device, the contact portion of the film with the pressing film is subjected to a process of lowering the coefficient of friction, such as, for example, coating or plating with oil or the like. Not only is the sliding with the film smooth and the contact property between the contact pin and the object to be measured is improved, but also the abrasion of the film can be minimized, the amount of pressing of the contact pin against the object to be measured, and the amount of contact. Pin wear can be kept constant. In addition, dust generation can be minimized.

According to a third aspect of the present invention, in the probe device according to the first or second aspect, a technique is employed in which a metal film is directly attached to the film.

In this probe device, the film is
For example, even if it is a resin film or the like which easily absorbs moisture and stretches, since the metal film is directly attached to the film, the metal film suppresses the elongation of the film. Therefore, the pitch of the contact pins does not shift due to the elongation of the film, and a reliable contact with each measurement object can be obtained.

Further, the metal film can be used as a ground, thereby enabling a design to take impedance matching up to near the tip of the contact probe. Even when a test in a high frequency range is performed, the adverse effect due to reflection noise is reduced. Can be prevented. That is, if the characteristic impedance between the substrate wiring side and the contact pin does not match in the middle of the transmission line from the tester, reflected noise occurs. In that case, the longer the transmission line having a different characteristic impedance is, the larger the reflected noise is. There's a problem. Reflected noise causes signal distortion, and tends to cause malfunction at higher frequencies. In the present probe device, by using the metal film as the ground, it is possible to minimize the deviation of the characteristic impedance from the substrate wiring side to the vicinity of the contact pin tip, and it is possible to suppress malfunction due to reflected noise.

According to a fourth aspect of the present invention, in the probe device according to the third aspect, a technique is employed in which a second film is directly attached to the metal film.

In this probe device, since the second film is directly attached to the metal film, an effect is obtained that it serves as a cushioning material against tightening when the contact probe is assembled by the holding member. Can be Therefore, it is possible to reduce damage to the wiring pattern at the time of assembling. Further, a short circuit between the metal film and a terminal of another circuit can be prevented.

[0027]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the probe device according to the present invention will be described below with reference to FIGS.
The present embodiment is characterized in that the protruding amount (length) of the ferroelastic film 400 is devised in the conventional probe device 100 described above. Therefore, the same reference numerals are given to the same points as those described in the conventional example,
Detailed description is omitted.

In the probe device 101 of the present embodiment, as shown in FIGS. 1 and 2, the ferroelastic film (pressing film) 410 has its tip when the contact pin 3a is pressed through the resin film 201a. Corner 411
And the resin film 201a is provided so as to protrude from the resin film 201a so as to be in a non-contact state.

The ferroelastic film 410 also has
When the contact pin 3a is pressed via the resin film 201a, the amount of protrusion from the resin film 201a is set smaller than that of the contact pin 3a so that the contact pin 3a is not in contact with the contact pin 3a.

The ferroelastic film 410 is preferably made of an organic material or an inorganic material. If it is an organic material, it is preferably made of polyethylene terephthalate or the like, and if it is an inorganic material, it is preferably made of a ceramic, especially an alumina film.

Strong elastic film 4 of resin film 201a
Oil is applied to the contact portion 201b with the oil-in-oil 10 to reduce the friction coefficient.

The basic structure of the contact probe 200a is as shown in FIG.
201a has a structure in which a pattern wiring 3 made of metal is attached to one surface of the resin film 201a.
The end of the pattern wiring 3 protrudes from the end of 201a to form a contact pin 3a.

Next, with reference to FIGS. 3 and 4, the steps of manufacturing the contact probe 200a will be described in the order of steps.

[Support Metal Plate and Base Metal Layer Forming Step] First, as shown in FIG. 3A, a base metal is formed on a stainless steel support metal plate (substrate layer) 5 by Cu (copper) plating. The layer 6 is formed. This base metal layer 6
Is formed on the upper surface of the supporting metal plate 5 with a uniform thickness.

