JPH10224308A - Optical transmission module - Google Patents
Optical transmission moduleInfo
- Publication number
- JPH10224308A JPH10224308A JP9022390A JP2239097A JPH10224308A JP H10224308 A JPH10224308 A JP H10224308A JP 9022390 A JP9022390 A JP 9022390A JP 2239097 A JP2239097 A JP 2239097A JP H10224308 A JPH10224308 A JP H10224308A
- Authority
- JP
- Japan
- Prior art keywords
- conversion element
- photoelectric conversion
- circuit board
- optical
- lead terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は光伝送モジュールに
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical transmission module.
【０００２】[0002]
【従来の技術】従来、例えば特開昭６１−８８６２４号
公報で図示されているように光電気変換素子、電気光変
換素子が実装されたパッケージのリード端子は切断され
成形後回路基板に接続されていた。また、回路基板、光
電気変換素子、電気光変換素子のケースへの固定に関し
ては述べられていない。2. Description of the Related Art Conventionally, as shown in, for example, Japanese Patent Application Laid-Open No. 61-88624, lead terminals of a package on which an opto-electrical conversion element and an electro-optical conversion element are mounted are cut, molded and connected to a circuit board. I was Further, there is no description about fixing the circuit board, the photoelectric conversion element, or the electro-optical conversion element to the case.
【０００３】[0003]
【発明が解決しようとする課題】上記の構成ではリード
端子を成形するための複雑な治具が必要で作業工数も大
きくなる。また、リード端子の長さが長くなり雑音発生
量、受信量の増加で信号対雑音比を劣化させる。In the above configuration, a complicated jig for forming the lead terminal is required, and the number of working steps is increased. Further, the length of the lead terminal becomes longer, and the signal-to-noise ratio is degraded due to an increase in the amount of noise generation and the amount of reception.
【０００４】[0004]
【課題を解決するための手段】上記問題は電気回路基板
が光電気変換素子と電気光変換素子の其々のパッケージ
のリード端子の中心の高さに配置され挾み込む形態で取
り付けられる様ケース溝が形成され、また上記リード端
子は上記回路基板と垂直方向に折り曲げることなく上記
回路基板の両面で接続される配置にする事で解決され
る。SUMMARY OF THE INVENTION The above-mentioned problem is caused by a case in which the electric circuit board is arranged at the height of the center of the lead terminal of each package of the photoelectric conversion element and the electro-optical conversion element and is mounted so as to be sandwiched therebetween. The problem is solved by forming a groove and arranging the lead terminals so as to be connected to both surfaces of the circuit board without bending the lead terminals in the vertical direction.
【０００５】上記光伝送モジュールは、光電気変換素子
と電気光変換素子の其々のパッケージのリード端子の中
心の高さに電気回路基板が配置され、また、上記リード
端子は上記回路基板と垂直方向に折り曲げることなく上
記回路基板の両面で接続される配置にする事により、光
電気変換素子と電気光変換素子のパッケージのリード端
子の成形が不要になり作業工数低減が可能になる。また
上記リード端子を短くする事が可能なため信号対雑音比
も向上できる。In the optical transmission module, an electric circuit board is arranged at a height of the center of a lead terminal of each package of the photoelectric conversion element and the electro-optical conversion element, and the lead terminal is perpendicular to the circuit board. By arranging the connection on both sides of the circuit board without bending in the direction, it is not necessary to form the lead terminals of the package of the photoelectric conversion element and the electro-optical conversion element, and the number of working steps can be reduced. In addition, since the lead terminals can be shortened, the signal-to-noise ratio can be improved.
【０００６】[0006]
【発明の実施の形態】以下、本発明の一実施例である光
伝送モジュールに関し図１により説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An optical transmission module according to an embodiment of the present invention will be described below with reference to FIG.
