JPH10209195A - Solder ball-mounting apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a solder ball-mounting apparatus capable of reliably picking up solder balls from a feeder and reliably mounting them on a work such as substrate. SOLUTION: A pickup head 11 is composed of an upper and lower cases 30, 31 partitioned by transparent plate 33. The lower case 31 is a hermetic chamber having many suction holes 32 for vacuum-sucking solder balls and connected to a suction unit through a tube 8. The upper case 30 has a first and second mirrors 34, 35 and optical sensor 36. The capacity of the lower hermetic case 31 is small enough to securely vacuum-suck solder balls 1 by the suction unit.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder ball mounting apparatus for mounting a solder ball on a work by vacuum-sucking the ball with a pickup head.

[0002]

2. Description of the Related Art It is known that solder balls are mounted on the surface of a work such as a chip or a substrate, and then the solder balls are heated and melted, then cooled and solidified to form bumps (protruding electrodes). ing. Generally, many bumps are formed on a work, and thus a large number of solder balls are mounted on the work. Hereinafter, a conventional solder ball mounting apparatus for mounting a large number of solder balls on a work at once will be described.

FIG. 18 is a side view of a conventional solder ball mounting apparatus. Solder ball 1 which is the material of bump is container 2
It is stored in. 3 is a pickup head,
Driving up and down by driving up and down movement means (not shown) causes the solder balls 1 to be inserted into the suction holes formed in the lower surface thereof.
Is moved by a reciprocating means (not shown) and horizontally moved, thereby moving above a workpiece such as the substrate 5 which is clamped and positioned by the clamper 6, and performs vertical movement again there. Accordingly, the solder ball 1 is mounted at a predetermined position on the substrate.

A large number of suction holes are formed in the lower surface of the pickup head 3, and the solder balls 1 must be vacuum-sucked in all the suction holes and mounted on the substrate 5. Therefore, conventionally, a camera 4 is installed below the movement path of the pickup head 3, and the lower surface of the pickup head 3 is observed by the camera 4, and image processing is performed to determine whether or not the solder balls 1 are vacuum-sucked in all the suction holes. If OK, the pickup head 3 moves directly above the substrate 5 and mounts the solder ball 1 on the substrate 5.

[0005]

On the lower surface of the pickup head, a large number of suction holes for vacuum-sucking the solder balls are formed, and the solder balls are reliably sucked into these suction holes for pick-up. Also, the picked-up solder balls must be securely mounted on the work.

Accordingly, an object of the present invention is to provide a solder ball mounting device with high operation reliability. More specifically, it is an object of the present invention to provide a solder ball mounting apparatus capable of reliably picking up a solder ball by a pickup head and mounting the picked-up solder ball on a work.

[0007]

SUMMARY OF THE INVENTION According to the present invention, there is provided a solder ball mounted on a workpiece by vacuum-sucking a plurality of solder balls provided in a solder ball supply section into suction holes formed in a lower surface of a pickup head. Mounting apparatus, wherein the pickup head is composed of an upper case and a lower case partitioned by a transparent plate, the lower case being an airtight chamber, and a suction hole for vacuum suction of a solder ball on a lower surface of the lower case. A plurality of units were formed, a suction device was connected to the lower case, and optical means for detecting a pickup error and / or mounting error of the upper case solder balls was provided.

Preferably, the optical means detects light leaked from any one of the plurality of suction holes from the suction holes, and the light detection means detects light transmitted through the transparent plate. And condensing means.

Preferably, the light condensing means is disposed on a first reflection film for reflecting light leaked from the suction hole in a substantially horizontal direction, and is disposed on a side of the first reflection film, It is a second reflection film that reflects light reflected by the film to the light detection means.

Preferably, the light condensing means includes a transmission film that refracts light leaked from the suction hole obliquely upward at an acute angle, and a reflection film that reflects light refracted by the transmission film to the light detection means. is there.

Preferably, the light condensing means includes a transmission film for refracting the light leaked from the suction hole obliquely upward and at an acute angle, and a lens for condensing the light refracted by the transmission film to the light detection means. is there.

