JPH1194876A - Manufacture for contact probe - Google Patents

Abstract

PROBLEM TO BE SOLVED: To form a boundary between a coated part with a film and a project ing part from the film with high position accuracy, by removing through irradia tion of laser light a part covering a pattern wiring to be provided for a contact pin. SOLUTION: A photoresist layer 7 is formed on a base metal layer 6 at a supporting metallic plate 5. An Ni alloy layer N is processed at an opening part 7a by electrolytic plating, thereby forming a pattern wiring 3. After the photoresist layer 7 is removed, a resin film 2 where an area to be projected as a contact pin 3a is etched is bonded by an adhesive sheet 2a onto the pattern wiring 3 of the metallic layer N. The coated resin film 2 is irradiated with laser beam, so that a part covering the pattern wiring 3 to be provided for the contact pin 3a is removed. Thereafter, the supporting metallic plate 5 is separated. As a result, a contact probe having the pattern wiring 3 bonded to the resin film 2 is manufactured. A boundary between the film-coated part and the projecting part of the pattern wiring 3 can be formed with good position accuracy.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is used as a probe pin, a socket pin, or the like, and is incorporated in a probe card, a test socket, or the like, and contacts each terminal of a semiconductor IC chip, a liquid crystal device, or the like to perform an electrical test. And a method for manufacturing the same.

[0002]

2. Description of the Related Art In general, a contact pin is used to conduct an electrical test by contacting a semiconductor chip such as an IC chip or an LSI chip or each terminal of an LCD (liquid crystal display). In recent years, as the integration and miniaturization of IC chips and the like have increased, the pitch of contact pads, which are electrodes, has been reduced, and the pitch of contact pins has been required to be narrower. However, with a tungsten needle contact probe used as a contact pin, it has been difficult to cope with a multi-pin narrow pitch due to the limitation of the diameter of the tungsten needle.

On the other hand, for example, Japanese Patent Publication No. 7-820
No. 27 proposes a contact probe technique in which a plurality of pattern wirings are formed on a resin film, and the ends of these pattern wirings are arranged so as to protrude from the resin film and serve as contact pins. In this technology example, by using a contact pin at a tip end of a pattern wiring precisely formed by using a photomechanical technology, a narrow pitch with a large number of pins is achieved, and many complicated components are not required.

As shown in FIG. 10, the production of the contact probe 1 is performed through the following steps. As shown in FIG. 10A, copper plating 6 is applied to the upper surface of the stainless steel plate 5. A resist mask (mask) 7 is formed on the copper layer 6,
Exposure and development are performed via a photomask 8 as shown in FIG. As shown in FIGS. 3C and 3D, the pattern wiring 3 is formed by applying nickel plating N to the opening 7a formed in the resist mask 7 as described above. After removing the resist mask 7 as shown in FIG. 5E, as shown in FIG. 5F, a portion of the pattern wiring 3 to be a contact pin 3a (a portion to be projected from the polyimide resin film PI). ) Is adhered to the upper surface of the part excluding the resin film PI via an adhesive (adhesive sheet) 2a, and thereafter, as shown in FIGS. The contact probe 1 is manufactured by separating a portion composed of the stainless steel plate 5 and the copper layer 6 from each other.

[0005]

However, according to the above manufacturing method, the adhesive sheet 2a and the polyimide resin film PI used in the above steps are used.
However, if it is not accurately formed in a predetermined shape in advance, the following problem occurs. FIG. 11 is a perspective view showing a state where the resin film PI is about to be bonded to the pattern wiring 3 as shown in FIG. 10 (f), and FIG.
FIG. 12 is a view taken along line XX of FIG. 11. As shown in these figures, the resin film PI and the adhesive sheet 2a are positioned at a reference position (a base end position of a portion serving as the contact pin 3a) K protruding from the resin film PI in the pattern wiring 3.
The shape or size is adjusted to suit.

When the shapes of the resin film PI and the adhesive sheet 2a are accurately formed, FIG.
As shown in (b), although the resin film PI and the adhesive sheet 2a do not protrude from the reference position K in the pattern wiring 3, for example, when the adhesive sheet 2a is slightly large and the amount of the adhesive is large, As shown in FIG. 12C, the adhesive 2a sometimes protrudes beyond the reference position K in the pattern wiring 3. Similarly,
Although not shown, if the shape of the resin film PI is slightly larger, for example, the resin film PI may be covered beyond the reference position K.

