JPH10214927A - Epoxy resin molding material for electronic part sealing and electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain good frame retardance and setting property by non-halogen and non-antimony by adopting epoxy resin, phenol compound, at least one kind of molybdenum and inorganic filler as essential elements and setting a content of filler in a range of specific percentage to an entire of element materials. SOLUTION: As epoxy resin, linear aliphatic epoxy resin which is obtained by oxidation with acyl hydraperoxide and cycloaliphatic epoxy resin are included, which are used single or in a proper variety. Phenol compound functions as a setting agent of epoxy resin and is not limited especially. At least one kind of molybdenum compound selected from molybdenum sulfide, molybdenum carbide and molybdenum silicide is used as flame retarder and its mixing is not especially limited. A mixing amount of inorganic filler is 85 to 95wt.% to an entire of molding materials. If a mixing amount is 85wt.% or less, frame retandance is insufficient and if it exceeds 95wt.%, setting property and hardening matter property lower.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin molding material for sealing electronic parts having excellent flame retardancy, curability, and properties of a cured product, and an electronic part having an element encapsulated with the molding material.

[0002]

2. Description of the Related Art Resin encapsulation is predominant in electronic components such as transistors and ICs from the viewpoints of productivity, cost and the like. Epoxy resins excellent in electrical properties, cost, workability, etc. are mainly used for this sealing resin, but since epoxy resins have insufficient flame retardancy, conventionally, brominated epoxy resins and the like have been used. Flame retardancy is measured by adding a brominated flame retardant and antimony oxide in combination.

[0003]

DISCLOSURE OF THE INVENTION Halogen (bromine) flame retardants such as decabrom are suspected of producing dioxin during combustion, and antimony oxide is known to be toxic. Epoxy resin molding materials and methods of disposing of electronic components using the molding materials have become problems in terms of environment and safety, and demands for use regulations have been increasing. It is also known that bromine ions have a bad influence on the high-temperature storage characteristics of plastic-encapsulated ICs. From this viewpoint, reduction of bromine-based flame retardants is desired.

[0004] Under such circumstances, various non-halogens,
Non-antimony flame retardants have been proposed. For example, metal hydrates such as aluminum hydroxide and magnesium hydroxide can make the epoxy resin molding material flame-retardant by adding a large amount of it, but the curing properties of the molding material and the properties of the cured product are not excellent. There is a problem that the reliability of an electronic component using the same decreases. Phosphorus-based flame retardants such as red phosphorus and phosphate compounds can also be made flame retardant in smaller amounts than metal hydrates, but have the same problems as metal hydrates.

An object of the present invention is to provide a non-halogen, non-antimony epoxy resin molding material for encapsulating an electronic component which is excellent in flame retardancy, curability and cured product properties, and an electronic component in which an element is encapsulated with the molding material. Things.

[0006]

Means for Solving the Problems The inventors of the present invention have conducted intensive studies to solve the above-mentioned problems, and as a result, by using a specific compound as a flame retardant and blending it with a specific amount of a filler, The inventors have found that the object can be achieved, and have completed the present invention.

That is, the present invention provides (1) (A) an epoxy resin, (B) a phenol compound,
(C) a molding material containing at least one molybdenum compound selected from molybdenum sulfide, molybdenum boride, molybdenum carbide and molybdenum silicide, and (D) an inorganic filler as an essential component, wherein the content of the (D) component is An epoxy resin molding material for electronic component sealing, characterized in that the content is 85 to 95% by weight based on the whole molding material; Electronic components obtained by stopping.

[0008]

DETAILED DESCRIPTION OF THE INVENTION (A) used in the present invention
The epoxy resin component is not particularly limited as it is commonly used in epoxy resin molding materials for electronic component encapsulation. For example, phenols such as phenol novolak epoxy resins and orthocresol novolak epoxy resins Glycidylamine epoxy resin obtained by the reaction of epichlorohydrin with polyamines such as diglycidyl ethers such as bisphenol A, bisphenol F, bisphenol S, and alkyl-substituted biphenols, diaminodiphenylmethane, isocyanuric acid, etc. There are, for example, a linear aliphatic epoxy resin obtained by oxidizing an olefin bond with a peracid such as peracetic acid, and an alicyclic epoxy resin, and these may be used alone or in combination of any kinds as appropriate. Kill.

