JPH10209790A - Lead-type piezoelectric component and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To seal a piezoelectric circuit component by providing a cavity that gives a restriction to a vibration section of the piezoelectric circuit component accurately with a simple structure and keeping surely the shape of the cavity. SOLUTION: Lead terminals 11 are connected to a piezoelectric circuit component 1, whose circuit pattern 3 is provided to both sides of a ceramic substrate 2 and extended externally, and a specific part of the circuit pattern 3 is placed in the inside of a cavity 24, so as to restrict a vibration part of the piezoelectric circuit component 1 with the cavity 24. Then a specific part of the circuit pattern 3 is released from the restriction by an opening 21, and the entire piezoelectric circuit component 1, including the other circuit pattern, is coated and fixed by a synthetic resin mold 20. A sealing cover 25 is used to cover the opening 21 to keep the inside of the opening as the cavity 24, so as to restrict the vibration. Then the entire piezoelectric circuit component 1 provided with the synthetic resin mold 20 is contained and sealed in a hollow outer package case 30.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead type piezoelectric component having a so-called energy containment structure, such as a ceramic filter, and a method of manufacturing the same.

[0002]

2. Description of the Related Art In general, a ceramic filter can be used as a lead type piezoelectric component having an energy containment structure. It comprises a piezoelectric circuit element having a predetermined circuit pattern provided on both sides of a piezoelectric ceramic substrate, and a plurality of lead terminals connected to ends of the circuit pattern are attached to the ceramic substrate and led out,
A specific frequency can be extracted by positioning a specific portion of the circuit pattern on both surfaces of the substrate inside the hollow portion (facing the hollow portion) and limiting a predetermined piezoelectric vibrating portion of the piezoelectric circuit element by the hollow portion. It is configured as follows.

In this lead type piezoelectric component, the vibrating portion of the piezoelectric circuit element is precisely limited by aligning the cavity with a specific portion of the circuit pattern and accurately forming the inner portion of the cavity without error. The cavity must also be assembled to ensure shape retention.

Conventionally, in the above-mentioned lead type piezoelectric component, wax to be subsequently extracted is applied to a specific portion of a circuit pattern, and the wax is covered and a hole for extracting wax is provided on the film surface to synthesize the entire element. It is assembled by coating with a resin coating, removing the wax after the coating is cured, providing a cavity inside the coating, and sealing the wax extraction hole with the same synthetic resin as the coating.

[0005] However, in the assembly process of such a lead type piezoelectric component, not only many processing steps are required, but also,
There is a problem with the accuracy of the cavity formed by the synthetic resin film in view of its shape retention.

Japanese Patent Application Laid-Open No. 57-174916 discloses that
A method of inserting a ceramic filter body in which a piezoelectric element is soldered to a lead frame into a synthetic resin frame, further inserting these into a synthetic resin case (cap), and sealing an opening thereof with the synthetic resin frame portion. Is disclosed.

Further, Japanese Utility Model Publication No. 56-17710 discloses a component in which a piezoelectric element is soldered to a lead frame.
There is disclosed a structure in which a case is covered so as to be wrapped by being divided into upper and lower two parts, and sealed by an adhesive so that the case is not peeled off.

[0008]

As described above, the manufacturing method for removing the wax inside the synthetic resin film requires many processing steps. Further, the piezoelectric vibrating portion such as a ceramic filter needs a hollow portion, and the volume of the hollow portion greatly affects the characteristics of the ceramic filter. However, there is a problem in the accuracy of the hollow portion formed by the synthetic resin film.

The above-mentioned Japanese Patent Application Laid-Open No. 57-174916 is also disclosed.
In the case of the case type in which the piezoelectric element body is housed in a case, as in the case of Japanese Patent Application Laid-Open No. 56-17710, synthetic resin for sealing the case opening or the case joint flows into the cavity of the piezoelectric vibrating part. , The characteristics of ceramic filters and the like may be greatly deteriorated. In addition, when a resin having a high resin viscosity is used to prevent the resin from flowing, the flowability is poor, the workability is deteriorated, and there is a problem that the sealing cannot be completely performed. If the sealing is incomplete, the deterioration of characteristics occurs due to the penetration of moisture and the like.

[0010] A first object of the present invention is to solve the above problems,
Provided is a lead-type piezoelectric component that includes a cavity that accurately defines a vibrating portion of a piezoelectric circuit element with a simple structure, and that is configured to securely shape the cavity and seal the piezoelectric circuit element. is there.

