JPH1022594A - Radiation-hardened composition for baking - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the productivity by shortening of a process by using a solvent-free type which hardens by radiation, for the composition used for the making of a thick pattern such as an insulator, a conductor, a dielectric, a resistor structure, etc., by screen printing. SOLUTION: The composition used for making a thick pattern is one which hardens by radiation, and it is the composition consisting of organic components capable of removing the remaining of carbonic components in a thick pattern or combusting completely in the baking process. As a substance suitable for such baking, there is an acrylic compound. As the formation method, the composition material is kneaded with, for example, a radiation-hardened insulating paste adjuster 20 into paste form, and then the rib 12 of a specified plasma display 34 is patterned with a screen printing part 22. Next, it is exposed to UV with a radiation applicator 24. An unbaked rib 12 with a specified height is made by repeating this operation. Lastly, it is baked with a baker 32 into a plasma display board 34.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a plasma display substrate, a ceramic laminated circuit board, a chip-type laminated ceramic capacitor and the like by using a thick film such as an insulator, a conductor, a dielectric or a resistor structure by a printing method. The present invention relates to a composition used for forming a pattern, and more specifically, the composition is a solventless type cured by radiation, and has a carbon content remaining in a thick film pattern film by firing after curing. The present invention relates to a baking radiation-curable composition comprising an organic component capable of eliminating or burning completely.

[0002]

2. Description of the Related Art Conventionally, a printing technique has been utilized in various fields by making use of the characteristic that a line drawing can be repeatedly duplicated on an object to be transferred. In particular, screen printing is frequently used in the field of thick film pattern formation in electronics. This screen printing is a method in which a paste (ink) placed on a mask or a plate is filled in a mask pattern portion or a mesh of the plate with a squeegee and transferred to a substrate or the like as an object to be transferred. The thickness of the transferred paste varies depending on characteristics such as the thickness of the mask or plate, the gap with the substrate or the like, the thickness of the mesh, the printing pressure of the squeegee, the angle and speed, the viscosity of the paste, etc. Specifically, a thick film of several μm to several tens μm can be applied.

As a structure to which such thick film pattern printing is applied, there is a rib (partition) (12) of a plasma display substrate (34) as shown in FIG. The ribs (partitions) (12) formed on the glass substrate (10) are walls separating the discharge cells corresponding to the pixels of the display, and have a pattern having a width of several tens μm to several hundreds μm and a height of about 20 μm.
It must be formed at 0 μm. As a method for forming the ribs (partitions) (12), a screen printing method is used. As described above, since the coating thickness at one time by screen printing is limited to several tens of μm, the printing process must be repeated several to ten and several times to form the rib (partition) (12).

FIG. 1B shows a process of forming a conventional plasma display substrate (34) by a screen printing method. First, the paste obtained by the solvent-type insulating paste adjusting section (26) is applied on a glass substrate (10) by screen printing. Next, heat drying is performed in the heat drying section (28). By this thermal drying, the solvent in the solvent-type insulating paste is removed, and unfired ribs (12) are formed by the remaining inorganic material and the binder resin. Next, the cooling unit (30)
Cooled by. This cooling step is for returning the glass substrate (10) thermally expanded by the drying step to the original dimensions at the time of printing and improving the lamination accuracy of printing. The steps from the printing step to the cooling step are repeated several times to tens of times. Next, it is fired at about 580 ° C. in the firing section (32) to form a plasma display substrate (34).

Further, as a technique to which the thick film pattern printing is applied, there is a mounting technique of a ceramic laminated circuit board. recent years,
As electronic components have become smaller and more accurate, the mounting density has increased, and high-density mounting technology, which is a three-dimensional development of surface mounting technology, that is, multi-layer boards has become mainstream. The number of laminations of this laminated substrate may reach 50 layers.

[0006] The ceramic laminated circuit board varies in its material and manufacturing process. As a typical classification example, an insulating paste layer and a conductor paste as a circuit pattern are printed on a fired ceramic circuit board. This process is repeated as a single layer, and this process is repeated to form a multilayer. A dry method is used. The conductor layer and the insulating layer are repeatedly printed on an unfired ceramic circuit board (green sheet) to form a multilayer. And a wet sheet lamination method in which a plurality of unfired ceramic circuit boards (green sheets) on which conductor patterns are printed are laminated and fired at once. In some cases, these methods are combined.

