JPH10233574A - Surface mounting method and electronic part for surface mounting - Google Patents
Surface mounting method and electronic part for surface mountingInfo
- Publication number
- JPH10233574A JPH10233574A JP3476797A JP3476797A JPH10233574A JP H10233574 A JPH10233574 A JP H10233574A JP 3476797 A JP3476797 A JP 3476797A JP 3476797 A JP3476797 A JP 3476797A JP H10233574 A JPH10233574 A JP H10233574A
- Authority
- JP
- Japan
- Prior art keywords
- surface mounting
- wiring board
- printed wiring
- electronic component
- solder ball
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、半田ボールを用い
て行う電子部品（コネクタ、パッケージ等）のプリント
配線基板への表面実装方法及び表面実装用電子部品に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting electronic components (connectors, packages, etc.) on a printed wiring board by using solder balls, and an electronic component for surface mounting.
【０００２】[0002]
【従来の技術】従来のＢＧＡ（ＢＡＬＬ ＧＲＩＤ Ａ
ＲＲＡＹ）半田ボール部の製造に関する主な基本方式に
は、次の２種類がある。2. Description of the Related Art Conventional BGA (BALL GRID A)
(Rray) There are two main types of basic methods for manufacturing the solder ball portion as follows.
【０００３】まず、半田ボールセット法について図４を
参照して説明する。まず、図４（ａ）に示されるよう
に、パッケージ５０上の銅パターンの所要箇所にパッド
電極５１を形成し、それらの上にフラックス５２を塗付
する。次に、図４（ｂ）に示されるように、あらかじめ
形成された半田ボール５３を吸着具５４のノズル５５で
吸着する。続いて、図４（ｃ）に示されるように、吸着
具５４で半田ボール５３をパッド電極５１上にセットし
た後、吸着を停止する。その後、図４（ｄ）に示される
ように、リフローを行い、半田ボール電極５６を形成す
る。First, the solder ball setting method will be described with reference to FIG. First, as shown in FIG. 4A, a pad electrode 51 is formed at a required portion of a copper pattern on a package 50, and a flux 52 is applied thereon. Next, as shown in FIG. 4B, the solder ball 53 formed in advance is sucked by the nozzle 55 of the suction tool 54. Subsequently, as shown in FIG. 4C, after the solder ball 53 is set on the pad electrode 51 by the suction tool 54, the suction is stopped. Thereafter, as shown in FIG. 4D, reflow is performed to form solder ball electrodes 56.
【０００４】次に、ソルダーペースト法について図５を
参照して説明する。まず、図５（ａ）に示されるよう
に、パッケージ６０上にそのパッド電極６１に相当する
位置に開口を有するマスク６２を置く。次に、図５
（ｂ）に示されるように、スキージ６３を用いて半田ペ
ースト６４をマスク６２内に充填する。続いて、図５
（ｃ）に示されるように、マスク６２を上方へ取り外
す。その後、図５（ｄ）に示されるように、リフローを
行い、半田ボール電極６５を形成する。Next, the solder paste method will be described with reference to FIG. First, as shown in FIG. 5A, a mask 62 having an opening is placed on a package 60 at a position corresponding to the pad electrode 61. Next, FIG.
As shown in (b), the mask 62 is filled with the solder paste 64 using the squeegee 63. Subsequently, FIG.
As shown in (c), the mask 62 is removed upward. Thereafter, as shown in FIG. 5D, reflow is performed to form solder ball electrodes 65.
【０００５】半田ボールセット法には、あらかじめ半田
ボールの形状及び寸法が整っているため、半田ボール電
極の高さが適切でばらつきが小さい等の長所があるが、
コストが高価になるという短所がある。ソルダーペース
ト法には、コストが安価になるという長所があるが、半
田ボール電極の高さにばらつきが大きいという短所があ
る。[0005] The solder ball setting method has the advantage that the shape and dimensions of the solder balls are adjusted in advance, so that the height of the solder ball electrodes is appropriate and the variation is small.
There is a disadvantage that the cost is high. The solder paste method has an advantage that the cost is low, but has a disadvantage that the height of the solder ball electrode varies greatly.
【０００６】[0006]
【発明が解決しようとする課題】従来の技術では、パッ
ケージ等の電子部品側に半田ボールを形成するため、次
の欠点があった。In the prior art, since the solder ball is formed on the electronic component side such as a package, the following disadvantages are caused.
【０００７】（１）電子部品とプリント配線基板との間
の位置決めを、正確に行うことができなかった。(1) The positioning between the electronic component and the printed wiring board cannot be performed accurately.
