JPH05175072A - Manufacture of laminated ceramic capacitor - Google Patents

Manufacture of laminated ceramic capacitor

Info

Publication number
JPH05175072A
JPH05175072A JP33812491A JP33812491A JPH05175072A JP H05175072 A JPH05175072 A JP H05175072A JP 33812491 A JP33812491 A JP 33812491A JP 33812491 A JP33812491 A JP 33812491A JP H05175072 A JPH05175072 A JP H05175072A
Authority
JP
Japan
Prior art keywords
ceramic
pressure
laminated body
pressed
internal electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP33812491A
Other languages
Japanese (ja)
Other versions
JP2993247B2 (en
Inventor
Hiroaki Matsuyama
広明 松山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP3338124A priority Critical patent/JP2993247B2/en
Publication of JPH05175072A publication Critical patent/JPH05175072A/en
Application granted granted Critical
Publication of JP2993247B2 publication Critical patent/JP2993247B2/en
Anticipated expiration legal-status Critical
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  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

PURPOSE:To unite a plurality of internal electrodes and ceramic green sheets per plane by a method wherein, when a laminated body composed of the plurality of internal electrodes and ceramic green sheets is pressurized, the laminated body is pressurized without stretching the laminated body in the manufacturing method of a laminated ceramic capacitor which is used for various electronic apparatuses. CONSTITUTION:When a ceramic laminated body is compression-bonded, its peripheral part 12 where an internal electrode does not exist is pressurized and, after that, its central part 13 where the internal electrode exists is pressurized. In addition, a metal mold used for a pressurization operation is formed as a recessed-face metal mold 16 wherein its peripheral part 16a is high and its central part 16b is a low recessed face.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は各種電子機器に使用され
る電子部品の一種である積層セラミックコンデンサの製
造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a monolithic ceramic capacitor which is a kind of electronic component used in various electronic devices.

【0002】[0002]

【従来の技術】近年、電子機器の軽薄短小化に伴い、電
子部品のチップ化が進み、積層セラミックコンデンサの
需要も高まりつつある。
2. Description of the Related Art In recent years, as electronic devices have become lighter, thinner, shorter and smaller, electronic parts have been made into chips, and the demand for monolithic ceramic capacitors is also increasing.

【0003】以下に、一般的な積層セラミックコンデン
サの構成について説明する。図4は、積層セラミックコ
ンデンサの一部を断面にして示す斜視図である。図4に
おいて、1はセラミック誘電体層、2は内部電極で、こ
の内部電極2と前記セラミック誘電体層1とは、セラミ
ック誘電体層1を介して内部電極2が対向するように交
互に積層されている。3は端子電極で、前記内部電極2
は、各々端子電極3に接続されている。
The structure of a general monolithic ceramic capacitor will be described below. FIG. 4 is a perspective view showing a part of the monolithic ceramic capacitor in section. In FIG. 4, reference numeral 1 is a ceramic dielectric layer, 2 is an internal electrode, and the internal electrode 2 and the ceramic dielectric layer 1 are alternately laminated so that the internal electrodes 2 face each other with the ceramic dielectric layer 1 in between. Has been done. 3 is a terminal electrode, which is the internal electrode 2
Are respectively connected to the terminal electrodes 3.

【0004】以下に、従来の積層セラミックコンデンサ
の製造方法について説明する。まず、チタン酸バリウム
系の混合原料に、有機バインダ、可塑剤、溶剤等からな
るスラリーを用いてドクターブレード法等の成形工法に
より、厚さ30〜100μmのセラミックグリーンシー
トを作製する。
A conventional method for manufacturing a monolithic ceramic capacitor will be described below. First, a ceramic green sheet having a thickness of 30 to 100 μm is produced by a molding method such as a doctor blade method using a slurry containing an organic binder, a plasticizer, a solvent, and the like as a barium titanate-based mixed raw material.

【0005】次に、図5に示すように、このセラミック
グリーンシート4上にパラジウム、白金等の貴金属を主
成分とした電極ペーストを用いてスクリーン印刷等によ
り、千鳥格子状に短冊状の内部電極2を形成する。ここ
で、図5において、5は内部電極2が存在しない周辺部
分、6は内部電極2が存在する中央部分である。
Next, as shown in FIG. 5, screen-printing or the like is performed on the ceramic green sheet 4 by using an electrode paste containing a noble metal such as palladium or platinum as a main component to form a checkered checkered strip inside. The electrode 2 is formed. Here, in FIG. 5, 5 is a peripheral portion where the internal electrode 2 is not present, and 6 is a central portion where the internal electrode 2 is present.