The conventional manufacturing process of the wet sheet laminating method among the ceramic laminated circuit boards will be described with reference to FIG. 3B, and the structure of the ceramic laminated circuit board (43) will be described with reference to FIG.
It will be described according to. First, a paste obtained by mixing a ceramic material such as alumina, a binder resin, a solvent, and additives such as a plasticizer and a dispersant is sealed with a doctor blade or the like, and a green sheet (40) is produced. Next, the through hole (42) is formed at the through hole punched portion (46).
Punch out. Next, a solvent-type conductor paste adjusting unit (4)
Screen printing unit (22) with paste prepared in 8)
To print the conductor pattern (44). Next, the solvent is removed in the heat drying section (28), and the composition is cured to form a single-layer substrate.
The steps from the green sheet production to the heat drying are repeated to produce a required number of single-layer substrates.

[0008] The required number of single-layer substrates are stacked in a laminated portion (50).
And heat and press to laminate. Next, a predetermined external shape is formed in the punching part (52), and firing is performed in the firing part (32). The exposed conductor is plated with nickel, and the ceramic laminated circuit board (43) is formed.
And

As another example of the technique using the thick film pattern printing, there is a chip type multilayer ceramic capacitor (66) as shown in FIG. By stacking thin-film dielectrics, the chip-type multilayer ceramic capacitor can have a larger capacity than a single-layer capacitor. In the manufacturing process of the chip-type multilayer ceramic capacitor (66), the sheet laminating method is mainly used similarly to the above-mentioned ceramic multilayer circuit board.

Here, the conventional manufacturing process of the chip-type multilayer ceramic capacitor shown in FIG. 5 will be described. Titanium oxide (TiO ₂ ), titanium titanate (BaTiO ₃ )
A ceramic dielectric material mainly composed of, for example, is pulverized, and a binder resin and a solvent are kneaded to form a paste. The paste is used as a thin film capacitor green sheet (60) with a doctor blade or the like. This green sheet (6
An internal electrode (62) is formed on the surface of (0) by screen printing or the like using a paste made of a noble metal such as palladium (Pd) exhibiting high-temperature stability, a binder resin, and a solvent. Next, this is dried to remove the solvent, and the paste is cured to form a single-layer sheet. This sheet is laminated in several layers to several tens of layers, laminated by heating and pressing, and punched into a predetermined external shape. This is fired at about 580 ° C. Next, an external electrode (64) made of silver-panadium (Ag-Pd) or the like is provided at the end to provide a chip-type multilayer ceramic capacitor (66).

[0011] In the conventional techniques of forming a thick film pattern in the above three cases, since all are multi-layered, printing and thermal drying of a firing paste for an insulator and a conductor (a cooling step is also required in the case of forming a rib of a plasma display). Need to be repeated as many times as the number of layers, and it takes a lot of time and heat energy to complete the process.

These conventional firing pastes usually comprise a filler and an inorganic binder, a binder resin, a solvent, an additive, and the like. The filler is an insulator, a conductor, and a dielectric material. The inorganic binder is softened or melted by heating at the softening point or the melting point or more during firing, entangled in the filler and the substrate, and after cooling, to bring about the bonding between the filler and the substrate. It is.
Further, the binder resin and the solvent are for adjusting the fluidity and viscosity having printability in order to pattern the filler by printing. Here, in the heat drying step after printing, the solvent is evaporated and dried, but there is much heat energy consumption and solvent consumption (consumption of natural resources).

[0013]

However, in the process of manufacturing a thick film pattern or a laminated structure using a baking paste having printability, which is the prior art described above, the heat drying process is performed the same number of times as the number of laminations. Repeating it takes a lot of time and lowers productivity, and solvent-based baking paste becomes an unstable factor in printability due to a change in viscosity due to solvent evaporation before printing, and a heat drying process after printing. Therefore, there is a lot of heat energy consumption and solvent consumption (consumption of natural resources), and there is also a problem in terms of global environmental protection.

