JPH10214746A - Method for manufacturing ceramic laminated electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce variation in characteristics by protruding a die part which pressurizes the periphery of a ceramic laminate, from a part that pressurizes the center of the ceramic laminate, by a specific quantity. SOLUTION: A part 7 for pressurizing the periphery of a ceramic laminate 4, of at least one of a upper die 5 and a lower die 6 which sandwich the ceramic laminate 4, is protruded and the total of the protruding quantities of the upper die 5 and the lower die 6 is 0.5-30% of the thickness of the press-bonded ceramic laminate 4. The ceramic laminate 4 is sandwiched between the upper die 5 and the lower die 6 to be mounted on a uniaxial press 8, the protruding part 7 is provided at least one of the upper die 5 and the lower die 6, and the total of the protruding quantities of the upper die 5 and the lower die 6 is specified. When the protruding quantity of the die is larger than 0.5% of the thickness of the press-bonded laminate, effect of suppressing stretching becomes high. When it is less than 30%, sheets are mutually press-bonded. Yield deterioration generated in press-bonding process is suppressed in the case a laminated component is miniaturized.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for manufacturing a ceramic multilayer electronic component such as a multilayer capacitor and a multilayer filter.

[0002]

2. Description of the Related Art In recent years, as typified by mobile phones, the miniaturization of various devices has been remarkable. There is also a strong demand for miniaturization of laminated electronic components having a structure in which a conductive metal and a dielectric ceramic are laminated, such as a capacitor, a filter, and a multilayer substrate, among the components constituting the device. When the size of the multilayer electronic component is reduced, the influence of variations in the manufacturing process on variations in electrical characteristics such as capacitance and resonance frequency becomes greater than before. Many of these laminated electronic components are manufactured by laminating, pressing and firing a green sheet of a dielectric ceramic on which a conductive paste is printed, as disclosed in JP-A-3-254513. As shown in FIG. 3, the conventional crimping step in the above-described manufacturing process is performed by the uniaxial pressing machine 3 with the ceramic laminate 1 sandwiched between the molds 2.

[0003]

According to the above-mentioned crimping method, the ceramic laminate extends in the direction perpendicular to the pressing direction.
This is one of the major causes of the decrease in the yield of the obtained electronic components. Therefore, there has been a demand for the development of a pressure bonding method for suppressing the spread of the ceramic laminate.

[0004] It is an object of the present invention to solve the above-mentioned technical problems and to provide a manufacturing method for reducing variation in characteristics of a ceramic laminated electronic component.

[0005]

In order to achieve the above object, a first method of manufacturing a ceramic laminated electronic component according to the present invention is a method for manufacturing a ceramic laminated body in which a predetermined number of ceramic green sheets are stacked in an upper mold and a lower mold. In the step of press-fitting, a portion of at least one of the upper mold and the lower mold that presses a peripheral portion of the ceramic laminate protrudes from a portion that presses a central portion of the ceramic laminate, and The total amount of protrusion of the mold and the lower mold is 0.5 to 30% with respect to the thickness of the ceramic laminate after crimping.