A second object of the present invention is to easily form a cavity for precisely defining a vibrating portion of a piezoelectric circuit element,
It is an object of the present invention to provide a method of manufacturing a lead-type piezoelectric component that can be assembled so as to securely hold a cavity portion and seal a piezoelectric circuit element.

Other objects and novel features of the present invention will be clarified in embodiments described later.

[0013]

In order to achieve the above object, a lead-type piezoelectric component according to the present invention comprises a piezoelectric circuit element having a predetermined circuit pattern provided on both sides of a ceramic substrate. In a configuration in which the connected lead terminal is led out and a specific portion of the circuit pattern is positioned inside the cavity, and the vibrating portion of the piezoelectric circuit element is limited by the cavity, the circuit pattern is specified. A synthetic resin mold that covers and fixes the entire piezoelectric circuit element, including other circuit pattern portions, avoiding portions with opening holes,
The vibrating portion is limited by a sealing lid that closes the opening of the opening hole and retains and forms the inside of the opening hole as the cavity, and the entire piezoelectric circuit element provided with the synthetic resin mold is hollow. It is housed and sealed in the outer case.

In the lead-type piezoelectric component, the outer case includes a case body and a case cover part penetrating the lead terminal, wherein the case cover part is fitted into an opening of the case body, and It is preferable that a back mold made of a synthetic resin is provided around the periphery of the mouth and the outer surface of the case lid, and the opening is sealed.

In the method of manufacturing a lead-type piezoelectric component according to the present invention, a lead terminal is connected to a piezoelectric circuit element provided on both sides of a ceramic substrate to lead out a predetermined circuit pattern, and the circuit pattern is specified. In the case where a portion is located inside a hollow portion and the vibrating portion of the piezoelectric circuit element is limited by the hollow portion, the piezoelectric circuit including another circuit pattern portion avoiding a specific portion of the circuit pattern by an opening hole portion A synthetic resin mold for covering and fixing the whole element is formed by injection molding, the opening of the opening hole is closed with a sealing lid, and the inside of the opening hole is formed as the cavity, and the synthetic resin mold is provided. The entire piezoelectric circuit element is housed inside the opening of the case body, and a case lid portion through which the lead terminal is inserted is fitted into the opening of the case body. The case body and the case lid constitute a hollow exterior case, and furthermore, a synthetic resin back mold is provided around the periphery of the opening of the body case or the outer surface of the case lid to seal the case. Features.

In the method of manufacturing a lead-type piezoelectric component, the case lid may be formed by heat-welding a pair of thermoplastic resin film lid plates divided by a dividing line passing through the lead terminal penetrating portion. It is good also as an integrated configuration.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a lead type piezoelectric component and a method of manufacturing the same according to the present invention will be described below with reference to the drawings.

An embodiment of a lead type piezoelectric component and a method of manufacturing the same according to the present invention will be described with reference to FIGS. Here, FIGS. 1 and 2 show a lead type piezoelectric component in a completed state, and FIGS. 3 to 13 show a manufacturing process of the lead type piezoelectric component. The illustrated lead type piezoelectric component is configured as a ceramic filter.

As shown in FIGS. 1 and 2, the lead type piezoelectric component in a completed state includes a piezoelectric circuit element 1 in which a predetermined circuit pattern 3 is provided on both sides of a piezoelectric ceramic substrate 2. And a plurality of parallel and straight lead terminals 11 connected to the piezoelectric circuit element 1 (i.e., the piezoelectric circuit element 1).
A synthetic resin mold 20 that covers and fixes the entire piezoelectric circuit element including other circuit pattern portions while avoiding the specific portion including the vibrating portion) by the opening hole portion 21; The vibrating portion is limited by a sealing lid 25 which keeps the inside of the hole portion as a hollow portion 24, and the entire piezoelectric circuit element provided with the synthetic resin mold 20 is housed in a hollow box-shaped outer case 30. It is a sealed structure.

The outer case 30 includes a case body 31 made of an insulating synthetic resin and a case lid 32 for closing an opening of the case body 31 with a plurality of lead terminals 11 penetrating therethrough.
Consists of Then, the case lid 32 is fitted into the opening of the case main body 31, and a synthetic resin back mold 35 is applied and provided around the periphery of the opening and the outer surface of the case lid 32. The opening is hermetically sealed including the lead-out portion of the lead terminal 11.