[Pattern Forming Step] Next, a photoresist layer (mask) 7 is formed on the base metal layer 6, and then, as shown in FIG. A photomask 8 having a predetermined pattern is applied to the layer 7 and exposed, and as shown in FIG. 3C, the photoresist layer 7 is developed to remove the portion that will become the pattern wiring 3 and the remaining photoresist is removed. An opening (unmasked portion) 7 a is formed in the layer 7. Further, in the present embodiment, the photoresist layer 7 is formed of a negative photoresist, but a desired opening 7a may be formed by employing a positive photoresist. In the present embodiment, the photoresist layer 7
Correspond to a “mask”. However, the “mask” is not limited to the one in which the openings 7 a are formed through the exposure and development steps using the photomask 8 like the photoresist layer 7 of the present embodiment. For example, a film or the like in which a hole is formed in advance in a portion to be plated (that is, the film is formed in advance in a state indicated by reference numeral 7 in FIG. 3C) may be used. When such a film or the like is used as a “mask”, the pattern forming step in the present embodiment is unnecessary.

[Electroplating Step] Then, FIG.
As shown in FIG. 7, a Ni or Ni alloy layer N serving as the pattern wiring 3 is formed in the opening 7a by plating. Thereafter, as shown in FIG. 3E, the photoresist layer 7 is removed.

[Film Adhering Step] Next, FIG.
As shown in FIG. 3, on the Ni or Ni alloy layer N, except for the tip of the pattern wiring 3 shown in FIG. 2a.
The resin films 201 and 201a are two-layer tapes in which a metal film (copper foil) 500 is integrally provided on a polyimide resin PI. Before this film deposition process,
The copper surface 500 of the two-layer tape is subjected to copper etching using a photoengraving technique to form a ground surface, and in this film attaching step, the resin surface PI of the two-layer tape is bonded with an adhesive. 2a is applied to the Ni or Ni alloy layer N. The metal film 500 may be made of Ni, Ni alloy or the like in addition to the copper foil. [Separation Step] Then, as shown in FIG. 3 (g), after the portion composed of the resin films 201, 201a, the pattern wiring 3 and the base metal layer 6 is separated from the supporting metal plate 5, Cu etching is performed. Through the resin film 201,
It is assumed that only the pattern wiring 3 is adhered to 01a.

[Gold Coating Step] Next, as shown in FIG. 3H, an Au plating is applied to the exposed pattern wiring 3 to form an Au plating layer A on the surface. At this time, the Au layer A is formed on the entire surface of the contact pins 3a protruding from the resin films 201, 201a over the entire circumference.

[Second Film Adhering Step] As shown in FIG. 4, a second resin film 202 is directly adhered to the upper surface of the metal film 500 with an adhesive.

[Oil coating step] As shown in FIG. 2, on the upper surface of the resin film 201a, a portion 201b that comes into contact with the ferroelastic film 410 during overdrive is
Apply grease.

Through the above steps, as shown in FIGS. 4 and 5, a contact probe 200a in which the pattern wiring 3 is bonded to the resin films 201, 201a is manufactured.

The probe device 101 according to the present embodiment
As in the conventional example, the contact probe holding body (holding member) 110 and the contact probe holding body 110
Is fixed to the frame-like frame 120.

The contact probe holding body 110 is shown in FIG.
As shown in FIG. 2, a top clamp 111 and a bottom clamp 115 are provided. The top clamp 111 includes a main body 111a and a bolt 11 with respect to the main body 111a.
1c. A first projection 112 for pressing the distal end of the contact pin 3a is formed on the distal end 111b, and the main body 111a has
A second protrusion 113 for pressing the terminal 301 on the TABIC (circuit) 300 side as a driver IC and a third protrusion 114 for pressing the lead are formed. The bottom clamp 115 includes an inclined plate 116, a mounting plate 117 and a bottom plate 11.
8.

Next, a method of assembling the contact probe holding body 110 will be described with reference to FIG. 1 and FIGS.