The present invention has been made to solve the above-mentioned problems of the prior art, and an object of the present invention is to eliminate a heat drying step which requires a particularly long time in the production of a thick film pattern or a laminated structure. The productivity can be improved by shortening the process, and printing stability can be achieved, and heat energy consumption and solvent consumption (consumption of natural resources) can be reduced.
That is, the present invention provides a solvent-free radiation-curable composition for firing which contributes to global environmental protection. Another object of the present invention is to provide a baking radiation curable composition comprising an organic component capable of eliminating carbon residue in the thick film pattern film or capable of completely burning in the baking process.

[0015]

In order to achieve the above object, the present invention first provides a method for manufacturing a plasma display substrate, a ceramic laminated circuit board, a chip type laminated ceramic capacitor, and the like. The composition used for forming a thick film pattern such as an insulator, a conductor, a dielectric and a resistor structure by a method or the like is a radiation-curable composition for firing characterized by being cured by radiation. is there.

Further, in the invention of claim 2, the composition comprises an organic component capable of eliminating the carbon content in the thick film pattern by baking after curing or capable of completely burning. This is a radiation curable composition for firing.

According to a third aspect of the present invention, there is provided a radiation curable composition for firing, wherein the organic component is an acrylic compound such as an acrylic polymer, an oligomer or a monomer.

[0018]

Embodiments of the present invention will be described below. The curing method for the radiation curable composition for firing of the present invention is based on radiation such as ultraviolet (UV) or electron beam (EB) irradiation.

As a component for exhibiting such curing properties by radiation, there are polymers, oligomers and monomer compounds which exhibit UV curing or EB curing. In particular,
There are unsaturated polyester-based, acrylic-based, thiol-ene-based, and epoxy-based compounds.

Here, firing suitability, which is a point of the present invention, becomes a problem. That is, in the firing step, the compound must be capable of eliminating the residual carbon content in the pressure-sensitive film pattern film or exhibit a thermal decomposition behavior close to sublimation near the decomposition temperature so as to completely burn. This is because residual carbon due to poor combustion causes destructive phenomena such as cracking and deformation of the structure, gas generation in a later process, reaction with glass components, and the like, thereby impairing the characteristics of the structure. Among such compounds, there are acrylic compounds among the above compounds, and the other compounds were not suitable for firing due to residual carbon and the like.

Specific examples of the acrylic polymer and oligomer of the acrylic compound include ester acrylates, ether acrylates, epoxy acrylates, urethane acrylates, and copolymers thereof.

Specific examples of the acrylic monomer of the acrylic compound include monofunctional monomers such as 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate, 2-hydroxypropyl methacrylate, butoxyethyl acrylate, and methoxyethylene glycol acrylate. , Ethylene glycol diacrylate, diethylene glycol diacrylate, diethylene glycol dimethacrylate, neopentyl glycol diacrylate, neopentyl glycol dimethacrylate,
1,3-butylene glycol dimethacrylate, 1,6
-Bifunctional systems such as hexadiol diacrylate, and polyfunctional systems such as trimethylolethane trimethacrylate, trimethylolpropane trimethacrylate, and tetramethylolmethanetetramethacrylate.

These acrylic compounds function as substitutes for the binder resin and the solvent of the conventional solvent-type paste, and secure the fluidity and viscosity to enable the printing of the filler or the inorganic binder as the paste. And has a role of bonding the filler to the substrate and connecting the filler. Thick film pastes require the properties of a pseudoplastic fluid that increases fluidity when shear stress is applied and increases viscosity when stress is removed. Due to this characteristic, for example, in the case of screen printing, the ink transferred from the plate onto the substrate can be held as a thick film pattern shape. In order to obtain such paste characteristics, these acrylic compounds are used alone or in combination as necessary.

The basic composition of the UV-curable paste is composed of the above-mentioned acrylic compound which is the main curing component, a polymerization initiator, and a filler, an inorganic binder and an additive of the same materials as those of the conventional solvent-type paste. On the other hand, the basic composition of the EB-curable paste is composed of the above-mentioned acrylic compound, which is the main curing component, and a filler, an inorganic binder and an additive of the same material as those of the conventional solvent-type paste. These materials are kneaded by a roll mill, a bead mill, an automatic mortar, or the like to obtain a desired paste.