【０００８】（２）電子部品のプリント配線基板への取
り付けは、直付け（半田付け）することにほぼ限定され
ていた。ＢＧＡパッケージ用ソケットは存在するが、Ｂ
ＧＡパッケージはほとんど直付けに使用される。したが
って、例えばＢＧＡパッケージのＬＳＩは、交換が困難
であった。(2) The mounting of electronic components on a printed wiring board has been substantially limited to direct mounting (soldering). Although there is a socket for BGA package,
GA packages are used almost directly. Therefore, for example, replacement of a BGA package LSI has been difficult.
【０００９】（３）半田ボールの電子部品への形成から
プリント配線基板への実装までの間に、２回加熱する必
要があった。(3) Heating has to be performed twice between the formation of the solder ball on the electronic component and the mounting on the printed wiring board.
【００１０】そこで、本発明は、前記従来の技術の欠点
を改良し、電子部品をプリント配線基板に乗せるときの
位置決めが容易で、製造が簡易で、しかも、コストが安
価な表面実装方法及び表面実装用電子部品を提供しよう
とするものである。Accordingly, the present invention improves the disadvantages of the above-mentioned conventional technology, and provides a surface mounting method and a surface mounting method which can easily position electronic components on a printed wiring board, are easy to manufacture, and are inexpensive. It is intended to provide electronic components for mounting.
【００１１】[0011]
【課題を解決するための手段】本発明は、前記課題を解
決するため、次の手段を採用する。The present invention employs the following means to solve the above-mentioned problems.
【００１２】（１）プリント配線基板上に半田ボールを
形成し、前記半田ボール上に電子部品を乗せ、加熱によ
り半田付けを行う表面実装方法。(1) A surface mounting method in which solder balls are formed on a printed wiring board, electronic components are placed on the solder balls, and soldering is performed by heating.
【００１３】（２）プリント配線基板の電極と電子部品
の電極との間に半田ボールを位置させた状態で加熱する
ことにより、前記半田ボールを前記両電極に半田付けす
る表面実装方法。(2) A surface mounting method in which the solder balls are soldered to the two electrodes by heating with the solder balls positioned between the electrodes of the printed wiring board and the electrodes of the electronic component.
【００１４】（３）２個以上の半田ボールを形成された
プリント配線基板と、前記半田ボールのうち少なくとも
２個の半田ボールと位置決めを行う窪み部に電極を設け
られた電子部品とから構成される表面実装用電子部品。(3) A printed wiring board on which two or more solder balls are formed, and an electronic component having electrodes provided in recesses for positioning at least two of the solder balls. Electronic components for surface mounting.
【００１５】（４）２個以上の半田ボールを形成された
プリント配線基板と、前記半田ボールのうち少なくとも
２個の半田ボールと位置決めを行う窪み部を有する電極
を設けられた電子部品とから構成される表面実装用電子
部品。(4) A printed circuit board on which two or more solder balls are formed, and an electronic component provided with an electrode having a recess for positioning at least two of the solder balls. Electronic components for surface mounting.
【００１６】（５）前記電子部品がインシュレータとコ
ンタクトとから構成されるコネクタであり、前記半田ボ
ールと接続される前記電極が前記コンタクトと一体に構
成されている前記（３）又は（４）記載の表面実装用電
子部品。(5) The electronic component according to (3) or (4), wherein the electronic component is a connector including an insulator and a contact, and the electrode connected to the solder ball is formed integrally with the contact. Electronic components for surface mounting.
【００１７】[0017]
【発明の実施の形態】本発明の二つの実施の形態例につ
いて図１〜図３を参照して説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Two embodiments of the present invention will be described with reference to FIGS.
【００１８】まず、本発明の第１実施の形態例について
図１と図２を参照して説明する。First, a first embodiment of the present invention will be described with reference to FIGS.
【００１９】図１に示されるように、２列各５本合計１
０本のピンコンタクト１０が、一定の間隔でインシュレ
ータ２０に固定され、コネクタが構成されている。相手
側のソケットコネクタは、図示されていない。ピンコン
タクト１０は、円柱状であり、ピンコンタクト１０の一
端には、円形状の電極１１が形成されている。インシュ
レータ２０には、２箇所の窪み部２１が形成され、２箇
所の窪み部２１は、２個の電極１１に対応している。イ
ンシュレータ２０に窪み部２１を形成する代りに、ピン
コンタクト１０の電極１１に窪み部を形成するように設
計変更することができる。As shown in FIG. 1, each of the two rows has a total of five lines.