As described above, for example, if the adhesive 2a is erroneously attached to a specific one of the plurality of pattern wirings 3, the contact pin 3a is less likely to bend than the other ones. As a result, the pad contacted by the contact pin 3a may be damaged during overdrive, or the wear amount of the contact pin 3a itself may be different from that of other contact pins, resulting in poor contact. In addition, the film P
When I is larger, the amount of protrusion from the film PI (the length of the contact pin 3a) becomes smaller, and it becomes difficult to bend as compared with the other contact pins 3a, resulting in the same problem.

The present invention has been made in view of the above circumstances, and there is no need to accurately form an adhesive or a resin film in a predetermined shape in advance.
It is an object of the present invention to provide a method of manufacturing a contact probe capable of forming a boundary between a portion to be coated with the resin film and a portion exposed from the film with high positional accuracy.

[0009]

The present invention has the following features to attain the object mentioned above. That is, in the method for manufacturing a contact probe according to the first aspect, a plurality of pattern wirings are formed on a film, and the tips of the pattern wirings are arranged in a protruding state from the film to be used as contact pins. So,
A first metal layer forming step of forming a first metal layer of a material to be adhered to or bonded to the material of the contact pin on the substrate layer, and applying a first mask on the first metal layer; A plating process of plating the second metal layer provided for the contact pins on the unmasked portion to form the pattern wiring; and a plating process of removing the first mask from the second metal layer. A film applying step of applying the film using a bonding means on the pattern wiring to be formed, and applying a second mask on the film applied on the pattern wiring to an unmasked portion A film removing step of irradiating a laser to remove a portion of the film and the bonding means that covers the pattern wiring provided to the contact pin;
And a separation step of separating a portion made of the metal layer from a portion made of the substrate layer and the first metal layer.

In this method of manufacturing a contact probe,
Applying a second mask on the film adhered on the pattern wiring and irradiating an unmasked portion with a laser to provide a pattern wiring provided to the contact pins of the film and the bonding means; Since there is provided a film removing step of removing the portion covering the film, it is not necessary to accurately form the shapes of the film and the bonding means used in the film attaching step in advance. Further, since the film and the bonding means which are not masked by the second mask are cut by laser irradiation, in the area which is not masked, the film and the bonding means are completely removed and only the pattern wiring is left. it can. As a result, there is no possibility that the adhesive is erroneously attached to the portion that should be the contact pin and that the film is not covered. In addition, since the laser irradiation area can be partitioned by the mask, the boundary between the part to be coated with the film and the part to be projected from the film in the pattern wiring can be formed with high positional accuracy, and can be projected from the film. The length of the contact pins can be made uniform. Here, the second mask has a function of reflecting and not transmitting a laser, and a metal plate such as a copper foil plate or an aluminum foil is suitable.

According to a second aspect of the present invention, there is provided a method for manufacturing a contact probe, comprising:
A method for manufacturing a contact probe, in which a plurality of pattern wirings are formed on the back surface side of the metal layer forming surface, and the respective ends of these pattern wirings are arranged in a protruding state from the film to be contact pins, and the contact probe is formed on the substrate layer. A first metal layer forming step of forming a first metal layer of a material to be adhered to or bonded to the material of the contact pin, and applying a first mask on the first metal layer so as not to be masked A plating step of plating the second metal layer provided for the contact pins on the portion to form the pattern wiring; and covering the pattern wiring of the third metal layer formed on the film. Perform the etching process leaving the part to be
A third metal layer etching step of removing the third metal layer in the etched portion and exposing the film corresponding to the portion, and a second metal layer removing the first mask.
On a pattern wiring consisting of a metal layer of the above, a film applying step of applying a film having undergone the third metal layer etching step using an adhesive means, and on the film applied on the pattern wiring, A film removing step of irradiating a laser to remove a portion of the film and the bonding unit that is not covered with the third metal layer, a portion composed of the film and the second metal layer, And a separation step of separating the first metal layer and the portion made of the first metal layer.

In this method of manufacturing a contact probe,
An etching process is performed on the third metal layer formed on the film except for a portion covering the pattern wiring, and the third metal layer in the etched portion is removed to correspond to the portion. Since the third metal layer etching step for exposing the film is provided, the etching area can be accurately partitioned by performing the etching using, for example, mask exposure. In the film removing step, the film and the bonding means are removed by irradiating a laser to the film and the bonding means exposed by removing the third metal layer by the etching, so that the film and the bonding means are accurately partitioned. The removed area is removed so that the lengths of the contact pins protruding from the film can be made uniform, and there is no possibility that the bonding means may accidentally adhere to the contact pins.