Here, as the polymerization initiator used for the UV-curable paste, diethoxyacetone phenone,
2-hydroxy-2-methyl-1-phenylpropane-
Benzophenones such as acetophenones such as 1-one, benzoin ethers such as isobutyl benzoin ether and isopropyl benzoin ether, benzyl ketals such as benzyl dimethyl ketal and hydroxycyclohexyl phenyl ketone, and benzophenones such as benzophenone;
Thioxanthone such as chlorothioxanthone;

As the additives, wetting agents, dispersants, plasticizers, defoaming agents, polymerization inhibitors, thixotropy-imparting agents and the like are used as required. Examples of the plasticizer include diphenyl phthalate, dioctyl phthalate, dihexyl phthalate, dicyclohexyl phthalate, dimethyl isophthalate, and benzoic acid scroll.

A glass frit or the like is usually used as an inorganic binder of a firing paste for forming a thick film pattern. In an insulating material for forming ribs of a plasma display, glass frit functions as a filler and an inorganic binder. As this glass frit, lead borosilicate glass having a low softening point is often used in order to create a binding force between the substrate and the thick film pattern. As a filler other than the glass frit, a high melting point inorganic material such as alumina and zirconia is used. This is to control the flowability of the glass frit that has reached the softening point during firing and to add it as a skeletal agent for maintaining the pattern shape.

On the other hand, the paste is baked to thermally decompose the organic components, and the conductor component is patterned by sintering or melting.
So-called Printed and Fired Thi
The conductor paste of ckFilm (PAF) is about 1-5 μm.
A few wt% glass powder is added to a metal powder having a particle size of m. For example, gold (Au), palladium (Pd), and silver (A) for low-temperature firing, which are stable in an atmosphere such as temperature and humidity, are used as metal powders used in a conductor paste of a ceramic multilayer substrate.
g), platinum (Pt), silver / palladium (Ag-Pd),
Tungsten (W), nickel (Ni), molybdenum (Mo), molybdenum / manganese (Mo-Mn) and the like for chemically stable high-temperature firing are available. Platinum (P) is used as the conductor paste for chip-type multilayer ceramic capacitors.
t), Panadium (Pd), Silver (Ag), Silver / Palladium (Ag-Pd) are frequently used.

[0029]

Next, the present invention will be described in detail with reference to examples.

<Embodiment 1> The ribs (partitions) (1) of the plasma display substrate (34) shown in FIGS.
2) The composition of the insulating paste for firing used for formation was as follows. Insulating paste composition for firing Lead borosilicate glass frit 68 parts by weight Alumina 12 parts by weight Epoxy acrylate 8 parts by weight butyl methacrylate 8 parts by weight t-butyl anthraquinone 2 parts by weight butyl benzyl phthalate 2 parts by weight

In the radiation-curable insulating paste adjusting section (20) shown in FIG. 1A, the material having the above composition was sufficiently kneaded using a roll mill to obtain a paste.

Next, in the screen printing section (22), the paste was set on a plate of a screen printing machine, and the glass substrate (10) was set on an alignment table beside the printing table. When the printing machine was started, the glass substrate (10) on the alignment table was slid, and the ribs (12) of the predetermined plasma display substrate (34) were patterned.

Next, a UV which is movable and completely covers the glass substrate (10) so that the irradiation light does not leak outside.
In the radiation irradiator (24) having an exposure device, the substrate on which the printing process of the first layer was completed was exposed. At this time, the exposure amount was 100 mJ / cm ² , and the exposure time was 30 seconds.

The above printing and UV exposure are repeated 15 times,
Unfired ribs (partitions) having a height of 200 μm (12)
Was formed. The time required to complete the UV exposure of the fifteenth layer was about 20 minutes.

Finally, in the firing section (32), about 58
It was baked at 0 ° C. to obtain a plasma display substrate (34). At this time, it was found that the ribs (partitions) (12) exhibited good characteristics without any charring or destruction phenomena observed at the time of poor combustion.

Comparative Example 1 The ribs (partitions) of the conventional plasma display substrate (34) shown in FIG.
(12) The composition of the solvent-type baking insulating paste used for formation is shown below. Insulating paste composition for solvent-type baking Lead borosilicate glass frit 68 parts by weight Alumina 12 parts by weight Ethyl cellulose 6 parts by weight Butyl carbitol acetate 12 parts by weight Butyl benzyl phthalate 2 parts by weight

In the solvent type insulating paste adjusting section (26) shown in FIG. 1 (b), the material having the above composition was sufficiently kneaded using a roll mill to obtain a paste.