The phenol compound of the component (B) used in the present invention functions as a curing agent for the epoxy resin (A), and is not particularly limited. Examples thereof include phenol, cresol, xylenol, hydroquinone,
Phenols such as resorcin, catechol, bisphenol A, bisphenol F or α-naphthol, β-
Resin obtained by condensing or co-condensing naphthols such as naphthol and dihydroxynaphthalene with aldehydes such as formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde and salicylaldehyde in the presence of an acidic catalyst; synthesized from phenols and dimethoxyparaxylene An aralkyl-type phenol resin having a xylylene skeleton; a phenol resin having a dicyclopentadiene skeleton; a naphthol resin having a xylylene skeleton may be used alone or in combination of two or more.

The equivalent ratio of the epoxy resin (A) to the phenol compound (B) (the number of hydroxyl groups in (B) / (A))
Is not particularly limited, but is preferably set in the range of 0.7 to 1.3 in order to reduce the amount of each unreacted component. More preferably 0.8 to
1.2.

Further, a curing accelerator for accelerating the curing reaction between the epoxy resin and the phenol resin can be used as required. As this curing accelerator, for example, 1,8
-Diazabicycloalkenes such as diazabicyclo (5,4,0) undecene-7 and derivatives thereof, and tertiary amines such as triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol and tris (dimethylaminomethyl) phenol Imidazoles such as 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole and 2-heptadecylimidazole; organic phosphines such as tributylphosphine, methyldiphenylphosphine and triphenylphosphine; and tetraphenylphosphonium. Tetra-substituted phosphonium / tetra-substituted borate such as tetraphenyl borate, 2-ethyl-4-methylimidazole / tetraphenyl borate, N-methylmorpholine / tetraf And the like tetraphenyl boron salts such as Niruboreto.

In the present invention, at least one molybdenum compound selected from molybdenum sulfide, molybdenum boride, molybdenum carbide and molybdenum silicide, which is the component (C), is used as a flame retardant, and the amount thereof is not particularly limited. The amount is preferably 5 to 50 parts by weight, more preferably 10 to 30 parts by weight, based on 100 parts by weight of the epoxy resin. If the amount is less than 5 parts by weight, the flame retardancy becomes insufficient, and if it exceeds 50 parts by weight, the curability and the physical properties of the cured product tend to decrease.

The inorganic filler of component (D) used in the present invention is not particularly limited, but may be fused silica, crystalline silica, alumina, zircon, calcium silicate, calcium carbonate, silicon carbide, boron nitride, beryllia, zirconia, Powder, or beads obtained by spheroidizing them, single crystal fibers such as potassium titanate, silicon carbide, silicon nitride, and alumina, glass fibers, and the like. Further, examples of the inorganic filler having a flame-retardant effect include aluminum hydroxide, magnesium hydroxide, zinc borate and the like, and these can be used alone or in combination. Among the above-mentioned inorganic fillers, fused silica is preferred from the viewpoint of reducing the linear expansion coefficient, and alumina is preferred from the viewpoint of high thermal conductivity. The shape of the filler is preferably 50% or more spherical from the viewpoint of fluidity and mold wear during molding, and it is particularly preferable to use spherical fused silica powder.

The compounding amount of the inorganic filler is 85 to 95% by weight based on the whole molding material. If the amount is less than 85% by weight, the flame retardancy becomes insufficient, and if it exceeds 95% by weight, the curability and the physical properties of the cured product are reduced.

In addition to the above, the molding material of the present invention may further include nitrogen-based flame retardants such as melamine and isocyanuric acid compounds, phosphorus-based flame retardants such as red phosphorus and phosphoric acid compounds, and metals such as aluminum hydroxide and magnesium hydroxide. Hydrates and the like can be appropriately added as a flame retardant aid. Other additives include higher fatty acids, higher fatty acid metal salts, release agents such as ester wax and polyolefin wax, coloring agents such as carbon black, epoxy silane, amino silane, ureido silane, vinyl silane, alkyl silane,
Coupling agents such as organic titanates and aluminum alcoholates, and flexible agents such as silicone powder can be used as necessary.

The molding material in the present invention can be prepared by any method as long as the various raw materials can be uniformly dispersed and mixed. As a general method, a predetermined amount of the raw materials is sufficiently mixed with a mixer or the like. After mixing, melt-kneading with a mixing roll, extruder, etc., cooling,
A pulverizing method can be used.

