JP2539961Y2 - Optical link - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Technical Field The present invention relates to an optical-to-optical conversion device or an optical link for connecting an optical-to-electrical conversion device to an optical fiber cable so that the end face of the optical fiber cable faces an optical signal exchange. About.

2. Description of the Related Art In recent automobiles and the like, electronic devices have been advanced, for example, a microcomputer is used to control an engine and a suspension of a vehicle body. Is bad.

Therefore, by using an optical link to convert an electric signal into an optical signal and then exchanging the signal between the control device and the controlled device, electric noise is not mixed during signal transmission. It has been tried to be.

At this time, in order to transmit and receive signals between devices in two directions, it is necessary to pair two optical links whose signal transmission directions are opposite to each other and provide them between the devices.

2. Description of the Related Art Conventionally, when two optical links are paired, simply providing the two optical links side by side does not provide any structural uniformity.

The present invention has been made in view of the above points, and when pairing at least two optical links so that transmission and reception of signals can be performed in both directions, the optical links are integrated. And an optical link whose structure is simplified.

Configuration Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

In the optical link according to the present invention, FIGS.
As shown in the figure, an electric-optical conversion element 11 and an optical-electric conversion element 12 are juxtaposed, and the juxtaposed electric-optical conversion element 11 is provided.
Mold part 2 formed by molding each part of the optical and electrical conversion element 12 with a light-transmitting resin while pulling out the lead frame 7 (71, 72, 73) of each element to the outside, and each inner part thereof The molding part 2 is collectively molded with resin, and an insertion hole 5 for each optical fiber cable 6 is provided to oppose the electric-optical conversion element 11 and the optical-electric conversion element 12 arranged in parallel. And an outer molded part 4.

The outer mold part 4 is formed by molding a resin such as a light-blocking black resin on the outer side of the inner mold part 2 so as to overlap with the electric / light conversion element 11 and the light / electric conversion element 12. Noise is prevented from being mixed into the optical signal exchanged with the optical fiber cable 6 due to external light.

The optical fiber cables 6 inserted into the respective insertion holes 5 of the outer molded part 4 are fixed to the outer molded part 4 side by bonding or the like.

Note that, for example, an LED is used as the electro-optical conversion element 11. The optical-electrical conversion element 12 may be a one-chip IC in which a photodiode, a light receiving amplifier, and a waveform shaping circuit are integrated, or an IC chip including a phototransistor.
An IC chip or the like in which a phototransistor and a normal transistor are connected in Darlington is used.

The inner mold part 2 has an axial displacement between the end face of the optical fiber cable 6 inserted into the outer mold part 4 and the opto-electric conversion element 11 or opto-electric conversion element 12 opposed thereto. Or, a collimating lens-shaped lens portion 3 for suppressing the attenuation of an optical signal due to a radial displacement is integrally formed.

In the optical link constructed as described above, in particular, in the present invention, as shown in FIG. 1, the leads for applying the bias of the electric-optical conversion element 11 and the optical-electric conversion element 12 arranged in parallel are provided. The frame 71 has a common lead frame configuration.

In the figure, reference numeral 72 denotes a lead frame for grounding, and 73 denotes a lead frame for output of the optical-electrical conversion element 12.

Thus, lead frame for bias application
By using a common lead frame configuration for 71, the lead frame 7 has five drawers when two optical links are simply provided side by side.
Becomes four, and the overall configuration is simplified.

In addition, by using a common lead frame 71, the area of the lead frame 71 increases,
The heat radiation effect of the chip is improved.

As shown in FIG. 1, when an LED chip is mounted as the electro-optical conversion element 11, the lead frame on the cathode side is used in order to make the light emission intensity of the LED uniform.
72, and each of the divided lead frames 721, 72
A chip-shaped resistor 9 is provided between the two.