【0006】次に、内部電極2を形成したセラミックグ
リーンシート4を、内部電極2がセラミック誘電体層1
を挟んで交互に対向するように、所望の積層数まで積層
を繰り返し、セラミック積層体を形成する。
Next, the ceramic green sheet 4 on which the internal electrodes 2 are formed has the internal electrodes 2 formed on the ceramic dielectric layer 1.
Lamination is repeated up to a desired number of laminations so as to alternately face each other with sandwiching therebetween to form a ceramic laminated body.

【0007】次に、図6に示すように、内部電極2が存
在しない周辺部分5と、内部電極2が存在する中央部分
6とを区別することなくセラミック積層体の全体に渡っ
て金型7により一度に積層方向に所定の圧力で加圧して
圧着する。
Next, as shown in FIG. 6, the mold 7 is provided over the entire ceramic laminated body without distinguishing between the peripheral portion 5 where the internal electrode 2 does not exist and the central portion 6 where the internal electrode 2 exists. With this, pressure is applied at a predetermined pressure in the stacking direction at one time to perform pressure bonding.

【0008】次に、この圧着されたセラミック積層体
を、相対する端面部に交互に内部電極2が露出した個片
状の積層セラミックコンデンサ素子となるように、所定
の寸法に切断する。
Next, the pressure-bonded ceramic laminated body is cut into a predetermined size so as to form individual monolithic ceramic capacitor elements in which the internal electrodes 2 are alternately exposed at opposite end faces.

【0009】最後に、個片状の積層セラミックコンデン
サ素子を1200〜1400℃の温度で焼成し、両端部
に端子電極3を付与して積層セラミックコンデンサを製
造していた。
Finally, individual monolithic ceramic capacitor elements were fired at a temperature of 1200 to 1400 ° C., and terminal electrodes 3 were attached to both ends to produce a monolithic ceramic capacitor.

【0010】[0010]

【発明が解決しようとする課題】しかしながら、前記従
来の製造方法では、セラミック積層体を所定の圧力で加
圧して圧着する際、セラミック積層体の全体に渡って金
型により一度に積層方向に所定の圧力で加圧して圧着す
るため、加圧・圧着されたセラミック積層体は、各々の
端面方向に伸びが生じ、個片状に切断する際、積層セラ
ミックコンデンサ素子の寸法ばらつきが大となるため、
所定の寸法に切断すると、切断位置ずれが生じるという
課題を有していた。
However, in the above-mentioned conventional manufacturing method, when the ceramic laminate is pressed under a predetermined pressure to be pressure-bonded, the entire ceramic laminate is predetermined in the stacking direction at once by the die. Since the pressure is applied with pressure and pressure bonding is applied, the pressure-bonded ceramic laminated body expands in the direction of each end face, and when cut into individual pieces, the dimensional variation of the laminated ceramic capacitor element becomes large. ,
There is a problem in that the cutting position shifts when cutting to a predetermined size.

【0011】本発明は、前記従来の課題を解決するもの
で、セラミック積層体に伸びが生じることなく加圧・圧
着可能で、切断歩留が向上し寸法精度の優れた積層セラ
ミックコンデンサを得ることを目的とする。
The present invention solves the above-mentioned problems of the prior art, and provides a monolithic ceramic capacitor which can be pressed and crimped without expansion of the ceramic laminate, has improved cutting yield and is excellent in dimensional accuracy. With the goal.

【0012】[0012]

【課題を解決するための手段】この目的を達成するため
に本発明の積層セラミックコンデンサの製造方法は、ま
ず内部電極の存在しない周辺部分を加圧した後、内部電
極の存在する中央部分を加圧するものである。
In order to achieve this object, a method for manufacturing a monolithic ceramic capacitor according to the present invention comprises first pressing a peripheral portion where internal electrodes are not present and then applying a central portion where internal electrodes are present. It is something to press.