Preferably, the optical means is a light source for emitting light toward the transparent plate.

According to the above configuration, the lower case is made an airtight chamber, so that the solder balls can be reliably sucked into the suction holes on the lower surface thereof. Can be reliably detected.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION

(Embodiment 1) FIG. 1 is a side view of a solder ball mounting apparatus according to Embodiment 1 of the present invention, FIG. 2 is a sectional view of the same pickup head, FIG. 3 is a plan sectional view of the same pickup head, and FIG. FIG. 5 is a perspective view of the pickup head and the light emitting device, and FIG. 5 is a front view of the light emitting device. In FIG. 1, reference numeral 11 denotes a pickup head. The pickup head 11 is held by a block 12. The block 12 is mounted on a guide rail 14 provided on a front surface of a bracket 13 so as to be vertically movable. A nut 15 is provided integrally with the block 12.
6 is screwed. Therefore, when the motor 17 is driven forward and backward to rotate the feed screw 15 forward and backward, the pickup head 11 is guided by the guide rail 14 and moves up and down.

A nut (not shown) provided on the back of the bracket 13 is screwed to a horizontal feed screw 18.
19 is a holding table for the feed screw 18. Accordingly, when the motor 20 is driven forward and backward, the feed screw 18 rotates forward and backward, and the pickup head 1 held by the bracket 13 is rotated.
1 moves horizontally in the X direction.

A supply section 21 for the solder ball 1 is provided below a moving path of the pickup head 11. The supply unit 21 is formed of a container, and is supported by a box 22. A hole 23 is formed at the bottom of the supply unit 21. The box 22 is placed on a base 24 and the base 2
A gas blower 25 is installed in the inside of 4. Gas such as air blown from the gas blower 25 is supplied from the hole 23 to the supply unit 21 (see the broken arrow), and the gas pressure causes the solder ball 1 to fluidize. By performing the operation, the pickup head 11 vacuum-adsorbs and picks up the solder ball 1 on its lower surface. As means for fluidizing the solder ball 1 so that the pickup head 11 easily sucks the solder ball 1 in vacuum, in addition to the above-described means for sending gas to the supply unit 21, means for vibrating the supply unit 21 with a vibrator may be used. Can be

On the side of the supply section 21, a positioning section 26 for the substrate 5 is provided. The positioning section 26 is configured by stacking a Y table section 28 on an X table section 27 and installing a clamper 29 for clamping the substrate 5 above the Y table section 28. When the motor Mx of the X table unit 27 is driven, the substrate 5 moves in the X direction, and the Y table unit 28
Is driven, the substrate 5 moves in the Y direction. Thus, the position of the substrate 5 is adjusted by moving the substrate 5 horizontally.

Next, the structure of the pickup head 11 will be described with reference to FIGS. The pickup head 11 mainly includes an upper case 30 and a lower case 31. On the lower surface of the lower case 31, a large number of suction holes 32 for vacuum suction of the solder balls 1 are formed in a matrix. The boundary between the upper case 30 and the lower case 31 is partitioned by a translucent plate 33, and the inside of the lower case 31 is an airtight chamber. The lower case 31 is connected to the suction device 9 via the tube 8 (FIG. 1).
By vacuum-suctioning the inside of the lower case 31, the solder ball 1 is vacuum-sucked into the suction hole 32. As shown in FIGS. 1 to 3, the volume of the lower case 31 is smaller than the volume of the upper case 30. As described above, the lower case 31 is divided from the upper case 30 by the transparent plate 33 to form an airtight chamber having a small volume. The ball 1 can be reliably sucked by vacuum. Upper case 30 and lower case 31
Is a dark box into which external light does not enter from other than the suction hole 32.

As shown in FIG. 2, above the plate 33, a first reflection film 34 having a gentle curved surface is provided. Also, on the side of the first reflection film 34, a second reflection film 3 having a similarly gentle curved surface is provided.
5 are provided. An optical sensor 36 is provided on a side wall of the upper case 30. In FIG. 3, the optical sensor 36 is connected to a light leakage detection unit 37 and a control unit 38. Therefore, as shown by an arrow in FIG. 2, light entering from any one of the plurality of suction holes 32 formed on the lower surface of the lower case 31 is transmitted to the second reflection film 34 by the first reflection film 34. The light is condensed and reflected on the reflection film 35, and further, as shown in FIG.
The light is condensed and reflected by the optical sensor 36.