According to a third aspect of the present invention, in the method of manufacturing a contact probe according to the first or second aspect, the film removing step includes etching using plasma in addition to the means by laser irradiation. Techniques performed by means are employed.

In this method of manufacturing a contact probe,
Since the film removing step is performed by etching means using plasma in addition to the means by laser irradiation, a portion of the pattern wiring, on which the film is to be applied, is further compared with the case of only using laser. The boundary between the contact pin and the portion protruding from the film can be formed with high positional accuracy, and the adhesive or the like that has protruded can be completely removed, and the length of the contact pin protruding from the film is made uniform. Can be.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of a method for manufacturing a contact probe according to the present invention will be described below with reference to FIGS. 2, reference numeral 16 denotes a contact probe, 2 denotes a resin film, and 3 denotes a pattern wiring.

The contact probe 16 of the present embodiment is
It has a structure in which a pattern wiring 3 made of metal is attached to one surface of a polyimide resin film 2, and a tip of the pattern wiring 3 protrudes from an end of the resin film 2 to be a contact pin 3 a.

Next, with reference to FIG. 3, the steps of manufacturing the contact probe 16 will be described in the order of steps.

[Base Metal Layer Forming Step (First Metal Layer Forming Step)] First, as shown in FIG. 3A, a base metal plate 5 made of stainless steel is plated with Cu (copper). A metal layer (first metal layer) 6 is formed.

[Pattern Forming Step] After a photoresist layer 7 is formed on the base metal layer 6, as shown in FIG. 3B, a predetermined pattern is formed on the photoresist layer 7 by photolithography. A photomask 8 is applied and exposed, and as shown in FIG.
Is developed to remove the portion that will become the pattern wiring 3, and an opening 7 is formed in the remaining photoresist layer (first mask) 7.
a is formed.

In the present embodiment, the photoresist layer 7 is formed of a negative type photoresist, but a desired opening 7a is formed by employing a positive type photoresist.
May be formed. In the present embodiment,
The photoresist layer 7 corresponds to a “first mask” in the claims of the present application. However, the “first mask” in the claims of the present application is defined as the photoresist layer 7 of the present embodiment.
The opening 7 is exposed through an exposure and development process using a photomask 8.
It is not limited to the one in which a is formed. For example, a film or the like in which a hole is formed in advance in a portion to be plated (that is, the film is formed in advance in a state indicated by reference numeral 7 in FIG. 3C) may be used. In the present invention, when such a film or the like is used as the “first mask”, the pattern forming step in the present embodiment is unnecessary.

[Plating Step] Then, FIG.
As shown in FIG. 3, after a Ni or Ni alloy layer (second metal layer) N serving as the pattern wiring 3 is formed in the opening 7a by electrolytic plating, as shown in FIG. The resist layer 7 is removed.

[Third Metal Layer Etching Step] Next, as shown in FIG. 1A, a polyimide resin film PI and a copper foil (second mask, third metal layer) 500 are provided integrally. An etching process is performed on the obtained resin film 2 which is a two-layer tape. That is, the copper foil 500 of the resin film 2 is subjected to copper etching using a photoengraving technique.
In this case, the etching region is precisely partitioned by mask exposure. The etched region is a region excluding a portion that covers the pattern wiring 3 when the resin film 2 is applied to the pattern wiring 3 in a film applying step described later, that is, a tip of the pattern wiring 3 as a contact pin 3a. Is a region in which is projected from the film. The etching process is performed until the copper foil 500 in the etched portion is completely removed and the polyimide resin film PI in the portion is exposed. Note that the second mask or the third metal layer only needs to have a function of reflecting and not transmitting a laser used in a film removing step described later. Instead of the copper foil, an aluminum foil, Ni, Ni
Alloy foil or the like may be used.

[Film Adhering Step] Next, FIG.
As shown in FIG. 1A and on the Ni or Ni alloy layer N, the pattern wiring 3 shown in FIG.
The polyimide resin film PI side of the resin film 2 is bonded to the adhesive sheet in a state where the tip end of the resin film 2 is aligned with the boundary end portion of the copper foil 500 remaining after the etching, that is, the boundary portion protruding from the film as the contact pin 3a. (Adhesion means) The Ni or Ni alloy layer N
(Pattern wiring 3).