The zero pin contacts 10 are fixed to the insulator 20 at regular intervals to form a connector. The mating socket connector is not shown. The pin contact 10 has a columnar shape, and a circular electrode 11 is formed at one end of the pin contact 10. Two recesses 21 are formed in the insulator 20, and the two recesses 21 correspond to the two electrodes 11. Instead of forming the recess 21 in the insulator 20, the design can be changed so that a recess is formed in the electrode 11 of the pin contact 10.
【００２０】プリント配線基板４０には、コネクタの１
０本のピンコンタクト１０の電極１１に相当する位置に
１０個の円形状の電極４１が形成されている。The printed wiring board 40 has a connector 1
Ten circular electrodes 41 are formed at positions corresponding to the electrodes 11 of the zero pin contacts 10.
【００２１】実装方法を説明すると、まず、図２（ａ）
に示されるように、プリント配線基板４０の１０個の電
極４１上に１０個の半田ボール３０をそれぞれ形成す
る。次に、図２（ｂ）に示されるように、プリント配線
基板４０にその上方からコネクタを乗せる。すると、２
箇所の窪み部２１と２個の半田ボール３０がかん合する
ため、縦横方向の仮位置決めが行われる。続いて、この
状態で半田ボール３０を加熱すると、半田ボール３０
は、ピンコンタクト１０の電極１１に半田付けされ、図
２（ｃ）の状態に至って接続が完了する。The mounting method will be described. First, FIG.
As shown in (1), ten solder balls 30 are formed on ten electrodes 41 of the printed wiring board 40, respectively. Next, as shown in FIG. 2B, the connector is placed on the printed wiring board 40 from above. Then 2
Since the two recessed portions 21 and the two solder balls 30 are engaged with each other, temporary positioning in the vertical and horizontal directions is performed. Subsequently, when the solder ball 30 is heated in this state, the solder ball 30 is heated.
Are soldered to the electrodes 11 of the pin contacts 10, and the connection is completed as shown in FIG.
【００２２】次に、本発明の第２実施の形態例について
図３を参照して説明する。Next, a second embodiment of the present invention will be described with reference to FIG.
【００２３】本実施の形態例は、インシュレータ２０の
１０箇所に窪み部２１が形成されている点で第１実施の
形態例と相違し、その他の点では同様である。The present embodiment is different from the first embodiment in that dents 21 are formed at ten places of the insulator 20, and the other points are the same.
【００２４】実装方法を説明すると、まず、図３（ａ）
に示されるように、プリント配線基板４０の１０個の窪
み部２１上に１０個の半田ボール３０をそれぞれセット
する。次に、プリント配線基板４０の１０個の電極４１
が１０個の半田ボール３０上に位置するように、プリン
ト配線基板４０をコネクタ上に乗せる。続いて、この状
態で半田ボール３０を加熱すると、半田ボール３０は、
コンタクト１０の電極１１とプリント配線基板４０の電
極４１の両方に半田付けされ、接続が完了する。図示さ
れていないが、本実施の形態例も、図２（ｃ）と同等の
状態に至る。The mounting method will be described. First, FIG.
10, ten solder balls 30 are set on the ten recesses 21 of the printed wiring board 40, respectively. Next, the ten electrodes 41 of the printed wiring board 40
The printed wiring board 40 is mounted on the connector so that the printed circuit board is located on the ten solder balls 30. Subsequently, when the solder balls 30 are heated in this state, the solder balls 30
The connection is completed by soldering to both the electrode 11 of the contact 10 and the electrode 41 of the printed wiring board 40. Although not shown, the present embodiment also reaches a state equivalent to that of FIG.
【００２５】[0025]
【発明の効果】以上の説明から明らかなように、本発明
によれば、次の効果を奏することができる。As is apparent from the above description, the present invention has the following advantages.
【００２６】（１）電子部品をプリント配線基板に乗せ
るとき、位置決めが容易である。(1) Positioning is easy when an electronic component is mounted on a printed wiring board.
【００２７】（２）パッケージ等に適用する場合、実装
前では、半田ボールはないから、ＬＧＡ（ＬＡＮＤ Ｇ
ＲＩＤ ＡＲＲＡＹ）パッケージとしてソケットコネク
タを介した実装を行うことも可能である。(2) When the present invention is applied to a package or the like, there is no solder ball before mounting.
It is also possible to carry out mounting via a socket connector as a (RID ARRAY) package.
【００２８】（３）半田ボールの電子部品への形成から
プリント配線基板への実装までの間に、加熱回数は最低
１回で済むから、製造が簡易でコストが安価である。(3) Since the number of heating times is at least one between the time when the solder ball is formed on the electronic component and the time when the solder ball is mounted on the printed wiring board, the manufacturing is simple and the cost is low.