The first reflection film 34 and the second reflection film 35 have the same optical characteristics as the reflection film 57 of the second embodiment described later, and the detailed description will be given in the second embodiment. .

In FIG. 1, a supply portion 21 for solder balls 1
A light emitting device 40 is provided between the light emitting device 40 and the positioning portion 26 of the substrate 5. In FIG. 4, the light emitting device 40 includes a line light source 42 on a long box-shaped base 41. Standing walls 43 and 44 are provided on both sides of the base 41, and a light emitting element 45 and a light receiving element 46 are provided above the standing walls 43 and 44, respectively. The light emitting element 45 and the light receiving element 46 are connected to a solder ball detecting section 48 and a control section 49 via a cord 47.

In FIG. 4, the line light source 42 has a longitudinal direction in the Y direction perpendicular to the moving direction (X direction) of the pickup head 11, and therefore, when the pickup head 11 moves in the X direction, its entire lower surface is formed. Is irradiated with light. The light emitting element 45 and the light receiving element 46 are arranged so as to sandwich the moving path of the pickup head 11, and irradiate light horizontally from the side along the lower surface of the pickup head 11, as shown in FIG. here,
As shown in FIG. 5, when at least one solder ball 1 remains on the pickup head 11, light is blocked by the solder ball 1.

This solder ball mounting device is configured as described above, and the operation will be described next. In FIG.
In a state where the pickup head 11 is located above the supply unit 21, the motor 17 is driven forward / reverse, whereby the pickup head 11 performs a descending / upward operation, and the supply unit 21 is provided in the suction hole 32 on the lower surface thereof. The solder ball 1 is picked up by vacuum suction. At this time, the gas is blown out from the gas blower 25 so that the solder balls 1 in the supply unit 21 are caused to flow so that the pickup head 11 easily sucks the solder balls 1 into all the suction holes 32 by vacuum.

Next, the pickup head 11 moves toward the substrate 5, but passes over the light emitter 40 on the way, as shown in FIG. At this time, the line light source 4
Light is emitted from 2 to the pickup head 11. Here, in FIG. 2, if there is a suction hole 32 in which the solder ball 1 is not vacuum-sucked, light leaks from the suction hole 32 into the lower case 31, and the light is leaked to the first reflection film 34.
And the light sensor 3 reflected by the second reflection film 35
Light enters 6 (see arrow). The output signal of the optical sensor 36 is input to the light leakage detection unit 37, and it is found that the suction hole 32 that does not vacuum-suck the solder ball 1 exists, that is, that the solder ball 1 has been picked up incorrectly.

In this case, the pickup head 11 turns back above the supply section 21 and performs the lowering / upward operation again to pick up again. Then, the pickup head 11 moves above the line light source 42 again, and determines again whether there is light leakage. If no light leakage is detected, it is determined that the solder balls 1 are correctly vacuum-sucked in all the suction holes 32 (that is, there is no pick-up error), and the solder balls 1 are directly moved above the substrate 5.
Then, the pickup head 1 performs the lowering / upward operation again and releases the vacuum suction state, thereby mounting the solder ball 1 on the substrate 5. Note that a flux is applied to the substrate 5 in advance.

The pickup head 11 having the solder balls 1 mounted on the substrate 5 as described above returns to the supply unit 21. On the way, the pickup head 1
1 passes above the light emitting device 40, and at this time, light is irradiated from the side along the lower surface of the pickup head 11 from the light emitting element 45 as shown in FIG. When the irradiated light is shielded, the control unit 49 determines that at least one solder ball 1 remains and adheres to the suction hole 32 and the light is blocked by the solder ball 1. This solder ball 1 has failed to be mounted on the substrate 5,
Therefore, the control unit 49 determines that there is a mounting error, and the substrate 5 is removed from the line as a defective product. The non-defective substrate 5 is sent to a reflow device, where the solder balls 1 are heated to generate bumps.