Further, according to a second method of manufacturing a ceramic laminated electronic component of the present invention, an adhesive sheet is adhered to both sides of a metal plate, and a predetermined number of ceramic green sheets are laminated thereon. In the step of placing a mold and pressing the same, the portion of the mold that presses the peripheral portion of the ceramic laminate is pressurized from the portion that presses the center of the ceramic laminate relative to the thickness of the ceramic laminate after the compression. 0.5 to 30%.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The dielectric ceramic material used in the present invention is not particularly limited in composition,
BaTiO3 series for multilayer capacitors, PbTiO3 for piezoelectric filters
-PbZrO3-Pb (ZnNb) O3 series, Bi2O3-Nb2O for dielectric filter
5 series, Al2O3-B2O3-SiO2-PbO series for a multilayer substrate, etc. are desirable. The dielectric powder is mixed with a solvent, a binder, and a plasticizer to form a slurry. As the solvent, water, ester, or alcohol is preferable. The binder is desirably polyvinyl butyral or acrylic.
The slurry is formed to obtain a dielectric green sheet. As a molding method, a doctor blade method or a reverse roll method is preferable. Green sheet thickness is 5-20
00 μm is preferred. If necessary, a conductor paste is printed on a predetermined green sheet to form a pattern. The conductor is preferably Cu, Ag, Pd, Ni, W, Mo, or an alloy thereof. As a printing method, screen printing, gravure printing, or the like is preferable. After the conductor pattern is printed on a predetermined green sheet in advance, the green sheet may be laminated to form a ceramic laminate, or the process of printing the conductor pattern on the green sheet while repeating the green sheet may be repeated to form the ceramic laminate. May be. At this time, workability is good if a sheet having double-sided adhesiveness is attached to a metal plate, and a green sheet is stacked thereon to form a laminate. The thus obtained ceramic laminate is pressed and pressed. In the case of the first invention, a portion of at least one of an upper mold and a lower mold that sandwiches the ceramic laminate, which presses a peripheral portion of the ceramic laminate, protrudes,
The sum of the protrusion amounts of the upper mold and the lower mold is 0.5 to 30% with respect to the thickness of the ceramic laminate after pressure bonding. In the case of the second invention, an adhesive sheet is stuck on both sides on a metal plate, a mold is placed on a ceramic laminate formed thereon, and pressure-bonded, but the ceramic laminate in the mold is pressed. The part which presses the peripheral part of the body is made to project from the part which presses the center part of the ceramic laminate by 0.5 to 30% with respect to the thickness of the ceramic laminate after pressing. The protrusion of the mold used in these inventions
If it is less than 0.5%, the effect of suppressing the spread of the ceramic laminate becomes small, and if it is more than 30%, no pressure is applied to the central portion of the ceramic laminate, and the sheets do not adhere to each other. The dimensions of the ceramic laminate obtained by the above method before and after the pressure bonding step are measured to determine the spread.

[0008] As the mold used in the present invention, a portion for pressing the peripheral portion of the ceramic laminate and a portion for pressing the central portion of the ceramic laminate may be provided separately.

[0009]

【Example】

(Embodiment 1) Embodiment 1 corresponds to the first invention. FIG. 1 is a cross-sectional view illustrating an example of a method for crimping a ceramic laminate according to the first invention. Hereinafter, an example in which the present invention is applied to a multilayer capacitor will be described in detail.

As a dielectric ceramic, the relative dielectric constant is 30.
A BaTiO3-CoO-Nb2O5 system of No. 00 was used. Based on 100 parts by weight of the dielectric ceramic powder, 5.5 parts by weight of polyvinyl butyral resin as a binder, 3.0 parts by weight of benzyl butyl phthalate as a plasticizer, and 55 parts of butyl acetate as a solvent.
A weight part was added and mixed with a zirconia ball having a diameter of 10 mm for 48 hours to obtain a slurry. The slurry was formed into a green sheet having a thickness of 20 μm by a doctor blade method. A conductor pattern was printed on the green sheet cut into a square of 100 mm, and 50 sheets were overlapped and temporarily pressed at 100 kg / cm2. The dimensions of the ceramic laminate thus obtained were measured. As shown in FIG. 1, the ceramic laminate 4 was mounted on a uniaxial pressing press 8 with an upper mold 5 and a lower mold 6 sandwiched therebetween. At least one of the upper mold 5 and the lower mold 6 is provided with a projecting portion 7 as shown in the figure, and the sum of the projecting amount a of the upper mold and the projecting amount b of the lower mold becomes various values. I did it. The pressing pressure was 500 kg / cm2. Thereafter, the dimensions of the ceramic laminate were measured, and the spread due to pressure bonding was determined. The results are shown in (Table 1). The total amount of protrusion of the mold was shown as a ratio to the thickness of the ceramic laminate after pressure bonding.

[0011]

[Table 1]

From Table 1, it has been clarified that, according to the present invention, the spread of the laminate sheet due to the pressure bonding can be suppressed as compared with the conventional method in which the pressing is performed by using a mold having no protrusion. 0.5% protrusion of the mold relative to the thickness of the laminate after crimping
When it was smaller, the effect of suppressing growth was small. Also, 30
When it was larger than%, the sheets did not crimp together. Therefore,
Excluded from the claims.