【0013】また、圧着する際、セラミック積層体を加
圧するための金型を、周辺部が高く、中央部が低い凹面
とした凹面金型にてセラミック積層体を加圧するもので
ある。
Further, when pressure-bonding, the die for pressing the ceramic laminated body is a concave die having a concave surface having a high peripheral portion and a low central portion to press the ceramic laminated body.

【0014】[0014]

【作用】本発明の積層セラミックコンデンサの製造方法
によれば、内部電極とセラミックグリーンシートとの積
層体の内部電極の存在しない周辺部分を先に加圧するこ
とにより、その部分は圧着固定され、次に内部電極の存
在する中央部分を加圧した時前記周辺部分が側面方向へ
ののびを抑える枠として作用するため、前記中央部分は
側面方向にのびが生じることなく加圧圧着することが可
能となる。
According to the method of manufacturing a laminated ceramic capacitor of the present invention, the peripheral portion of the laminated body of the internal electrode and the ceramic green sheet where the internal electrode does not exist is first pressed, so that the portion is pressure-bonded and fixed. When the central portion where the internal electrode is present is pressed, the peripheral portion acts as a frame for suppressing the lateral extension, so that the central portion can be pressure-bonded without the lateral extension. Become.

【0015】また、内部電極とセラミックグリーンシー
トとの積層体を加圧一体化するための金型を、周辺部が
高く中央部が低い凹面とした凹面金型を用いることによ
り、前記金型の周辺部で前記内部電極とセラミックグリ
ーンシートとの積層体の内部電極の存在しない周辺部分
を加圧し、中央部で前記内部電極とセラミックグリーン
シートとの積層体の内部電極の存在する中央部分を加圧
しているため、内部電極の存在しない周辺部分は内部電
極の存在する中央部分に比べ強固に圧着固定され、前記
周辺部分は前記中央部分の側面方向へののびを抑える枠
として作用する。さらに、前記中央部分は金型によって
も側面方向へののびを抑えられていることから、前記中
央部分には側面方向へののびが生じることなく加圧圧着
することが可能となる。
Further, by using a concave mold having a concave surface having a high peripheral portion and a low central portion, the mold for pressurizing and integrating the laminated body of the internal electrodes and the ceramic green sheet is used. The peripheral portion of the laminated body of the internal electrode and the ceramic green sheet presses the peripheral portion where the internal electrode does not exist, and the central portion adds the central portion of the laminated body of the internal electrode and the ceramic green sheet where the internal electrode exists. Since the pressure is applied, the peripheral portion where the internal electrode is not present is more firmly pressure-bonded and fixed than the central portion where the internal electrode is present, and the peripheral portion acts as a frame for suppressing the lateral extension of the central portion. Further, since the central portion is prevented from extending in the lateral direction even by the mold, it is possible to perform pressure bonding without causing lateral extension in the central portion.

【0016】[0016]

【実施例】以下、本発明の一実施例について図面を参照
しながら説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

【0017】(実施例1)図1(a),(b)は、本発
明の第1の実施例による製造方法において、セラミック
積層体を加圧圧着する際の製造工程図である。図1
(a),(b)において、11は内部電極を形成したセ
ラミックグリーンシートを内部電極がセラミック誘電体
層を挟んで交互に対向するように順次積層して作製した
セラミック積層体、12は内部電極が存在しない周辺部
分、13は内部電極が存在する中央部分、14,15は
それぞれセラミック積層体11の周辺部分12及び中央
部分13を加圧するための周辺部金型及び中央部金型で
ある。
(Embodiment 1) FIGS. 1 (a) and 1 (b) are manufacturing process diagrams for press-bonding a ceramic laminate in a manufacturing method according to a first embodiment of the present invention. Figure 1
In (a) and (b), 11 is a ceramic laminate formed by sequentially laminating ceramic green sheets having internal electrodes so that the internal electrodes are alternately opposed to each other with a ceramic dielectric layer interposed therebetween, and 12 is an internal electrode. Is a peripheral portion where 13 is not present, 13 is a central portion where internal electrodes are present, and 14 and 15 are a peripheral die and a central die for pressing the peripheral portion 12 and the central portion 13 of the ceramic laminate 11, respectively.

【0018】以下に、本発明における積層セラミックコ
ンデンサの製造方法について図1を用いて説明する。こ
こで、従来技術と同様な工程については、詳しい説明を
省略する。
The method of manufacturing the monolithic ceramic capacitor according to the present invention will be described below with reference to FIG. Here, detailed description of steps similar to those of the conventional technique will be omitted.