In the first embodiment, the light sensor 36 corresponds to the light detecting means, and the first reflecting film 34 and the second reflecting film 35 correspond to the light collecting means.

(Embodiment 2) FIG. 6 is a side view of a solder ball mounting apparatus according to Embodiment 2 of the present invention, FIG. 7 is a cross-sectional view of a pickup head of the solder ball mounting apparatus, and FIG. 9 and 10 are explanatory diagrams of the transmission film, and FIGS. 11 and 12 are explanatory diagrams of the reflective film.

In FIG. 6, the structure other than the pickup head 51 is the same as that of the first embodiment shown in FIG. 1, and the same parts are denoted by the same reference numerals and description thereof will be omitted. Next, the pickup head 51 will be described. 7 and 8, the pickup head 51 has a dark box structure mainly composed of an upper case 52 and a lower case 53. On the lower surface of the lower case 53, a large number of suction holes 54 are formed in a matrix. Upper case 52 and lower case 53
Is partitioned by a translucent plate 55, and the inside of the lower case 53 is an airtight chamber, which is connected to the suction device 9 (FIG. 1) via the tube 8.

In FIG. 7, a transmission film 56 is provided immediately above the film 55. A reflection plate 57 is disposed on the right side of the upper case 52 with a slight inclination, and a reflection film 58 is disposed on the left side with a slight inclination. As shown in FIG. 8, a light detection sensor 59 is provided on the side of the reflection film 58.

9 and 10 show the optical characteristics of the transmission film 56. FIG. 9 is a sectional view of the transmission film 56, and FIG. 10 is an enlarged sectional view of the same. As shown in FIG. 10, the upper surface of the transmission film 56 has a prism surface, and light incident from below is refracted by the prism surface and emitted to both sides. Therefore, as shown in FIG. 9, the light incident from below is emitted to both sides at an acute angle a1 as a whole. a1 is approximately 2 ° to 20 °.

FIGS. 11 and 12 show the optical characteristics of the reflection film 58. FIG.
8 is a sectional view, and FIG. 12 is an enlarged sectional view of the same. As shown in FIG. 12, the reflective film 58 is formed by forming an aluminum vapor-deposited layer 583 on a plate 581 with an adhesive layer 582 interposed therebetween, and further laminating a prism layer 584 on the upper surface thereof. Therefore, light incident from above is reflected by the prism layer 5.
After being refracted and incident on 84 and reflected by the aluminum deposition layer 583, the light is refracted from the prism layer 584 and emitted. Therefore, as shown in FIG. 11, light incident from above is reflected laterally at an acute angle a2 as a whole. a2 is 2 ° -1
5 °.

Since the transmission film 56 has the above-mentioned optical characteristics, the light incident from the suction hole 54 in FIG. The light emitted to the right is reflected by the reflection plate 57 toward the reflection film 58 on the left. The light emitted to the left directly enters the reflection film 58. As described above, the transmissive film 56 has a characteristic of emitting the incident light at the acute angle a1, so that the height H of the upper case 52 in FIG. 7 can be reduced to make the upper case 52 compact.

In FIG. 8, light incident on the reflection film 58 from the transmission film 56 or the reflection plate 57 is reflected laterally at an acute angle a2 and is incident on the light detection sensor 59.
As described above, the reflection film 58 converts the incident light into the acute angle a2.
Therefore, the reflection film 58 is disposed at the acute angle a3, the length D of the reflection film 58 is reduced, and the upper case 52 can be made compact. That is, the transmission film 56 and the reflection film 58 are directional optical elements for refracting and reflecting light in an acute angle direction in order to make the pickup head 51 compact and compact.

As described above, the suction hole 54 of the lower case 53
By using the above-mentioned transmissive film 56 and reflective film 58 as an optical element for making light incident from the light incident on the light detection sensor 59, the upper case 52 can be made compact, and the pickup head 51 can be made compact.