First, the contact probe 200a is placed on the inclined plate 116 such that the surface of the second resin film 202 faces upward. Next, the terminal 301 of the TABIC 300 is placed so as to be in contact with the pattern wiring 3 between the resin films 201a, 201 of the contact probe 200a (the TABIC 300 is not shown in FIGS. 1 and 2). The two protrusions 301 and 3 are pressed by the second protrusion 113 of the main body 111a, and the rear end surface of the strong elastic film 410 is brought into contact with the front surface 113a of the second protrusion 113 for positioning.

Next, the first protrusion 112 of the tip 111b is formed.
Is placed on the ferroelastic film 410 and the second resin film 202 on the distal end side, and the distal end portion 111b is fastened and fixed to the main body portion 111a with a bolt 111c. Further, the top clamp 111 and the bottom clamp 1
15 are tightened by bolts 130, and the contact probe holding body 110 is assembled.

In the electrical test of the LCD 90 using the probe device 101, the tip of the contact pin 3a is
0 terminal (not shown), TABIC
300 is driven to send various test signals, and the signal obtained from the contact pin 3a is
This is performed by taking out to the outside through the BIC 300.

In the probe device 101, the ferroelastic film 410 is formed so that the tip corner 411 and the resin film 201a are not in contact with each other when the contact pin 3a is pressed through the resin film 201a. Since the ferroelastic film 410 is provided so as to protrude from the resin film 201a, the ferroelastic film 410 comes into sliding contact with the resin film 201a only at the lower surface 410a other than the tip corner 411. Therefore, compared with the case of contact at the tip corner 411, the contact with the other lower surface 410 a is more effective for the resin film 20.
1a is reduced and the resin film 20
Wear of 1a is minimized. Therefore, the slidability between the ferroelastic film 410 and the resin film 201a during overdrive is not impaired, and the contact property between the contact pins 3a and the terminals of the LCD 90 does not deteriorate. Further, dust generation due to abrasion of the resin film 201a is also minimized.

Further, since no recess is formed on the surface of the resin film 201a due to abrasion, the strong elastic film 4
The pressing force from 10 acts on the contact pin 3a by a predetermined pressing amount via the resin film 201a. Therefore, there is no shortage of the pressing amount of the contact pins 3a against the terminals of the LCD 90, and there is no possibility of causing a contact failure. For the same reason, the contact pressure of each contact pin 3a against the terminal becomes uniform, and as a result, the wear state (flatness of the pin tip) of the contact pin 3a due to repeated use is also uniformed.

Further, in the probe device 101, when the ferroelastic film 410 presses the contact pins 3a via the resin film 201a, the protruding amount from the resin film 201a is set so as not to be in contact with the contact pins 3a. Are set smaller than the contact pins 3a, the ferroelastic film 410
a is not directly pressed, and the resin film 201 a between them buffers the pressing force from the ferroelastic film 410. Therefore, even if the contact pin 3a is repeatedly used, the contact pin 3a is not distorted and bent due to friction with the ferroelastic film 410.

In the probe device 101, the contact portion 2 of the resin film 201a with the ferroelastic film 410 is formed.
Since oil and fat are applied to 01b to reduce the coefficient of friction, the sliding between the ferroelastic film 410 and the resin film 201a is smooth, so that the contact between the contact pins 3a and the terminals of the LCD 90 is improved. Resin film 2
01a can be minimized, and the amount of contact pin 3a pressed against the terminal and the degree of wear of contact pin 3a can be made constant. Further, dust generation of the resin film 201a can be minimized.

Further, as shown in FIG. 8, the resin films 201a and 201 are polyimide resins and easily expand by absorbing moisture. However, since the metal films 500 are provided directly on the resin films 201a and 201, Film 500
Thereby, the elongation of the resin films 201a and 201 is suppressed. Therefore, the pitch t of the contact pins 3a does not shift due to the extension of the resin films 201a, 201, and reliable contact with each terminal can be obtained.