【0019】まず、チタン酸バリウム系の混合原料に、
有機バインダ、可塑剤、溶剤等からなるスラリーを用い
てドクターブレード法等の成形工法により、厚さ50μ
mのセラミックグリーンシートを作製し、1辺が200
mmの正方形に裁断する。
First, a barium titanate-based mixed raw material is added.
Using a slurry consisting of an organic binder, plasticizer, solvent, etc., a thickness of 50μ can be obtained by a molding method such as a doctor blade method.
A ceramic green sheet of m is produced, and one side is 200
Cut into mm squares.

【0020】次に、図5に示すようにこのセラミックグ
リーンシート4上の中央部分6にパラジウム、白金等の
貴金属を主成分とした電極ペーストを用いてスクリーン
印刷等により内部電極2を形成する。この時、セラミッ
クグリーンシート4には、端から10mmの幅で内部電極
2が存在しない周辺部分5が設けられる。
Next, as shown in FIG. 5, an internal electrode 2 is formed on the central portion 6 of the ceramic green sheet 4 by screen printing or the like using an electrode paste containing a noble metal such as palladium or platinum as a main component. At this time, the ceramic green sheet 4 is provided with a peripheral portion 5 having a width of 10 mm from the end and having no internal electrode 2.

【0021】次に、内部電極を形成したセラミックグリ
ーンシートを内部電極がセラミック誘電体層を挟んで交
互に対向するように順次積層し、セラミック積層体11
を形成する。
Next, the ceramic green sheets having the internal electrodes are sequentially laminated so that the internal electrodes are alternately opposed to each other with the ceramic dielectric layer sandwiched therebetween, and the ceramic laminated body 11 is formed.
To form.

【0022】次に、図1(a)に示すように、セラミッ
ク積層体11の内部電極が存在しない周辺部分12を、
積層方向より周辺部金型14により加圧する。その後、
図1(b)に示すように、内部電極が存在する中央部分
13を、中央部金型15により加圧する。
Next, as shown in FIG. 1A, the peripheral portion 12 of the ceramic laminate 11 where the internal electrodes are not present is
Pressure is applied by the peripheral mold 14 from the stacking direction. afterwards,
As shown in FIG. 1B, the central portion 13 where the internal electrodes are present is pressed by the central die 15.

【0023】このようにしてセラミック積層体11を加
圧・圧着した後は、従来と同様に、個片状の素子に切断
し、端子電極を形成して積層セラミックコンデンサとす
る。
After the ceramic laminated body 11 is pressed and pressure-bonded in this manner, it is cut into individual elements and terminal electrodes are formed in the same manner as in the prior art to form a laminated ceramic capacitor.

【0024】(実施例2)図2(a),(b)に本発明
の第2の実施例を示しており、図2において、図1に示
す部分と同一の部分については同一番号を付し、製造方
法においても同一の工程については説明を省略する。
(Embodiment 2) FIGS. 2 (a) and 2 (b) show a second embodiment of the present invention. In FIG. 2, the same parts as those shown in FIG. However, the description of the same steps in the manufacturing method is omitted.

【0025】本実施例の製造方法は、まず、内部電極が
存在しない周辺部分12を周辺部金型14で加圧した
後、内部電極が存在する中央部分13を中央部金型15
で加圧する際に、図2(b)に示すように、内部電極が
存在しない周辺部分12を周辺部金型14により加圧し
ながら、内部電極が存在する中央部分13を中央部金型
15により加圧するものである。
In the manufacturing method of this embodiment, first, the peripheral portion 12 where the internal electrodes are not present is pressed by the peripheral die 14, and then the central portion 13 where the internal electrodes are present is applied to the central die 15.
2B, while pressing the peripheral portion 12 where the internal electrode does not exist by the peripheral die 14, the central portion 13 where the internal electrode exists is pressed by the central die 15 as shown in FIG. 2B. It is to pressurize.