The operation of the solder ball mounting device of the second embodiment is the same as that of the first embodiment described above.
When the pickup head 51 passes above the light emitting device 40 as in the case of the first embodiment shown in FIG. 1, the presence or absence of light leakage from the suction hole 54 is detected by the light detection sensor 59 to detect the presence or absence of a pickup error. I do. Further, as shown in FIG. 5, while the pickup head 51 is returning toward the supply unit 21, the presence or absence of a mounting error is detected based on whether or not the light emitted from the light emitting element 45 is blocked by the solder ball 1. .

In the second embodiment, the light detection sensor 59
Correspond to the light detecting means, and the reflecting plate 57, the reflecting film 58,
The transmission film 56 corresponds to the light collecting means.

(Embodiment 3) FIG. 13 is a sectional view of a pickup head of a solder ball mounting apparatus according to Embodiment 3 of the present invention, FIG. 14 is a plan sectional view of the same, and FIG. It is a perspective view of a pickup head, a light emitting device, and a light receiving device. The entire configuration other than the pickup head and the light emitter / receiver is the same as that of the first embodiment shown in FIG.

13 and 14, the pickup head 61 has a dark box structure composed of an upper case 62 and a lower case 63, and a translucent plate 55 and a transmissive film 56 are provided between the upper case 62 and the lower case 63. Are arranged. Therefore, the inside of the lower case 63 is an airtight chamber, and is connected to the suction device 9 (FIG. 1) via the tube 8. Also, the first case is provided on both sides inside the upper case 62.
And a second reflective film 58b. The transmission film 56, the first reflection film 58a, and the second reflection film 58b are the same as the transmission film 56 and the reflection film 58 of the second embodiment.

In FIG. 14, a nozzle 6 for emitting light toward the first reflection film 58a is provided on the side surface of the upper case 62.
5 is attached. The nozzle 65 holds the end face of the optical fiber 66 connected to the light source 67 toward the dark box. A control unit 77 controls the light source unit 67.

In FIG. 15, reference numeral 70 denotes a light emitting device.
A line light source 72 is provided on the upper surface of the base 71. Reference numeral 73 denotes a light receiver, which has a line sensor 75 on the upper surface of a base 74. The light-emitting device 70 and the light-receiving device 73 are provided below the moving path of the pickup head 61 in place of the light-emitting device 40 of the first embodiment shown in FIG. 76 is a recognition unit connected to the light receiver 73, 77 is the light emitter 70, the light receiver 7
3. A control unit that controls the recognition unit 76.

The entire operation other than the operation of judging the presence or absence of a pick-up error or mounting error is the same as that of the first embodiment. Hereinafter, the operation of judging a pick-up error or mounting error will be briefly described. First, the operation of determining a pickup error will be described. The pickup head 61 that has picked up the solder balls 1 of the supply unit 21 moves above the light emitter 70 as shown in FIG. At this time, light is emitted from the line light source 72 toward the lower surface of the pickup head 61. 13 and 14, when the solder ball 1 is not vacuum-sucked in any of the suction holes 64, light leaked from the suction hole 64 is transmitted from the transmission film 56 to the second Reflective film 5
The light exits at an acute angle a1 toward 8b, is further reflected laterally at an acute angle a2 by a second reflection film 58b, and enters a light detection sensor 59. Also in this case, the transmission film 56
By using the reflection films 58a and 58b, the height H2 and the width D2 of the upper case 62 can be reduced and the upper case 62 can be made compact.

After the pickup head 61 mounts the solder ball 1 on the substrate 5, it passes above the light receiver 73 while returning to the supply section 21. At this time, the nozzle 6
5 irradiates light to the first reflective film 58a. FIG.
3 and FIG. 14, the dashed arrow indicates this light. The light is uniformly scattered by the light diffusion plate 69 and is incident on the first reflection film 58a at an acute angle a2, and is reflected by the first reflection film 58a and transmitted to the transmission film 56 at an acute angle a1 as shown in FIG. The light enters, enters the lower case 63 side, and emits light downward through the suction hole 64.