[Film Removal Step] As shown in FIG. 1B, a laser is applied to the copper foil 500 side of the resin film 2 adhered on the pattern wiring 3 to remove unnecessary portions of the polyimide. Resin film PI and adhesive sheet 2
a is removed. In this case, the copper foil 500 of the resin film 2
Does not transmit the laser to the polyimide resin film PI under the copper foil 500 by reflecting the laser, the polyimide resin film PI under the copper foil 500 and the adhesive sheet 2a remain without being removed. That is, FIG.
As shown in (c), the polyimide resin film PI is etched in the third metal layer etching step.
Is exposed (the part not covered by the copper foil 500) and only the adhesive sheet 2a thereunder is removed by laser. At this time, even if the laser is irradiated, the Ni or Ni alloy layer N remains without being removed. The PI and the adhesive sheet 2a are removed.

[Separation Step] Then, as shown in FIG. 3 (g), after the portion consisting of the resin film 2, the pattern wiring 3 and the base metal layer 6 is separated from the supporting metal plate 5, copper etching is performed. After that, only the pattern wiring 3 is adhered to the resin film 2.

[Gold Coating Step] Then, as shown in FIG.
Plating is performed to form an Au layer A on the surface. At this time,
In the contact pins 3a protruding from the resin film 2, an Au layer A is formed on the entire surface over the entire circumference.

Through the above steps, a contact probe 16 in which the pattern wiring 3 is adhered to the resin film 2 as shown in FIG. 2 is manufactured.

In the present embodiment, since the third metal layer etching step and the film removing step are provided, the resin film 2 and the adhesive sheet 2a used in the film attaching step are different from the conventional example. It is not necessary to accurately form the shape in advance.

That is, the region of the copper foil 500 covering the polyimide resin film PI and the adhesive sheet 2a is determined by etching, and after the laser irradiation area is limited, the polyimide resin film not covered with the copper foil 500 is determined. Since the PI and the adhesive sheet 2a are removed by laser irradiation, in a region not covered with the copper foil 500, the polyimide resin film PI and the adhesive sheet 2a are completely removed, and only the pattern wiring 3 can be left. . As a result, the adhesive sheet 2a may be erroneously attached to or protruded from the portion that should be the contact pin 3a, or the resin film 2 (polyimide resin film PI)
Will not suffer.

In this case, the region of the copper foil 500 that determines the laser irradiation area is etched by mask exposure, so that the portion of the pattern wiring 3 where the resin film 2 is to be adhered (remains) and the resin Film 2
The boundary with the portion protruding from (removing the resin film 2) can be formed with high positional accuracy. Thereby, the length of the contact pins 3a protruding from the resin film 2 can be made uniform, and the adhesive sheet 2a can be effectively prevented from being erroneously attached to the contact pins 3a.

Along with adopting the above manufacturing method, the copper foil 500 is provided up to the base end of the contact pin 3a as shown in FIG.
The protrusion amount from the leading end of the zero is 5 mm or less. This copper foil 500 can be used as a ground,
As a result, it is possible to design the impedance matching up to the vicinity of the tip of the probe device, and it is possible to prevent adverse effects due to reflected noise even when performing a test in a high frequency range.

The resin film 2 (polyimide resin P
The copper foil 500 attached to I) has the following advantages. That is, when there is no copper foil 500, since the resin film 2 is made of a polyimide resin, it absorbs moisture and elongates, and as shown in FIG. 6, the interval t between the contact pins 3a, 3a changes. There was something. Therefore, there is a problem that the contact pin 3a cannot contact a predetermined position of the electrode pad, and an accurate electrical test cannot be performed. In the present embodiment, the copper foil 500 is adhered to the resin film 2 so as to reduce the change in the interval t even when the humidity changes, so that the contact pin 3a can be reliably brought into contact with a predetermined position of the electrode pad. Has become.

After the film removing step, a second resin film (not shown) may be directly attached to the copper foil 500. As a result, there is obtained an effect that it becomes a buffer against tightening when the contact probe 16 is incorporated as a probe device described later.

Next, the contact probe 16 is
The configuration adopted as a probe for C and incorporated into the mechanical part 60 to form a probe device (probe card) 70 will be described.

FIG. 4 is a view showing the contact probe 16 cut out into a predetermined shape as an IC probe, and FIG. 5 is a cross-sectional view taken along line CC of FIG.