【0026】ここで、図6に示すように、セラミック積
層体の全体に亘って金型7により一度に積層方向に所定
の圧力で加圧・圧着された従来のものと、実施例1,2
による本発明品について、セラミック積層体の伸び幅と
加圧条件を(表1)に比較して示している。この(表
1)において、セラミック積層体の伸び幅は、図5に示
すa,b,c,d,e,fの寸法を加圧前後で測定し、
その差を示したものである。また、試料1は従来例によ
り作成したものであり、試料2,試料5はそれぞれ実施
例1,実施例2により作成したものである。また、試料
3,4は実施例1と同様の方法で加圧圧力を変えたもの
であり、試料6,7は実施例2と同様の方法で加圧圧力
を変えたものである。
Here, as shown in FIG. 6, a conventional one and a conventional one in which the whole ceramic laminated body is pressed and pressure-bonded at a predetermined pressure in the laminating direction at a time by the mold 7,
Regarding the product of the present invention according to (1), the elongation width of the ceramic laminate and the pressurizing condition are shown in comparison with (Table 1). In this (Table 1), the elongation width of the ceramic laminate was measured by measuring the dimensions of a, b, c, d, e, and f shown in FIG.
The difference is shown. In addition, Sample 1 is prepared by the conventional example, and Samples 2 and 5 are prepared by Examples 1 and 2, respectively. In addition, Samples 3 and 4 are the same as in Example 1 except that the pressure applied is changed, and Samples 6 and 7 are similar to those in Example 2 where the pressure applied is different.

【0027】[0027]

【表1】 [Table 1]

【0028】この(表1)から明らかなように、本発明
にかかる試料2,3,5,6は内部電極とセラミックグ
リーンシートとの積層体の加圧前後の伸び幅が非常に小
さくなっている。
As is clear from this (Table 1), in Samples 2, 3, 5 and 6 according to the present invention, the extension width before and after the pressing of the laminated body of the internal electrodes and the ceramic green sheet was very small. There is.

【0029】なお、周辺部金型14および中央部金型1
5の加圧圧力は、所望する積層セラミックコンデンサの
特性によって異なる。
The peripheral mold 14 and the central mold 1
The pressurizing pressure of 5 depends on the desired characteristics of the monolithic ceramic capacitor.

【0030】(実施例3)図3に本発明の第3の実施例
を示しており、図3において、図1に示す部分と同一の
部分については同一番号を付し、製造方法においても同
一の工程については説明を省略する。
(Embodiment 3) FIG. 3 shows a third embodiment of the present invention. In FIG. 3, the same parts as those shown in FIG. The description of the step is omitted.

【0031】本実施例では、図3に示すように、周辺部
16aが高く、中央部16bが低い凹面を持つ凹面金型
16を用いて、内部電極の存在しない周辺部分12と内
部電極の存在する中央部分13を区別することなく、積
層方向に所定の圧力で加圧し、圧着するものである。
In this embodiment, as shown in FIG. 3, by using a concave metal mold 16 having a concave surface having a high peripheral portion 16a and a low central portion 16b, the peripheral portion 12 where the internal electrode does not exist and the internal electrode exist. The center portion 13 to be pressed is not distinguished, and is pressed and pressed by a predetermined pressure in the stacking direction.

【0032】ここで、従来の金型と本実施例の凹面金型
16により加圧したセラミック積層体について、加圧前
後の伸び幅と、金型の周辺部と中央部の高低差を調べ
た。この結果を(表2)に示している。
Here, the extension width before and after the pressing and the height difference between the peripheral portion and the central portion of the die were examined for the ceramic laminate pressed by the conventional die and the concave die 16 of this embodiment. .. The results are shown in (Table 2).

【0033】[0033]

【表2】 [Table 2]

【0034】この(表2)より明らかなように、金型の
周辺部と中央部の高低差を設ける凹面金型16を用いる
ことにより、セラミック積層体を圧着した際に伸び幅の
小さい積層セラミックコンデンサを提供できる。また、
凹面金型16の周辺部16aと中央部16bの高低差は
積層体厚みの1/2としたものを用いることにより、よ
り伸び幅の小さい積層セラミックコンデンサを提供でき
る。
As is clear from this (Table 2), the use of the concave mold 16 which provides a height difference between the peripheral portion and the central portion of the mold makes it possible to obtain a monolithic ceramic having a small expansion width when the ceramic laminate is pressure-bonded. Capacitor can be provided. Also,
The height difference between the peripheral portion 16a and the central portion 16b of the concave mold 16 is ½ of the thickness of the laminated body, so that a monolithic ceramic capacitor having a smaller stretch width can be provided.