(Embodiment 2) Embodiment 2 corresponds to the second invention. FIG. 2 is a cross-sectional view showing an example of the method for crimping a ceramic laminate according to the second invention. Hereinafter, an example in which the present invention is applied to a multilayer filter will be described in detail.

As a dielectric ceramic, the relative dielectric constant is 43
Bi2O3-Nb2O5 system was used. Powders of dielectric ceramics1
With respect to 00 parts by weight, 5.0 parts by weight of polyvinyl butyral resin as a binder, 2.4 parts by weight of benzyl butyl phthalate as a plasticizer, and 55 parts by weight of butyl acetate as a solvent were added, and mixed with a zirconia ball having a diameter of 10 mm for 48 hours. I got The slurry was formed into a green sheet having a thickness of 50 μm by a doctor blade method. As shown in FIG. 2, an adhesive sheet 15 was adhered to both sides of a metal plate 14, and the green sheet cut into a 100 mm square was laminated thereon. Conductive patterns were printed at necessary positions, and lamination was repeated. A total of 42 green sheets were laminated and temporarily pressed at 100 kg / cm2. The dimensions of the ceramic laminate 9 thus obtained were measured. The ceramic laminate bonded to the metal plate was placed on the lower mold 11, the upper mold 10 was placed thereon, and mounted on the uniaxial pressing machine 12. The upper mold 10 is provided with a protrusion 13 as shown in the figure, and the protrusion amount of the mold has various values. The pressing pressure was 500 kg / cm2. Thereafter, the dimensions of the ceramic laminate were measured, and the spread due to pressure bonding was determined. The results are shown in (Table 2). The amount of protrusion of the mold was shown as a ratio to the thickness of the ceramic laminate after pressure bonding.

[0015]

[Table 2]

From Table 2, it has been clarified that, according to the present invention, the spread of the laminate sheet due to the pressure bonding can be suppressed as compared with the conventional method in which the pressing is performed by using a mold having no protrusion. 0.5% protrusion of the mold relative to the thickness of the laminate after crimping
When it was smaller, the effect of suppressing growth was small. Also, 30
When it was larger than%, the sheets did not crimp together. Therefore,
Excluded from the claims.

[0017]

As described above, in the step of press-bonding the ceramic laminate using the mold, the portion of the mold that presses the peripheral portion of the ceramic laminate is added to the center of the ceramic laminate. By protruding from the portion to be pressed, it is possible to suppress the growth of the laminated body due to the pressure bonding step, and it is possible to suppress the decrease in the yield that occurs when the size of the laminated component is reduced.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an example of a pressure bonding step of a ceramic laminate according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view showing another example of the crimping step of the ceramic laminate.

FIG. 3 is a cross-sectional view showing an example of a conventional ceramic laminate pressing step.

[Explanation of symbols]

 1,4,9 Ceramic laminate 2 Mold 3,8,12 Uniaxial pressing press machine 5,10 Upper mold 6,11 Lower mold 7,13 Mold protrusion 14 Metal plate 15 Adhesive sheet

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Yoshihiro Okawa Tanabe-cho, Tsuzuki-gun, Kyoto 55--12 Osumi-koza, Hamamatsu Matsushita Nitto Denki Co., Ltd.

Claims (2)

[Claims] In a step of pressing a ceramic laminate in which a predetermined number of ceramic green sheets are stacked between an upper mold and a lower mold, the periphery of the ceramic laminate in at least one of the upper mold and the lower mold. The portion that presses the portion is more protruding than the portion that presses the center of the ceramic laminate, and the sum of the protrusion amounts of the upper mold and the lower mold is 0.5 to 0.5 with respect to the thickness of the ceramic laminate after crimping. 30
%, The method for manufacturing a ceramic laminated electronic component. 2. A step of attaching an adhesive sheet on both sides to a metal plate, placing a mold on a ceramic laminate in which a predetermined number of ceramic green sheets are stacked thereon, and pressing the mold on the laminate, and pressing the mold. Wherein the portion for pressing the peripheral portion of the ceramic laminated body in (c) protrudes from the portion for pressing the central portion of the ceramic laminated body by 0.5 to 30% with respect to the thickness of the ceramic laminated body after pressure bonding. Manufacturing method of laminated electronic components.