An adhesive 36 is applied to the inner bottom surface of the case body 31 in advance, and when the ceramic substrate 2 of the piezoelectric circuit element 1 is stored in the case body 31, the ceramic substrate 2 is bonded and fixed. Like that.

Next, details of the method of manufacturing and the structure of the piezoelectric component shown in FIGS. 1 and 2 will be sequentially described with reference to FIGS.

When the piezoelectric component is a ceramic filter,
Usually, it consists of a composite component of a coupling capacitor and a piezoelectric element,
As shown in FIG. 3, the composite component has a predetermined circuit pattern 3 (3a, 3a,
(Combination of four patterns 3b, 3c, 3d) is obtained as a piezoelectric circuit element 1 formed on the front and back plate surfaces of a piezoelectric ceramic substrate 2 by printing or the like. In the piezoelectric circuit element 1, a plurality of lead terminals 11
a, 3b, 3c, and are provided by soldering and fixing to the ceramic substrate 2.

In order to manufacture a piezoelectric component using the piezoelectric circuit element 1, as shown in FIGS. 3 to 6, FIGS. 8 to 10, 12 and 13, a predetermined number of lead terminals 11 are used.
(In the present embodiment, three for one piezoelectric circuit element)
Can be used as a set, and a lead frame 10 formed by punching a conductive metal strip at regular intervals in the longitudinal direction of the plate surface of the piezoelectric circuit element 1 can be used. This lead frame 10
Are the circuit patterns 3a, 3b, 3c as shown in FIG.
And the respective lead terminals 11 are connected and fixed by soldering, and can be applied as a conveying means for feeding the piezoelectric circuit elements 1 at a pitch in a later process. In the lead frame 10, set holes 12 for pitch feed and positioning are formed at regular intervals.

First, as shown in FIG. 3, the lead frame 10 on which the piezoelectric circuit element 1 is mounted is fed by pitch so that the piezoelectric circuit element 1 is fed into a synthetic resin mold 20 forming step as shown in FIG. Here, a synthetic resin mold 20 for covering and fixing the entire piezoelectric circuit element including the soldering portion of each lead terminal 11 is formed by injection molding using an insulating synthetic resin such as epoxy. The synthetic resin mold 20 is simultaneously formed with an opening 21 exposing a specific portion of the circuit pattern 3 (that is, a specific portion including the vibrating portion of the piezoelectric circuit element 1). For example, when the circuit pattern of the ceramic filter has two elements, the opening holes 21 are provided on the front side and the back side of the ceramic substrate 2 at symmetrical positions. That is, the opening hole 21
Are formed at the same position on both sides of the synthetic resin mold 20 in correspondence with specific portions of the circuit pattern with the ceramic substrate 2 interposed therebetween.

The injection molding can be performed at an accurate position by positioning the lead frame 10 on the mold surface of the injection molding die with the plurality of set holes 12.

Since each of the opening holes 21 is formed by injection molding, and the lead frame 10 is positioned on the mold surface of the injection molding and is molded simultaneously with the resin mold 20, the opening holes 21 are precisely aligned with a specific portion of the circuit pattern 3. It can be formed with high precision. An elliptical step 22 surrounds two opening holes 21 on the upper and lower sides of the synthetic resin mold 20 respectively.
0 are formed on the upper surface and the lower surface, respectively. Step 2
Numeral 2 has a step surface 23 which is one step lower than the periphery, and is formed for fitting and fixing (locking and fixing) a sealing lid described later.

After the synthetic resin mold 20 is injection molded, opening holes 21 formed on the upper and lower surfaces thereof are formed.
The oval sealing lids 25 shown in FIG. 5 are fitted into and fixed to the step portions 22 on the upper and lower surfaces, respectively, so as to close and seal. At this time, it is desirable that the sealing lid 25 be temporarily fixed to the synthetic resin mold 20 by spotting with an epoxy-based adhesive. It is desirable that the sealing lid 25 is also a synthetic resin molded product of the same material as the synthetic resin mold 20.

As a result, as shown in FIG.
Closes the opening holes 21 on both sides of the synthetic resin mold 20 by fitting and fitting the steps 22 respectively. By the fitting (fitting) of the sealing lid 25, the sealing lid 25 can be stably mounted on the synthetic resin mold 20, and as shown in FIG. 7, a predetermined space facing a specific portion including the vibrating portion of the piezoelectric circuit element 1. Of the ceramic substrate 2 can be securely formed on both sides of the ceramic substrate 2.