【0035】[0035]

【発明の効果】以上のように本発明の積層セラミックコ
ンデンサの製造方法によれば、セラミック積層体を加圧
圧着する際、内部電極の存在しない周辺部分を加圧した
後、内部電極の存在する中央部分を加圧することによ
り、また周辺部が高く中央部が低い凹面金型を用いてセ
ラミック積層体を加圧することにより、内部電極とセラ
ミックグリーンシートとの積層体にのびが生じることな
く加圧・圧着でき、これによって切断歩留が向上し、寸
法精度の優れた積層セラミックコンデンサを実現できる
ものである。
As described above, according to the method of manufacturing a monolithic ceramic capacitor of the present invention, when the ceramic laminate is pressure-bonded, the peripheral portions where the internal electrodes are not present are pressurized, and then the internal electrodes are present. By pressing the central part and pressing the ceramic laminated body using a concave mold with a high peripheral part and a low central part, the laminated structure of the internal electrodes and the ceramic green sheet can be pressed without stretching. -It can be crimped, which improves the cutting yield and realizes a monolithic ceramic capacitor with excellent dimensional accuracy.

【図面の簡単な説明】[Brief description of drawings]

【図1】(a),(b)は本発明の第1の実施例による
積層セラミックコンデンサの製造方法において、セラミ
ック積層体の圧着工程を示す断面図
1A and 1B are cross-sectional views showing a pressure bonding step of a ceramic laminated body in a method for manufacturing a laminated ceramic capacitor according to a first embodiment of the present invention.

【図2】(a),(b)は本発明の第2の実施例におい
て、セラミック積層体の圧着工程を示す断面図
2 (a) and 2 (b) are cross-sectional views showing a pressure-bonding step of a ceramic laminate in the second embodiment of the present invention.

【図3】本発明の第3の実施例において、セラミック積
層体の圧着工程を示す断面図
FIG. 3 is a sectional view showing a pressure-bonding process of a ceramic laminate in a third embodiment of the present invention.

【図4】一般的な積層セラミックコンデンサの一部を断
面にして示す斜視図
FIG. 4 is a perspective view showing a part of a general monolithic ceramic capacitor in section.

【図5】同コンデンサにおいて、内部電極を印刷したセ
ラミックグリーンシートを示す概略図
FIG. 5 is a schematic view showing a ceramic green sheet on which internal electrodes are printed in the same capacitor.

【図6】従来例におけるセラミック積層体の圧着工程を
示す断面図
FIG. 6 is a sectional view showing a pressure-bonding process of a ceramic laminate according to a conventional example.

【符号の説明】[Explanation of symbols]

11 セラミック積層体 12 周辺部分 13 中央部分 14 周辺部金型 15 中央部金型 11 Ceramic Laminated Body 12 Peripheral Part 13 Central Part 14 Peripheral Part Mold 15 Central Part Mold