Next, in the screen printing section (22), the paste was set on a plate of a screen printing machine, and the glass substrate (10) was set on an alignment table beside the printing table. When the printing press was started, the glass substrate (10) on the alignment table was slid, and the ribs (12) of the predetermined plasma display were patterned.

Next, the glass substrate (10) is removed from the alignment table and moved to a heat drying furnace (28), and the glass substrate (10) is moved to about 100
Dry for 10 minutes at ° C.

Next, the dried glass substrate (10)
Was forcibly lowered to room temperature in the cooling section (30).

The above printing, drying and forced cooling are repeated 15 times, and unfired ribs (partitions) having a height of 200 μm.
(12) was formed. The time required to complete the drying step for the fifteenth layer was about 3 hours and 15 minutes.

Finally, in the firing section (32), about 58
It was baked at 0 ° C. to obtain a plasma display substrate (34).

Example 2 The composition of the radiation-curable conductive paste for firing of the ceramic laminated circuit board (56) shown in FIGS. 3A and 4 was as follows. Conductive paste composition for radiation curing type firing 75 parts by weight Tungsten 5 parts by weight Glass frit 5 parts by weight butyl acrylate copolymer 6 parts by weight Pentaerythritol acrylate 10 parts by weight Benzophenone 2 parts by weight Diphenyl phthalate 2 parts by weight

In the radiation-curable conductive paste adjusting section (47) shown in FIG. 3 (a), the material having the above composition was sufficiently kneaded using a roll mill to obtain a paste.

First, the screen printing unit (22)
90% alumina and silica (SiO _Two), Magnesia
(MgO), calcia (CaO), thermoplastic organic binder
-Layer green sheet (41) made of styrene and plasticizer
(128 x 128 mm, thickness 0.5 mm)
A predetermined conductive pattern (4
4) was formed by screen printing.

This is placed on a belt and irradiated with a radiation (2).
4) and UV exposure was performed to obtain an unfired single-layer ceramic circuit board. The exposure amount at this time was 200 mJ /
cm ² and the exposure time was 20 seconds.

The through hole (42) of the second layer green sheet (40) is punched out by a micro drill, and a predetermined conductor pattern (44) is passed through the sheet (40) with the above radiation-curable conductive paste. It was formed by screen printing so as to cover the hole (42). Thereafter, UV exposure was performed in the same manner as in the first layer to obtain an unfired single-layer ceramic circuit board. The same operation is performed for the third and subsequent layers, and 20
Various types of unfired ceramic circuit boards were produced.

Next, in the laminating section (50), 20 unfired single-layer ceramic circuit boards were laminated and heated and pressed (150 ° C., press 100 kg / cm ² ).
The time required for the steps so far was about 40 minutes.

Next, the outer shape of the laminated ceramic circuit board was cut out at a punching section (52). Finally, in the firing section (32), about 1600 ° C. (in a nitrogen atmosphere)
To obtain a ceramic laminated circuit board (56). At this time, it was found that the conductor pattern (44) did not have any carbonization phenomenon or destruction phenomenon observed at the time of poor combustion, and exhibited good characteristics.

Comparative Example 2 The composition of the solvent-type firing conductor paste of the ceramic laminated circuit board (56) shown in FIGS. 3B and 4 was as follows. Conductive paste composition for solvent-based firing 75 parts by weight Tungsten 5 parts by weight Glass frit 5 parts by weight Ethyl cellulose 6 parts by weight Ethylene glycol monoethyl ether 12 parts by weight Diphenyl phthalate 2 parts by weight

In a solvent type conductor paste adjusting section (48) shown in FIG. 3B, the material having the above composition was sufficiently kneaded using a roll mill to obtain a paste.

First, in the screen printing section (22),
90% alumina and silica (SiO _Two), Magnesia
(MgO), calcia (CaO), thermoplastic organic binder
-Layer green sheet (41) made of styrene and plasticizer
(128 x 128 mm, thickness 0.5 mm)
A predetermined conductor pattern (4
4) was formed by screen printing.

This was placed on a belt and passed through a thermal drying section (28) to perform thermal drying to obtain an unfired single-layer ceramic circuit board. At this time, the drying temperature was 100 ° C., and the passage time through the heat drying section (28) was 10 minutes.