In FIG. 15, the line sensor 75 of the light receiver 74 receives the light emitted from the suction hole 64, and the output signal is input to the recognition unit 76. The control unit 77 determines whether there is a mounting error by analyzing the light that has entered the recognition unit 76. That is, if light is emitted from all the suction holes 64, it is determined that there is no mounting error. If any of the suction holes 64 is shielded from light, the suction holes 6
The solder ball 1 that blocks light remains adhered to 4, and it is determined that there is a mounting error. It should be noted that the recognition unit 76 and the control unit 77 also detect the case where dust is clogged in the suction hole 64 and does not emit light. Therefore, for example, when the same suction hole 64 is continuously shielded from light a plurality of times, the suction hole 64 may be blocked by dust and may be blocked from light. In this case, the notification element such as a buzzer may be used. May be notified to that effect.

In the third embodiment, the light detection sensor 59
Are the light detecting means, the transmission film 56 and the reflection film 5
8b corresponds to the light condensing unit, and the end face of the optical fiber 66 held by the nozzle 65 corresponds to the light emitting unit.

(Embodiment 4) FIG. 16 is a sectional view of a pickup head of a solder ball mounting apparatus according to Embodiment 4 of the present invention, and FIG. 17 is a plan sectional view of the same. The pickup head 81 has a dark box structure including an upper case 82 and a lower case 83, and a translucent plate 55 and a transmissive film 56 are disposed between the upper case 82 and the lower case 83.

A rod-like light source 85 is provided on one side of the upper case 82.
The other end is provided with a converging lens 86 and a linear image sensor 87 each having a cross-sectional shape. The light source 85 and the linear image sensor 87 are connected to the light leakage detection unit 37 and the control unit 38 similar to those in FIG. The configuration other than the pickup head 81 is the same as that of the above-described embodiment.

Next, the operation will be described. After the pickup head 81 picks up the solder ball 1 of the supply unit 21, it irradiates light from below when passing above the light emitting device 40. The light leaked from the suction hole 84 is transmitted to the transmission film 5.
From 6, light is emitted toward the condenser lens 86 at an acute angle a1 and enters the linear image sensor 87, whereby a pickup error is detected. After the pickup head 81 mounts the solder ball 1 on the substrate 5, the light source 85 is turned on while returning to the supply unit 21. As shown by the dashed arrow, the light enters the transmissive film 56 at an acute angle and leaks from the suction hole 84 of the lower case 83. Thus, as in the case of the third embodiment, the light is received by the light receiver 73, and it is determined whether or not the solder ball 1 remains and adheres to the suction hole 84, that is, whether or not there is a mounting error.

In the fourth embodiment, the linear image sensor 87 corresponds to the light detecting means, the transmissive film 56 and the condenser lens 86 correspond to the condenser means, and the light source 85 corresponds to the light emitting section.

The present invention is not limited to the above embodiments. For example, in the first embodiment, a planar light source may be used instead of the line light source 42. In the first embodiment, the line light source 42, the light emitting element 45, and the light receiving element 46 are integrally formed. However, these may be provided separately. Further, a CCD camera is used in place of the light receiver 73 having the line sensor 75 shown in FIG. 15, and the suction holes 64, 8 are formed based on the image data obtained by the CCD camera.
4 may be detected whether it is not blocked, that is, whether there is a mounting error or a clog of dust. In addition, a flux storage tank is provided on the path of movement of the pickup head, and the pickup head is moved up and down on this storage tank. After that, the solder balls may be mounted on the substrate. In this case, after picking up the solder ball 15 from the supply unit 21 and after applying the flux, the presence or absence of a pick-up error is determined by the above-described method.
Do it twice. The work may be a flip chip chip or an electronic component other than the substrate.

[0051]

As described above, according to the present invention, the lower case is made an airtight chamber, and the solder ball can be reliably sucked into the suction hole on the lower surface thereof. The presence or absence of a ball pick-up error or mounting error can be reliably detected.

[Brief description of the drawings]

FIG. 1 is a side view of a solder ball mounting device according to a first embodiment of the present invention.