【０００７】光送信部１３は入力した電気信号により電
気光変換素子に流れる電流を送信回路１により変化させ
光の強弱信号として光ファイバに伝送する機能を有す
る。また、温度変化に対し光出力電力を一定に保つ機能
をも有する。電気光変換素子は気密パッケージ２内に実
装されレセプタクル３内に固定される。The optical transmission unit 13 has a function of changing the current flowing through the electro-optical conversion element by the transmission circuit 1 according to the input electric signal and transmitting the signal as an optical intensity signal to the optical fiber. It also has a function of keeping the optical output power constant with respect to temperature changes. The electro-optical conversion element is mounted in the airtight package 2 and fixed in the receptacle 3.
【０００８】光受信部１４は光ファイバより入力された
光信号を光電気変換素子により電気信号に変換し受信回
路４により増幅した後外部に出力する機能を有する。光
電気変換素子は気密パッケージ５内に実装されレセプタ
クル３内に固定される。送信回路１、受信回路４は電気
回路基板６に実装され、レセプタクル３と一体になった
本体中央の高さに設けられた溝７に挿入され固定され
る。この溝７の長さは電気回路基板６の寸法に合わせて
あり電気回路基板６の位置決めが可能である。このと
き、光電気変換素子と電気光変換素子の其々のパッケー
ジ２、５のリード端子は同心円上に配置され同心円の中
心と電気回路基板６の板厚中心が同一高さとなる配置に
溝７が設けられている為、電気回路基板６を挾み込む形
で電気回路基板６の表裏のパターン８に接続される。
尚、パターン８はリード端子の間隔に合った配置となっ
ているため、リード端子の長さを合わせるだけで接続で
きる。The optical receiving section 14 has a function of converting an optical signal input from an optical fiber into an electric signal by a photoelectric conversion element, amplifying the electric signal by the receiving circuit 4, and outputting the amplified signal to the outside. The photoelectric conversion element is mounted in the airtight package 5 and fixed in the receptacle 3. The transmission circuit 1 and the reception circuit 4 are mounted on an electric circuit board 6 and are inserted and fixed in a groove 7 provided at the center of the main body and integrated with the receptacle 3. The length of the groove 7 is adjusted to the size of the electric circuit board 6 so that the electric circuit board 6 can be positioned. At this time, the lead terminals of the packages 2 and 5 of the photoelectric conversion element and the electro-optical conversion element are arranged concentrically, and the groove 7 is arranged so that the center of the concentric circle and the plate thickness center of the electric circuit board 6 are at the same height. Are provided, and are connected to the front and back patterns 8 of the electric circuit board 6 so as to sandwich the electric circuit board 6.
In addition, since the pattern 8 is arranged in accordance with the interval between the lead terminals, connection can be made only by adjusting the length of the lead terminals.
【０００９】電気回路基板６の板厚はリード端子の間隔
（約０．９６ｍｍ）以下とすることで電気回路基板６を
リード端子の根元まで近づけることが可能なためリード
端子は半田接続時に耐熱性で問題となる間隔（約１ｍ
ｍ）と半田接続に必要な長さ（約２ｍｍ）を加えた長さ
（約３ｍｍ）迄短くすることが可能である。また、電気
光変換素子のアノード、カソードと接続されたリード端
子９、１０は表面、光電気変換素子のアノード、カソー
ドと接続されたリード端子１１、１２は裏面に配置され
電気回路基板６の導体で遮蔽されるため送信部から発生
する雑音を受信部で受信する量を減らすことが可能であ
る。本実施例は光電気変換素子、電気光変換素子が実装
されたパッケージがレセプタクルに固定された場合の説
明をしたが、パッケージと光ファイバが結合されたピグ
テール型の場合も効果がある。By setting the thickness of the electric circuit board 6 to be equal to or less than the distance between the lead terminals (about 0.96 mm), the electric circuit board 6 can be brought close to the base of the lead terminals. At intervals (about 1m
m) and the length (about 2 mm) required for solder connection can be reduced to a length (about 3 mm). The lead terminals 9 and 10 connected to the anode and the cathode of the electro-optical conversion element are on the front side, and the lead terminals 11 and 12 connected to the anode and the cathode of the photoelectric conversion element are arranged on the back side and the conductors of the electric circuit board 6 , It is possible to reduce the amount of noise received from the transmission unit at the reception unit. In this embodiment, the case where the package on which the photoelectric conversion element and the electro-optical conversion element are mounted is fixed to the receptacle is described. However, the effect is also obtained in the case of the pigtail type in which the package and the optical fiber are coupled.