In the synthetic resin molding step of the piezoelectric circuit element 1, as shown in FIG.
4 is formed on the basis of the opening hole portion 21 which is easily formed in shape. Also, since each cavity 24 is formed by covering the opening hole 21 with the sealing lid 25, the cavity 24 is formed so as to accurately limit the vibrating portion of the piezoelectric circuit element 1 with a simple structure. can do.

In the piezoelectric circuit element 1 provided with the synthetic resin mold 20, in a later step, the entire element except for a lead-out portion to the outside of each lead terminal 11 is formed of a case body 31 and a case lid 3.
2, and before the housing and sealing step, the case lid 32 is closed as shown in FIG.
A pair of cover plates 33 and 34 made of a thermoplastic resin film or the like divided in a dividing line X (parallel to the arrangement direction of the lead terminals 11) passing through the penetrating portion of each lead terminal 11 sandwiches the lead terminal 11. In combination as follows. In other words, a plurality of cutouts 33 are formed on the relative sides of the lid plates 33 and 34 so as to become a plurality of through holes through which the parallel and straight portions of the lead terminals 11 can be inserted when they are combined.
a, 34a are respectively formed, and the respective lid plates 33, 3
Reference numeral 4 denotes a state in which the relative sides are brought into contact with each other in a state where each lead terminal 11 is inserted into the through hole formed by the cutouts 33a and 34a, and is welded by a welder welding bar W as shown in FIG. Thus, the case lid 32 is formed.

The welding of the lid plates 33 and 34 is performed at a position away from the connecting position of the lead terminal 11 to the piezoelectric circuit element 1 for the convenience of the operation or to prevent the piezoelectric circuit element 1 from being thermally damaged. Good. After the welding process, FIG.
As shown by, the lead circuit may be positioned by lowering it to a predetermined position of the lead terminal straight portion near the connection position of the piezoelectric circuit element 1.

The reason why the lid plates 33 and 34 thus divided are combined into the case lid portion 32 is that the lead terminals 11 cannot be inserted directly into the case lid portion 32 when the lead frame 10 is not separated. Because.

As described above, the outer case 30 has a hollow box-shaped case body 31 having a volume capable of accommodating the piezoelectric circuit element 1 and having an opening for inserting the element as shown in FIG.
And a case lid 3 for closing an opening of the case body 31.
Consists of two. The case body 31 may be formed of an insulating epoxy resin or the like. In addition, the case cover 32 (that is, cover plates 33 and 34)
For example, a polyethylene terephthalate film or the like can be used as a thermoplastic resin having heat resistance and heat welding.

Next, the entire structure having the synthetic resin mold 20 and the sealing lid 25 provided on the piezoelectric circuit element 1 and further having the case lid 32 attached thereto is housed inside the case main body 31, and the case main body 31 is Assembly processing is performed on the circuit element 1. As shown in FIG. 11, the adhesive 36 is applied in advance to the inner bottom surface of the case main body 31 with the dispenser D1,
As the structure including the piezoelectric circuit element 1 is accommodated in the case main body 31, the case main body 31 is bonded and fixed to the ceramic substrate 2 as shown in the completed state of FIG. In addition, when the case body 31 is assembled, the case cover 32 is fitted into the opening of the case body 31, so that the entire structure including the piezoelectric circuit element 1 is moved to the outer case 30.
Can be housed inside.

Thereafter, as shown in FIG. 12, using a dispenser D2, an insulating synthetic resin P is formed as a back mold (back coating) 35 from the periphery of the opening of the case body 31 to the outer surface of the case cover 32. Apply. With this back mold 35, the outer case 3
0 can be hermetically sealed. As the synthetic resin used for the back mold 35, for example, a curable resin having a good flowability and a low viscosity (1,200 to 2,100 centipoise / 25 ° C.) can be used.

Then, as shown in FIG. 13, the back mold 35 applied to the case lid 32 is cured by a heater H, and each step of exterior inspection, separation and cutting of each lead terminal 11 from the lead frame 10, and characteristic inspection is performed. (See FIGS. 1 and 2).

According to this embodiment, the following effects can be obtained.