Further, the metal film 500 can be used as a ground, which makes it possible to design impedance matching up to the vicinity of the tip of the contact probe 200a. Even when a test in a high frequency range is performed, adverse effects due to reflected noise are caused. Can be prevented. That is, if the characteristic impedance between the substrate wiring side and the contact pin 3a does not match in the middle of the transmission line from the tester, reflected noise occurs. In this case, the longer the transmission line having a different characteristic impedance is, the larger the reflected noise is. There is a problem that arises. Reflected noise causes signal distortion, and tends to cause malfunction at higher frequencies. Probe device 1
In No. 01, by using the metal film 500 as the ground, it is possible to minimize the deviation of the characteristic impedance from the substrate wiring side to the vicinity of the contact pin 3a, and to suppress the malfunction due to the reflection noise.

In the probe device 101, since the second film 202 is directly attached to the metal film 500, the contact probe holding member 110 is provided.
The function and the effect of being a cushioning material against the tightening when the contact probe 200a is assembled due to the above can be obtained. Therefore, damage to the wiring pattern 3 at the time of assembling can be reduced. Also, TABIC300
When the terminal 301 and the contact pin 3a are connected to each other, a short circuit between the metal film 500 and the terminal 301 of the TABIC 300 is prevented by providing the second resin film 202 on the metal film 500 on the resin film 201. Can be prevented. Further, by providing the second resin film 202, the surface of the metal film 500 is covered, and the progress of oxidation in the atmosphere can be effectively suppressed.

Although the present embodiment is applied to a probe device for an LCD, in the present invention, the object to be measured is an LC probe.
It is not limited to D, but may be a semiconductor chip, for example. In this case, the contact probe may be cut out for measuring the semiconductor chip, and a holding member (mechanical part) for measuring the semiconductor chip may be used. Further, the present embodiment is applied to a so-called probe card 101, but the probe device according to the present invention may be another measuring jig or the like. For example, the present invention may be applied to an IC chip test socket or the like mounted on an IC chip burn-in test device or the like for holding and protecting the IC chip inside.

[0056]

According to the probe device of the first aspect,
The pressing film, when pressing the contact pins through the film, is provided so as to protrude from the film so that the tip corner and the film are in a non-contact state, and the pressing film The projecting amount of the film from the film is set smaller than that of the contact pins so that the film is not in contact with the contact pins. Therefore, the pressing film slides on the film only on the lower surface other than the corners of the tip. As a result, the contact pressure of the pressing film against the film is reduced correspondingly, and wear of the film is minimized. Therefore, the sliding property between the pressing film and the film during overdrive is not impaired, and the contact property between the contact pin and the object to be measured does not deteriorate.
Also, dust generation due to abrasion of the film can be minimized.

Further, since a concave portion due to abrasion is not formed on the film surface, the pressing force from the pressing film acts on the contact pin by a predetermined pressing amount via the film. Therefore, there is no shortage of the amount of pressing of the contact pin against the object to be measured, and there is no possibility of causing poor contact. In addition, for the same reason, the contact pressure of each contact pin on the object to be measured becomes uniform,
As a result, the state of wear of the contact pin (the flatness of the pin tip) due to repeated use is also made uniform.

Further, according to this probe device, when the pressing film presses the contact pin through the film, the projecting amount from the resin film is set so as to be in a non-contact state with the contact pin. Since it is set smaller than the contact pins, the pressing film does not directly press the contact pins, and the film between them buffers the pressing force from the pressing film. Therefore, even if the contact pin is repeatedly used, the contact pin does not bend and bend due to friction with the pressing film.

According to the probe device of the second aspect, in the probe device of the first aspect, the film comprises:
Since the contact portion that comes into contact with the pressing film when the pressing film presses the contact pin through the film has been subjected to a process of reducing the coefficient of friction,
Not only is the sliding between the pressing film and the film smooth and the contact property between the contact pin and the object to be measured is improved, but also the abrasion of the film can be minimized, and the contact pin with respect to the object to be measured. The pressing amount and the degree of wear of the contact pin can be made constant. In addition, dust generation can be minimized.

According to the probe device of the third aspect, in the probe device of the first or second aspect, the film is provided with a metal film directly adhered thereto. Even in the case of a resin film or the like that is easily absorbed and stretched, the elongation of the film is suppressed by the metal film, so that the pitch of the contact pins does not shift due to the elongation of the film, and a reliable Contact can be made.