【００１０】[0010]
【発明の効果】本発明によればリード端子の成形が不要
となるため作業工数の低減が図れる。また、リード端子
の長さを短くできるため電気光変換素子のリード端子か
ら発生する雑音量を減らし光電気変換素子のリード端子
が受信する雑音量を減らす事が可能となり信号対雑音比
の向上が図れる。According to the present invention, it is not necessary to form a lead terminal, so that the number of working steps can be reduced. In addition, since the length of the lead terminal can be reduced, the amount of noise generated from the lead terminal of the electro-optical converter can be reduced, and the amount of noise received by the lead terminal of the photoelectric converter can be reduced, thereby improving the signal-to-noise ratio. I can do it.
【図１】本発明の光伝送モジュールの一実施例を示す構
成図である。FIG. 1 is a configuration diagram showing one embodiment of an optical transmission module of the present invention.
【図２】本発明の電気回路基板と光電気変換素子の実装
されたパッケージと電気光変換素子の実装されたパッケ
ージ、及び送信回路、受信回路の実装の一実施例を示す
説明図。FIG. 2 is an explanatory view showing an embodiment of a package on which an electric circuit board and a photoelectric conversion element are mounted, a package on which an electro-optical conversion element is mounted, and a transmission circuit and a reception circuit of the present invention.
１…送信回路、 ２…パッケージ、 ４…受信回路、 ５…パッケージ、 ６…電気回路基板、 ８…パッド、 ９、１０…電気光変換素子のアノード、カソードと接続
されたリード端子、 １１、１２…光電気変換素子のアノード、カソードと接
続れさたリード端子。DESCRIPTION OF SYMBOLS 1 ... Transmission circuit, 2 ... Package, 4 ... Receiving circuit, 5 ... Package, 6 ... Electric circuit board, 8 ... Pad, 9, 10 ... Lead terminal connected to the anode and cathode of an electro-optical conversion element, 11, 12 ... Lead terminals connected to the anode and cathode of the photoelectric conversion element.
Claims (3)
力電気信号を増幅する受信回路からなる光受信器、及び
電気光変換素子と上記電気光変換素子を駆動する送信回
路からなる光送信器を有し、上記光電気変換素子また上
記電気光変換素子は３本以上のリード端子が同心円上に
配置された其々のパッケージに実装され、上記受信回
路、上記送信回路が電気回路基板に実装された光伝送モ
ジュールにおいて、上記光電気変換素子、上記電気光変
換素子のパッケージと上記電気回路基板を固定する樹脂
でできた一体のモールドを有し、上記モールドには上記
電気回路基板を挿入する溝が上記光電気変換素子と電気
光変換素子の其々のパッケージのリード端子の中心の高
さに上記電気回路基板の寸法に合わせて形成され、上記
リード端子は上記回路基板と垂直方向に折り曲げること
なく配置されることで上記回路基板の両面で接続される
ことを特徴とする光伝送モジュール。An optical receiver comprising a photoelectric conversion element and a receiving circuit for amplifying an output electric signal of the photoelectric conversion element, and an optical transmission comprising a photoelectric conversion element and a transmission circuit for driving the photoelectric conversion element. The photoelectric conversion element or the electro-optical conversion element is mounted on each package in which three or more lead terminals are arranged concentrically, and the reception circuit and the transmission circuit are mounted on an electric circuit board. The mounted optical transmission module includes an integrated mold made of a resin for fixing the photoelectric conversion element, the package of the electro-optical conversion element, and the electric circuit board, and inserting the electric circuit board into the mold. A groove to be formed is formed at the height of the center of the lead terminal of each package of the photoelectric conversion element and the electro-optical conversion element in accordance with the dimensions of the electric circuit board, and the lead terminal is connected to the circuit. Optical transmission module, characterized in that it is connected on both sides of the circuit board by being disposed without bending in a direction perpendicular to the substrate.