The through holes (42) of the second layer green sheet (40) are punched out with a micro drill, and a predetermined conductor pattern (44) is formed on the sheet (40) with the above-mentioned solvent-type firing conductor paste. It was formed by screen printing so as to cover the through hole (42). Thereafter, heat drying was performed in the same manner as in the first layer to obtain an unfired single-layer ceramic circuit board. By the same operation for the third and subsequent layers, 20 types of unfired ceramic circuit boards were produced.

Next, in the laminating section (50), 20 unfired single-layer ceramic circuit boards were laminated and heated and pressed (150 ° C., press 100 kg / cm ² ).
The time required for the steps so far was 6 hours.

Next, the outer shape of the laminated ceramic circuit board was cut out at a punching section (52). Finally, in the firing section (32), firing was performed at about 1600 ° C. (in a nitrogen atmosphere) to obtain a ceramic laminated circuit board (56).

The time required before the production of the ribs (partitions) (12) of the substrate (34) of the plasma display in Example 1 and the production of the ceramic multilayer substrate (43) in Example 2 before firing is as follows. Both were about 1/10 of the conventional one.

[0058]

As described above, the present invention has the following effects. That is, an insulator by a printing method or the like,
In forming thick film patterns such as conductors, dielectrics, and resistor structures, the composition used for the firing paste is changed from a conventional solvent type to a solventless type that cures by radiation, which requires much time conventionally. Since the heat drying process, which has been performed, can be omitted, there is an effect that productivity can be improved by greatly shortening the process. In addition, there is an effect that heat energy consumption and solvent consumption (consumption of natural resources) are small, that is, it greatly contributes to global environmental conservation. Further, since the composition is completely burned by baking after curing, there is no carbonization or destruction of the structure, and there is an effect of exhibiting good characteristics even in a subsequent step.

[Brief description of the drawings]

1 (a) and 1 (b) are explanatory views showing the steps of one embodiment of the present invention.

FIG. 2 is an explanatory diagram showing a cross section, showing one embodiment of the present invention.

FIGS. 3 (a) and 3 (b) are explanatory views showing the steps of one embodiment of the present invention.

FIG. 4 is an explanatory diagram showing a cross section, showing an embodiment of the present invention.

FIG. 5 is an explanatory view showing a cross section of the embodiment of the present invention.

[Explanation of symbols]

 10 glass substrate 12 rib (partition wall) 20 radiation curing type insulating paste adjusting part 22 screen printing part 24 radiation irradiation part 26 solvent type insulating paste adjusting part 28 thermal drying Part 30 cooling part 32 firing part 34 plasma display substrate 40 green sheet 41 first layer green sheet 42 through hole 44 conductor pattern 45 green sheet producing part 46 Through-hole punching part 47 Radiation-curable conductive paste adjusting part 48 Solvent-type conductive paste adjusting part 50 Lamination part 52 Punching part 54 Plating part 56 Ceramic laminated circuit board 60 Capacitor Green sheet 62 mm internal electrode 64 mm external electrode

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[Procedure amendment]

[Submission date] August 28, 1996

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Fig. 1

[Correction method] Change

[Correction contents]

FIG. 1 is an explanatory view showing a process of one embodiment of the present invention and a conventional process.

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] Figure 3

[Correction method] Change

[Correction contents]

FIG. 3 is an explanatory view showing a process of one embodiment of the present invention and a conventional process.

 ──────────────────────────────────────────────────の Continued on the front page (72) Inventor Katsumi Ohira 1-5-1, Taito, Taito-ku, Tokyo Letterpress Printing Co., Ltd.

Claims (3)

[Claims] 1. A composition used for forming a thick film pattern of an insulator, a conductor, a dielectric and a resistor structure by a printing method or the like in the production of a plasma display substrate, a ceramic laminated circuit substrate, a chip-type laminated ceramic capacitor and the like. A radiation-curable composition for firing, characterized in that the product is a solvent-free type that is cured by radiation. 2. The composition according to claim 1, wherein the composition comprises an organic component capable of eliminating the carbon content in the thick film pattern film by baking after curing or capable of completely burning. A radiation-curable composition for firing. 3. The radiation-curable composition for firing according to claim 1, wherein the organic component is an acrylic compound such as an acrylic polymer, an oligomer or a monomer.