As shown in FIG. 4, the contact probe 1
The resin film 2 is provided with positioning holes 4 and 9 for positioning and fixing the contact probe 16, and a signal obtained from the pattern wiring 3 is passed through the contact terminal 10 of the drawing wiring. Printed circuit board 20
(Refer to FIG. 7).

As shown in FIG. 7, the mechanical part 60 includes a mounting base 30, a top clamp 40, and a bottom clamp 50. First,
Attach the top clamp 40 on the printed circuit board 20,
Next, the mounting base 30 to which the contact probe 16 is attached is attached to the top clamp 40 by screwing a bolt 42 into a bolt hole 41 (see FIG. 9). Then, by holding down the contact probe 16 with the bottom clamp 50, the pattern wiring 3 is maintained in a constant inclined state, and the contact pin 3a bent downward is held.
Is set at a predetermined angle, and the contact pin 3a is pressed against the IC chip.

FIG. 8 shows the probe device 70 after the assembly is completed. FIG. 9 is a sectional view taken along line EE of FIG. As shown in FIG. 9, the tip of the pattern wiring 3, that is, the contact pin 3a is
It is in contact with C chip I.

The mounting base 30 is provided with a positioning pin 31 for adjusting the position of the contact probe 16, and the positioning pin 31 is inserted into the positioning hole 4 of the contact probe 16, whereby a pattern is formed. The wiring 3 and the IC chip I can be accurately positioned. The contact terminal 1 in the portion of the window 11 provided in the contact probe 16
0, pressing the elastic body 51 of the bottom clamp 50,
The contact terminals 10 are brought into contact with the electrodes 21 of the printed circuit board 20, and signals obtained from the pattern wiring 3 can be transmitted to the outside through the electrodes 21.

The probe device 70 configured as described above
When performing a probe test or the like of the IC chip I using the probe device 70, the probe device 70 is inserted into the prober and electrically connected to the tester, and a predetermined electric signal is transmitted from the contact pins 3a of the pattern wiring 3 to the wafer. By sending the signal to the IC chip I, the output signal from the IC chip I is transmitted from the contact pin 3a to the tester, and the electrical characteristics of the IC chip I are measured.

In this embodiment, a resin film 2 composed of a two-layer tape in which a polyimide resin film PI and a copper foil 500 are integrated is used. Functioned as a surface,
The present invention is not limited to this. For example, a method may be used in which the resin film is made of a single polyimide resin film, and the laser impermeable surface is covered with a mask (second mask) while positioning a separate aluminum foil or the like on the polyimide resin film.

In this embodiment, a means for irradiating a laser is used in the film removing step, but an etching means using plasma may be used after the means.

Further, in the present embodiment, the contact probe 16 is used for IC inspection. However, it goes without saying that the application of the contact probe of the present invention is not limited to this. That is, by changing the cut-out shape of the contact probe and the mechanical parts holding the contact probe to appropriate ones, for example, a semiconductor chip socket disclosed in Japanese Patent Application Laid-Open No. Hei 6-317788 or Japanese Patent Application No. 8-169701. It is needless to say that the present invention is also applicable to a liquid crystal display (LCD) test disclosed in Japanese Patent Application Publication No.

[0044]

According to the method of manufacturing a contact probe according to the present invention, a laser beam is applied to a portion which is not masked by applying a second mask on the film adhered on the pattern wiring. And the film and the bonding means of the film removing step of removing the portion covering the pattern wiring provided to the contact pins, the shape of the film and the bonding means used in the film attaching step, An effect is obtained that it is not necessary to form them accurately in advance. Further, since the film and the bonding means which are not masked by the second mask are cut by laser irradiation, in the area which is not masked, the film and the bonding means are completely removed and only the pattern wiring is left. it can. As a result, there is no possibility that the adhesive is erroneously attached to the portion that should be the contact pin and that the film is not covered. Further, since the laser irradiation region can be partitioned by a mask, in the pattern wiring,
The boundary between the portion on which the film is to be applied and the portion protruding from the film can be formed with high positional accuracy, and the length of the contact pins protruding from the film can be made uniform.

According to the method for manufacturing a contact probe of the second aspect, the etching process is performed while leaving the portion of the third metal layer formed on the film which covers the pattern wiring, and the etching process is performed. A third metal layer etching step of removing the third metal layer of the portion to expose the film corresponding to the portion,
By performing the etching using, for example, mask exposure, an etched region can be accurately partitioned. In the film removing step, the third etching is performed.
A laser is applied to the exposed film and the bonding means from which the metal layer has been removed to remove the film and the bonding means, so that precisely separated areas of the film and the bonding means are removed and project from the film. The length of the contact pins to be formed can be made uniform, and there is no possibility that the bonding means accidentally adheres to the contact pins.