A support member such as a lead frame, a wired tape carrier, a wiring board, glass, or a silicon wafer is provided with active elements such as semiconductor chips, transistors, diodes, and thyristors, and passive elements such as capacitors, resistors, and coils. An electronic component can be manufactured by mounting the element and sealing a necessary portion with the molding material for sealing of the present invention. An example of such an electronic component is a TCP in which a semiconductor chip connected to a tape carrier by a bump is sealed with the molding material of the present invention. Also, active elements such as semiconductor chips, transistors, diodes, thyristors, and / or passive elements such as capacitors, resistors, and coils are connected to wiring formed on a wiring board or glass by wire bonding, flip chip bonding, soldering, or the like. , A COB module, a hybrid IC, a multi-chip module, and the like, which are sealed with the molding material of the present invention. As a method of sealing the electronic component, a low-pressure transfer molding method is the most common, but an injection molding method, a compression molding method, or the like may be used.

[0018]

Next, the present invention will be described with reference to examples, but the scope of the present invention is not limited to these examples.

Examples 1 to 5 Raw materials having the composition shown in Table 1 were weighed and preliminarily mixed. Thereafter, the mixture was kneaded with a biaxial heat roll at 80 ° C. for 10 minutes, cooled and pulverized to produce molding materials of Examples 1 to 5. The biphenyl skeleton type epoxy resin has an epoxy equivalent of 188 and a melting point of 106.
Oily Shell Epoxy Epicoat YH-4000H
The aralkyl-type phenol resin has a hydroxyl equivalent of 167,
Millex XL-225 manufactured by Mitsui Toatsu having a softening point of 70 ° C was used.

Comparative Examples 1 to 3 In the same manner as in Examples 1 to 5, molding materials of Comparative Examples 1 to 3 were prepared with the formulations shown in Table 1.

[0021]

[Table 1]

The characteristics of the molding materials obtained in Examples and Comparative Examples were measured using a transfer molding machine at a mold temperature of 180 ° C.
Under the molding conditions of a molding pressure of 6.9 MPa and a curing time of 90 seconds,
The following tests were performed and evaluated. (1) Flame retardancy Using a mold to mold a test piece 1/16 inch thick,
180 ° C, 6.9MPa, 90 by transfer press
The molding material was molded under the conditions of seconds, and post-cured at 175 ° C. for 6 hours. The evaluation followed the UL94 vertical test method. (2) Hardness at heating 180 ° C., 6.9 MPa by transfer press using a mold for forming a disk having a diameter of 100 mm and a thickness of 3 mm.
a, A molding material was molded under the conditions of 90 seconds, and the hot hardness of the molded product immediately after molding was determined by a Shore hardness meter (D type). In addition, it is evaluated that the higher the value of the hardness at the time of heating, the better. (3) Water absorption 50 mm in diameter and 5 in thickness according to JIS-K-6911
mm disk, and the temperature of 85 ° C, 85% RH
Moisture was absorbed for 8 hours, and the moisture absorption was determined from the weight change before and after the moisture absorption. (4) Reflow Resistance A QFP 80-pin semiconductor device was prepared as a test piece, and after absorbing moisture at 85 ° C. and 85% RH for a predetermined time, VP
The treatment was performed at 215 ° C. for 90 seconds using the S apparatus, and the number of cracks generated was measured.

Table 2 shows the obtained evaluation results.

[Table 2]

Examples 1 to 5 of the present invention all have good flame retardancy, and are also excellent in hot hardness, moisture absorption and reflow resistance. On the other hand, Comparative Examples 1 and 2, which do not contain the flame retardant of the present invention, are not excellent in curability due to low hardness when heated and remarkably poor in reflow resistance. Also in Comparative Example 3 in which the content of the filler does not satisfy the present invention, the hardness when heated and the reflow resistance are inferior, and the flame retardancy is not the best V-1.

[0025]

As described in Examples, the epoxy resin molding material for encapsulating electronic parts obtained by the present invention can achieve flame retardancy with non-halogen and non-antimony, and has excellent curability and other properties. It is suitable for sealing electronic components. Furthermore, electronic components using the same have excellent reliability and do not cause environmental and safety problems at the time of disposal thereof, so that their industrial value is great.

Claims (2)

[Claims] 1. An epoxy resin, (B) a phenol compound, (C) at least one molybdenum compound selected from molybdenum sulfide, molybdenum boride, molybdenum carbide and molybdenum silicide, and (D) an inorganic filler. An epoxy resin molding material for electronic component encapsulation, which is a molding material as an essential component, wherein the content of the component (D) is 85 to 95% by weight based on the whole molding material. 2. An electronic component obtained by sealing an element with the epoxy resin molding material for sealing electronic components according to claim 1.