(1) According to the lead-type piezoelectric component according to this embodiment, the cavity 24 is formed as shown in FIGS.
Each of the opening holes 21 is formed on the basis of the opening holes 21 shown in FIG.
Is covered with the sealing lid 25 to secure the cavity 24, so that the vibrating portion including the pattern of the piezoelectric circuit element 1 can be accurately limited by the cavity 24 on both sides of the substrate 2. Further, it is possible to assemble so as to keep the internal space between each sealing lid 25 and the side surface of the case main body 31. Further, as shown in FIG. 1, the piezoelectric circuit element 1 is fixed to the case body 31 with the adhesive 36, so that there is no play.

(2) In addition to covering and fixing the entire piezoelectric circuit element 1 with the resin mold 20 except for a part led out of the lead terminal 11 serving as an external terminal, the piezoelectric circuit element 1 and the composite Since the structure including the resin mold 20 and the sealing lid 25 is housed and sealed in the outer case 30, the whole component can be configured with a simple structure as a package type component in which the piezoelectric circuit element is hermetically sealed.

(3) The outer case 30 is composed of a case body 31 and a case cover 32 for closing the opening of the case body 31. The case body 31 and the case cover 32 are adhered and fixed with a back mold 35. Internal piezoelectric circuit element 1
Can be hermetically sealed. Further, in order to prevent the synthetic resin constituting the back mold 35 from flowing into the case main body 31 (particularly, a portion that becomes a cavity), the case lid portion 32 can use a low-viscosity resin having good fluidity as the back mold resin. Therefore, it is possible to improve the efficiency of the sealing operation and prevent the characteristic deterioration due to the inflow of the resin.

(4) According to the method for manufacturing a lead-type piezoelectric component according to this embodiment, the same assembling means as in the conventional example in which the piezoelectric circuit element 1 is mounted on the lead frame 10 and pitch-fed is applied. It is only necessary to add an injection molding step, an assembling step of the sealing lid 25, and an assembling step of the outer case 30 during the steps, so that the steps can be extremely simplified. Further, since the resin mold 20 including the opening 21 is injection-molded, the cavity 24 based on the opening 21 can be accurately formed. Can be reliably housed and sealed in the interior of the device.

(5) The outer case 30 is composed of a case main body 31 and a case lid 32 for closing the opening of the case main body 31. The case lid 32 is divided by a dividing line X passing through the lead terminal 11 through. The lead frame 10 is constituted by lid plates 33 and 34 made of a thermoplastic resin film or the like forming a pair.
The cover plate 33, 34 can be attached to the lead terminal 11 and the case cover 32 can be integrated with the piezoelectric circuit element 1 connected thereto. Element 1 to lead frame 10
The process can be performed in a connected state, which is convenient for automating the manufacturing process. Further, if the lid plates 33 and 34 are made of a heat-sealable film such as polyethylene terephthalate,
The integration process can be easily performed by heat welding, and the material is inexpensive.

In the above embodiment, the two opening holes 21 formed on the upper and lower surfaces of the synthetic resin mold 20 are closed by one sealing lid 25, respectively. It is also possible to form a step around the opening of the portion 21 and to close each opening hole 21 with one sealing lid.

Although the lid plates 33 and 34 divided into two parts are used as the case lid part 32, when the case frame 32 is attached to the lead terminals 11 and the process of separating the lead frame 10 is executed, the division is made. Instead of using the cover plates 33 and 34, it is possible to use a single case cover from the beginning, in which a through hole for inserting the lead terminal 11 is formed.

Although the embodiments of the present invention have been described above, it is obvious to those skilled in the art that the present invention is not limited to the embodiments and various modifications and changes can be made within the scope of the claims. There will be.

[0047]

As described above, according to the lead-type piezoelectric component of the present invention, the cavity portion facing the specific portion including the vibration portion of the piezoelectric circuit element is formed by resin molding. Based on the opening holes that can be easily and accurately formed, each opening hole is covered with a sealing lid to secure a cavity, so that the cavity precisely limits the vibration part of the piezoelectric circuit element It can be formed with high precision. In addition, the entire piezoelectric circuit element is housed and sealed in the outer case except for the part that is to be led out of the lead terminals that will be the external terminals, so the whole part is a package-type part in which the piezoelectric circuit element is hermetically sealed. It can be configured as a simple structure.

According to the method of manufacturing a lead-type piezoelectric component according to the present invention, an injection molding process, a sealing lid assembling process, and an outer case assembling process are only required during the piezoelectric component manufacturing process. For this reason, the process can be extremely simplified. In addition, since the resin mold including the opening hole is injection-molded, a cavity based on each opening hole can be formed accurately, and the piezoelectric circuit element is securely housed and sealed inside the outer case by back molding. Can be stopped.