FIG. 2 is a sectional view of a pickup head of the solder ball mounting device according to the first embodiment of the present invention.

FIG. 3 is a plan sectional view of a pickup head of the solder ball mounting device according to the first embodiment of the present invention.

FIG. 4 is a perspective view of a pickup head and a light emitting device of the solder ball mounting device according to the first embodiment of the present invention.

FIG. 5 is a front view of a light emitting device of the solder ball mounting device according to the first embodiment of the present invention.

FIG. 6 is a side view of the solder ball mounting device according to the second embodiment of the present invention;

FIG. 7 is a sectional view of a pickup head of the solder ball mounting device according to the second embodiment of the present invention.

FIG. 8 is a plan sectional view of a pickup head of the solder ball mounting device according to the second embodiment of the present invention.

FIG. 9 is an explanatory diagram of a transmission film of the solder ball mounting device according to the second embodiment of the present invention.

FIG. 10 is an explanatory view of a transmission film of the solder ball mounting device according to the second embodiment of the present invention.

FIG. 11 is an explanatory view of a reflection film of the solder ball mounting device according to the second embodiment of the present invention.

FIG. 12 is an explanatory view of a reflection film of the solder ball mounting device according to the second embodiment of the present invention.

FIG. 13 is a sectional view of a pickup head of the solder ball mounting device according to the third embodiment of the present invention.

FIG. 14 is a plan sectional view of a pickup head of the solder ball mounting device according to the third embodiment of the present invention.

FIG. 15 is a perspective view of a pickup head, a light emitting device, and a light receiving device of the solder ball mounting device according to the third embodiment of the present invention.

FIG. 16 is a sectional view of a pickup head of a solder ball mounting device according to a fourth embodiment of the present invention.

FIG. 17 is a plan sectional view of a pickup head of the solder ball mounting device according to the fourth embodiment of the present invention.

FIG. 18 is a side view of a conventional solder ball mounting device.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 solder ball 5 substrate (work) 9 suction device 11, 51, 61, 81 pickup head 21 supply unit 32, 54, 64, 84 suction hole 33 transparent plate 34 first reflection film (light collecting element) 35 second Reflective film (light collecting element) 36 Light sensor 40, 70 Light emitting device 42, 72 Line light source 45 Light emitting device 46 Light receiving device 56 Transmissive film 58, 58a, 58b Reflective film 73 Light receiving device

Claims (6)

[Claims] 1. A solder ball mounting apparatus for vacuum-sucking a plurality of solder balls provided in a supply portion of a solder ball into suction holes formed on a lower surface of a pickup head to pick up and mount the solder balls on a work. The pickup head consists of an upper case and a lower case separated by a transparent plate.The lower case is made an airtight chamber, and a plurality of suction holes for vacuum suction of solder balls are formed on the lower surface of the lower case. An apparatus for mounting a solder ball, wherein a suction device is connected, and an optical means for detecting a pick-up error and / or a mounting error of the solder ball is provided on an upper case. 2. The light detecting means for detecting light leaked from any one of the plurality of suction holes from the suction hole, and collecting the light transmitted through the transparent plate to the light detection means. 2. The solder ball mounting device according to claim 1, further comprising a light condensing means for emitting light. 3. A first reflection film for reflecting light leaked from said suction hole in a substantially horizontal direction, said condensing means being disposed on a side of said first reflection film. 3. The solder ball mounting device according to claim 2, wherein the device is a second reflection film that reflects the reflected light to the light detecting means. 4. The light condensing means includes a transmission film that refracts light leaked from the suction hole obliquely upward and at an acute angle, and a reflection film that reflects light refracted by the transmission film to the light detection means. 3. The solder ball mounting device according to claim 2, wherein: 5. A transmission film for refracting light leaked from said suction hole obliquely upward at an acute angle, and a lens for condensing the light refracted by said transmission film to said light detection means. 3. The solder ball mounting device according to claim 2, wherein: 6. The optical system according to claim 1, wherein said optical means is a light source for emitting light toward said transparent plate.
A mounting device for the solder ball described in the above.