ありモニタフォトダイオードと同一パッケージに実装さ
れ上記レーザダイオードのアノード、カソードと接続さ
れた其々のリード端子とモニタフォトダイオードのアノ
ード、カソードと接続された其々のリード端子が基板の
別の面に配置され、上記光電気変換素子がフォトダイオ
ードであり上記フォトダイオードのアノード、カソード
と接続された其々のリード端子が上記レーザダイオード
のアノード、カソードと接続された其々のリード端子と
は基板の別の面で接続された請求項１に記載の光伝送モ
ジュール。And a lead terminal connected to an anode and a cathode of the laser diode and connected to an anode and a cathode of the monitor photodiode. Each lead terminal is disposed on another surface of the substrate, the photoelectric conversion element is a photodiode, the anode of the photodiode, each lead terminal connected to the cathode is the anode of the laser diode, The optical transmission module according to claim 1, wherein each of the lead terminals connected to the cathode is connected to another surface of the substrate.
前置増幅器が実装された請求項１に記載の光伝送モジュ
ール。3. The optical transmission module according to claim 1, wherein a preamplifier is mounted in the same package as said photoelectric conversion element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP02239097A JP3527824B2 (en) | 1997-02-05 | 1997-02-05 | Optical transmission module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP02239097A JP3527824B2 (en) | 1997-02-05 | 1997-02-05 | Optical transmission module |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003432011A Division JP2004179674A (en) | 2003-12-26 | 2003-12-26 | Optical transmission module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10224308A true JPH10224308A (en) | 1998-08-21 |
| JP3527824B2 JP3527824B2 (en) | 2004-05-17 |
Family
ID=12081337
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP02239097A Expired - Lifetime JP3527824B2 (en) | 1997-02-05 | 1997-02-05 | Optical transmission module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3527824B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013539728A (en) * | 2010-09-20 | 2013-10-28 | オートリブ エーエスピー，インコーポレイティド | Reinforced electronic assembly |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6188624A (en) * | 1984-10-05 | 1986-05-06 | Fujitsu Ltd | Optical signal transmitting and receiving device |
| JPH05104570A (en) * | 1991-10-18 | 1993-04-27 | Sumitomo Electric Ind Ltd | Optical data link device and manufacture thereof |
| JPH0575727U (en) * | 1992-03-24 | 1993-10-15 | 北陽電機株式会社 | Optical data transmission device |
| JPH05335617A (en) * | 1992-05-27 | 1993-12-17 | Hitachi Ltd | Optical transmission module |
| JPH0672255U (en) * | 1993-03-23 | 1994-10-07 | 株式会社富士通ゼネラル | Photo interrupter mounting structure |
| JPH09219575A (en) * | 1996-02-08 | 1997-08-19 | Nippon Telegr & Teleph Corp <Ntt> | Optical element mounting structure |
-
1997
- 1997-02-05 JP JP02239097A patent/JP3527824B2/en not_active Expired - Lifetime
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6188624A (en) * | 1984-10-05 | 1986-05-06 | Fujitsu Ltd | Optical signal transmitting and receiving device |
| JPH05104570A (en) * | 1991-10-18 | 1993-04-27 | Sumitomo Electric Ind Ltd | Optical data link device and manufacture thereof |
| JPH0575727U (en) * | 1992-03-24 | 1993-10-15 | 北陽電機株式会社 | Optical data transmission device |
| JPH05335617A (en) * | 1992-05-27 | 1993-12-17 | Hitachi Ltd | Optical transmission module |
| JPH0672255U (en) * | 1993-03-23 | 1994-10-07 | 株式会社富士通ゼネラル | Photo interrupter mounting structure |
| JPH09219575A (en) * | 1996-02-08 | 1997-08-19 | Nippon Telegr & Teleph Corp <Ntt> | Optical element mounting structure |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013539728A (en) * | 2010-09-20 | 2013-10-28 | オートリブ エーエスピー，インコーポレイティド | Reinforced electronic assembly |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3527824B2 (en) | 2004-05-17 |
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