According to the method for manufacturing a contact probe of the present invention, the film removing step is performed by etching means using plasma in addition to the means for irradiating the laser. Thus, the boundary between the portion on which the film is to be applied and the portion protruding from the film in the pattern wiring can be formed with high positional accuracy, and the lengths of the contact pins protruding from the film are made uniform. be able to.

[Brief description of the drawings]

FIG. 1 is a sectional side view of a main part showing a characteristic portion of one embodiment of a method for manufacturing a contact probe according to the present invention.

FIG. 2 is a perspective view of a main part showing a contact probe in the embodiment.

FIG. 3 is a fragmentary sectional front view showing the manufacturing method in the embodiment in the order of steps;

FIG. 4 is a plan view showing a contact probe according to the embodiment.

FIG. 5 is a sectional view taken along line CC of FIG. 4;

FIG. 6 is a front sectional view showing the contact probe according to the embodiment.

FIG. 7 is an exploded perspective view showing an example of a probe device incorporating the contact probe according to the embodiment.

FIG. 8 is a perspective view of a main part showing an example of the probe device.

FIG. 9 is a sectional view taken along line EE of FIG. 8;

FIG. 10 is a fragmentary front sectional view showing an example of a conventional method for manufacturing a contact probe in the order of steps.

FIG. 11 is a perspective view showing an example of a conventional method for manufacturing a contact probe.

FIG. 12 is a side sectional view of a main part showing a defect of an example of a conventional method for manufacturing a contact probe.

[Explanation of symbols]

 2 Film (resin film) 2a Adhesion means (adhesive sheet) 3 Pattern wiring 3a Contact pin 5 Substrate layer (support metal plate) 6 First metal layer (base metal layer) 7 First mask (photoresist layer) 7a Opening Part (unmasked part) N Second metal layer (Ni or Ni alloy layer) 16 Contact probe 500 Second mask, third metal layer (copper foil)

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Mitsuyoshi Ueki Inside the Mita Plant, 12th Techno Park, Mita City, Hyogo Prefecture

Claims (3)

[Claims] 1. A method for manufacturing a contact probe, wherein a plurality of pattern wirings are formed on a film, and the respective ends of the pattern wirings are arranged in a protruding state from the film to form contact pins. A first metal layer forming step of forming a first metal layer of a material to be adhered to or bonded to the material of the contact pin; and a portion which is not masked by applying a first mask on the first metal layer A second pin provided to the contact pin
A plating process of plating the metal layer to form the pattern wiring, and applying the film by using an adhesive means on the pattern wiring of the second metal layer from which the first mask has been removed. Applying a second mask on the film adhered on the pattern wiring, and irradiating a laser to an unmasked portion of the film, and contacting the film and the bonding means in the bonding means. A film removing step of removing a portion covering the pattern wiring provided for the pin; separating the portion consisting of the film and the second metal layer from the portion consisting of the substrate layer and the first metal layer And a method of manufacturing a contact probe. 2. The film on which the third metal layer is formed,
A method of manufacturing a contact probe, wherein a plurality of pattern wirings are formed on the back surface side of a third metal layer forming surface, and the tips of these pattern wirings are arranged so as to protrude from the film to form contact pins. A first metal layer forming step of forming a first metal layer of a material to be adhered to or bonded to the material of the contact pin, and applying a first mask on the first metal layer to be masked A second portion provided to the contact pin
A plating process of plating the metal layer to form the pattern wiring, and performing an etching process while leaving a portion of the third metal layer formed on the film that covers the pattern wiring. A third metal layer etching step of removing the third metal layer in the treated portion to expose the film corresponding to the portion, and a pattern wiring of the second metal layer from which the first mask is removed. A film applying step of applying the film having undergone the third metal layer etching step using an adhesive means, and irradiating a laser to the film applied on the pattern wiring, and A film removing step of removing a portion of the bonding means that is not covered by the third metal layer; a portion consisting of the film and the second metal layer; A method for manufacturing a contact probe, comprising: a separation step of separating the substrate layer and a portion made of the first metal layer. 3. The method of manufacturing a contact probe according to claim 1, wherein said film removing step is performed by etching means using plasma in addition to said means by laser irradiation. Probe manufacturing method.