JPH10209595A - Board device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent short circuits between connection terminals by forming, in a major board, large and small connection terminals alternately in correspondence to those of a sub board. SOLUTION: A sub board 12 is installed upright on a major board 11. In other words, a slot 13 is formed in the major board 11, and a connection terminal section 14 formed in the sub board 12 is inserted into the slot 13. A plurality of connection terminals 15 formed in the connection terminal section 14 are formed closely to each other at intervals of about 2mm. Connection terminals 16 of the major board 11 are formed in the positions corresponding to the connection terminals 15 of the sub board 12. The connection terminals 16 are alternately large and small in size. The connection terminals 15 or 16 are connected to electronic components mounted on the major board 11 or sub board 12. Due to this structure, solder gathers in the large connection terminals, absorbing solder of the small connection terminals, thereby preventing short circuits between the connection terminals.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a substrate device used for electronic equipment and the like.

[0002]

2. Description of the Related Art A conventional substrate device will be described below.

In a conventional board device, a hole 2 is provided in a parent board 1 as shown in FIG.
Was inserted. A plurality of connection terminals 5 were provided adjacent to each of the terminal portions 4. A plurality of connection terminals 6 were also provided on the corresponding parent substrate 1. Here, the soldered portions of the connection terminals 5 of the daughter board 3 and the connection terminals 6 of the parent board 1 had the same shape.

[0004]

However, in such a conventional configuration, the connection terminal 5 or the connection terminal 6 is not provided.
However, since they are provided close to each other, there is a problem that the solder is short-circuited between the connection terminals when dip soldering is performed.

An object of the present invention is to solve such a problem, and an object of the present invention is to provide a substrate device for preventing a short circuit between connection terminals.

[0006]

In order to achieve this object, a board device according to the present invention is provided with alternately large and small connection terminals of a parent board corresponding to the connection terminals of a child board. is there.

With this configuration, it is possible to prevent a short circuit between the connection terminals.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to a first aspect of the present invention is directed to a mother board on which electronic components are mounted and provided with a long hole, and a child board which is inserted into the long hole and stands upright. Having a connection terminal portion inserted into the elongated hole, a plurality of connection terminals of the plurality of child substrates provided close to each other in the connection terminal portion, and between the connection terminals. With the holes provided, the connection terminals of the parent substrate are alternately provided on the parent substrate corresponding to the connection terminals of the child substrate, and the connection terminals of the child substrate and the connection terminals of the parent substrate are provided. This is a board device that is connected by dip soldering. In this way, the connection terminals of the parent board are provided with large and small connection terminals alternately, so that the solder gathers on the large connection terminals and the solder on the small connection terminal portion is removed. It will be absorbed and prevent short circuit between terminals Kill. Further, since the holes are provided between the connection terminals of the daughter board, the gas generated during the dip soldering is discharged therefrom to further enhance the effect of preventing the short circuit between the terminals.

According to a second aspect of the present invention, the hole provided between the connection terminals of the daughter board is a long hole.
In the substrate device described in (1), since the shape of the hole is a long hole, the area through which gas escapes is increased, and the effect of preventing short circuit is further increased.

According to a third aspect of the present invention, an empty pattern is provided near each end of the connection terminal of the parent substrate.
In the substrate device described in (1), the outer pattern solder that is most likely to accumulate when the dip soldering is performed is sucked by the empty pattern, and thus the short circuit between the terminals is reduced.

According to a fourth aspect of the present invention, there is provided the board apparatus according to the second aspect, wherein both ends of the connection terminal of the parent board and both ends of the connection terminal of the child board are discarded terminals. Since the terminals at both ends where the occurrence of the error occurs most are discarded, it is safe even if the terminals are short-circuited.

According to a fifth aspect of the present invention, there is provided the board apparatus according to the second aspect, wherein both ends of the connection terminal of the parent board and both ends of the connection terminal of the child board are ground terminals. Is grounded, so that it is not affected by external jamming radio waves, and even if touched, this terminal is at the ground potential and is safe.