Further, the metal film can be used as a ground, thereby making it possible to design the impedance matching up to the vicinity of the tip of the contact probe, and to reduce the adverse effect of reflected noise even when performing a test in a high frequency range. Can be prevented.

According to the probe device of the fourth aspect, in the probe device of the third aspect, a technique is employed in which a second film is directly attached to the metal film. The effect of being a buffer material against the tightening when the contact probe is assembled by the holding member is obtained. Therefore, it is possible to reduce damage to the wiring pattern at the time of assembling. Further, a short circuit between the metal film and a terminal of another circuit can be prevented.

[Brief description of the drawings]

FIG. 1 is a side view showing a main part of an embodiment of a probe device according to the present invention.

FIG. 2 is a side view showing a use state of the device.

FIG. 3 is a fragmentary cross-sectional view showing a method of manufacturing a contact probe constituting the same device in order of steps.

FIG. 4 is a side sectional view of the contact probe.

FIG. 5 is an exploded perspective view showing a main part of the probe device.

FIG. 6 is a sectional view of the same.

FIG. 7 is a perspective view of the same.

FIG. 8 is a front view for explaining a metal film of the contact probe.

FIG. 9 is a perspective view showing a contact probe in a general probe device.

FIG. 10 is a sectional view taken along line AA of FIG. 9;

FIG. 11 is a perspective view showing a use state of the device.

FIG. 12 is a side view showing a conventional defect of a contact probe in the device.

FIG. 13 is a side view showing a conventional defect of the device.

FIG. 14 is a side view showing the same device adopting a means for solving the same disadvantage.

FIG. 15 is a side view showing the same device employing a means for solving another disadvantage of the same device.

FIG. 16 is an enlarged side view exaggerating yet another drawback of the device.

[Explanation of symbols]

 Reference Signs List 3 pattern wiring 3a contact pin 90 object to be measured (LCD) 101 probe device 110 holding member (contact probe holding body) 201a resin film 201b contact portion 202 second film 300 circuit 301 terminal 410 strong elastic film 411 tip corner portion 500 metal the film

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Hideaki Yoshida, 12th Techno Park, Mita City, Hyogo Sanritsu Materials Co., Ltd.Mita Plant (72) Inventor Nobuyoshi Tachikawa, 12th Techno Park, Mita City, Hyogo Prefecture Noroku Sanritsu Material Co., Ltd. Mita Plant

Claims (4)

[Claims] 1. A plurality of pattern wirings (3) are formed on a film (201a) and these pattern wirings (3) are formed.
A contact probe (200a) having a distal end protruding from the film (201a) and serving as a contact pin (3a) is connected to a terminal (301) connected to each base end of the pattern wiring (3). A probe device (101) connected to a circuit (300) having the film (201).
a) the contact pins (3a) disposed on the contact pins (3a) via the film (201a) when the contact pins (3a) come into contact with the object to be measured (90) in a pressurized state;
And a holding member (110) for holding the pressing film (410) and the contact probe (200a). The film (410) is the film (20).
When the contact pin (3a) is pressed through 1a), the tip corner (411) and the film (20) are pressed.
1a) in a non-contact state.
1a), and the amount of protrusion of the pressing film (410) from the film (201a) is such that the pressing film (410) is out of contact with the contact pin (3a). A probe device characterized in that the probe device is set smaller than the probe device. 2. The probe device (101) according to claim 1, wherein:
In the above-mentioned (201a), the film for press (4)
10) The contact portion (201b) that comes into contact with the pressing film (410) when the contact pin (3a) is pressed via the film (201a) is subjected to a process of reducing the coefficient of friction. A probe device characterized by the above-mentioned. 3. The probe device (101) according to claim 1, wherein the film (201a) includes a metal film (50).
0) is directly attached to the probe device. 4. The probe device (101) according to claim 3, wherein
In the metal film (500), a second film (2
02) is directly attached.