[Brief description of the drawings]

FIG. 1 is a front sectional view of a lead type piezoelectric component in a completed state, which is an embodiment of a lead type piezoelectric component and a method of manufacturing the same according to the present invention.

FIG. 2 is a plan sectional view of the same.

FIG. 3 is a front view of a piezoelectric circuit element and a lead frame used in this embodiment.

FIG. 4 is a perspective view showing a state in which a synthetic resin mold is formed by injection molding in this embodiment.

FIG. 5 is a perspective view showing a step of attaching a sealing lid for closing and sealing the opening of the opening formed in the synthetic resin mold.

FIG. 6 is a perspective view showing a state after the sealing lid is attached.

FIG. 7 is a sectional view taken along the line VII-VII of FIG. 6;

FIG. 8 is an explanatory view showing a step of attaching a lid plate obtained by dividing a case lid into two parts to a lead terminal in this embodiment.

FIG. 9 is a front view of the same.

FIG. 10 is a front view showing a state in which a case lid is positioned at a predetermined position of a lead terminal in this embodiment.

FIG. 11 is a front sectional view showing a step of applying an adhesive to an inner bottom surface of a case main body constituting the outer case.

FIG. 12 is a side view showing a step of forming a back mold of the outer case.

FIG. 13 is a front view showing a back mold drying and curing step of the outer case.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Piezoelectric circuit element 2 Piezoelectric ceramic substrate 3 Circuit pattern 10 Lead frame 11 Lead terminal 12 Set hole 20 Synthetic resin mold 21 Opening hole 22 Stepped portion 23 Stepped surface 24 Cavity 25 Sealing lid 30 Exterior case 31 Case body 32 Case Lids 33, 34 Lids 33a, 34a Notch 35 Back mold 36 Adhesive D1, D2 Dispenser H Heater W Welder welding bar

Claims (4)

[Claims] A piezoelectric circuit element provided with a predetermined circuit pattern on both sides of a ceramic substrate; a lead terminal connected to the piezoelectric circuit element is led out; and a specific portion of the circuit pattern is formed in a cavity. A lead-type piezoelectric component which is located inside the piezoelectric circuit element and defines a vibrating portion of the piezoelectric circuit element by the cavity, wherein the piezoelectric circuit element includes another circuit pattern portion while avoiding a specific portion of the circuit pattern by an opening hole. The vibrating portion is limited by a synthetic resin mold that covers and fixes the entirety, and a sealing lid that covers the opening of the opening hole and forms the inside of the opening hole as the cavity to form the cavity. A lead-type piezoelectric component characterized in that the entire piezoelectric circuit element provided with is accommodated and sealed in a hollow exterior case. 2. The exterior case comprises a case body and a case cover portion through which the lead terminal is penetrated, wherein the case cover portion is fitted into an opening of the case body, and a periphery of the opening is formed. 2. The lead-type piezoelectric component according to claim 1, wherein a back mold made of synthetic resin is provided over an outer surface of the case lid, and the opening is sealed. 3. A piezoelectric circuit element provided on both sides of a ceramic substrate with a predetermined circuit pattern connected to lead terminals and led out, and a specific portion of the circuit pattern is located inside a hollow portion. In a method of manufacturing a lead-type piezoelectric component in which a vibrating portion of a piezoelectric circuit element is limited by the hollow portion, a specific portion of the circuit pattern is avoided by an opening hole, and the entire piezoelectric circuit element including another circuit pattern portion is covered and fixed. The piezoelectric circuit element, wherein a synthetic resin mold to be formed is formed by injection molding, the opening of the opening hole is closed with a sealing lid, and the inside of the opening hole is formed as the cavity, and the synthetic resin mold is provided. The whole is housed inside the opening of the case main body, and the case lid portion through which the lead terminal is penetrated is fitted into the opening of the case main body. A lead type, wherein a hollow exterior case is constituted by the case lid portion, and a synthetic resin back mold is provided and sealed around an edge of an opening of the main body case or an outer surface of the case lid portion. Manufacturing method of piezoelectric parts. 4. The case lid is formed by thermally welding together a pair of thermoplastic resin film lids divided by a dividing line passing through a penetrating portion of the lead terminal. The manufacturing method of the lead-type piezoelectric component according to the above.