An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of a main part of the substrate device of the present invention. In FIG. 1, reference numeral 11 denotes a master board,
In 1, a child substrate 12 is planted. That is, the mother board 11 is provided with the elongated holes 13, and the connection terminal portions 14 provided on the daughter board 12 are inserted into the elongated holes 13.
Reference numeral 15 denotes a plurality of connection terminals provided on the connection terminal portion 14, and the connection terminals 15 are provided close to each other at intervals of about 2 mm. Reference numeral 16 denotes a connection terminal provided on the parent substrate 11, and a connection terminal 15 provided on the child substrate 12.
Is provided at a position corresponding to. The connection terminals 16 are alternately large and small. The connection terminal 15 or the connection terminal 16 is connected to an electronic component mounted on the parent board 11 or the child board 12. A hole 17 is provided between the connection terminals 15 of the connection terminal portion 14. This will be described in detail with reference to FIG.

In FIG. 2, a connection terminal 15 and a connection terminal 15 adjacent to this connection terminal 15 (temporarily connection terminal 15a
C) are very close at an interval of about 2 mm. Therefore, a hole 17 is provided therebetween to increase the amount of passing gas generated during dip soldering. Further, the long hole 17 is a long hole having a longer diameter provided in parallel with the connection terminal 15, and the longer diameter of the long hole 17 is about 2 mm. Connection terminal 16 of parent board 11
Are provided with connection terminals 16a having a large shape and connection terminals 16b having a small shape alternately. A discard pattern 18 and a discard pattern 19 are provided outside the terminals 16a and 16c at both ends. This is because the solder of the connection terminal 16a when the dip soldering is performed in the direction A flows to prevent a short circuit. Since the solder of the endmost connection terminal 16a has no place for soldering, it flows into the discard pattern 18 and good dip soldering can be performed. Further, when the discard pattern 19 provided in the opposite direction is also subjected to dip soldering in the B direction, the presence of the dip solder causes no short circuit of the solder.

If the connection terminals 16a or 16c at both ends and the connection terminals 15 of the daughter board corresponding thereto are also provided with empty patterns, it is safe even if a short circuit occurs. Also, the connection terminals 16a, 16
If c is connected to ground, it is safe even if touched from outside. In addition, it also prevents external interference signal input.

[0016]

As described above, according to the present invention, the connection terminals of the parent substrate are provided on the parent substrate in correspondence with the connection terminals of the child substrate, and the connection terminals of the parent substrate alternately have large and small shapes. Therefore, the solder collects on the large connection terminals, and the solder of the small connection terminals is sucked, so that a short circuit between the terminals can be prevented. Further, since the holes are provided between the connection terminals, the gas generated during the dip soldering is released therefrom to further enhance the effect of preventing short-circuit between the terminals.

[Brief description of the drawings]

FIG. 1 is a perspective view of a main part of a dip solder surface of a board device according to an embodiment of the present invention.

FIG. 2 is an enlarged perspective view of a main part of the same.

FIG. 3 is a perspective view of a main part of a conventional substrate device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Parent board 12 Child board 13 Long hole 14 Connection terminal part 15 Connection terminal of child board 16 Connection terminal of parent board 17 hole

Claims (5)

[Claims] An electronic component is mounted on a mother board provided with a long hole, and a child board is inserted into the long hole and stands upright. The child board is inserted into the long hole. The connection terminal portion, the connection terminal portion, the connection terminals of a plurality of daughter boards provided in close proximity to each other, and has a hole provided between the connection terminals, and the parent substrate has the A board device in which connection terminals of a large and small parent board are alternately provided corresponding to connection terminals of a child board, and the connection terminals of the child board and the connection terminals of the parent board are connected by dip soldering. 2. The substrate device according to claim 1, wherein the holes provided between the connection terminals of the daughter board are elongated holes. 3. The substrate device according to claim 2, wherein empty patterns are respectively provided near both ends of the connection terminals of the parent substrate. 4. The board device according to claim 2, wherein both ends of the connection terminal of the parent board and both ends of the connection terminal of the child board are discarded terminals. 5. The board device according to claim 2, wherein both ends of the connection terminal of the parent board and both ends of the connection terminal of the child board are ground terminals.