As the resistor 9, a chip resistance element having a small resistance value is soldered in advance between the lead frames 721 and 722, then the LED is made to emit light, and while measuring the emission intensity, a laser trimmer is used so that the emission intensity becomes predetermined. The chip resistance element is trimmed by using a device or the like so that an optimum resistance value is obtained.

Here, in the LED, the resistor 9 is provided on the cathode side in consideration of the fact that the heat radiation amount on the anode side is larger than that on the cathode side.

Similarly, although not specifically shown, for example, an optical-electrical conversion element
Even when an IC chip integrated with a photodiode, a light receiving amplifier and a waveform shaping circuit is mounted as 12, the gain adjustment or bias of the light receiving amplifier or the waveform shaping circuit is required to make the level of the output signal of the photodiode uniform. An adjusting resistor can be integrated into the optical link.

Further, it is also possible to incorporate an automatic gain control circuit for keeping the level of the output signal of the photodiode constant in an IC chip in which the photodiode, the light receiving amplifier and the waveform shaping circuit are integrated.

In each lead frame 71, 72, 73, a hole 8 is formed to allow the resin to penetrate during the molding of the inner molding part 2 and to fix the inner molding part 2 to each of the lead frames 71, 72, 73. Each is provided.

Effect As described above, in the optical link according to the present invention, the electric-optical conversion element and the optical-electric conversion element of the IC chip requiring the bias are arranged in parallel, and the electric-optical conversion element arranged in parallel is provided. Each part of the optical-to-electrical conversion element is molded with a light-transmitting resin while pulling out the lead frame of each element to the outside, and the respective inner molding parts are collectively molded with resin. It has an outer mold forming part provided with an insertion hole for each optical fiber cable which is formed and arranged in parallel with the electric / optical conversion element and the optical / electrical conversion element. The lead frame for bias application of each of the light conversion element and the light-to-electric conversion element has a common lead frame structure.
The two optical links to be paired are efficiently formed into an integrated structure, and the structure is highly reliable. In addition, the number of lead frames drawn out from the integrated optical link is reduced, so that the structure is effectively simplified and the whole becomes compact. In particular, the electric / optical conversion element is mounted on the lead frame for bias application. When mounting on a device, the area of the bias lead frame is increased to make it common with the lead frame on the opto-electric conversion element side, and the heat dissipation effect of the electro-optical conversion element where heat generation is a problem is improved. It has various excellent advantages such as

[Brief description of the drawings]

FIG. 1 is a front sectional view showing an embodiment of the optical link according to the present invention, and FIG. 2 is a side sectional view of the optical link in the embodiment. 11 …… Electrical-to-optical conversion element, 12 …… Opto-electrical conversion element, 2
...... Inner molded part, 3 ... Lens part, 4 ... Outer molded part, 6 ... Optical fiber cable, 7
(71,72,73) …… Lead frame

 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-59-128508 (JP, A) JP-A-58-168284 (JP, A) Jpn.

Claims (1)

(57) [Scope of request for utility model registration] An optical link for connecting an electrical / optical conversion element or an optical / electrical conversion element so that an optical signal is exchanged with the end face of an optical fiber cable facing the optical / electrical conversion element. ICs that require a bias as an element
After using the chip, the electrical-optical conversion element and the optical-electrical conversion element are juxtaposed, and each part of the juxtaposed electric-optical conversion element and the opto-electrical conversion element is used for each element. An inner-molded part that is molded with a light-transmitting resin while the lead frame is pulled out, and the respective inner-molded parts are collectively molded and molded with resin, and an electric-optical conversion element that is juxtaposed An outer mold formed portion provided with an insertion hole for each optical fiber cable facing the optical-electrical conversion element, and an optical-optical conversion element having a two-terminal structure and an optical / optical conversion element having a three-terminal structure provided side by side; The lead frame for applying each bias with the electric conversion element is configured as a common lead frame, and the output lead frame of the optical / electric conversion element and the grounding of both conversion elements are used. Optical links, characterized in that the drawn out from the outer molded portion with over lead frame.