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】セラミックグリーンシートと内部電極を交
互に積層したセラミック積層体を圧着する際に、まず内
部電極の存在しない周辺部分を加圧した後、内部電極の
存在する中央部分を加圧して圧着することを特徴とする
積層セラミックコンデンサの製造方法。
1. When pressure-bonding a ceramic laminated body in which ceramic green sheets and internal electrodes are alternately laminated, first, a peripheral portion where internal electrodes do not exist is pressed, and then a central portion where internal electrodes exist is pressed. A method for manufacturing a monolithic ceramic capacitor, which comprises crimping.
【請求項2】セラミックグリーンシートと内部電極を交
互に積層したセラミック積層体を圧着する際に、まず内
部電極の存在しない周辺部分を加圧し、次に前記周辺部
分を加圧しながら、内部電極の存在する中央部分を加圧
して圧着することを特徴とする積層セラミックコンデン
サの製造方法。
2. When pressure-bonding a ceramic laminated body in which ceramic green sheets and internal electrodes are alternately laminated, first, a peripheral portion where no internal electrode is present is pressed, and then the peripheral portion is pressed, while A method for manufacturing a monolithic ceramic capacitor, characterized in that the existing central portion is pressed and pressure-bonded.
【請求項3】内部電極の存在しない周辺部分は内部電極
の存在する中央部分を加圧する圧力以上の圧力で加圧す
る請求項1または2記載の積層セラミックコンデンサの
製造方法。
3. The method for producing a monolithic ceramic capacitor according to claim 1, wherein the peripheral portion where the internal electrode does not exist is pressed at a pressure higher than the pressure for pressing the central portion where the internal electrode exists.
【請求項4】セラミックグリーンシートと内部電極を交
互に積層したセラミック積層体を圧着する際に、周辺部
が高く中央部が低い凹面とした凹面金型にてセラミック
積層体を加圧して圧着することを特徴とする積層セラミ
ックコンデンサの製造方法。
4. When pressure bonding a ceramic laminate in which ceramic green sheets and internal electrodes are alternately laminated, the ceramic laminate is pressed and pressure-bonded by a concave mold having a concave surface having a high peripheral portion and a low central portion. A method for manufacturing a monolithic ceramic capacitor, comprising:
【請求項5】凹面金型において、金型の周辺部と中央部
の高低差が、セラミック積層体の厚みの1/2以下であ
る請求項4記載の積層セラミックコンデンサの製造方
法。
5. The method for producing a monolithic ceramic capacitor according to claim 4, wherein in the concave die, the height difference between the peripheral portion and the central portion of the die is 1/2 or less of the thickness of the ceramic laminated body.
JP3338124A 1991-12-20 1991-12-20 Manufacturing method of multilayer ceramic capacitor Expired - Fee Related JP2993247B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3338124A JP2993247B2 (en) 1991-12-20 1991-12-20 Manufacturing method of multilayer ceramic capacitor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3338124A JP2993247B2 (en) 1991-12-20 1991-12-20 Manufacturing method of multilayer ceramic capacitor

Publications (2)

Publication Number Publication Date
JPH05175072A true JPH05175072A (en) 1993-07-13
JP2993247B2 JP2993247B2 (en) 1999-12-20

Family

ID=18315142

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3338124A Expired - Fee Related JP2993247B2 (en) 1991-12-20 1991-12-20 Manufacturing method of multilayer ceramic capacitor

Country Status (1)

Country Link
JP (1) JP2993247B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2271314A (en) * 1992-09-29 1994-04-13 Murata Manufacturing Co Manufacturing multilayer components
US5534092A (en) * 1993-08-05 1996-07-09 Murata Manufacturing Co., Ltd. Method of manufacturing multilayer ceramic electronic component
GB2282349B (en) * 1993-08-05 1997-11-05 Murata Manufacturing Co A method of manufacturing a multilayer ceramic electronic component
US7182899B2 (en) 2001-09-19 2007-02-27 Matsushita Electric Industrial Co., Ltd. Manufacturing method of ceramic electronic components and its manufacturing equipment
JP2009246298A (en) * 2008-03-31 2009-10-22 Tdk Corp Method for manufacturing ceramic laminated body, manufacturing apparatus of ceramic laminated body, and method for manufacturing ceramic laminated electronic component

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2271314A (en) * 1992-09-29 1994-04-13 Murata Manufacturing Co Manufacturing multilayer components
JPH06112088A (en) * 1992-09-29 1994-04-22 Murata Mfg Co Ltd Manufacture of layered ceramic electronic part
US5370760A (en) * 1992-09-29 1994-12-06 Murata Manufacturing Co., Ltd. Method of manufacturing multilayer ceramic electronic component
GB2271314B (en) * 1992-09-29 1996-07-03 Murata Manufacturing Co Method of manufacturing multilayer components
JP2976717B2 (en) * 1992-09-29 1999-11-10 株式会社村田製作所 Manufacturing method of multilayer ceramic electronic component
US5534092A (en) * 1993-08-05 1996-07-09 Murata Manufacturing Co., Ltd. Method of manufacturing multilayer ceramic electronic component
GB2282349B (en) * 1993-08-05 1997-11-05 Murata Manufacturing Co A method of manufacturing a multilayer ceramic electronic component
US7182899B2 (en) 2001-09-19 2007-02-27 Matsushita Electric Industrial Co., Ltd. Manufacturing method of ceramic electronic components and its manufacturing equipment
JP2009246298A (en) * 2008-03-31 2009-10-22 Tdk Corp Method for manufacturing ceramic laminated body, manufacturing apparatus of ceramic laminated body, and method for manufacturing ceramic laminated electronic component

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