【図１】本発明の第１実施の形態例の実装前の状態を示
し、（ａ）は正面から見た断面図、（ｂ）は側面から見
た断面図、（ｃ）はコネクタの平面図である。1A and 1B show a state before mounting according to a first embodiment of the present invention, wherein FIG. 1A is a cross-sectional view as viewed from the front, FIG. 1B is a cross-sectional view as viewed from a side, and FIG. FIG.
【図２】本発明の第１実施の形態例の実装工程を示す側
面から見た断面図であり、（ａ）は実装前のもの、
（ｂ）は実装中のもの、（ｃ）は実装後のものを、それ
ぞれ示す。FIGS. 2A and 2B are cross-sectional views showing a mounting process according to the first embodiment of the present invention, as viewed from the side, in which FIG.
(B) shows the state during mounting, and (c) shows the state after mounting.
【図３】本発明の第２実施の形態例を示し、（ａ）は実
装中の工程を側面から見た断面図、（ｂ）は実装前のコ
ネクタの平面図である。3A and 3B show a second embodiment of the present invention, wherein FIG. 3A is a cross-sectional view of a process during mounting as viewed from a side, and FIG. 3B is a plan view of a connector before mounting.
【図４】従来の半田ボールセット法の製造工程の断面図
を順次（ａ）〜（ｄ）に示す。4 (a) to 4 (d) are cross-sectional views showing a manufacturing process of a conventional solder ball setting method.
【図５】従来のソルダーペースト法の製造工程の断面図
を順次（ａ）〜（ｄ）に示す。5 (a) to 5 (d) are cross-sectional views of a manufacturing process of a conventional solder paste method.
１０ ピンコンタクト １１ 電極 ２０ インシュレータ ２１ 窪み部 ３０ 半田ボール ４０ プリント配線基板 ４１ 電極 10 Pin Contact 11 Electrode 20 Insulator 21 Depression 30 Solder Ball 40 Printed Wiring Board 41 Electrode
Claims (5)
し、前記半田ボール上に電子部品を乗せ、加熱により半
田付けを行うことを特徴とする表面実装方法。1. A surface mounting method comprising: forming a solder ball on a printed wiring board; placing an electronic component on the solder ball; and performing soldering by heating.
極との間に半田ボールを位置させた状態で加熱すること
により、前記半田ボールを前記両電極に半田付けするこ
とを特徴とする表面実装方法。2. The surface mounting method according to claim 1, wherein the solder balls are soldered to the electrodes by heating with the solder balls positioned between the electrodes of the printed wiring board and the electrodes of the electronic component. Method.
ント配線基板と、前記半田ボールのうち少なくとも２個
の半田ボールと位置決めを行う窪み部に電極を設けられ
た電子部品とから構成されることを特徴とする表面実装
用電子部品。3. A printed circuit board on which two or more solder balls are formed, and an electronic component having electrodes provided in recesses for positioning at least two of the solder balls. An electronic component for surface mounting, characterized in that:
ント配線基板と、前記半田ボールのうち少なくとも２個
の半田ボールと位置決めを行う窪み部を有する電極を設
けられた電子部品とから構成されることを特徴とする表
面実装用電子部品。4. A printed wiring board on which two or more solder balls are formed, and an electronic component provided with an electrode having a recess for positioning at least two of the solder balls. An electronic component for surface mounting, characterized in that:
クトとから構成されるコネクタであり、前記半田ボール
と接続される前記電極が前記コンタクトと一体に構成さ
れていることを特徴とする請求項３又は４記載の表面実
装用電子部品。5. The electronic component according to claim 3, wherein the electronic component is a connector including an insulator and a contact, and the electrode connected to the solder ball is formed integrally with the contact. Electronic components for surface mounting as described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03476797A JP3270997B2 (en) | 1997-02-19 | 1997-02-19 | Electronic components for surface mounting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03476797A JP3270997B2 (en) | 1997-02-19 | 1997-02-19 | Electronic components for surface mounting |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10233574A true JPH10233574A (en) | 1998-09-02 |
| JP3270997B2 JP3270997B2 (en) | 2002-04-02 |
Family
ID=12423467
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP03476797A Expired - Fee Related JP3270997B2 (en) | 1997-02-19 | 1997-02-19 | Electronic components for surface mounting |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3270997B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6421912B1 (en) | 1999-07-23 | 2002-07-23 | Hirose Electric Co., Ltd. | Method of making an electrical connector |
-
1997
- 1997-02-19 JP JP03476797A patent/JP3270997B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6421912B1 (en) | 1999-07-23 | 2002-07-23 | Hirose Electric Co., Ltd. | Method of making an electrical connector |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3270997B2 (en) | 2002-04-02 |
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